W tym modelu stosowano zasilacz BN44-00692A L22S0Q_EPN /PPR01688P * podobny do BN44-00746A, L23S0D-EPN, Z tego forum swego czasu Link p.s BN44-00695A, /* L28S0_ESM, PSLF490S06A stosowano : - S3330 (FAN6755) + polowy MMF60R580P * czasem S3310 * LED driver BD93941FP (backlight): integrated into PSU; 63V 350mA Strony z ros. forum podaja dla tego psu ICM801CS SOIC-8 SSC620, /* Sanken 3S1xx http://obrazki.elektroda.pl/6106119700_1494503428_thumb.jpg http://obrazki.elektroda.pl/7925245700_1494503569_thumb.jpg http://obrazki.elektroda.pl/9999635200_1494504052_thumb.jpg Podaj nazwy ukłądów z tej strony. Na stronie Link masz dobre foto, częśći > jakie napięcia wytwarza: CNM803: A13 > 12.8V 1.8A Vamp > 12.8V 0.48A
Datasheet
LED Drivers for LCD Backlights
White LED Driver for large LCD
Panels (DCDC Converter type)
BD93941EFV BD93941FP
Features
4ch LED constant current driver and DC/DC converter
Maximum LED Current: 200mA
LED Feedback Voltage: 0.37V (@ADIM=2.5V)
so lower heat. Adjustable Feed Back Voltage
by following LED Current setting.
2% LED current accuracy (ADIM=2.5V,
when each LED is set to 100mA)
Analog current (Linear) dimming at ADIM pin
LED pin rating 60V
Individual detection and individual LED OFF for both
open and short circuits
Built-in ISET pin short-circuit protection circuit
Set Soft-Start time by external capacitor.
FET’s Gate (N pin) is driven by 5.8V swing
Built-in Vout discharge circuit for shutdown
Built-in Vout overvoltage protection (OVP) /
reduced voltage protection (SCP) circuit
HTSSOP-B20 and HSOP20 package with high heat
radiation efficiency
General Description
BD93941EFV and BD93941FP is a high efficiency driver
for white LEDs and designed for large LCDs. These ICs
are built-in a boost DCDC converters that employ an
array of LEDs as the light source. BD93941EFV and
BD93941FP have some protect function against fault
conditions, such as the over-voltage protection (OVP),
the over current limit protection of DCDC (OCP), the
short circuit protection (SCP), the open detection of LED
string. Therefore BD93941EFV and BD93941FP are
available for the fail-safe design over a wide range
output voltage.
Key Specification
Operating power supply voltage range: 9.0V to 35.0V
LED minimum current
30mA
LED maximum current:
200mA
Oscillator frequency:
150kHz (RT=100kΩ)
Operating Current:
4.5mA (Typ.)
Operating temperature range:
-40°C to +85°C
Applications
TV, Computer Display, Notebook, LCD Backlighting
Package
HTSSOP-B20
HSOP20
W(Typ.) x D(Typ.) x H(Max.)
6.50mm x 6.40mm x 1.00mm
14.90mm x 7.80mm x 2.10mm
Figure 1(a). HTSSOP-B20
(BD93941EFV)
Figure 1(b). HSOP20
(BD93941FP)
Typical Application Circuit
VIN
VIN
Inductor
Diode
CIN
COUT
EXPOSED
PAD
REG58
CREG
RN2
FET
REG58
DN RN1
RCS
STB
N
VCC
CS
RRT
AGND
ROVP1
ROVP2
COVP
RFB CFB1
LED4
RT
LED3
OVP
FB
CFB2
LED_GND
RISET
CAUTO
ADIM
SS
ISET
CLED4
CLED3
LED2
LED1
CSS
RVCC
CVCC
DCDC_GND
PGND
ON/OFF
PWM
CLED2
CLED1
PWM
AGND
AUTO
ADIM
Figure 2. Typical Application Circuit
○Product structure：Silicon monolithic integrated circuit
.
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
○This product has not designed protection against radioactive rays
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Datasheet
BD93941EFV BD93941FP
Absolute maximum ratings (Ta=25°C)
Parameter
Symbol
Ratings
Unit
VCC
36
V
STB, ADIM, OVP, PWM
36
V
LED1 to 4
60
V
7
V
Power supply voltage
STB, ADIM, OVP, PWM terminal voltage
LED1 to 4 terminal voltage
AUTO, REG58, CS, N, ISET, SS, FB, RT terminal
voltage
Power dissipation (HTSSOP-B20)
(HSOP20)
Operating temperature range
AUTO, REG58, CS, N,
ISET, SS, FB, RT
Pd1
Pd2
Topr
3.20 *1
2.18 *2
-40 to +85
°C
Tstg
-55 to +150
°C
150
°C
Storage temperature range
Junction temperature
Tjmax
*1 Ta = 25°C or more, diminished at -25.6mW/°C in the case of HTSSOP-B20
(when 4-layer / 70.0 mm x 70.0 mm x 1.6 mm board is mounted)
*2 Ta = 25°C or more, diminished at -17.4mW/°C in the case of HSOP20
(when 4-layer / 70.0 mm x 70.0 mm x 1.6 mm board is mounted)
W
Operating Ratings
Parameter
Symbol
Limits
Unit
VCC
9.0 to 35.0
V
Min. output current of LED1 to 4
ILED_MIN
30
Max. output current of LED1 to 4
ILED_MAX
200
mA *1
mA
*1,2
VCC supply voltage
ADIM input voltage1 (use ADIM function)
VADIM1
ADIM input voltage1 (don’t use ADIM function)
VADIM2
0.2 to 2.7 (normal op.)
1.0 to 2.7
(start up)
REG58 to 35.0
Fsw
100 to 800
DC/DC oscillation frequency
V *3
V
kHz
Min. on-duty time for PWM light modulation
PWM_MIN
30
μs
*1 The amount of current per channel.
*2 If LED makes significant variations in its reference voltage, the driver will increase power dissipation, resulting in a rise
in package temperature.
To avoid this problem, design the board with thorough consideration given to heat radiation measures.
*3 To avoid unused LED pin’s misdetection, set ADIM within 1.0V to 2.7V at start up stage. After unused LED pin’s
detection, set ADIM within 0.2V to 2.7V in normal operation.
Pin Configuration
HSOP20
HTSSOP-B20
1
VCC
20
2
REG58
ADIM
19
3
CS
RT
18
4
N
FB
17
5
DCDC_GND
SS
16
6
OVP
ISET
15
7
STB
PWM
14
8
LED1
LED4
13
9
LED2
LED3
12
10
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
AUTO
LED_GND
N.C.
11
Figure 3. Pin Configuration
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Datasheet
BD93941EFV BD93941FP
Marking diagram and physical dimension
HTSSOP-B20
HSOP20
LOT No.
BD93941FP
D93941
LOT No.
Figure 4. Physical Dimension
Electrical Characteristics (Unless otherwise noted, Ta = 25oC, VCC=24V)
Parameter
Symbol
Limit
Min.
Typ.
Max.
Unit
Condition
[Whole Device]
Circuit current while in operation
ICC
-
4.5
9
mA
STB=3V,PWM=3V,
RT=100kΩ
Circuit current while in standby
ISTB
-
40
80
μA
STB=0V
REG58 Output Voltage
REG58
5.742
5.8
5.858
V
IO=0mA
REG58 available current
IREG58
15
-
-
mA
UVLO release voltage
VUVLO_VCC
6.5
7.5
8.5
V
UVLO hysteresis voltage
VUHYS_VCC
150
300
600
mV
VLED
0.35
0.37
0.39
V
fsw
142.5
150.0
157.5
kHz
RT=100kΩ
Max. duty cycle per output of N pin
DMAX
83
90
97
%
RT=100kΩ
On resistance on N pin source side
RONH
-
4
8
Ω
ION=-10mA
On resistance on N pin sink side
RONL
-
3
6
Ω
ION=10mA
SS pin source current
ISSSO
-4
-2
-1
uA
SS=2V
VSS_END
3.3
3.7
4.1
V
SS=SWEEP UP
IFBSINK
50
100
150
μA
LED=2.0V, FB=1.0V
IFBSOURCE
-150
-100
-50
μA
LED=0V, FB=1.0V
VCS
0.40
0.45
0.50
V
CS=SWEEP UP
[REG58 Block]
[UVLO Block]
VCC=SWEEP UP
VCC=SWEEP DOWN
[DC/DC Block]
Error amp. Reference voltage
Oscillation frequency
Soft start completion voltage
FB sink current
FB source current
Over current detection voltage
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ISET=75kΩ, ADIM=2.5V
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Datasheet
BD93941EFV BD93941FP
Electrical Characteristics (Unless otherwise noted, Ta = 25oC, VCC=24V)
Parameter
Symbol
Limit
Unit
Condition
Min.
Typ.
Max.
VOVP
2.7
3.00
3.3
V
VOVP_HYS
50
100
200
mV
OVP=SWEEP DOWN
VSCP
0.04
0.10
0.25
V
OVP=SWEEP DOWN
LED pin current accuracy 1
dILED1
-2
-
2
%
LED pin current accuracy 2
dILED2
-3.2
-
3.2
%
LED pin current accuracy 3
dILED3
-4.6
-
4.6
%
LED pin current accuracy 4
dILED4
-8
-
8
%
LED pin current accuracy 5
dILED5
-3
-
3
%
LED pin Leakage Current
ILLED
-2.5
-
2.5
μA
LED=60V
LED open detection voltage
VOPEN
0.05
0.2
0.285
V
LED=SWEEP DOWN
LED short detection voltage
VSHORT
4
5
6
V
LED=SWEEP UP
ILADIM
-2.5
-
2.5
μA
ADIM=3V
STB pin high-level voltage
STBH
2
-
35
V
STB=SWEEP UP
STB pin low-level voltage
STBL
-0.3
-
0.8
V
STB=SWEEP DOWN
STB pin pull-down resistance
RSTB
500
1000
1500
kΩ
STB=3.0V
PWM pin high-level voltage
PWMH
2
-
35
V
PWM=SWEEP UP
PWM pin low-level voltage
PWML
-0.3
-
0.8
V
PWM= SWEEP DOWN
PWM pin pull-down resistance
RPWM
180
300
420
kΩ
PWM=3.0V
[DC/DC Protection Block]
Overvoltage protection detection
voltage
Overvoltage protection detection
hysteresis voltage
Short circuit protection detection
voltage
OVP=SWEEP UP
[LED Driver Block]
ADIM pin Input Current
ILED=100mA,
(ADIM=2.5V,ISET=75kΩ)
ILED=70mA,
(ADIM=1.75V,ISET=75kΩ)
ILED=50mA,
(ADIM=1.25V,ISET=75kΩ)
ILED=30mA,
(ADIM=0.75V,ISET=75kΩ)
ILED=100mA,
(ADIM=7V,ISET=75kΩ)
[STB Block]
[PWM Block]
[Failure Indication Block (Open Drain)]
AUTO pin source current
IAUTO
-2
-1
-0.5
μA
AUTO=2V
AUTO pin Detection Voltage
VAUTO
3.6
4.0
4.4
V
AUTO=SWEEP UP
Abnormal Detection Timer
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TSZ22111・15・001
tCP
20
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ms
RT=75kΩ
TSZ02201-0F1F0C100270-1-2
12.Aug.2015 Rev.003
Datasheet
BD93941EFV BD93941FP
Pin Descriptions (BD93941EFV)
Pin No
Pin Name
In/Out
1
AUTO
Out
Auto-restart time setting pin
2
Power supply for N pin
-0.3 to 7
DC/DC output current detection and OCP detection pin
-0.3 to 7
DC/DC switching output pin
-0.3 to 7
REG58
Out
3
CS
In
4
N
Out
5
Function
Rating [V]
-0.3 to 7
DCDC_GND
-
6
OVP
In
Overvoltage protection detection pin
-0.3 to 36
-
7
STB
In
Enable pin
-0.3 to 36
8
Power GND pin
LED1
Out
Output pin 1 for LED
-0.3 to 60
9
LED2
Out
Output pin 2 for LED
-0.3 to 60
10
LED_GND
-
Ground pin for LED
-
11
LED3
Out
Output pin 3 for LED
-0.3 to 60
12
LED4
Out
Output pin 4 for LED
-0.3 to 60
13
PWM
In
External PWM light modulation signal input pin for LED1-4
-0.3 to 36
14
ISET
Out
LED current setting resistor connection pin
-0.3 to 7
15
GND
-
16
SS
Out
17
FB
In/Out
18
RT
Out
19
ADIM
20
VCC
-
Analog GND pin
Soft start pin / LED protection masking time setting pin.
-0.3 to 7
Error amp output pin
-0.3 to 7
DC/DC drive frequency setting resistor connection pin.
-0.3 to 7
In
Analog dimming DC voltage input pin
-0.3 to 36
In
Power supply pin
-0.3 to 36
Pin Descriptions (BD93941FP)
Pin No
Pin Name
In/Out
Function
1
AUTO
Out
Auto-restart time setting pin
2
Rating [V]
-0.3 ~ 7
REG58
Out
Power supply for N pin
-0.3 ~ 7
3
CS
In
DC/DC output current detection and OCP detection pin
-0.3 ~ 7
4
N
In
DC/DC switching output pin
-0.3 ~ 7
Power GND pin
5
DCDC_GND
-
FIN1
GND
-
6
OVP
In
-0.3 ~ 36
Overvoltage protection detection pin
7
STB
In
Enable pin
-0.3 ~ 36
8
LED1
Out
Output pin 1 for LED
-0.3 ~ 60
9
LED2
Out
Output pin 2 for LED
-0.3 ~ 60
10
LED_GND
-
Ground pin for LED
-
11
N.C.
-
Non connection pin
-
12
LED3
Out
Output pin 3 for LED
-0.3 ~ 60
13
LED4
Out
14
PWM
In
15
ISET
Out
FIN2
GND
-
16
SS
Out
17
FB
In/Out
18
RT
Out
DC/DC drive frequency setting resistor connection pin.
-0.3 ~ 7
19
ADIM
In
Analog dimming DC voltage input pin
-0.3 ~ 36
20
VCC
In
Power supply pin
-0.3 ~ 36
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TSZ22111・15・001
Output pin 4 for LED
-0.3 ~ 60
External PWM light modulation signal input pin for LED1-4
-0.3 ~ 36
LED current setting resistor connection pin
-0.3 ~ 7
-
Analog GND pin
Soft start pin / LED protection masking time setting pin.
-0.3 ~ 7
Error amp output pin
-0.3 ~ 7
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Datasheet
BD93941EFV BD93941FP
Pin ESD Type
REG58 / N / DCDC_GND / CS
ADIM
100k
FB
ADIM
LED1~4, LED_GND
RT
SS
PWM
ISET
STB
OVP
AUTO
Figure 5. Pin ESD Type
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Datasheet
BD93941EFV BD93941FP
Block Diagram
VIN
C IN
+
CREG58
COUT
REG58
OSDET
VCC
VCC
CVCC
STB
UVLO
(VCC)
REGULATOR
TSD
SCP
OVP
OVP
AUTO
FILTER
RT
+
OSC
PWM COMP
+
-
CAUTO
REG58
N
Control
Logic
DRIVER
SS
CSS
CS
Current
Sense
SS
Timer
DCDC_GND
ERR AMP
GND
+
FB
RFB
CFB
LED1
LED2
LED3
LED4
Current driver
DC
STOP4CH
STOP3CH
STOP2CH
STOP1CH
PWM
ADIM
ISET
ISET
LED_GND
Open-Short
Detect
LSP(5V fixed)
OSDET
Figure 6. Block Diagram
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Datasheet
BD93941EFV BD93941FP
Typical Performance Curve
1000
8
VCC=24V
Ta=25°C
STB=3V,
PWM=3V,
RT=100kΩ
7
N Frequency [MHz]
6
Icc [mA]
5
4
3
100
2
1
10
0
8
12
16
20
24
VCC [V]
28
32
10
36
1 40
200
160
VCC=24V
Ta=25°C
RISET=75kΩ
ADIM=2.5V
VCC=24V
Ta=25°C
RISET=75kΩ
1 20
1 00
120
ILED [mA]
ILE D [mA]
140
1000
Figure 8. N Frequency [MHz] vs. R_RT [kΩ]
Figure 7. Operating Current (ICC) [mA] vs. VCC[V]
180
100
R_RT [kΩ]
100
80
60
80
60
40
40
20
20
0
0
-40 -20
0
20
40 60 80 100 120 140
Temp [℃]
0
Figure 9. LED Current (ILED) [mA] vs. Temp [oC]
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TSZ22111・15・001
0.5
1
1.5
2
ADIM [V]
2.5
3
3.5
Figure 10. LED Current (ILED) [mA] vs. ADIM[V],
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Datasheet
BD93941EFV BD93941FP
Pin Function
○AUTO (1pin)
This sets up time till auto-restart time from the point of abnormal detection. Having 1μA constant current charge at external
capacitor connected to AUTO pin, it will start again when it becomes over 4.0V (The auto pin is shorted to GND, this IC’s
protection function operates latched off mode).
○Auto-restart period vs. AUTO capacitance (Ideal)
T AUTO
4 .0[V ] C AUTO
4 .0 10 6 C AUTO [sec]
6
1 .0 10 [ A ]
○REG58 (2pin)
The REG58 pin is used in the DC/DC converter driver block to output 5.8V power. The maximum operating current is 15mA.
Using the REG58 pin at a current higher than 15mA can affect the N pin output pulse, causing the IC to malfunction and
leading to heat generation of the IC itself. To avoid this problem, it is recommended to make load setting to the minimum
level.
Please place the ceramic capacitor connected to REG58 pin (2.2μF～10μF) closest to REG58-GND pin.
○CS (3pin)
The CS pin has the following two functions:
1. DC/DC current mode current feedback function
Current flowing through the inductor is converted into voltage by the current sensing resistor RCS connected to the CS pin
and this voltage is compared with voltage set with the error amplifier to control the DC/DC output voltage.
2. Inductor current limit function
The CS pin also incorporates the over current protection (OCP) function. If the CS pin voltage reaches 0.45V (Typ.) or more,
switching operation will be forcedly stopped.
○N (4pin)
The N pin is used to output power to the external NMOS gate driver for the DC/DC converter in the amplitude range of
approx. 0 to REG58. ON resistances is 4.0Ω(typ.) in sorrce (H side), 3.0Ω(typ.) in sink (L side).
Frequency setting can be made with a resistor connected to the RT pin. For details of frequency setting, refer to the
description of the RT pin.
○DCDC_GND (5pin)
The PGND pin is a power ground pin for the driver block of the output pin N.
○OVP (6pin)
The OVP pin is an input pin for over-voltage protection and short circuit protection of DC/DC output voltage. If over-voltage
is detected, the OVP pin will stop the DC/DC converter conducting step-up operation. When the short circuit protection
(SCP) function is activated, the DC/DC converter will stop operation, and then the timer will start counting. When the timer
completes counting the preset period of time, the LED drivers are stopped.
The OVP pin is of the high impedance type and involves no pull-down resistor, resulting in unstable potential in the
open-circuited state. To avoid this problem, be sure to make input voltage setting with the use of a resistive divider or
otherwise.
○STB (7pin)
The STB pin is used to make setting of turning ON and OFF the IC and allowed for use to reset the IC from shutdown.
Note: The IC state is switched (i.e., the IC is switched between ON and OFF state) according to voltages input in the STB
pin. Avoid using the STB pin between two states (0.8 to 2.0V).
○LED1 – LED4 (8,9,11,12pin)
The LED1 to 4 pins are used to output constant current to LED drivers. Current value setting can be made by connecting a
resistor to the ISET pin. For the current value setting procedure, refer to the description of “ISET pin”.
If any of the LED pins is put in an erroneous state (e.g. short circuit mode, open circuit mode, or ground short circuit mode),
the relevant protection function will be activated.
○LED_GND (10pin)
The LED_GND pin is a power ground pin used for the LED driver block.
○PWM (13pin)
The PWM pin is used to turn ON and OFF LED drivers. Light can be modulated by changing the duty cycle through the
direct input of a PWM light modulation signal. The high and low voltage levels of PWM pin is as listed in the table below:
State
PWM Voltage
LED ON state
PWM= 2.0V to 35V
LED OFF state
PWM= -0.3V to 0.8V
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Datasheet
BD93941EFV BD93941FP
○ISET (14pin)
The ISET pin is an output current setting resistor. Output current ILED varies in inverse proportion to resistance.
The relation between output current ILED and the resistance of ISET pin connection resistor RISET is given by the following
equation:
I LED [ mA]
3000
V ADIM [V ]
R ISET [ kΩ]
I LED [mA]
7500
RISET [ kΩ]
(ADIM=0.2V to2.7V)
(ADIM & gt; 4V to 35V)
Output current setting should be made in the range of 30 to 200mA.
It prepares automatically to suitable LED feedback voltage that can output LED current set by ISET pin.
In short LED feedback voltage is dropped when the LED current is small and the IC heating is held automatically.
In case of a large current is needed, raise the LED pin feedback voltage. And it adjusts automatically to LED pin voltage
that can be flow large LED current.
The calculation is as below.
VLED 3.7 I LED [ A] [V ]
The LED feedback voltage (VLED) is clamped to 0.3V (typ.) when the LED current (ILED) is less than 81.1mA.
ADIM input range is from 0V to 35V. And the range which the LED currents change with linearity is from 0.2V to 2.7V.
When it reaches under VISET×0.90V(typ.), the LED current is off to prevent from passing a large current to the LED pin
when the RISET is shorted and the ISET pin is shorted to the GND. And as the ISET pin returns to a normal state, the LED
current returns.
○GND (15pin)
The GND pin is an internal analog circuit ground of the IC.
○SS (16pin)
The SS pin is used to make setting of soft start time and duty for soft start. It performs constant current charge of 2.0 uA to
the external capacitor connected with SS terminal, which enables soft-start of DC/DC converter.
Since the LED protection function (OPEN/SHORT detection) works when the SS terminal voltage reaches 3.7 V (typ.) or
higher, it must be set to bring stability to conditions such as DC/DC output voltage and LED constant current drive operation,
etc. before the voltage of 3.7 V is detected.
○FB (17pin)
The FB pin is an output pin used for DC/DC current mode control error amplifier. In other words, the FB pin detects the
voltages of LED pins (1 to 4) and controls inductor current so that the pin voltage of the LED located in the row with the
highest Vf will come to 0.37V (ADIM=2.5V, ILED=100mA). As a result, the pin voltages of other LEDs become higher by Vf
variation. After completion of soft start, the FB pin is put into the high-impedance state with the PWM signal being in the low
state, thus maintaining the FB voltage.
○RT (18pin)
The RT pin is used to connect a DC/DC frequency setting resistor. DC/DC drive frequency is determined by connecting the
RT resistor.
Drive frequency vs. RT resistance (Ideal)
R RT
15000
f SW [ kHz ]
[ k ]
When RT is 100kΩ, Fsw is 150kHz(typ.). However, drive frequency setting should be made in the range of 100 kHz to 800
kHz.
○ADIM (19pin)
ADIM pin is for analog dimming. Output current is proportionality with input voltage. Basically, ADIM pin assumes the
voltage inputted externally using high accuracy of resistive divider and etc., IC internally is in OPEN (High impedance)
condition. Cannot use in an OPEN condition.
If you don't use analog dimming, please connect pull-up resistor to over 5V (for example REG58).
○VCC (20pin)
The VCC pin is used to supply power for the IC in the range of 9 to 35V.
If the VCC pin voltage reaches 7.5V (Typ.) or more, the IC will initiate operation. If it reaches 7.2V (Typ.) or less, the IC will
be shut down.
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Startup operation and soft start (SS) capacitance setting
The following section describes the sequence for the startup of this IC.
2uA
5V
SS
SLOPE
VOUT
Q D
PWM
SS
COMP
N
DRIVER
Css
OSC
ILED
SS=FB
Circuit
LED
LED_OK
VLED
PWM=L:STOP
FB
PWM
LED_DRIVER
Figure 12. Circuit behavior at startup
Figure 11. Startup waveform
Description of startup sequence
(1) Set the STB and PWM pin to “ON”.
(2) Set sll systems to “ON”, SS charge will be initiated.
At this time, a circuit in which SS pin voltage for soft start becomes equal to FB pin voltage operates to equalize the
FB pin and SS pin voltages regardless of whether the PWM pin is set to Low or High level.
(3) Since the FB pin and SS pin reach the lower limit of the internal sawtooth wave of the IC, the DC/DC converter
operates to start VOUT voltage rising.
(4) The Vout voltage continues rising to reach a voltage at which LED current starts flowing.
(5) When the LED current reaches the set amount of current, isolate the FB circuit from the SS circuit. With this, the
startup operation is completed.
(6) After that, conduct normal operation following the feedback operation sequence with the LED pins.
If the SS pin voltage reaches 3.7V or more, the LED protection function will be activated to forcedly end the SS and
FB equalizing circuit.
SS capacitance setting procedure
As aforementioned, this IC stops DC/DC converter when the PWM pin is set to Low level and conducts step-up operation
only in the section in which the PWM pin is maintained at High level. Consequently, setting the PWM duty cycle to the
minimum will extend the startup time. The startup time also varies with application settings of output capacitance, LED
current, output voltage, and others.
Startup time at minimum duty cycle can be approximated according to the following method:
Make maeasurement of VOUT startup time with a 100% duty cycle, first. Take this value as “Trise100”.
The startup time “Trise_min” for the relevant application with the minimum duty cycle is given by the following equation.
Trise _ min
Trise _100[Sec]
Min _ Duty [ratio]
[Sec]
However, since this calculation method is just for approximation, use it only as a guide.
Make setting of time during which the SS pin voltage reaches the FB pin voltage longer than this startup time.
Assuming that the FB pin voltage is VFB, the time is given by the following equation:
Tss
Css [ F ] VFB[V ]
2[A]
[Sec]
As a result, it is recommended to make SS capacitance setting so that “Tss” will be greater than “Trise_min”
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About unused LED terminal automatic detecting function
This IC is detected automatically that it is an unused channel by asssuming the LED terminal to be OPEN at starting. It
explains the sequence.
｛
Figure 14. Block diagram
Sequence;
① STB=ON
② All systems are ON at initial timing of PWM=H. SS starts charging.
③ When the output voltage is boosted enough, and enough current flows through the LED, LED_OK signal is switched
in the IC. PWM=L from the Rise timing of this signal for about 20us
④ During this PWM=L period, LED pins with LED connections' output voltage becomes 0.2V and above, where as
unused LED pins are below 0.2V.
⑤ During this time, determination on whether the LED pins are 0.2V above/below is done.
⑥ After the determination, unused LED pins are pulled up to 5V.
⑦The AUTO signal remains “L” level.
In addition, automatic determination of the OPEN decision will only be in SS range, therefore, please set the application so
that the step-up/boost be completed before SS & gt; 3.7V.
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LED current setting
Setting of LED output current “ILED” can be made by connecting a resistor RISET to the ISET pin.
RISET vs. ILED current relation equation
R ISET
7500
[ k]
I LED [ mA]
(ADIM=2.5V)
However, LED current setting should be made in the range of 30mA to 200mA.
[Setting example]
To set ILED current to 100mA, RISET resistance is given by the following equation:
R ISET
7500
7500
75 [k]
I LED [mA] 100[ mA]
DC/DC converter drive frequency setting
DC/DC converter drive frequency is determined by making RT resistance setting.
Drive frequency vs. RT resistance (ideal) relation equation
R RT
15000
f SW [ kHz ]
[ k ]
where fsw DC/DC converter oscillation frequency [kHz]
This equation has become an ideal equation without any correction item included.
For accurate frequency settings, thorough verification should be performed on practical sets.
[Setting example]
To set DC/DC drive frequency “fsw” to 200 kHz, RRT is given by the following equation:
RRT
15000
15000
75 [ k]
f sw [ kHz ] 200[ kHz ]
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OVP/SCP Settings
OVP pin is DC/DC output voltage’s over voltage protection and short circuit protection input pin.
OVP pin is a high impedance pin with no pull down resistor. Thus, at OPEN state please set the voltage
input settings using voltage dividing resistor and such.
Respective OVP pin protection conditions are as below
Protection
Name
Detection
Pin
Detection
Condition
Cancellation
Condition
OVP
OVP
OVP & gt; 3.0V
OVP & lt; 2.9V
SCP
OVP
OVP & lt; 0.1V
OVP & gt; 0.1V
Timer
Operations
No
Yes
Protection Type
DCDC stops during
detection
All latch
○OVP Detection Setting
VOUT abnormally increase、voltage detected by OVP, VOVPDET,
R1,R2 settings are as follows
R1 R2[k]
(VOVP [V ] 3.0[V ])
DET
[k]
3.0[V ]
○OVP Cancellation Setting
R1,R2 set from above equation,
OVP cancellation voltage VOVPCAN equals to
VOVP 2.9V
CAN
( R1[k] R2[k])
[V ]
R2[k]
Figure 15. OVP/SCP setting example
○SCP Detection Setting
When R1,R2 are set using values obtained above, SCP voltage setting is VSCPDET is as follows
VSCP 0.1V
DET
( R1[k] R2[k])
[V ]
R2[k]
【Setting Example】
VOUT at normal operation 56V、OVP detection voltage VOVPDET=68V、R2=10k, R1 is as follows
R1 R2[k]
(VOVPDET [V ] 3.0[V ])
(68[V ] 3[V ])
10[k]
216.7 [k]
3.0[V ]
3[V ]
When R1, R2 are set at these values, OVP cancellation voltage, VOVPCAN
VOVP 2.9[V ]
CAN
( R1[k] R2[k])
10[k] 216.7[k]
2.9[V ]
[V ] 65.7 [V ]
10[k]
R2[k]
In addition, at this R1, R2, SCP detection voltage
VSCPDET 0.1[V ]
( R1[k] R2[k])
10[k] 216.7[k]
0.1[V ]
[V ] 2.27 [V ]
R2[k]
10[k]
To select DC/DC components, give consideration to IC variations as well as individual component variations,
and then conduct thorough verification on practical systems.
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Timer Latch Time Setting
This IC has a built-in timer latch counter. Timer latch time is set by counting the clock frequency which is
set at the RT pin. After
Timer Latch Time
When various abnormal conditions happen, counting starts from the timing, latch occurs after below time has passed.
Furthermore, even if PWM=L, if abnormal condition continues, timer count will not reset.
LATCHTIME 212
RRT
R [k]
4096 RT 7 [s]
10
1.5 10
1.5 10
Here, LATCHTIME = time until latch condition occurs
RRT = Resistor value connected to RT pin
Figure 16. Example of LED Short protection timing chart
【Setting Example】
Timer latch time when RT=75kohm
LATCHTIME 4096
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75[k]
4096
0.02[s]
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OCP Settings/DCDC Components’ Current Capacity Selection Method
One of the function of CS pin - when its pin voltage & gt; 0.45 it stops the DCDC. Thus, RCS resistor value
need to be checked after the peak current flow through the inductor is calculated. Furthermore, DCDC external
components’ current capacity needs to be greater than peak current flowing through this inductor.
（Inductor peak current Ipeak calculation method）
Firstly, ripple voltage which occurs at the CS pin is decided depending on the DCDC application conditions.
The conditions when made as below;
Output voltage=VOUT[V]
LED total current=IOUT[A]
DCDC input voltage=VIN[V]
DCDC efficiency =η[%]
Total required average input current IIN:
I IN
VOUT [V ] I OUT [ A]
[ A]
VIN [V ] [%]
Inductor ripple current IL[A] which occurs at inductor L[H] during
DCDC drive operation with switching frequency=fsw[Hz] is as follows
Δ IL
(VOUT [V ] V IN [V ]) V IN [V ]
[ A]
L[ H ] VOUT [V ] f SW [ Hz ]
Figure 17. DC/DC convertor application circuit
Therefore, IL’s peak current Ipeak can be calculated using below equation
Ipeak I IN [ A]
IL[ A]
2
[ A] (1)
(Resistor RCS connected to CS pin selection method)
This Ipeak flows in RCS and generates voltage. (refer to time chart
diagram on the right). This voltage value, VCSpeak can be calculated as below
VCS peak Rcs Ipeak
[V ]
This VCSpeak when reach 0.45V, will stop the DCDC output.
Thus when selecting RCS value, below condition needs to be met.
Rcs [ ] Ipeak [ A] 0.45[V ]
(DCDC Components’ Current Capacity Selection Method)
When OCP reach detection voltage CS=0.45V, Iocp current
I OCP
0.45[V ]
[ A] ( 2 )
Rcs[ ]
Figure 18. Inductor current waveform
Ipeak current (1)、IOCP current (2)、and components’ MAX current capacity needs to satisfy the following
I peak I OCP
Rated current of components
Above condition needs to be satisfied when selecting DCDC application parts eg. FET, inductor, diode etc.
Furthermore, continuous mode is recommended for normal DCDC applications. Inductor’s ripple current MIN limit value,
lmin becoming
Im in I IN [ A]
IL[ A]
[ A] 0
2
Is a condition to be met. If this is not met, it is called discontinuous mode.
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【Setting Example】
Output voltage=VOUT[V]=56V
LED total current=IOUT[A]=100mA×4ch=0.40A
DCDC input voltage=VIN[V]=14V
DCDC efficiency=η[%]=90%
Total required average input current IIN:
I IN [ A]
VOUT [V ] I OUT [ A] 56[V ] 0.40[ A]
1.78 [ A]
14[V ] 90[%]
VIN [V ] [%]
When, DCDC switching frequency =fsw[Hz]=200kHz
Inductor L[H]=33uH,
Inductor ripple current ΔIL[A]:
Δ IL
(VOUT [V ] V IN [V ]) V IN [V ]
(56[V ] 14[V ]) 14[V ]
1.59 [ A]
L[ H ] VOUT [V ] f SW [ Hz ]
33 10 6 [ H ] 56[V ] 200 10 3 [ Hz ]
Thus, IL peak current Ipeak becomes
Ipeak I IN [ A]
IL[ A]
1.59[ A]
[ A] 1.78[ A]
2.58 [ A]
2
2
…Peak current calculation result
RCS resistor value when set at 0.1ohm
VCS
peak
Rcs Ipeak 0 . 10 [ ] 2 . 58 [ A ] 0 . 258
[V ] 0 . 45V
…RCS resistor consideration
and satisfy the condition.
In addition、OCP detection current IOCP at this time is
I OCP
0.45[V ]
4 . 5 [ A]
0.1[ ]
If parts used (FET,INDUCTOR、DIODE etc)’s current capacity & lt; 5A,
I peak I OCP
Rated current of components
2.58[ A] 4.5[ A] 5[ A]
…DCDC current capacity consideration
Thus, there is no problem of parts selection as the above condition is satisfied.
In addition、IL ripple current minimum limit Imin is
Im in I IN [ A]
IL[ A]
[ A] 1.78[ A] 0.795[ A] 0.985[ A] 0
2
Thus、will not become discontinuous mode。
To select DC/DC components, give consideration to IC variations as well as individual component variations, and
then conduct thorough verification on practical systems.
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Selection of inductor L
The value of inductor has significant influence on the input ripple current. As
shown by Equation (1), the larger the inductor and the higher the switching
frequency, the inductor ripple current ∆IL becomes increasingly lower.
ΔIL
ΔIL
VIN
(VOUT V IN ) V IN
[ A] ・・・・・
(1)
L VOUT f SW
Expressing efficiency as shown by Equation (2), peak input current is given
as Equation (3).
VOUT I OUT
・・・・・
(2)
V IN I IN
ΔIL VOUT I OUT
ΔIL
ILMAX I IN
・・・・・
(3)
2
VIN
2
IL
L
VOUT
RCS
COUT
where, L: Reactance value [H],
VOUT : DC/DC output voltage [V],
VIN: Input voltage [V],
IOUT: Output load current (total output current) [A],
IIN: Input current [A], and
FSW: Oscillation frequency [Hz]
.
Figure 19. Inductor current waveform and diagram
Note: If a current in excess of the rated current of the inductor applies to the coil, the inductor will cause magnetic
saturation, resulting in efficiency degradation.
Select an inductor with an adequate margin so that peak current will not exceed the rated current of the
inductor.
Note: To reduce power dissipation from and increase efficiency of inductor, select an inductor with low resistance
component (DCR or ACR).
Selection of output capacitor COUT
Select a capacitor on the output side taking into account the stability region
of output voltage and equivalent series resistance necessary to smooth
ripple voltage. Note that higher output ripple voltage may result in a drop in
LED pin voltage, making it impossible to supply set LED current.
The output ripple voltage ∆VOUT is given by Equation (4).
VIN
IL
L
ΔVOUT ILMAX R ESR
VOUT
RESR
RCS
COUT
1
C OUT
I OUT
1
f SW
[V ] ・・・・・
(4)
where RESR Equivalent series resistance of COUT.
Note: Select capacitor ratings with an adequate margin for output voltage.
Note: To use an electrolytic capacitor, an adequate margin should be
provided for permissible current. Particularly to apply PWM light modulation
to LED, note that a current higher than the set LED current transiently flows.
Figure 20. Output capacitor diagram,
Selection of switching MOSFET transistors
There will be no problem for switching MOSFET transistors having absolute maximum rating higher than rated current of the
inductor L and VF higher than “COUT breakdown voltage Rectifier diode”. However, to achieve high-speed switching, select
transistors with small gate capacity (injected charge amount).
Note: Rated current larger than over current protection setting current is recommended.
Note: Selecting transistors with low on resistance can obtain high efficiency.
Selection of rectifier diodes
Select Schottky barrier diodes having current capability higher than the rated current of the inductor L and
breakdown voltage higher that COUT breakdown voltage, particularly having low forward voltage VF.
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Phase Compensation Setting Procedure
DC/DC converter application for current mode control includes one each of pole fp (phase delay) by CR filer consisting of output
capacitor and output resistor (i.e., LED current) and zero (phase lead) fZ by the output capacitor and capacitor ESR.
Furthermore, the step-up DC/DC converter includes RHP zero “fZRHP” as the second zero. Since the RHP zero has phase delay
(90) characteristics like the pole, the crossover frequency fc should be set to not more than RHP zero
VOUT
VIN
ILED
L
VOUT
gm
RESR
+
RCS
COUT
FB
RFB1
CFB2
CFB1
Figure 21. Output stage and error amplifier diagram
i.
Find pole fp and RHP zero fZRHP of DC/DC converter.
fp
Where
ii.
I LED
[ Hz
]
2 VOUT COUT
ILED Total LED current [A],
D
f ZRHP
VOUT VIN
VOUT
VOUT (1 D) 2
[ Hz
]
2 L I LED
Find phase compensation to be inserted in the error amplifier. (Set fc to 1/5 of fZRHP.)
R FB1
C FB1
where
iii.
f RHZP RCS I LED
[
]
5 f p gm VOUT (1 D)
1
5
[F ]
2 RFB1 f C
2 RFB1 f ZRHP
gm 4.0 10 4 [ S ]
Find zero used to compensate ESR (RESR) of COUT (electrolytic capacitor).
C FB 2
RESR C OUT
[F
]
RFB1
Note: Even if a ceramic capacitor (RESR of the order of milliohms) for COUT, it is recommended to insert CFB2 for
stable operation.
To improve transient response, it is necessary to increase RFB1 and reduce CFB1. However, this improvement reduces a phase
margin. To avoid this problem, conduct thorough verification, including variations in external components, on practical
systems.
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Timing Chart
VCC
7.5V
2.0V
STB
0.8V
2.6V
REG58
2.4V
ISET
RT
3.7V
SS
SS=FB or LED
feed-back
FB
LED
feed-back
VOUT
2.0V
PWM
ILEDｘ
LED_OPEN
LED_SHORT
Disable
Enable
Disable
ISET_GND_SHORT
Disable
Enable
Disable
REG58_UVLO
VCC_UVLO
Disable
Enable
Disable
OVP
SCP
FB OVER SHOOT
Disable
Enable
Disable
Figure 22. Timing chart
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List of Protect Function (typ condition)
Protection
Name
Detection
Pin
Detection Conditions
Detection pin
PWM
Cancellation
Conditions
SS
Protection Type
Immediately Auto-Restart
after detection
(Judge periodically
whether normal or not)
Immediately Auto-Restart
after detection
(Judge periodically
whether normal or not)
LED OPEN
LEDｘ
LEDx & lt; 0.2V
H
SS & gt; 3.7V
LEDx & gt; 0.2V
LEDSHORT
LEDｘ
LEDx & gt; 5V
H
SS & gt; 3.7V
LEDx & lt; 5V
ISET GND
SHORT
ISET
-
-
REG58 UVLO
REG58
REG58 & lt; 2.4V
-
-
REG58 & gt; 2.6V
Auto-Restart
VCC UVLO
VCC
VCC & lt; 7.3V
-
-
VCC & gt; 7.5V
Auto-Restart
OVP
OVP
OVP & gt; 3.0V
-
-
OVP & lt; 2.9V
SCP
OVP
OVP & lt; 0.1V
-
-
OVP & gt; 0.1V
FB OVER
SHOOT
FB
FB & gt; 4V
-
-
FB & lt; 3.6V
Auto-Restart
Immediately Auto-Restart
after detection
(Judge periodically
whether normal or not)
Immediately Auto-Restart
after detection
(Judge periodically
whether normal or not)
OCP
CS
OCP & gt; 0.45V
-
-
-
Under
ISET×90%
Above
ISET×90%
Auto-Restart
Pulse-by-Pulse
To clear the latch type, STB should be set to “L” once, and then to “H”.
Operation after the protection function detected
Protection Function
DC/DC
LED Driver
Soft-start
Only detects LED,
stops after CP1 count
Only detects LED,
stops after CP1 count
Stop immediately
Stop
(and when REG58 & lt; 2.4V)
Stop immediately
Discharge immediately
Stop immediately
Discharge immediately
Continue to operate
Continue to operate
LED OPEN
Continue to operate
LEDSHORT
Continue to operate
ISET GND SHORT
Stop immediately
STB
Stop immediately
REG58 UVLO
Stop immediately
VCC UVLO
Stop after CP1 count
Discharge after CP1 count
FB OVER SHOOT
Stop immediately
Stop immediately
(N pin only)
Stop immediately
(N pin only)
Stop after CP2 count
Stop after CP2 count
Continue to operate
OCP
N pin limits DUTY
Continue to operate
Continue to operate
OVP
SCP
Continue to operate
Continue to operate
Continue to operate
Discharge immediately
* CP1 = 20ms (RT=75KΩ) , CP2=1.31s (RT=75KΩ)
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BD93941EFV BD93941FP
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply terminals.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Rush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
8.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
9.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
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BD93941EFV BD93941FP
Operational Notes – continued
10.
Unused Input Terminals
Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance
and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to
the power supply or ground line.
11. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND & gt; Pin A and GND & gt; Pin B, the P-N junction operates as a parasitic diode.
When GND & gt; Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Figure 23. Example of monolithic IC structure
12.
Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
13. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
14. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
15. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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Datasheet
BD93941EFV BD93941FP
Ordering Information
B
D
9
3
9
Part Number
4
1
F
P
Package
EFV: HTSSOP-B20
FP : HSOP20
-
E2
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagrams
HSOP20 (TOP VIEW)
HTSSOP-B20 (TOP VIEW)
Part Number Marking
Part Number Marking
D 9 3 9 4 1
BD93941FP
LOT Number
1PIN MARK
1PIN MARK
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LOT Number
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Datasheet
BD93941EFV BD93941FP
Physical Dimension, Tape and Reel Information 1
Package Name
HTSSOP-B20
& lt; Tape and Reel information & gt;
Tape
Embossed carrier tape (with dry pack)
Quantity
2000pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
Direction of feed
1pin
Reel
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)
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Datasheet
BD93941EFV BD93941FP
Physical Dimension, Tape and Reel Information 2
Package Name
HSOP20
Max. 15.25 ( include. BURR )
Drawing No.
& lt; Tape and Reel information & gt;
Tape
Embossed carrier tape
Quantity
2000pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
Direction of feed
1pin
Reel
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)
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Datasheet
BD93941EFV BD93941FP
Revision History
Date
Revision
10.Oct.2013
001
24.Dec.2014
002
12.Aug.2015
003
Changes
Draft Version
P.2 ADIM input voltage1 (use ADIM function)
Add ADIM range at start up and add note *3
p.3 [REG58 Block]
Soft start completion voltage - & gt; REG58 available current
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Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001