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Internal Use Only
Service Manual
LG-P920
Date: June, 2011 / Issue 1.0
Table Of Contents
1. INTRODUCTION ..................................................................... 3
4.6 GPS/WIFI/BT RF components ........................................................... 9
1.1 Purpose ........................................................................................................ 3
4.7 GPS/WIFI/BT SIGNAL PATH ................................................................ 94
1. Regulatory Information ......................................................................... 3
4.8 Power ON Troubleshooting............................................................... 96
1.3 Abbreviations............................................................................................. 5
4.9 Charger Troubleshooting ................................................................. 101
2. PERFORMANCE...................................................................... 7
.1 Product Name............................................................................................ 7
. Supporting Standard .............................................................................. 7
.3 Main Parts : GSM Solution..................................................................... 7
.4 HW Features ............................................................................................... 8
.5 SW Features ............................................................................................. 10
.6 HW SPEC. ................................................................................................. 13
.7 P90 Figures ............................................................................................ 3
4.10 USB Trouble shooting ..................................................................... 104
4.11 Audio trouble ..................................................................................... 107
4.1 Camera trouble(5M/VGA).............................................................. 118
4.13 Main LCD trouble ..............................................................................1
4.14 SIM detect Trouble shooting........................................................17
4.15 Vibrator Troubleshooting ..............................................................19
4.16 HDMI Troubleshooting ...................................................................13
4.17 Motion Sensor on/off trouble...................................................... 134
4.18 Gyro/Compass sensor troubleshooting .................................. 137
3. TECHNICAL BRIEF ................................................................ 24
4.19 Proximity Sensor on/off trouble ................................................. 140
3.1 Radio Part General ................................................................................ 5
4.0 Illumination Sensor on/off trouble............................................14
3. Radio Part Rx Section........................................................................... 6
4.1 Touch trouble ..................................................................................... 144
3.3 Radio Part Tx Section ........................................................................... 7
3.4 Radio Part Interfaces ............................................................................ 8
3.5 Digital Baseband (OMAP4430) ........................................................ 9
3.6 Hardware Architecture........................................................................ 31
3.7 Subsystem (PMB9811_X-GOLDTM66) ....................................... 3
3.8 Power Block ............................................................................................. 45
3.9 External memory interface................................................................ 5
3.10 Audio and sound ................................................................................ 53
3.11 Main (5M pixels) & Sub (VGA) Camera ....................................... 58
3.1 Display..................................................................................................... 60
3.13 Vibrators.................................................................................................. 64
5. BLOCk DIAGRAM .............................................................. 148
6. CIRCUIT DIAGRAM ............................................................ 152
7. BGA PIN MAP .................................................................... 169
8. PCB LAYOUT ....................................................................... 178
9. CALIBRATION ..................................................................... 191
9.1 Configuration of Tachyon ................................................................ 191
9. How to use Tachyon ........................................................................... 193
10. HIDDEN MENU................................................................. 196
3.14 HDMI ........................................................................................................ 65
3.15 Compass Sensor .................................................................................. 66
11. EXPLODED VIEW & REPLACEMENT PART LIST ............. 218
3.16 Motion Sensor...................................................................................... 67
11.1 EXPLODED VIEW................................................................................18
3.17 Gyro Sensor ........................................................................................... 68
11. Replacement Parts ...........................................................................19
3.18 Illumination & Proximity Sensor ................................................... 69
11.3 Accessory .............................................................................................5
3.19 Touch Module ...................................................................................... 70
3.0 Main Features ....................................................................................... 71
4. TROUBLE SHOOTING .......................................................... 72
4.1 RF Component ....................................................................................... 7
4. SIGNAL PATH ........................................................................................... 73
4.3 Checking TCXO Block........................................................................... 76
4.4 Checking WCDMA Block .................................................................... 78
4.5 Checking GSM Block ............................................................................ 85
LGE Internal Use Only
--
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
1. INTRODUCTION
1. INTRODUCTION
1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company's employees, agents, subcontractors, or person working on your
company's behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system. There are may be risks of toll fraud associated
with your telecommunications system. System users are responsible for programming and configuring the
equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune
from the above case but will prevent unauthorized use of common-carrier telecommunication service of
facilities accessed through or connected to it.
The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone service
until repair can be done. A telephone company may temporarily disconnect service as long as repair is not
done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the this phone or compatibility with the
network, the telephone company is required to give advanced written notice to the user, allowing the user
to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorized
agent. The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and
may void any remaining warranty.
4/140
LGE Internal Use Only
-3-
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
2. INTRODUCTION
E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information such
as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation
Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from
unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated
by the sign. Following information is ESD handling:
o Service personnel should ground themselves by using a wrist strap when exchange system boards.
o When repairs are made to a system board, they should spread the floor with anti-static mat
which is also grounded.
o Use a suitable, grounded soldering iron.
o Keep sensitive parts in these protective packages until these are used.
o When returning system boards or parts like EEPROM to the factory, use the protective
package as described.
5/140
LGE Internal Use Only
-4-
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
1. INTRODUCTION
1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
APC
Automatic Power Control
BB
Baseband
BER
Bit Error Ratio
CC-CV
Constant Current - Constant Voltage
DAC
Digital to Analog Converter
DCS
Digital Communication System
dBm
dB relative to 1 milli watt
DSP
Digital Signal Processing
EEPROM
Electrical Erasable Programmable Read-Only Memory
ESD
Electrostatic Discharge
FPCB
Flexible Printed Circuit Board
GMSK
Gaussian Minimum Shift Keying
GPIB
General Purpose Interface Bus
GSM
Global System for Mobile Communications
IPUI
International Portable User Identity
IF
Intermediate Frequency
LCD
Liquid Crystal Display
LDO
Low Drop Output
LED
Light Emitting Diode
OPLL
Offset Phase Locked Loop
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LGE Internal Use Only
-5-
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
1. INTRODUCTION
PAM
Power Amplifier Module
PCB
Printed Circuit Board
PGA
Programmable Gain Amplifier
PLL
Phase Locked Loop
PSTN
Public Switched Telephone Network
RF
Radio Frequency
RLR
Receiving Loudness Rating
RMS
Root Mean Square
RTC
Real Time Clock
SAW
Surface Acoustic Wave
SIM
Subscriber Identity Module
SLR
Sending Loudness Rating
SRAM
Static Random Access Memory
PSRAM
Pseudo SRAM
STMR
Side Tone Masking Rating
TA
Travel Adapter
TDD
Time Division Duplex
TDMA
Time Division Multiple Access
UART
Universal Asynchronous Receiver/Transmitter
VCO
Voltage Controlled Oscillator
VCTCXO
Voltage Control Temperature Compensated Crystal Oscillator
WAP
Wireless Application Protocol
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LGE Internal Use Only
-6-
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
2. PERFORMANCE
2.1 Product Name
P920 : WCDMA900/1700/1900/2100+EGSM/GSM850/DCS/PCS
(HSUPA 5.8Mbps(cat6)/HSDPA 14.4Mbps(cat10)/GPRS Class12/EDGE Class12)
2.2 Supporting Standard
Item
Feature
Comment
Supporting Standard
WCDMA(FDD1,2,8)/EGSM/GSM850/DCS1800/PCS1900
with seamless handover
Phase 2+(include AMR)
SIM Toolkit
: Class 1, 2, 3, C-E
Frequency Range
WCDMA(FDD1) TX : 1920 - 1980 MHz
WCDMA(FDD1) RX : 2110 - 2170 MHz
WCDMA(FDD2) TX : 1850 - 1910 MHz
WCDMA(FDD2) RX : 1930 - 1990 MHz
WCDMA(FDD4) RX : 2112 - 2153 MHz
WCDMA(FDD4) TX : 1712 - 1753 MHz
WCDMA(FDD8) TX : 880 - 915 MHz
WCDMA(FDD8) RX : 925 - 960 MHz
EGSM TX : 880 - 915 MHz
EGSM RX : 925 - 960 MHz
GSM850 TX: 824 - 849 MHz
GSM850 RX: 869 - 894 MHz
DCS1800 TX: 1710 - 1785 MHz
DCS1800 RX: 1805 - 1880 MHz
PCS1900 TX: 1850 - 1910 MHz
PCS1900 RX: 1930 - 1990 MHz
Application Standard
2.3 Main Parts : GSM Solution
Item
Part Name
AP Chip
OMAP 4430 : TI
CP Chip
XMM6260 : Infineon
LGE Internal Use Only
Comment
-7-
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
2.4 HW Features
Item
Feature
Comment
Form Factor
DOP type
Battery
1) Capacity
Standard : Li-Ion Polymer, 1500mAh
2) Packing Type : Soft Pack
Size
Standard :128.8 x 68 x 11.9mm
Weight
162g
Volume
TBD
PCB
L1B1 type, 10 Layers , 0.8t
Stand by time
2G Up to 500 hrs
3G Up to 500 hrs
@ Paging Period 9 (2G)
@ DRX 7 (3G)
Charging time
3 hrs
@ Power Off / 1500mAh
Talk time
2G Up to 1200mins
3G Up to 600 mins
@ Tx=Max(2G)
@ Tx = 12dBm (3G)
RX sensitivity
WCDMA(FDD1) : -106.7 dBm
WCDMA(FDD2) : -106.7 dBm
WCDMA(FDD8) : -106.7 dBm
EGSM
: -105 dBm
GSM850
: -105 dBm
DCS 1800
: -105 dBm
PCS 1900
: -105 dBm
TX
output
power
WCDMA/
GSM/
GPRS
WCDMA : 24dBm/3.84MHz,+1/-3dBm
EGSM
: 33dBm
GSM850
: 33 dBm
DCS 1800
: 30 dBm
PCS 1900
: 30 dBm
Class3(WCDMA)
Class4 (EGSM)
Class4 (GSM850)
Class1 (PCS)
Class1 (DCS)
EDGE
GSM 900
DCS 1800
PCS 1900
E2 (GSM900)
E2 (PCS)
E2 (DCS)
GPRS compatibility
EDGE Class 12
SIM card type
: 27 dBm
: 26 dBm
: 26 dBm
GPRS Class 12
EDGE compatibility
With Battery
Plug-In SIM
2.85V /1.8V
LGE Internal Use Only
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Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
Display
Main LCD (WVGA)
TFT Main LCD(4.3", 480X800)
Built-in Camera
3D Camera, VGA secondary
Status Indicator
No
Keypad
Function Key : 4
Side Key
:4
ANT
Main : LDS(Laser Direct Structure) type
Sub : DPA type(Directed Print Antenna)
System connector
5 Pin Micro USB
Ear Phone Jack
3.5Phi, 4 Pole, Stereo
PC synchronization
Yes
Memory(AP)
eMMC : 8GB
LP-DDR2 : 512MB
Speech coding
FR, EFR, HR, AMR
Data & Fax
Built in Data & Fax support
Vibrator
Built in Vibrator
BlueTooth
V2.1 + EDR
MIDI(for Buzzer
Function)
72 Poly, MP3 Ringtone
Music Player
MP3/ WMA/AAC/AAC+/WAV/AC3
Video Player
MPEG4, H.263, H.264 @ Full HD 30fps/ Divx HD
Camcorder
MPEG4, H.264, H.263 @ 3D : 720p 2D : 1080p
30pfs
Voice Recording
Yes
Speaker Phone mode
Support
Yes
Travel Adapter
Yes
CDROM
No
Stereo Headset
Yes
Data Cable
Yes
T-Flash
(External Memory)
Yes
LGE Internal Use Only
5M AF CMOS CAM 2EA
Function Key:
Home,Back, menu,serach
Side Key :
Volume up,down, power key,
3D key
2.0 HS
Upto 32GB
-9-
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
2.5 SW Features
Item
Feature
RSSI
0 ~ 4 Levels
Battery Charging
0 ~ 6 Levels
Key Volume
0 ~ 7 Level
Audio Volume
1 ~ 15 Level
Time / Date Display
Yes
Multi-Language
Yes
Quick Access Mode
Phone / Contacts / Messaging / Menu
PC Sync
Yes
Speed Dial
Yes
Voice mail center - & gt; 1 key
Profile
Yes
not same with feature phone setting
CLIP / CLIR
Yes
Phone Book
Name / Number / Email / Chat Id /
Website / Postal addresses /
Organizations / Groups / BirthdayNotes /
Ringtone
There is no limitation on the number of
items.
It depends on available memory
amount.
Last Dial Number
Yes
There is no limitation on the number of
items.
It depends on available memory
amount.
Last Received
Number
Yes
There is no limitation on the number of
items.
It depends on available memory
amount.
Last Missed Number
Yes
There is no limitation on the number of
items.
It depends on available memory
amount.
Search by Number
/ Name
Name / N
Group
Yes
LGE Internal Use Only
Comment
CZECH , DUTCH , FRENCH , GERMAN ,
GREEK , ITALIAN , PORTUGUESE ,
SPANISH , ARABIC , HEBREW , T CHINESE
T W , S CHINESE , ROMANIAN ,
HUNGARIAN , SLOVAK , CROATIAN ,
BULGARIAN , MACEDONIAN , ICELANDIC
There is no limitation on the number of
items.
It depends on available memory
amount.
- 10 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
Fixed Dial Number
Yes
Service Dial Number
No
Own Number
Yes
Read only
(add/edit/delete are not supported)
Voice Memo
Yes
Support voice recorder
Call Reminder
Yes
Missed call popup
Network Selection
Automatic
Mute
Yes
Call Divert
Yes
Call Barring
Yes
Call Charge (AoC)
Yes
Call Duration
Yes
SMS (EMS)
There is no limitation on the number of
items.
It depends on available memory
amount.
SMS Over GPRS
No
EMS Melody / Picture
Send / Receive / Save
No
No
MMS MPEG4
Send / Receive / Save
Yes
Yes
Long Message
MAX 1000 characters
Cell Broadcast
Yes
Download
Over the Web
Game
Yes
Calendar
Yes
Memo
Yes
World Clock
Yes
Unit Convert
No
Stop Watch
Yes
Wall Paper
Yes
WAP Browser
No
WAP stack and wml are not supported.
Download Melody /
Wallpaper
Yes
Over web browser
SIM Lock
Yes
Operator Dependent
SIM Toolkit
Class 1, 2, 3, C, D
MMS
Yes
EONS
Yes
LGE Internal Use Only
EMS does not support.
SMS 10 concatenated
There is no limitation on the number of
items.
It depends on available memory
amount.
- 11 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
CPHS
Yes
ENS
Yes
Camera
Yes
5M AF /
Digital Zoom : x8
JAVA
No
Android do not support JAVA
Voice Dial
No
IrDa
No
Bluetooth
Yes
FM radio
Yes
GPRS
Yes
Class 12
EDGE
Yes
Class 12
Hold / Retrieve
Yes
Conference Call
Yes
DTMF
Yes
Memo pad
Yes
T TY
No
AMR
Yes
SyncML
Yes
IM
Yes
Email
Yes
LGE Internal Use Only
V4.2
Ver. 2.1+EDR
(GAP, A2DP, AVRCP, DUN, FTP, GAVDP,
GOEP, HFP, HSP, OPP, SDAP, SPP)
Max. 6
Rich Note
Gtalk
- 1 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
2.6 HW SPEC.
1) GSM transceiver specification
Item
Specification
Phase Error
Rms : 5°
Peak : 20 °
Frequency Error
GSM : 0.1 ppm
DCS/PCS : 0.1 ppm
EMC(Radiated Spurious Emission
Disturbance)
GSM/DCS : & lt; -28dBm
Transmitter Output power and Burst
Timing
GSM : 5dBm - 33dBm ? 3dB
DCS/PCS : 0dBm - 30dBm ? 3dB
Burst Timing
& lt; 3.69us
Spectrum due to modulation out to less
than 1800kHz offset
200kHz : -36dBm
600kHz : -51dBm/-56dBm
Spectrum due to modulation out to larger
than 1800kHz offset to the edge of the
transmit band
GSM :
1800-3000kHz : & lt; -63dBc(-46dBm)
3000kHz-6000kHz : & lt; -65dBc(-46dBm)
6000kHz & lt; : & lt; -71dBc(-46dBm)
DCS :
1800-3000kHz : & lt; -65dBc(-51dBm)
6000kHz & lt; : & lt; -73dBc(-51dBm)
Spectrum due to switching transient
400kHz : -19dBm/-22dBm(5/0), -23dBm
600kHz : -21dBm/-24dBm(5/0), -26dBm
Reference Sensitivity - TCH/FS
Class II(RBER) : -105dBm(2.439%)
Usable receiver input level range
0.012(-15 - -40dBm)
Intermodulation rejection - Speech
channels
? 800kHz, ? 1600kHz
: -98dBm/-96dBm (2.439%)
AM Suppression
GSM : -31dBm
- DCS : -29dBm
-98dBm/-96dBm (2.439%)
Timing Advance
? 0.5T
LGE Internal Use Only
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Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
2) WCDMA transmitter specification
Item
Specification
Transmit Frequency
BD1: 1920MHz ~ 1980 MHz
BD2: 1850~1910 MHz
BD8: 880 MHz ~ 915 MHz
Maximum Output Power
+24 dBm / 3.84 MHz, +1 / -3 dB
Frequency Error
within ?0.1 PPM
Open Loop Power Control
Normal Conditions : within ?9 dB,
Extreme Conditions : within ?12 dB
Minimum Transmit Power
& lt; -50 dBm /3.84 MHz
Occupied Bandwidth
& lt; 5 MHz at 3.84 Mcps (99% of power)
Adjacent Channel Leakage
Power Ratio (ACLR)
& gt; 33 dB @ ?5 MHz,
& gt; 43 dB @ ?10 MHz
Spurious Emissions
|f-fc| & gt; 12.5 MHz
& lt; -36 dBm / 1 kHz RW @ 9 kHz <= f & lt; 150 kHz
& lt; -36 dBm / 10 kHz RW @ 150 KHz <= f & lt; 30 MHz
& lt; -36 dBm / 100 kHz RW @ 30 MHz <= f & lt; 1 GHz
& lt; -30 dBm / 1 MHz RW @ 1 GHz <= f & lt; 12.75 GHz
& lt; -60 dBm / 3.84 MHz RW @ 869 MHz <= f <= 894 MHz
& lt; -60 dBm / 3.84 MHz RW @ 1930 MHz <= f <= 1900 MHz
& lt; -60 dBm / 3.84 MHz RW @ 2110 MHz <= f <= 2155 MHz
& lt; -67 dBm / 100 kHz RW @ 925 MHz <= f <= 935 MHz
& lt; -79 dBm / 100 kHz RW @ 935 MHz & lt; f <= 960 GHz
& lt; -71 dBm / 100 kHz RW @ 1805 MHz <= f <= 1880 MHz
& lt; -41 dBm / 300 kHz RW @ 1884.5 MHz & lt; f & lt; 1919.6 MHz
Transmit Intermodulation
& lt; -31 dBc @ 5 MHz & & lt; -41 dBc @ 10 MHz
when Interference CW Signal Level = -40 dBc
Error Vector Magnitude
& lt; 17.5 %, when Pout >= -20 dBm
Peak Code Domain Error
& lt; -15 dB at Pout -20 dBm
LGE Internal Use Only
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Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
3) WCDMA receiver specification
Item
Specification
Receive Frequency
BD1: 2110 MHz ~2170 MHz
BD2: 1850~1910 MHz
BD8: 925 MHz ~ 960 MHz
Reference Sensitivity Level
Band1 : BER & lt; 0.001 when Îor = -106.7 dBm / 3.84 MHz
Band2 : BER & lt; 0.001 when Îor = -106.7 dBm / 3.84 MHz
Band8 : BER & lt; 0.001 when Îor = -106.7 dBm / 3.84 MHz
Maximum Input Level
BER & lt; 0.001 when Îor = -25 dBm / 3.84 MHz
Adjacent Channel Selectivity
(ACS)
ACS & gt; 33 dB where BER & lt; 0.001 when
Îor = -92.7 dBm / 3.84 MHz
& Ioac = -52 dBm / 3.84 MHz @ ?5 MHz
Blocking Characteristic
BER & lt; 0.001 when Îor = -103.7 dBm / 3.84 MHz
& Iblocking = -56 dBm / 3.84 MHz @ Fuw(offset) = ?10 MHz
or Iblocking = -44 dBm / 3.84 MHz @ Fuw(offset) = ?15 MHz
Spurious Response
BER & lt; 0.001 when Îor = -103.7 dBm / 3.84 MHz
& Iblocking = -44 dBm
Intermodulation
BER & lt; 0.001 when Îor= -103.7 dBm / 3.84 MHz
& Iouw1 = -46 dBm @ Fuw1(offset) = ?10 MHz
& Iouw2 = -46 dBm / 3.84 MHz @ Fuw2(offset) = ?20 MHz
Spurious Emissions
& lt; -57 dBm / 100 kHz BW @ 9 kHz <= f & lt; 1 GHz
& lt; -47 dBm / 1 MHz BW @ 1 GHz <= f <= 12.75 GHz
Inner Loop Power Control
In Uplink
LGE Internal Use Only
Adjust output(TPC command)
cmd
1dB
2dB
+1
+0.5/1.5
+1/3
0
-0.5/+0.5
-0.5/+0.5
-1
-0.5/-1.5
-1/-3
group(10equal command group)
+1
+8/+12
+16/+24
- 15 -
3dB
+1.5/4
-0.5/+0.5
-1.5/-4
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
4) HSDPA transmitter specification
Item
Specification
Transmit Frequency
BD1: 1920MHz ~ 1980 MHz
BD2: 1850~1910 MHz
BD8: 880 MHz ~ 915 MHz
Maximum Output
Power
Sub-Test
1=2/15,
2=12/15
3=15/8
4=15/4
25.7~20.3dBm / 3.84 MHz
25.7~20.3dBm / 3.84 MHz
25.7~19.8dBm / 3.84 MHz
25.7~19.8dBm / 3.84 MHz
Sub-Test : 1=2/15, 2=12/15, 3=15/8, 4=15/4
Frequency offset from
carrier f
Measurement
Bandwidth
2.5 ~ 3.5 MHz
-35-15×( f-2.5)dBc
30 kHz
3.5 ~ 7.5 MHz
-35-1×( f-3.5)dBc
1 MHz
7.5 ~ 8.5 MHz
-35-10×( f-7.5)dBc
1 MHz
8.5 ~ 12.5 MHz
Spectrum
Emission Mask
Minimum requirement
-49dBc
1 MHz
Adjacent Channel
Leakage
Power Ratio (ACLR)
Sub-Test : 1=2/15, 2=12/15, 3=15/8, 4=15/4
& gt; 33 dB @ ?5 MHz
& gt; 43 dB @ ?10 MHz
Error Vector
Magnitude
& lt; 17.5 %, when Pout >= -20 dBm
5) HSDPA receiver specification
Item
Specification
Receive Frequency
BD1: 2110 MHz ~2170 MHz
BD2: 1850~1910 MHz
BD8: 925 MHz ~ 960 MHz
Maximum Input Level
(BLER or R), 16QAM Only
Sub-Test : 1=2/15, 2=12/15, 3=15/8, 4=15/4
BLER & lt; 10% or R & gt; = 700kbps
LGE Internal Use Only
- 16 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
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2. PERFORMANCE
6) HSUPA Tx, Rx specification
Item
Specification
Maximum Output
Power
Sub-Test
1=11/15
2=6/15
3=15/9
4=2/15
5=15/15
25.7~17.3dBm / 3.84 MHz
25.7~16.8dBm / 3.84 MHz
25.7~17.8dBm / 3.84 MHz
25.7~16.8dBm / 3.84 MHz
25.7~20.3dBm / 3.84 MHz
Sub-Test : 1=11/15, 2=6/15, 3=15/9, 4=2/15, 5=15/15
Frequency offset from
carrier f
-35-15×( f-2.5)dBc
30 kHz
-35-1×( f-3.5)dBc
1 MHz
-35-10×( f-7.5)dBc
1 MHz
8.5 ~ 12.5 MHz
LGE Internal Use Only
2.5 ~ 3.5 MHz
7.5 ~ 8.5 MHz
Adjacent Channel
Leakage
Power Ratio (ACLR)
Measurement
Bandwidth
3.5 ~ 7.5 MHz
Spectrum Emission
Mask
Minimum requirement
-49dBc
1 MHz
Sub-Test : 1=11/15, 2=6/15, 3=15/9, 4=2/15, 5=15/15
& gt; 33 dB @ ?5 MHz
& gt; 43 dB @ ?10 MHz
- 17 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
7) WLAN 802.11b transceiver specification
Item
Specification
Transmit Frequency
2400 MHz ~ 2483.5 MHz ( CH1~CH13 )
Tx Power Level
<= 20dBm under (Europe), <= 30dBm under (USA)
Frequency Tolerance
within ?25 PPM
Chip clock Frequency
Tolerance
within ?25 PPM
Spectrum Mask
<= -30 @ fc-22MHz & lt; f & lt; fc-11MHz and fc+11MHz & lt; f & lt; fc+22MHz
<= -50 @ f & lt; fc-22MHz and f & gt; fc+22MHz
Power ramp on/off time
<= 2us
Carrier Suppression
<= -15dB
Modulation Accuracy
(Peak EVM)
<= 35%
Spurious Emissions
& lt; -36 dBm @ 30MHz ~ 1GHz
& lt; -30 dBm above @ 1GHz ~ 12.75GHz
& lt; -47 dBm @ 1.8GHz ~ 1.9GHz
& lt; -47 dBm @ 5.15GHz ~ 5.3GHz
Rx Min input Sensitivity
<= -76dBm(1Mbps,2Mbps,5.5Mbps,11Mbps) @ FER <= 8%
Rx Max input Sensitivity
>= -10dBm(1Mbps,2Mbps,5.5Mbps,11Mbps) @ FER <= 8%
Rx Adjacent Channel
Rejection
>= 35dB @FER <= 8%,
interference input signal -70dBm@fc?25MHz(11Mbps)
LGE Internal Use Only
- 18 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
8) WLAN 802.11g transceiver specification
Item
Specification
Transmit Frequency
2400 MHz ~ 2483.5 MHz ( CH1~CH13 )
Tx Power Level
<= 20dBm under (Europe), <= 30dBm under (USA)
Frequency Tolerance
within ?25 PPM
Chip clock Frequency
Tolerance
within ?25 PPM
Spectrum Mask
<= -20 @ ?11MHz offset (9Mhz ~ 11MHz)
<= -28 @ ?20MHz offset (11MHz ~ 20Mhz)
<= -40 @ ?30MHz offset (20MHz ~ 30Mhz)
Transmitter constellation error
(rms EVM)
<= -5dB@6Mbps, <= -8dB@9Mbps, <= -10dB@12Mbps,
<= -13dB@18Mbps, <= -16dB@24Mbps, <= -19dB@36Mbps,
<= -22dB@48Mbps, <= -25dB@54Mbps
Spurious Emissions
& lt; -36 dBm @ 30MHz ~ 1GHz
& lt; -30 dBm above @ 1GHz ~ 12.75GHz
& lt; -47 dBm @ 1.8GHz ~ 1.9GHz
& lt; -47 dBm @ 5.15GHz ~ 5.3GHz
Rx Min input Sensitivity
PER <= 10%
-82dBm@6Mbps, -81dBm@9Mbps, -79dBm@12Mbps
-77dBm@18Mbps, -74dBm@24Mbps, -70dBm@36Mbps
-66dBm@48Mbps, -65dBm@54Mbps
Rx Max input Sensitivity
>= -20dBm(6,9,12,18,24,36,48,54Mbps) @ PER <= 10%
Rx Adjacent Channel
Rejection
PER <= 10%,
ACR >= 16dB@6Mbps, ACR >= 15dB@9Mbps,
ACR >= 13dB@12Mbps, ACR >= 11dB@18Mbps,
ACR >= 8dB@24Mbps, ACR >= 4dB@36Mbps
ACR >= 0dB@48Mbps, ACR >= -1dB@54Mbps
ACR shall be measured by setting the desired signal's strength 3 dB
above the rate-dependent
sensitivity specified in min input sensitivity
LGE Internal Use Only
- 19 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
9) WLAN 802.11n transceiver specification
Item
Specification
Transmit Frequency
2400 MHz ~ 2483.5 MHz ( CH1~CH13 )
Tx Power Level
<= 20dBm under (Europe), <= 30dBm under (USA)
Frequency Tolerance
within ?25 PPM
Chip clock Frequency
Tolerance
within ?25 PPM
Spectrum Mask
<= -20 @ ?11MHz offset (9Mhz ~ 11MHz)
<= -28 @ ?20MHz offset (11MHz ~ 20Mhz)
<= -45 @ ?30MHz offset (20MHz ~ 30Mhz)
Transmitter constellation error
(rms EVM)
<= -5dB@6.5Mbps, <= -10dB@13Mbps, <= -13dB@19.5Mbps,
<= -16dB@26Mbps, <= -19dB@39Mbps, <= -22dB@52Mbps,
<= -25dB@58.5Mbps, <= -28dB@65Mbps
Spurious Emissions
& lt; -36 dBm @ 30MHz ~ 1GHz
& lt; -30 dBm above @ 1GHz ~ 12.75GHz
& lt; -47 dBm @ 1.8GHz ~ 1.9GHz
& lt; -47 dBm @ 5.15GHz ~ 5.3GHz
Rx Min input Sensitivity
PER <= 10%
-82dBm@6.5Mbps, -79dBm@13Mbps, -77dBm@19.5Mbps
-74dBm@26Mbps, -70dBm@39Mbps, -66dBm@52Mbps
-65dBm@58.5Mbps, -64dBm@65Mbps
Rx Max input Sensitivity
>= -20dBm(6.5,13,19.5,26,39,52,58.5,65Mbps) @ PER <= 10%
Rx Adjacent Channel
Rejection
PER <= 10%,
ACR >= 16dB@6.5Mbps, ACR >= 13dB@13Mbps,
ACR >= 11dB@19.5Mbps, ACR >= 8dB@26Mbps,
ACR >= 4dB@39Mbps, ACR >= 0dB@52Mbps
ACR >= -1dB@58.5Mbps, ACR >= -2dB@65Mbps
ACR shall be measured by setting the desired signal's strength 3 dB above
the rate-dependent
sensitivity specified in min input sensitivity
LGE Internal Use Only
- 0 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
10) GPS receiver specification
Item
Specification
Receive Frequency
1574.42 MHz ~ 1576.42 MHz
Minimum Sensitivity
1 satellite >=-142dBm, 7 satellites >= -147dBm at coarse time aiding
11) Current consumption
Stand by
Bluetooth Off
Bluetooth Connected
Voice Call
VT
WCDMA
Only
4.0 mA under
(DRX=1.28)
7 mA under
(DRX=1.28)
350 mA under
( Tx=12dBm)
NA
GSM
Only
4.0 mA under
(Paging=5 period)
7 mA under
(Paging=5 period)
350 mA under
( Tx=Max)
12) FM Radio Current consumption
FM Radio Play 2G
Current Consumption
45mA
FM Radio Play 3G
45mA
Reason
Mixing FM radio sound and Android sound
requires enabling ABE, so FM Radio current is
higher than other models using external audio
codec only.
13) Battery life time
Stand by
Voice Call
VT
WCDMA
350 hours over
(DRX = 1.28)
250 min over
( TX = 12dBm,
Low Pwr mode)
NA
GSM
350 hours over
(Paging Period = 9)
250 min over
( TX Level = Max)
LGE Internal Use Only
- 1 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
14) Charging hour
3.5hour under ( 1500mAh battery, 1A TA)
15) RSSI indicator (Based on Cell power)
BAR
WCDMA
GSM/DCS/PCS
4
Over -88?2dBm
Over -91 ?2dBm
43
-88 ?2dBm
-91 ?2dBm
32
-96 ?2dBm
-99 ?2dBm
21
-104 ?2dBm
-103 ?2dBm
10
-110 ?2dBm
-105 ?2dBm
LGE Internal Use Only
- -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
16) Battery indicator
Battery Bar
Specification
BAR 6 (Full)
90% over
BAR 6 -- & gt; 5
90% 89%
BAR 5 -- & gt; 4
70% 69%
BAR 4 -- & gt; 3
50% 49%
BAR 3 -- & gt; 2
30% 29%
BAR 2 -- & gt; 1
15% 14%
BAR 1 -- & gt; 0
5% 4%
Low Battery Pop-up
4% ~ 15% : One Time popup (No call)
Critical Low Battery Pop-up
0% ~ 3% : Every Level change popup (No call)
POWER OFF
0%
remain%
2.7 P920 Figures
LGE Internal Use Only
- 3 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
The LG-P920 supports UMTS-900, UMTS-1900, UMTS-2100, GSM-850, GSM-900, GSM-1800, and GSM-1900 based
GSM/GPRS/EDGE/UMTS. All receivers and the UMTS transmitter use the radio One Zero-IF architecture to
eliminate intermediate frequencies, directly converting signals between RF and baseband. The quad-band GSM
transmitters use a baseband-to-IF up-conversion followed by an offset phase-locked loop that translates the
GMSK-modulated or 8-PSK-modulated signal to RF.
PMU
RF6590
GPS IN
1V2
Filter
B946
9
Diplexer
RD_H
RD_HX
1V8
2V852V65
VCTCXO
XO
AFC_DAC
26MHz
VCONT
PAM DCDC
RF6560
VOUT_FB
GSM_LB_TX VCC CP_OUT
GSM_HB_TX
TRX4
TRX5
TRX3
TRX2
TRX6
TRX1
Ant_B8
Ant_B5
Ant_B2
Ant_B1
Ant_B4
Ant_B3
B7953
B8 DPX
PM_L
B8_TX
B7671
B5 DPX
B7955
B2 DPX
B7696
B1 DPX
B7959
B4 DPX
B5_TX
MMMB
B2_TX
RF6260
PM_H
Transceiver
PMB5712
B1_TX
B4_TX
XMM6260
DCS
SAW filter
RX_L1X
RX_L1
RX_L2X
RX_L2
ST8T
BGSF18D
RX_M2X
RX_M2
RX_H2X
RX_H2
RX_H1X
RX_H1
RX_M1X
RX_M1
SYS_CLK
SYS_CLK
SYS_CLK_EN
SYSCLKEN
REF_CLK_EN
REF_CLK_EN
DI3_TX_DAT
DI3_TX_DATX
Di3_TX_DAT
Di3_TX_DATX
DI3_RX_DAT
DI3_RX_DATX
Di3_RX_DAT
Di3_RX_DATX
[Figure 3-1] Total Block diagram of RF part
LGE Internal Use Only
- 4 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3.1 Radio Part General
SMARTi(TM) UE2 is a highly integrated UMTS/GSM-transceiver, with all necessary features to enable multi mode,
multi band mobile cellular devices. It incorporates a fully integrated dual mode receiver with main and diversity
chains, 2 multi band TX outputs, control, Digitally controlled crystal support, a measurement interface,
DigRFV3.09 compliant high speed data and control interface, a multi mode timer unit and all necessary front end
signals for the complete RF Engine control. Overall the IC directly supports RF engines with up to 4 GSM bands
and typical 4 UMTS (can be less or more depending on engine setup) bands without additional discrete RF path
switches.
W1
PMU
Power
Control
GW
Diversity
Receiver
GW5
GW6
W1
Xtal
GW
Main
Receiver
G1300
GW5
GW6
DigRF 3G
V3_09
Data
&
Control
FE CTRL
(GPO/SPI)
Ctrl
Lo band
Digital
Modulator
Det
Hi band
Ctrl
DC/DC
[Figure 3-2] SMARTi UE2 main feature
-. 3GPP release 7 (HSPA+)
-. Up to 5 UMTS-FDD / 4 EDGE Bands
* Band I ~ VI, VIII ~ X
* EGPRS MSC 33 / 34
* 28Mbps DL / 11.5Mbps UL (HSPA+ 64 / 16QAM)
* 14.4Mbps HSDPA / 5.76Mbps HSUPA (cat 10 / 6)
-. Standard DigRF V3.09 interface to Digital BB
-. Multi-Mode / Multi-Band Single-Chain Tx Concept
LGE Internal Use Only
- 5 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3.2 Radio Part Rx Section
For the RX section the IC features 6 RX inputs, 4 of those might be used for multi mode receive, this means they
can be used for GSM and UMTS (the IC can be reconfigured to achieve in spec performance) operation. The
highband input are for UMTS operation only. The multi mode inputs include first LNA (for GSM and UMTS)
without and additional external LNA and inter-stage filter. The receiver structure is optimized for compressed
mode operation, thus only a single base band chain is used, saving area and optimizes power consumption. The
receiver AGC can be aligned to the UMTS frame structure.
Additionally to the normal receiver the IC contains a diversity receiver part, enabling up to 4 band Rx diversity for
GSM and UMTS mode without external LNA's and inter-stage filters.
RD_L1
S & H
RD_L1X
G Mode
RD_L
RD_LX
LPF
S & H
ADC
MUX
RD_M
LPF
RD_MX
RD_H
ADC
FIR
MUX
FIR
HPF
3G Mode
0/90°
RD_HX
HPF
RX synthesizer
RX_L1
DigRF
RX_L1X
RX_L
RX_LX
S & H
0/90°
G Mode
RX_M1
RX_M1X
LPF
S & H
ADC
MUX
RX_M
RX_MX
LPF
ADC
FIR
MUX
FIR
HPF
3G Mode
RX_H1
RX_H1X
HPF
RX_H
RX_HX
[Figure 3-3] 2G / 3G Rx Block Diagram
LGE Internal Use Only
- 6 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3.3 Radio Part Tx Section
The TX features 2 RF outputs, which are directly matched to 50
impedance for easy connection to external
power amplifiers, which reduces significantly external component count. Those 2 outputs are high power, small
signal polar modulated outputs for the GSM and UMTS system, with low sensitivity to PA harmonics. They are
capable to perform GMSK or 8-PSK as well as UMTS modulation signals with excellent noise performance, thus
no inter-stage filter in between transceiver and PA is required. The transmitter outputs are broadband, one
covers all low bands (Band V, VI, and VII), the higher band output covers all GSM and UMTS bands Band I, II, III, IV,
IX and X. The output driver is capable to support high output powers to enable low cost single chain PA's.
The IC features additionally closed loop power control for GSM and for UMTS, thus supporting TRP requirements
in cooperation with the power amplifier and the antenna design. There is one input ball for the power detector
voltage coming from the PA, and one input ball for the RF signal fed back to the TRX. The complete loop circuits
are implemented in the digital domain, which enables a high reliability of the loop performance for both
standards.
AM-Path
I/Q to R/Phi
TX-Disruptor
PM-Path
I/Q to R/Phi
I/Q-Chain
G
Modulator
1 bit
sign
AM-Path
PM-Path
to signal
chain
Feedback Sifnal
Processing
0C HIP
I/Q-Chain
DIG RF
3G
FIFO
1C HIP
1 bit
sign
Feedback RX
Detector ADC
[Figure 3-4] Single Chain PA's Tx Architecture
LGE Internal Use Only
- 7 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3.4 Radio Part Interfaces
The base band is connected via a DigRF V3.09 high speed data interface with a maximum clock frequency of 312
MHz. The pure digital interface enables the digital baseband to shrink efficiently, as all the analog functionality is
within the RFIC. All data and control traffic is multiplexed via the RX and TX interface lines. The IC features a high
level programming model enabling the complete compressed mode operation of the device in an RF engine
environment. It handles RX and TX power control, also incorporating the calibration data.
The complete timing is optimized for compressed mode operation of the transceiver, it controls the front end
components of the engine (PA´s, switches, Antenna switches etc...). Additionally a SPI control bus for front end
component control is available on the IC, which also enables the read back of data from external components,
thus the handling of functions like PA saturation, mismatch detection, overheating (incorporated in the closed
loop power control) can be adopted.
Data
DI3_RX_DAT
DI3_RX_DATX
RLVDS
Driver
P/S
Converter
Framer
Control
SYS_CLK
SysClk
Driver
SYS_CLK_EN
Digital
Baseband IC
RF IC
PLL
31 MHz
Control
DI3_TX_DAT
DI3_TX_DATX
RLVDS
Receiver
Phase
Correlator
Retimed
Data
S/P
Converter
Retimed
Data
Deframer
Data
[Figure 3-5] DigRF Architecture
Table 3-1. DigRF I/F path's Data Rates
LGE Internal Use Only
- 8 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
Public Version
3.5www.ti.com Baseband (OMAP4430)
Digital
Environment
1.2 Environment
The OMAP4430 high-performance multimedia application device is based on enhanced OMAPTM architecture
This section provides an overview of the OMAP environment. The device is associated with power and
audio technology. The (ICs). is associated with solution with the integrated circuits(ICs) that
and used 45-nm integrated circuits deviceTI provides a globalpower and audioTWL6030/TWL6040 devices. is called
Y
Figure 1-1 is an
TWL6030 and TWL6040. overview of a nonexhaustive environment for the high-tier OMAP4430 device.
Figure 1-1. OMAP4430 High-Tier Environment
Handset
microphones x2
Ear
speaker
HF speakers
x2
AR
Headset
Vbat
Backup
battery
Buckboost
Main
battery
Hands-free
amplifier
Speakers
Micro
Power
Boost
Vibrator/
actuator
x2
Vibrators
Gas
gauge
TWL6040
TWL6030
Charger
interface
Keypad
USB
charger
Headset
DVFS Ctrl
I2C Ctrl
SR
I2C1
*
7
4
1
Audio
I2C Ctrl
#
9
6
3
WL1283 BT/FM/GPS/WLAN
IN
AC
charger
BQ24156
0
8
5
2
S/PDIF
Micro USB
MCASP
MCPDM
KEYBOARD
DMIC
SLIMBUS1
SDMMC5
MCBSP2
Other flash
memory
SDMMC2
(Nor, Nand,
OneNand, ...)
NVM LPDDR 2
memory
2 or 4x
LPDDR2
SDRAM
GPMC
IM
eMMC
(JC64)
MCSPI2
MCBSP1
UART2
USBA0OTG
I2C2
SDMMC4
LPDDR22
MCSPI3
MCBSP2
UART3
USBB1ULPI/HSIC
SDMMC 1
PR
EL
NFC
Mobile TV
C2C
OMAP4430
SD/MMC
MCSPI4
LPDDR21
HSI
3G
MCBSP2
IrDA
UART3
I2C4
DISPC2
MCSPI1
RFBI
Fingerprint
/ Slide pad
MCSPI
RFBI
DISPC2
I2C2
Touchscreen
DSI1
Main display
I2C2
CVIDEO
DSI2
HDMI
CCP2
CSI2-A
I2C3
CSI2-B
HDMI companion
(LS+ESD+StepUp)
Touchscreen
Subdisplay
TVout
Primary
camera
Secondary
camera
PicoDLP(R)
intro-002
OMAP4430 Block Diagram (Typical Connections Shown)
SWPU231M - July 2010 - Revised November 2010
Introduction
257
Copyright (C) 2010, Texas Instruments Incorporated
LGE Internal Use Only
- 9 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
Cortex-A9 MPU Subsystem
Two ARM Coretex-A9 MPCore
IVA-HD Subsystem
The IVA-HD subsystem is a set of video encoder/decoder hardware accelerators. It supports up to 1080p x 30 fps,
slow-motion camcorder, triple play (HD and SD capture and JPEG capture), real-time transcoding of up to 720p,
and video conferencing up to 720p.
The IVA-HD supports:
MPEG-1/2/4, Divx 5.02, H.263 P0 (encode/decode) and P3 (decode), H.264 Annex G (scalable baseline profile up
to 720p), H.264 BL/MP/HP, H.264 Annex H(partial), Stereoscopic video, JPEG(encode/decode), VC-1 SP/MP/AP,
AVS-1.0, RealVideo 8/9/10 (decode only), On2 VP6.2/VP7 (decode only)
Display Subsystem
Display controller
: Three video pipelines, one graphic pipelines, and write-back pipeline.
Two LCD outputs, One TV output.
Remote frame buffer interface (RFBI) module
Two MIPI display serial interface (DSIs)
High-definition multimedia interface (HDMI) encoder
: HDMI 1.3, HDCP 1.2, and DVI 1.0 compliant
Deep-color mode support (10-bit for up to 1080p and up to 12-bit for 1080i/720p)
NTSC/PAL video encoder
ABE (Audio Back End) Subsystem
The ABE subsystem handles audio processing for the application. It manages the audio and voice streams
between the Cortex-A9 MPU subsystem and/or DSP, and the physical interfaces.
Imaging Subsystem (ISS)
The ISS processes data coming from the image, memory, and IVA-HD subsystem. The ISS is responsible for
multimedia applications such as : camera viewfinder, video record with up to 1080p at 30 fps with digital zoom
and still image processing, such as image capture up to 16 Mp with digital zoom and rotation. The ISS supports a
pixel throughput of up to 200Mp/s. It assures good performance with sensors up to 16 Mp and more (higher
resolution can be achieved through multiple passes).
2D/3D Graphics Accelerator
The 2D/3D graphics accelerator subsystem in based on POWERVR
SGX540 core from Imagination
Technologies. The SGX can process different data types simultaneously.
In addition to its processing elements, an extensive set of peripheral interfaces enables communication with all
necessary external devices.
LGE Internal Use Only
- 30 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3.6 Hardware Architecture
& lt; System HW Block & gt;
FM_ANT
LCD 4.3"
4.3" TFT 3D
LCD
(480x800)
Touch
LED
Backlight
Driver
Driver IC
DSI
I2C2
McBSP1(PCM)
McBSP3(I2S)
UART2
SDIO
5
McPDM
I2C2
Compass
2Gb-2ch
LPDDR2
POP
3D CAMERA
3D CAMERA
5M AF
MIPI(P)
5M AF
MIPI(S)
Keypad
eMMC (8Gb)
VT
0.3M
MIPI
I2C4
SDRC
SDMMC2
UART4 USB
Accelerometer
A-GPS
I2C1
MCLK
JTAG
PMB5712
LNA
Key LED
USIF3 DigRF
GPIO_34
NAND
GPIO_35
I2S2 XMM6260 DDR
MIPI_HSI
32.768KHz
FEM
MCP
1Gb
NAND
512Mb
DDR
USIM1
JTAG
JTAG
32.768KHz
PWR-ON KEY
Charge
r
Battery
38.4MHZ
USB
JTAG
PMIC_AP
(TWL6030)
VCHG
3.5 pi Ear_Jack
FM_ANT
USIF1
I2C
MIC2
3.5 pi Ear MIC(Ear_Jack)
TCXO Driver
IPC_SRDY
IPC_MRDY
GPIO_82
I2C3
MIC2
HS_MIC
HSOLR
MIC1
Fuel gauge
McSPI4
GPIO_119
GPIO_120
MCSPI2(PCM)
MIPI_HSI
UART1
KB_COL/ROW
SPK
MIC1
TWL6040
PDM
EAR_PIECE(RCV)
SPK
Motor
UART3
I2C4
AUXLR
Light Sensor
GPIO
I2C2
EARO
Proximity
GPIO_2
DMTIMER8_PWM_EV
5
T
I2C1
SDMMC1
I2C
HiFi & PCM Voice
OMAP4430
CSI2
HDMI
Gyro
BT/WLAN/FM
(WL1271)
I2C4
CSI1
5M CAM Flash
FM
FM_L/R
MUIC
Coin cell
VBAT
Figure. Block Diagram
LGE Internal Use Only
- 31 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3.7 Subsystem (PMB9811_X-GOLDTM626)
The X-GOLD(TM) 626 is a 3GPP Release 7 dual-mode baseband modem which is expected to connect to an
application processor in order to create a high-end smartphone solution. It can be used to create a data-card
solution as well. This section provides a high-level view of the chip architecture. More details can be found in the
X-GOLD(TM) 626
PMB 9811
sections that follow.
The X-GOLD(TM) 626 can be broken into 6 major subsystems: Backbone, Connectivity, Audio, 2GL1, 3GL1, and PMU.
CONFIDENTIAL ci
X-GOLD(TM) 626 Architecture Concepts
Each of these subsystems play important roles for operation of the modem.
01
02
Audio
Backbone
Audio
DSP1
03
ARM11
ETM11
04
05
ABW
08
DMA1
8-ch
L2 Cache
256 kB
09
CEU
CGU
GPTU 0
DMA2
2-ch
SPCU
GPTU 1
I2S2
DSP
Interrupt
CAPCOM1
RTC
07
SCU
STM
06
Audio
DSP2
CAPCOM0
32kB I-Cache
32kB D-Cache
8kB I-TCM
8kB D-TCM
I2S1
6
6
DSP
Timer
Shared Mem
CPU XBAR
Bridge
Peripheral XBAR
13
14
EBU
17
or
L
n
62
Shared
Mem
19
3GCU
ARM7
ETM7
ICU
USIF5
24
25
DL-MACPHY
UL-MACPHY
27
29
7
33
35
37
40
41
TxBitProc
TxMod
DPE
Searcher
OLP
MRAM
USIM
DSP
Timer
RF IF
USB-FS
ICU
GSM
Cipher
USB-HS
Channel Equalizer
Decoder Accelerator
USIF1
USB-HSIC
DSP
Interrupt
MIPI HSI
USIF3
IR
Memory
SD-MMC1
I2C1
DigRF 3.09
PMU
SD2
(VDDIO)
MIPI PTI
POR
PCL/GPIO
VANA
VUSB
VSIM
VMIPI
DAP
VPMU
VRTC
SSC
1
3 (+2)
2
(+4)
6
5
2
8
(+5)
7
2
7 (+7)
2 (+10)
5
USIF2
Measurement
TSMU
36
39
FCDP
VPLL
31
34
38
SYNC_TX
Rake
3G DSP
SD1
(VDDCore)
32
GSM
Timer
Timer
ORX
Rake
30
31
Connectivity
2GL1
2G DSP1 2G DSP2
R99ORX
HSIRX
HSORX
MACPHY
26
COMRAM
HSDPA
MCU
23
28
USI
Co
p
22
Pr
ov
21
yf
3GL1
20
GSI
de
18
dU
16
GUCIPH
LMU
RAM
LMU
ROM
ide
15
DA
12
rN
11
GE
10
Control Unit
BB_ ArchitectureOverview.vsd
Figure 6
Architecture Block Diagram of the X-GOLD(TM) 626
4.1.2
Architectural Characteristics
Fig.3.7 Architecture Block Diagram of X-GOLD(TM) 626
The X-GOLD(TM) 626 comes along with the following architecture units.
42
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57
ARC__Overview.fm
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Revision 1.0, 2010-04-26
EDD 3.4
3. TECHNICAL BRIEF
3.7.1 The Backbone Subsystem
The backbone subsystem contains elements which handle the main processing in the system. The protocol stack
is expected to execute here. The ARM(TM)1176 acts as the main CPU, it is connected via the CPU XBAR with the
internal memories (RAM, ROM), the external bus interface, and the 8-channel DMA (DMA1). There is level 1 cache
and tightly-coupled memory incorporated within the ARM which help with the performance of the CPU. A level
2 cache is also added to this which helps even further with the system performance. Given that the modem is
expected to support high data rates for HSDPA (category 14) and HSUPA (category 7), these additional elements
are necessary. The ARM(TM)1176 also has the capability of controlling the peripherals in the device that are
connected to the Peripheral XBAR via a bus bridge. This 32-bit multi master AHB bus is connected to all
peripherals.
The Clock and System Control Unit (CSC) consists of the system control unit (SCU), system power control unit
(SPCU) and the clock generation unit (CGU). These units are responsible for the reset handling, the clock
multiplexing and switching and the power control of the device.
3.7.2 The Connectivity Subsystem
There are a rich set of peripherals included in the connectivity subsystem which allow interfacing to external
devices. It is required that we have connectivity for inter-process communications (IPC) with the AP, SIM card
support, external interrupts, external memory cards, trace and debug, external device control (A-GPS), and
general purpose I/O. For IPC there are 3 generic interfaces: USB HSIC, MIPI HSI, and USIF3 (which provides UART
and SPI operation). SIM and FS-USB interfaces are dedicated to the SIM-Card. External interrupts are included for
waking the modem from low power modes. There is a SD-MMC interface for utilizing memory cards in datacards
applications. The USB-HS, USIF1, and MIPI PTI interfaces can be used for tracing purposes. NAND flash can be
connected to the FCDP interface for supporting memory accesses. External devices can be controlled by the
baseband through the I2C interface. There are also generic input/output pins that can be used to connect the
baseband to external components in the system. These peripherals occupy a different number of pins as
indicated in Fig.3.7. The number in parentheses refer to additional signals which are available only as alternate
functions behind other functions.
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3. TECHNICAL BRIEF
3.7.3 2GL1 Subsystem
While the upper layers of the modem software stack run on the main CPU, physical layer processing takes place
in the layer-1 subsystems. The 2GL1 subsystem contains 2 DSPs, which help with layer-1 processing in 2G modes.
The added DSP helps with higher performance use cases such as receive diversity and multi-slot classes. It
contains a set of dedicated HW peripherals (equalizer, etc) and connects to the digital RF interface.
3.7.4 3GL1 Subsystem
While in 3G modes, assistance is required from the 3GL1 subsystem. An ARM(TM)7 CPU deals with the
communication of the 3G subsystem with the stack SW running on the ARM(TM)1176 and handles the scheduling
of the different activities between the 3G HW peripherals (RAKE, DPE, Searcher, HSDPA Inner Receiver, Rel99and HSDPA-Outer Receiver). The signal processing tasks are handled by the 3G DSP. The up-link and downlink
data will be buffered in the COMRAM which connects to the ARM(TM)1176 system via the MACPHY peripherals.
Connection to the RF is managed by the DigRF peripheral.
3.7.5 The Integrated PMU Subsystem
The integrated PMU subsystem contains all of the supplies necessary for powering the baseband in the platform.
There are two step down converters for the digital core voltage (SD1) and digital IO voltage (SD2). Seven linear
voltage regulators provide the supply voltages for various internal and external components.
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3. TECHNICAL BRIEF
3.7.6 Audio Subsystem
An overview of the Audio Subsystem hardware architecture can be found in Figure 3.7.6.
The three main entities relevant for the audio processing are
o ARM(TM)1176 Embedded Microcontroller Unit core (ARM(TM)1176)
o Embedded Digital Signal Processor cores (DSPs)
o 3rd Party IP CODEC
Fig.3.7.6 Audio Subsystem Block Diagram
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3. TECHNICAL BRIEF
ABE Overview
The audio back end (ABE) module is a subsystem that manages various audio and voice uplink and downlink
streams between the initiator (the Cortex(TM)-A9 microprocessor unit [MPU], digital signal processor [DSP], or
direct memory access [DMA] controller) and the peripheral physical interfaces (multichannel buffered serial port
[McBSP], SLIMbus(R), digital microcontroller [DMIC], multichannel pulse density modulation [McPDM], and
multichannel audio serial port [McASP]).
The ABE module handles the audio processing for the applications. It receives voice or audio samples from the
initiator or the external audio chip (TWL6040 or other) and sends them to the peripheral interfaces or memories
after processing. The ABE can perform buffering of audio samples, mix audio with a voice down stream and/or a
microphone up stream (sidetone), and can apply some post-processing.
The ABE integrates the following modules:
o Peripheral physical interfaces:
- Three McBSP modules
- One McASP module
- One mobile industry processor interface (MIPI) SLIMbus interface
- One DMIC module to support up to six mono and up to three stereo digital microphones
- One McPDM module to support interconnect with an external audio chip.
o Audio engine (AE):
- Performs real-time signal processing like sample rate conversion, filtering, equalizing, and side-tone
- Audio traffic controller (ATC):
o Performs data move in the ABE
o Generates interrupt requests to the DSP and Cortex-A9 interrupt controllers
- On-chip memory:
o 64KB of RAM; 32-bit data memory (DMEM)
o 6KB for coefficient memory RAM (CMEM)
o 18KB for sample memory RAM (SMEM)
o 8KB for program memory RAM (PMEM)
o Local L4 interconnect (L4_ABE) to:
- L3 interconnect
- Cortex-A9 MPU
- DSP
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3. TECHNICAL BRIEF
The Cortex-A9 MPU and the DSP have private access to the L4_ABE interconnect. All other initiators (sDMA) can
access the L4_ABE only through the L3 interconnect.
o Timers:
- Four general-purpose (GP) timers
- One watchdog timer
o Clock and reset management: Receives clock and reset signals from the device PRCM module. The audio
engine operates from the DPLL_ABE, which is in the PRCM module. The ABE modules can be supplied with clock
signals from the DPLL_ABE or the DPLL_PER. The ABE has its own hardware reset domain (AUDIO_RST).
o Power management: The ABE module is power-independent. It has its own dedicated power domain (PD_ABE)
and can execute audio processing with the rest of the device in retention or in off mode.
o Each peripheral in the ABE can be accessed directly by the initiator when the AE is bypassed (legacy mode, for
old software compatability).
Figure 3.7.6.1 is a high-level overview of the ABE.
Fig.3.7.6.1 Audio Back End
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3. TECHNICAL BRIEF
AE Subsystem
The AE is the core of the ABE subsystem. It performs the real-time audio processing within the ABE:
mixing, muxing, volume control, smooth muting, sampling rate conversion, and side-tone equalization. The AE
subsystem also processes and executes all data transfers. To optimize the global processing, the ATC moves the
data. An IRQ/DMA controller controls system IRQ and DMA requests. Input DMA requests come from the ABE
peripherals, and output DMA requests and IRQ are generated and sent to the system (Cortex-A9 MPU interrupt
controller, DSP interrupt controller, system DMA [sDMA], and the DSP enhanced direct memory access controller
[eDMA]).
The AE subsystem contains:
o AE: processes and executes the micro code with its own RAMs:
- SMEM
- CMEM
- PMEM
o DMEM contains the audio buffer and communication circular buffer.
o ATC: Transfers data between all modules in the ABE
o IRQ DMA controller
For more information about the audio engine, see the Audio Back-End (ABE) and Hardware Abstraction Layer
(HAL) Addendum.
Multichannel Audio Serial Port
The multichannel audio serial port (McASP) is a GP audio serial port. It is useful for intercomponent (DIT)
transmission. The McASP is intended to be flexible enough so that it may connect gluelessly to audio A/D, D/A,
CODEC and SPDIF transmit physical layer components.
McASP has the following features:
o 2-interconnect slave interface supports:
- One interconnect configuration slave interface
- One interconnect DMA slave interface
- 32-bit data bus width
- 16- and 32-bit access
- 10-bit address bus width
- Burst not supported
- WNP
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3. TECHNICAL BRIEF
o Supports idle request/acknowledge protocol
o Buffers for transmit/receive operations
o DMA requests (one per direction) link with the 32-bit register
o Up to four transmit channels
o Four serializers implemented
o Support of disconnect protocol
Multichannel Buffered Serial Port
There are three McBSP instantiations: McBSP1 through McBSP3. They provide a full-duplex direct serial interface
between the ABE and external devices, such as other modems, BT chips, or codecs. Because of its versatility, a
McBSP can accommodate a wide range of peripherals and clocked frame-oriented protocols (I2S, PCM, TDM).
List of recommended usage per McBSP:
o MCBSP1: BT voice/audio data
o MCBSP2: Digital baseband (DBB) voice data
o MCBSP3: MIDI FM data
The McBSP has the following features:
o Interconnect slave interface (internal interconnect) supports:
- 32-bit data bus width
- 8-, 16-, and 32- bit access
- 10-bit address bus width
- Burst not supported
- WNP
o Buffers for transmit/receive operations: 128/128 32-bit words (McBSP1, 2, 3)
o Interrupts configurable in legacy mode (two requests) or PRCM-compliant (one request)
o DMA requests (one per direction) triggered with programmable FIFO thresholds
o Multidrop support
o Serial interface description
o Four-pin configuration (McBSP1, 2, 3)
o Full-duplex communication
o Multichannel selection modes
o Support to enable or block transfers in each channel
o Up to 128 channels for transmission and for reception
o Supported protocols
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3. TECHNICAL BRIEF
o Direct interface to industry-standard codecs, analog interface chips (AICs), and other serially connected A/D
and D/A devices:
- I2S-compliant devices
- TDM bus devices
- PCM devices
o A wide selection of data sizes: 8, 12, 16, 20, 24, and 32 bits
o Supports idle request/acknowledge protocol
o Clock generation support:
- Independent clocking and framing for reception and for transmission up to 48 MHz
- Support for external generation of clock signals and frame-synchronization (frame-sync) signals
- A programmable sample rate generator for internal generation and control of clock signals and
frame-sync signals
o Support of disconnect protocol
Multichannel Pulse Density Modulation Module
The McPDM is a proprietary interface based on multichannel pulse density modulation. The module consists of
five downlinks and three uplinks. Two other uplink channels are reserved for status communication.
The McPDM has the following features:
o Interconnect slave interface (L4_ABE internal interconnect) supports:
- 32-bit data bus width
- 10-bit address bus width
- Burst not supported
- WNP
o Full-duplex communication:
- Five audio downstream channels
- three audio upstream channels
o RX/TX FIFO operations: 32-bit words per channels
o Complies with PRCM interrupts:
- One to the MPU subsystem
- One to the DSP subsystem
o DMA requests (one per direction) triggered with programmable FIFO thresholds; depending on the FIFO
implementation, one per channel or one per direction
o Decimation filter for embedded uplink paths (five paths if two status paths)
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3. TECHNICAL BRIEF
o Oversampling for embedded uplinks (five paths)
o Sigma delta for embedded downlinks (three paths)
o Deserializers for the two status upstream channels
o Support of disconnect protocol
Interface
Phoenix audio comprehend 3 different interfaces:
1. I2C interface for the information with non-critical latency.
2. PDM interface for the audio signal and the register associated with audio path (gain, control)
3. GPO for audio IC interacting with Phoenix audio (drivers, power provider)
Some "dual access" registers (addresses 0x0A to 0x1B) can be accessed by both I2C and PDM.
By default, the concurrent access is disabled and only the PDM
interface can write in these registers. The R/W access can be switched to I2C only by setting bit
I2CSEL. A concurrent access by both I2C and PDM interfaces is also possible by setting bit
PDMI2CSEL. In this last case, Phoenix audio will not provide arbitration of simultaneous accesses and
the functionality of the system will not be guaranteed if this happens. In this mode, the software must ensure
that access by one interface is complete before using the other one, in order to avoid any
collision
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3. TECHNICAL BRIEF
PDM Interface
The PDM interface is the over-sampled serial interface used for communication between Phoenix audio and the
application processor companion chip.
PDM_CLK is 19.2 MHz or 17.64 MHz and data rate represented by PDM_FRAME is respectively 1.92 MHz or 1.764
MHz. Words of data can be transmitted from OMAP to ABB chip using PDM_DN line (downlink path) but words
of data can also be transmitted from ABB chip to OMAP using PDM_UP line (uplink path).
Both chips are synchronized through PDM_FRAME line. By default OMAP is the owner of PDM_FRAME but
during transmission, ABB chip can send back to OMAP some low-latency data by using frame line. This will be
detailed later in this chapter.
Phoenix audio PDM interface consists of three different modes, Normal mode, Command mode and Test mode.
Normal mode and Command mode are intended to use with OMAP McPDM. Test mode is designed for
evaluation and production test.
Fig.3.7.6.2 PDM Interface connectivity between Phoenix and OMAP4 McPDM
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3. TECHNICAL BRIEF
3.7.7 Vocoder Subsystem
FR, HR, EFR speech channels (TCH/FS, TCH/HS, TCH/EFS)
o NAMR/WAMR speech channels over GMSK and 8PSK
o Mandatory sub-functions for speech channels:
- Discontinous transmission (DTX)
- Voice activity detection (VAD)
- Background noise calculation
o Fullrate and halfrate data channels (F14.4, F9.6, F4.8, F2.4, H4.8, H2.4)
3.7.8 Memory Subsystem
The X-GOLD(TM)626 can use the general term SDRAM as a shortcut for Mobile DDR SDRAM.
A total of up to four external memories is supported, chip selects can be dynamically allocated to one of the two
external memory controllers of X-GOLD(TM)626. Only two memory devices can be connected to the SDRAM
controller if DDR support is required.
3.7.9 Battery Management - Hardware Configurations
The X-GOLD(TM)626 chip has an internal PMU that will provide power supply for the chip itself, memory and the
attached RF. The X-GOLD also holds a measurement unit that can perform all necessary battery measurements
through external HW. This is sufficient for a modem only design where charging is controlled by another chip.
3.7.10 Clocking
The clocking system is based on 2 different clocks, a 26 MHz reference clock generated within the RF Engine and
a 32 kHz real-time clock (RTC) generated in the baseband. The 26 MHz clock provided by the RF engine is the
main reference clock for the RF circuit and the X-GOLD(TM)626. Also other system components may be supplied
with 26 MHz reference clocks. A 32 kHz oscillator located at the X-GOLD(TM)626 supplies the RTC with the reference
clock for the real time clock application, as well as provides a low power standby clock for system sleep mode
operation. This clock is available
also for other system components like GPS.
.
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3. TECHNICAL BRIEF
3.7.11 USB
The XMM(TM)6260 platform provides two USB interfaces compliant to the USB2.0 standard:
o High speed interface (480 Mbps) for communication with external devices acting both as host or device
o Full speed interface (12 Mbps) for communication with the UICC using the IC-USB standard acting as host
The USB solution is based on USB controller hardware IP, which is integrated in the X-GOLD(TM)626 baseband chip
including both USB transceivers for high and full speed and the USB Stack software that implements the
different USB device classes and features.
The HS USB component supports the following features:
o Modem connection for Dial Up Networking and AT command interface (CDC-ACM)
o Tracing over USB (CDC-ACM)
o File System Access (Mass Storage Device)
o Audio over USB
o Suspend/Resume and Remote Wakeup and selective suspend (for power saving)
o Software download
The IC-USB component supports the following features:
o UICC-Terminal USB interface according to ETSI TS 102 600 (ICCD / Mass Storage / CDC-EEM)
o Suspend/Resume and Remote Wakeup (for power saving)
The USB HSIC component supports the following features:
o Modem connection for DialUp Networking and AT command interface (CDC-ACM)
o Tracing over USB (CDC-ACM)
o Suspend/Resume and Remote Wakeup, device triggered suspend (for power saving)
o LPM according to " USB 2.0 Link Power Management Addendum " , Remote Wakeup (for power saving)
o Wake-up by sideband signals (optional for optimized power consumption)
o Software download, flashless boot
The USB HSIC component supports the following features:
o Modem connection for DialUp Networking and AT command interface (CDC-ACM)
o Tracing over USB (CDC-ACM)
o Suspend/Resume and Remote Wakeup, device triggered suspend (for power saving)
o LPM according to "USB 2.0 Link Power Management Addendum", Remote Wakeup (for power saving)
o Wake-up by sideband signals (optional for optimized power consumption)
o Software download, flashless boot
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3. TECHNICAL BRIEF
3.8 Power Block
3.8.1 General
Since P920 uses two individual chips, XMM6260 (IFX Modem) uses integrated PMIC and OMAP4430 uses
T WL6030 as a main PMIC.
X-GOLD(TM) 626
PMU Sub-System
3.8.2 XMM6260 (IFX Modem)
Confidential
General Overview
X-GOLD(TM) 626 is a GSM/UMTS/GPRS/EDGE/HSDPA/HSUPA Baseband Controller with integrated modem power
1.1
PMU Block diagram
management unit. This system on chip is designed with the latest low power CMOS process technologies which
provides significant performance to meet the ever increasing demands of the cellular subscriber market for
FSS
eFuses
Digital Control
M4
M3
M2
M1
REF_CLK_EN
RESET_BB_N
ON2_N
TM_EN
TRIG_B
Ball
ON1
feature rich terminals at lowest power consumption and a very competitive cost position.
MU
SSC
VDD_VBAT_SD1
VREF
Bandgap
AGND
B
LSD1
V
CVSD1
VSS_SD1
CVDD_SD1
VDD_VSD2
VSIM
VDD_VBAT_SD2
LSIM
CVSIM
SD2
VPMU
XGOLD626 PMU
LPMU
CVPMU
VRTC
2x
SD2_SW
LIO_12
B
LSD2
V
SD2_FB
VSS_SD2
LRTC
CVRTC
CVSD2
CVDD_SD2
VIO_12
CVIO_12
VUSB_IO
LUSB_IO
CVUSB_IO
VPLL
LPLL
CVPLL
VUSB_ANA
POR
VUSB_PD
Battery
Supervision
LUSB_PD
VSS_PMU
CVUSB_PD
PMU Overview
LGE Internal Use Only
RESET_PWRDWN_N
OSC
LUSB_ANA
CVUSB_ANA
Figure 1
SD1_SW
SD1_FB
ANAMON
ANAMON
CVRTC_BUF
SD1
VDD_VBAT_PMU
CVREF
2x
CVDD_VBAT
DCDC
Supervision
Battery
Figure. LGP920 Modem Power Block Diagram
- 45 -
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Only for training and service purposes
3. TECHNICAL BRIEF
3.8.3 TWL6030
The TWL6030 is an integrated Power Management IC for applications powered by a rechargeable battery. The
device provides 7 configurable step-down converters with up to 1.5A capability for Memory, Processor Core, IO,
auxiliary, pre-regulation for LDOs, etc. It contains also 11 LDO regulators which can be supplied either from
battery or from pre-regulated supply. Power up / power down controller is configurable and can support any
Power up / down sequences (EPROM based).
The Real Time clock (RTC) provides 32KHz output buffer, seconds, minutes, hours, day, month, and year
information as well as Alarm wake up. The TWL6030 supports 32KHz clock generation based on crystal oscillator.
The device integrates also a Switch mode charger allowing faster battery charge, higher efficiency & less power
dissipation.
The TWL6030 generates power supplies for OMAP4 and operates together with TWL6040 which includes all
audio and related detection features. For audio IC parameters, see TWL6040 Datasheet. In addition TWL6030 can
be used as PMIC for several other processors, thanks to the programmable startup/shutdown controller and
default supply voltage levels. The TWL6030 is available in an nFBGA package 7.0mm x 7.0mm with 0.4mm ball
pitch.
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TI Confidential -- NDA Restrictions
3. TECHNICAL BRIEF
TWL6030
www.ti.com
SWCS045 - JANUARY 2010
PWMFORCE
BOOT0
BOOT1
BOOT2
BOOT3
RESPWRON
NRESWARM
PWRON
RPWRON
PREQ1
PREQ2A
PREQ2B
PREQ2C
PREQ3
INT
SYSEN
REGEN1
REGEN2
TESTEN
REFGND
VBG
IREF
VAUX2_IN
VAUX2
VAUX1
Control Ols
VPP
VMMC
VUSIM
REFS
TESTV
VCORE1_IN
VCORE1_SW
VCORE1
VCORE1_FDBK
SR bus
Events bus
VCORE1_GND
VCORE2_IN
VCORE2_SW
Events detect
SRI2C_SCL
SRI2C_SDA
MSECURE
VCORE2
I2C SmartReflex
VCORE2_FDBK
OCP bus
OSC32KIN
OSC32KCAP
OSC32KOUT
VAUX2
VAUX1
VAUX1_IN
VUSIM_IN1
VUSIM_IN2
_IN2: spareinput
VUSIM
VMMC_IN1
VMMC_IN2
_IN2: spareinput
VMMC
VPP
VPP_IN
VIO
GND_DIG_VIO
DEVICE INFORMATION
Xtal
32K
RC
32K
RC
24M
VCORE2_GND
VCORE3_IN
Power control
VCORE3_SW
CLK32KAO
CLK32KG
CLK32KAUDIO
VCORE3
ID
USB SRP
CTLI2C_SCL
VCORE3_GND
VMEM_IN
I2C control
VMEM_SW
CTLI2C_SDA
VMEM
VMEM_FDBK
I2C to OCP
SIM
MMC
BATREMOVAL
PWM1
PWM2
VMEM_GND
V1V8_IN
Card detect
and
PWM
V1V8_SW
V1V8
V1V8_FDBK
MUX
Scalers
GPADC_IN0
GPADC_IN1
GPADC_VREF1
GPADC_IN2
GPADC_IN3
GPADC_IN4
GPADC_VREF4
GPADC_IN5
GPADC_IN6
V1V8_GND
V1V2_IN
Control, data,
and
test logic
10-bit
ADC
V2V1_SW
V 2V1
V2V1_FDBK
GGAUGE_RESN
V2V1_GND
V1V29_IN
GGAUGE_RESP
Auto calib
GPADC_START
13-bit
??
ADC
Digital
filter
V1V29_SW
V1V29
V1V29_FDBK
Interrupt handler
CHRG_EXTCHRG_ENZ
CHRG_EXTCHRG_STATZ
VAC
Ext
charger
ctl
V1V29_GND
VANA_IN
OSC
3 MHz
VANA
VANA
VBUS
CHRG_PMID
VRTC_IN
VAUX3
CHRG_GND
VRTC
VRTC
VCXIO
CHRG_CSOUT
VDAC
USB
charger
and
VBUS
OTG
VUSB
CHRG_SW
CHRG_CSIN
CHRG_AUXPWR
GND_DIG_VRTC
VAUX3_IN
GND_ANA_B1
GND_ANA_B2
GND_ANA_B3
GND_ANA_B4
GND_ANA_B5
GND_ANA_B6
GND_ANA_B7
VDD_B1
VDD_B2
VDD_B4
VAUX3
VCXIO_IN
VCXIO
VDAC_IN
VDAC
VDD_B3
CHRG_PMID
VUSB
CHRG_LED_IN
CHRG_LED_TEST
CHRG_VREF
CHRG_DET_N
VBAT
SWCS045-001
Figure 1. TWL6030 Block Diagram
Figure. TWL6030 functional block diagram
Copyright (C) 2010, Texas Instruments Incorporated
LGE Internal Use Only
- 47 -
Product Folder Link(s): TWL6030
Submit Documentation Feedback
3
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
PRODUCT?PREVIEW
VCORE3_FDBK
RTC
3. TECHNICAL BRIEF
3.8.3.1 Charging control
P920 uses individual Charger IC which is RT9524.
Features
30V Maximum Rating for DC Adapter
Internal Integrated Power MOSFETs
Support 4.2V/2.3A Factory Mode
50mA Low Dropout Voltage Regulator
Status Pin Indicator
Programmed Charging Current
Under Voltage Lockout
Over Voltage Protection
Thermal Feedback Optimized Charge Rate
RoHS Compliant and Halogen Free
Typical Application Circuit
Functional Pin Description
LGE Internal Use Only
- 48 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3.3.8.2 Constant Current Charging Battery Pre-Charge Current
During a charge cycle, if the battery voltage is below the pre-charge threshold, the RT9524 enters the pre-charge
mode. This feature revives deeply discharged cells and protects battery. Under USB100 Mode, the pre-charge
current is internally set to 95mA. When the RT9524 is under USB500 and ISET Mode, the pre-charge current is
20% of fast-charge current set by external resistor RISET.
Battery Fast-Charge Current ISET Mode
The RT9524 offers ISET pin to program the charge current. The resistor RISET is connected to ISET and GND. The
parameter KISET is specified in the specification table.
LGE Internal Use Only
- 49 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
Battery Voltage Regulation (CV Mode)
The battery voltage regulation feedback is through BATT pin. The RT9524 monitors the battery voltage between
BATT and GND pins. When the battery voltage closes to battery regulation voltage threshold, the voltage
regulation phase begins and the charging current begins to taper down. When the charging current falls below
the programmed end-of-charge current threshold, the CHG_S pin goes high to indicate the termination of
charge cycle. The end-of-charge current threshold is set by the IEOC pin. The resistor RIEOC is connected to IEOC
and GND. The parameters KIEOC and IEOC are specified in the specification table.
The current threshold of IEOC (%) is defined as the percentage of fast-charge current set by RISET. After the
CHGSB pin pulled to high, the RT9524 still monitors the battery voltage. Charge current is resumed when the
battery voltage goes to lower than the battery regulation voltage threshold.
LGE Internal Use Only
- 50 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3.8.3.3 Constant Voltage Charging
Constant voltage charging begins when the battery voltage reaches a target voltage, 4.2V. The end of constant
voltage charging is commonly detected around 240mA from Travel adaptor.
3.8.3.4 LGP920 Charging Specification
-Charging Method : CC & CV (Constant Current & Constant Voltage)
-Maximum Charging Voltage : 4.2V
-Maximum Charging Current : 948mA
-Nominal Battery Capacity : 1500mAh
-Charging time : Max. 3h 30m
- Full charge indication current (icon stop current) : 248mA
3.8.3.5 LGP920 battery bar icon display
Battery Bar Number
Specification
BAR 6 (Full)
90% over
BAR 6 -- & gt; 5
90%
89%
BAR 5 -- & gt; 4
70%
69%
BAR 4 -- & gt; 3
50%
49%
BAR 3 -- & gt; 2
30%
29%
BAR 2 -- & gt; 1
15%
14%
BAR 1 -- & gt; 0
5%
Low Battery Pop-up
4% ~ 15% : One Time popup
Critical Low Battery Pop-up
0% ~ 3% : Popup at every level change
POWER OFF
0%
Remain %
4%
Table. LGP920 battery bar specification
LGE Internal Use Only
- 51 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3.9 External memory interface
3.9.1 Introduction
Since LG-P920 contains communication and application processor, memory is dedicated only for each processor.
XMM6260 (IFX modem) uses MCP (Multi Chip Package) 1Gb Nand / 512Mb LPDDR1 and OMAP4430 uses POP
(Package on Package) 512MB LPDDR2 and 8GB eMMC Nand memory.
3.9.2 LG-P920 XMM6260 (IFX Modem) memory Interface
-Multi Chip Package : DDR SDRAM and NAND Flash merged 1 package
-512Mbit Mobile DDR SDRAM / 1Gbit NAND Flash
Interface Spec
Part Name
H8BCS0QG0MMR46M
Product Gr
Maker
Operation Voltage
Speed
NAND
Hynix
1.8V
45ns
1.8V
166MHz
SDRAM
3.9.3 LG-P920 OMAP4430 memory Interface
- Package on Package on OMAP4430: DDR2 SDRAM
- 8GB eMMC 4.41 version
LPDDR2
Interface Spec
Part Name
Product Gr
Maker
Operation Voltage
Speed
K3PE4E400M-XGC1
SDRAM
Samsung
1.8V/1.2/1.2/1.2
DDR2 800
(400MHz)
8GB NAND
Interface Spec
Part Name
Product Gr
Maker
Operation Voltage
Speed
SDIN5C2-8G-974D
NAND
Sandisk
2.8V
15MB/s for read
9MB/s for write
3.9.4 External SD card memory Interface
OMAP4430 supports external SD card which supports up to 32GB (SDHC compatible)
LGE Internal Use Only
- 5 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3.10 Audio and sound
3.10.1 Overview of Audio path
OMAP
4430
ABE_PDM_UL_DATA
ABE_CLKS
ABE_PDM_LB_CLK
ABE_PDM_FRAME
ABE_McBSP3_DR
ABE_McBSP1_FSX
ABE_McBSP1_DX
ABE_McBSP1_DR
ABE_McBSP1_CLKX
UART2_RTS/
UART2_CTS/
UART2_RX
UART2_TX
DPM_EMU10
ABE_McBSP2_CLKX
ABE_McBSP2_DR
ABE_McBSP2_DX
ABE_McBSP2_FSX
FM_I2S_FSYNC
FM_I2S_DO
FM_I2S_CLK
FM_I2S_DI
BT_PCM_SYNC
BT_PCM_DOUT
BT_PCM_DIN
BT_PCM_CLK
BT_UART_RTS/
BT_UART_CTS/
BT_UART_RXD
BT_UART_TXD
BT / WiFi / FM
FM_I2S_FSYNC
FM_I2S_DI
FM_I2S_CLK
FM_I2S_DO
SPK
AUD_SPK_P
AUD_SPK_N
HFRP2
HFRN2
RCV
AUD_RCV_P
EARP
EARN AUD_RCV_N
AUDPWRON
NRESPWRON
SYS_nIRQ2
SYS NIRQ2
SYS_NIRQ2
ABE_McBSP3_CLKX
PDMCLK
PDMCLKLB
PDMFRAME
PDMDN
PDMUP
AUD_PWRON
SYS_nRESPWRON
HDQ_SIO
SYS_NRESPWRON
ABE_McBSP3_DX
SCL (Audio Codec)
ABE_CLKS
PDM_CLK
PDM_FRAME
I2C1_SCL
ABE_PDM_DL_DATA
ABE_McBSP3_FSX
HFRP1
SDATWL6040 HFRN1
I2C1_SDA
I2C1_SCL
PDM_DL_DATA
PDM_UL_DATA
I2C1_SDA
NAUDINT
FM_AUDIO_R
FM_AUDIO_L
AFML
AFMR
HBIAS
HS_MIC
HSL
HSR
ACCONN
HS_MICBIAS
HS_MIC
EAR_L
EAR_R
HOOK_ADC
3.5
PCM_AUD_FSYNC
PCM_AUD_IN
PCM_AUD_OUT
PCM_AUD_CLK
MBIAS
MMICP
MMICN
Analog
SBIAS
SMICP
SMICN
FM_ANT
Analog
MIC1
MIC2
EAR_SENSE
HCI_CTS
HCI_RTS
HCI_TX
HCI_RX
FM_ANT
EAR_SENSE
IPC_I2S_CLK
IPC_I2S_DOUT
IPC_I2S_DIN
IPC_I2S_SYNC
XMM6260
I2S2_CLK0
I2S2_TX
I2S2_RX
I2S2_WA0
Figure. Block diagram of Audio & Sound path
LGE Internal Use Only
- 53 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3.10.2 TWL6040 (Audio Codec)
The TWL6040 is an audio codec with a high level of integration providing analog audio codec functions for
portable applications, as shown in Figure 3.10.2. It contains multiple audio analog inputs and outputs, as well as
microphone biases and accessory detection. It is connected to the OMAP4 host processor through a proprietary
PDM interface for audio data communication enabling partitioning with optimized power consumption and
performance. Multichannel audio data is multiplexed to a single wire for downlink (PDML) and uplink (PDMUL).
The OMAP4 device provides a TWL6040 with five PDM audio-input channels (DL0-DL4). Channels DL0-DL3 are
connected to four parallel DAC channels multiplexed to stereo headphone (HSL, HSR), stereo speaker (HFL,HFR),
and earpiece (EAR) or stereo line outputs (AUXL, AUXR).
The stereo headphone path has a low-power (LP) mode operating from a 32-kHz sleep clock to enable over 100
hours of MP3 playback time. Very-high dynamic range of 104 dBA is achieved when using the system clock input
and DAC path high-performance (HP) mode. Headphone drivers provide a 1-Vrms output and are ground
centered for capless connection to headphone, thus enabling system size and cost reduction. The earpiece
driver is a differential class-AB driver with 2 Vrms capability to a typical 16Ohm or 32 Ohm load.
Stereo speaker path has filterless class-D outputs with 1.5W capability per channel. For output power
maximization supply connection to an external boost is supported. Speaker drivers support also hearing aid coil
loads. For vibrator and haptic feedback support TWL6040 has two PWM channels with independent input
signals from DL4 or I2C. Vibra drivers are differential H-bridge outputs, enabling fast acceleration and
deceleration of vibra motor. An external driver for a hearing aid coil or a piezo speaker requiring high voltage
can be connected to line outputs.
The TWL6040 supports three differential microphone inputs (MMIC, HMIC, SMIC) and a stereo line-input (AFML,
AFMR) multiplexed to two parallel analog-to-digital converters (ADCs). The PDM output from the ADCs is
transmitted to the OMAP4 through UL0 and UL1. Two LDOs provide a voltage of 2.1 V to bias analog
microphones (MBIAS and HBIAS). The maximum output current is 2 mA for each analog bias, allowing up to 2
microphones on one bias. Two LDOs provide a voltage of 1.8 V/1.85 V to bias digital microphones (DBIAS1 and
DBIAS2). One bias generator can bias up several digital microphones at the same time, with a total maximum
output current of 10 mA.
LGE Internal Use Only
- 54 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
The TWL6040 has an integrated negative charge pump and two LDOs (HS LDO and LS LDO) for high PSRR.
The only external supply needed is 2.1 V, which is available from the TWL6040 PMIC in the OMAP4 system. All
other supply inputs can be directly connected to battery or system 1.8-V I/O.
Two integrated phase-locked loops (PLLs) enable operatation from a 12-/19.2-/26738.4-MHz system clock
(MCLK) or, in LP playback mode, from a 32-kHz sleep clock (CLK32K). The frequency plan is based on a 48-kS/s
audio data rate for all channels, and host processor uses sample-rate converters to interface with different
sample rates (e.g., 44.1 kHz). In the specific case of low-power audio playback, the 44.1-kS/s and 48-kS/s rates are
supported by the TWL6040. Transitions between sample rates or input clocks are seamless.
Accessory plug and unplug detections are supported (PLUGDET). Some headsets have a manual switch for
submitting send/end signal to the terminal through the microphone input pin. This feature is supported by a
periodic accessory button press detection to minimize current consumption in sleep mode. Detection cycle
properties can be programmed according to system requirements.
Figure 3.10.2 shows a simplified block diagram of the device.
LGE Internal Use Only
- 55 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
Figure 3.10.2. Simplified Block diagram
LGE Internal Use Only
- 56 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
VBAT
VSEL_1.8V
VSEL_2.1V
C939
C938
C937
C936
C935
C934
C933 C932
C931 C930 C929
0.1u
0.1u
2.2u
220n
2.2u
2.2u
100n
0.1u
0.1u
0.1u
C940
0.1u
C924
2.2u
Added (P925 Rev.A)
C923
C902
4.7u
C903
4.7u
K9
L8
L10
K8
H8
PDM_DL_DATA
PDM_UL_DATA
ABE_CLKS
PDM_CLK
PDM_FRAME
TP901
TP902
TP903
TP904
I2C1_SDA
I2C1_SCL
H6
G6
AUD_PWRON
SYS_nRESPWRON
SYS_nIRQ2
D8
J9
E8
D4
B6
B7
C904
4.7u
C905
Removed (Rev.C)
Open/ground switch input
4.7u
L6
K6
L5
G5
E1
EAR_SENSE
HOOK_ADC
Microphone input
K2
A1
L1
A11
L11
AUD_CLK_IN
K7
CLK32K_AUD
H7
MMIC_P
ICVS0318150FR
VA902
C922
0.1u
C921
0.1u
C919
R921
0
R919
0.1u
C918
0
MMIC_N
SMIC_P
SMIC_N
0.1u
F2
C916
0.1u
C915
HS_MICBIAS
HS_MIC
0.1u
C917
0.1u
AFMR
AFML
a stereo line-input F1
FM_AUDIO_R
FM_AUDIO_L
B10
AUD_RCV_P
AUD_RCV_N
EARP
earpiece
C11
EARN
a differential class-AB driver
with 2 Vrms
AUDPWRON
NRESPWRON
NAUDINT
U901
TWL6040
GPO1
GPO2
GPO3
REFN
REFP
REF
PLUGDET
ACCONN
capability to a typical 32Ohm
HSL
stereo headphoneHSR
AUXLP
AUXLN
AUXRP
stereo line outputs
AUXRN
Added (P925 Rev.A)
ICVS0318150FR
VA903
0.1u
C920
HMICP
H2
HMICN
SDA
SCL
J11
K11
EAR_L
EAR_R
G3
F3
G4
F4
A4
HFLP1
A5
HFLN1
stereo speaker 1 B9
HFRP
filterless class-D outputs with B8
1.5W
HFRN1
HFLP2
HFLN2
HFRP2
HFRN2
ATEST
DTEST1
DTEST2
DTEST3
PROG
FB914
120
FB913
120
B4
B5
A9
A8
AUD_SPK_P
AUD_SPK_N
C913
C914
1n
1n
C1
VIBLP
D3
VIBLN
A2
VIBRP
B1
VIBRN
MCLK
CLK32K
NC1
NC2
NC3
NC4
Added (P925 Rev.A)
HBIAS
2.1V
H1
E6
E7
F8
G7
G8
D5
D6
D7
E5
J5
L4 X
K3 X
K1
J2
J4
H4
J3
PDMDN DOWNLINK
PDMUP UPLINK
PDMCLK
PDMCLKLB
PDMFRAME
GNDREF
GNDHS
GNDAMIC
GNDDMIC
GNDLDO1
GNDLDO2
GNDVCM
GNDNCP1
GNDNCP2
GNDHFL1
GNDHFL2
GNDHFL3
GNDHFR1
GNDHFR2
GNDHFR3
GNDDIG
GNDVIBR
GNDVIBL
GNDIO
4.7u
DBIAS1
DBIAS2
MBIAS
2.1V
MMICP
MMICN
SMICP
SMICN
PBKG1
PBKG2
PBKG3
PBKG4
PBKG5
Removed (Rev.C)
F5
F6
F7
E4
K10
K5
H9
H3
L3
E3
D9
J1
F10
G10
C5
C4
C6
C7
C8
C9
J6
B3
D2
J8
C901
VDDREGNCP
NCPOUT1
NCPOUT2
NCPFB
CFLYP
CFLYN
VDDVREF
VDDEAR
VDDHS
VDDUL
VDDDL
VDDPLL
VDDHFL1
VDDHFL2
VDDHFR1
VDDHFR2
VDDVIBL
VDDVIBR
VDDAMBIAS
VDDDMBIAS
VDDVIO
VSSEAR
VSSHS
VSSUL
VSSDL
VSSPLL
VDDV2V1
VDDLDO
VSSLDOIN
VSSLDO
H11
E10
E11
G9
G11
F11
NC5
NC6
NC7
NC8
NC9
FB901 120
MICBIAS
VA901
1u
H5
B11
J10
G2
E9
J7
A3
A6
A7
A10
C2
B2
L2
K4
L9
C10
H10
G1
F9
L7
E2
D1
D11
D10
100n
0.47u
C925
C941
2.2u
C926
VSEL_2.1V
0.1u
C927
120
470n
C928
FB941
ICVS0318150FR
0.1u
VBAT
HS_MIC|HOOK_ADC
FB1177
FB1175
1800
FB1176
1800
EAR_R
EAR_L
C1175
C1176
0.1u
C1177
R1178
33p
HS_MICBIAS
2.2K
R1176
0.1u
HOOK_ADC
HS_MIC
1800
10K
C1178
C1179
470p
10u
Added (925 Rev.D)
Changed (Rev.1.0)
FB1173
1800
Q1173
R1173 1M
2
1
R1172
Changed (P925 Rev.B)
VSEL_1.8V
S
G
D
EAR_SENSE
3
2SJ347
R1174
200K
DNI
LGE Internal Use Only
- 57 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3.11 Main (5M pixels) & Sub (VGA) Camera
LG-P920 supports two cameras. One is 5M pixels, main camera, the other is VGA, sub camera used VT & self
camera scene.
5M_VCM_V2V8_S
CN1221
GB042-40S-H10-E3000
FL1221
ICMEF214P101M
1
P1
2
P2
3
P3
4
P4
5
P5
6
P6
7
P7
8
P8
35
8
9
10
11
29
12
28
13
27
14
26
15
25
16
24
17
C1231
23
18
0.1u
19
21
ESD9B5_0ST5G
7
30
ESD9B5_0ST5G
ZD1225
6
34
31
ZD1224
9
G1
10
G2
PRIMARY_5M_MIPI_CLK_N
PRIMARY_5M_MIPI_CLK_P
5
22
5
P5
6
P6
7
P7
8
P8
4
36
FL1222
1
P1
2
P2
3
P3
4
P4
3
37
32
5M_MCLK
2
38
SECONDARY_5M_RESET_N
PRIMARY_5M_RESET_N
1
39
9
G1
10
G2
40
33
SECONDARY_5M_MIPI_CLK_N
SECONDARY_5M_MIPI_CLK_P
SECONDARY_5M_MIPI_DATA0_N
SECONDARY_5M_MIPI_DATA0_P
20
I2C4_SCL
I2C4_SDA
C1235
C1236
4.7u
1u
C1237
0.1u
5M_VANA_V2V7_S
1.2V_5M_VDIG
C1234
1.8V_5M_VIO
5M_VANA_V2V7_P
5M_MCLK_CAM
0.1u
C1233
0.1u
C1232
0.1u
I2C3_SCL
I2C3_SDA
5M_MCLK_CAM
5M_VCM_V2V8_P
C1228
ICMEF214P101M
4.7u
C1229
1u
C1230
0.1u
FL1223
1
P1
2
P2
3
P3
4
P4
5
P5
6
P6
7
P7
8
P8
9
G1
10
G2
PRIMARY_5M_MIPI_DATA0_N
PRIMARY_5M_MIPI_DATA0_P
PRIMARY_5M_MIPI_DATA1_N
PRIMARY_5M_MIPI_DATA1_P
ICMEF214P101M
Figure. Main 5M Camera Schematic
TWL_LDO_2.8V
TWL_LDO_1.8V
CN103
1
VT_0.3M_MIPI_DATA0_N
VT_0.3M_MIPI_DATA0_P
18
4
17
5
16
6
15
14
8
VT_0.3M_MCLK
19
3
7
VT_0.3M_MIPI_CLK_N
VT_0.3M_MIPI_CLK_P
20
2
13
9
12
10
11
FB101
Rev.1.1 (VSEL 1.8V Remove)
Rev.B(Removed Bypass Cap)
I2C3_SDA
I2C3_SCL
VT_CAM_PWDN
VT_CAM_RESET/
C103
C104
0.1u
0.1u
Figure. VGA Camera Schematic
LGE Internal Use Only
- 58 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
VBAT
2.2u
E4
D2
E3
D4
VINB
FB
5M_VANA_V2V7_P
A2
VIN1
D1
L1201
2.2u
C1209
2.2u
VIN2
10u
C1210
2.2u
10u
A4
C1201
C1211
C1212
VBATT
Close to E4
1.2V_5M_VDIG
LDO1
SW
GNDB
LDO2
B3
C4
I2C3_SDA
I2C3_SCL
C3
D3
E2
CAM_SUBPM_EN
IRQ_N
SDA
U1201
LP8720TLX
SCL
DVS
EN
LDO3
LDO4
R1202
100K
Changed (P925 Rev.A)
B2
C2
5M_VCM_V2V8_P
B4
DEFSEL
IDSEL
LDO5
A3
5M_VANA_V2V7_S
A1
1.8V_5M_VIO
C1
5M_VCM_V2V8_S
E1
C1204
C1206
C1207
C1208
1u
1u
1u
1u
B1
C1205
1u
G ND
Added Res. (Rev.B)
Figure. Camera Sub PMIC Schematic
CAMERA
VT_IO_DVDD_1V8
CAM_MCLK
`
VT_PCLK
VT_HSYNC
VT_AVDD_2V8
EMI/ESD Filter
VT_VSYNC
1.3M Camera
VT_DATA[7:0]
VT_RESET_N
VT
VT_CAM_PWDN
LP8720
LP8720
SUB PMIC
CAM_I2C_SC
L
CAM_I2C_SD
A
CAM_SUBPM_EN
AP20
Common mode filter
CAM_VDIG_1V2
CAM_AVDD_2V8
CAM_VIO_1V8
CAM_AF_2V8
8M_MIPI_CLK_N
8M_MIPI_CLK_P
8M
8M_MIPI_DATA0_N
Camera
8M_MIPI_DATA0_P
8M_MIPI_DATA1_N
(LGIT)
(LGIT)
8M_MIPI_DATA1_P
8M_RESET_N
CAM_MCLK
8M
8M_CAM_VCM_EN
CAM_VIO_1V8
Figure. Camera Block diagram
LGE Internal Use Only
- 59 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3.12 Display
LCD module is connected to Main PCB with 30-pin connector.
The LCD is controlled by MIPI Interface in OMAP4430
1.8V_LCD_IOVCC
12V_3D_LCD
2.8V_3D_LCD
CN1141
24-5804-030-000-829+
30
11
19
12
18
13
14
15
3D_LCD_BANK_SEL_1
2.8V_LCD_VCC
4
2.8V_LCD_VCI
2
I2C2_SDA
I2C2_SCL
LED_C1
LED_C2
LED_A
FB1143 600
C1143
1
1u
ICVS0318150FR
VA1104
ICVS0318150FR
VA1102
ICMEF214P101M
10
20
G2
10
G1
9
9
G1
10
G2
DSI2_LCD_MIPI_CLK_N
DSI2_LCD_MIPI_CLK_P
9
21
5
P5
6
P6
7
P7
8
P8
8
16
1
P1
2
P2
3
P3
4
P4
DNI
7
22
FL1142
DNI
R1191
23
ICMEF214P101M
R1190
6
17
DSI2_LCD_MIPI_D0_N
DSI2_LCD_MIPI_D0_P
DSI2_LCD_MIPI_D1_N
DSI2_LCD_MIPI_D1_P
5
24
1
P1
2
P2
3
P3
4
P4
4
26
25
5
P5
6
P6
7
P7
8
P8
3
27
FL1141
2
28
LCD_RESET_N
1
29
1u
3
C1141
Added (Rev.B)
Removeed VA1101, VA1103 (Rev.C)
Figure. Schematic of LCD connector (Main Board)
Table. Interface between LCD Module and MAIN Board
LGE Internal Use Only
- 60 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
LG-P920 supports 3D LCD(Glassless)
The 3D LCD is controlled by 3D control IC(ISL24832)(3D Control IC is in LCD Module)
OMP4430 is supplying power for the 3D LCD, control signals are supplied.
2.8V_3D_LCD
VBAT
U1106
BU28TD2WNVX
3D_LCD_EN
VIN
STBY
VOUT
GND
PGND
4
3
C1107
5
C1106
1
2
1u
1u
Figure. Schematic of 3D PWR LDO(Main Board)
Changed (Rev.B)
VBAT
L1131 4.7u
2
C1132
0.1u
4
3
5
3D_BOOST_EN
6
R1133
51K
R1134
SW
CP1
VO
CP2
OUT
EN
FB
GND
SS
C1134
200K
VIN
0.1u
Exposed_GND
9
10
12V_3D_LCD
C1138
0.1u
8
7
R1136
1
510K
11
C1137
1u
22K
4.7u
R1135
U1131
TPS61093
C1131
Changed (P925 Rev.A)
Figure. Schematic of 3D LCD Boost(VREF)(Main Board)
LGE Internal Use Only
- 61 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3D Mode On Sequence : 3D PWR On
VREF On
BANK_SEL On
Figure. 3D Mode On Sequence
3D Mode Off Sequence : BANK_SEL Off
VREF Off
3D PWR Off
Figure. 3D Mode Off Sequence
LGE Internal Use Only
- 6 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
LCD Block Diagram
Figure. LG-P920 LCD Module Block Diagram
LGE Internal Use Only
- 63 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3.13 Vibrators
The Linear motor, creates a certain kind of vibration controlled and defined uniquely by LG Electronics. The
followings are the certain examples of conditions that the users may feel the vibration from the phone:
Incoming Call (in Silence Mode), Google Keys Pressed, Turn-on / -off, Dialing, and Text Messaging.
Added (P925 Rev.A)
TWL_LDO_3.0V
TP905
3
R982
GND
MODE
VDD
GAIN
VDN
11
DNI
PWM
NC3
4
VDP
10
R981
100K
ISA1000
EN
NC2
2
U981
L989
8
82n
VIB_L_P
7
6
L988
5
82n
VIB_L_N
NC1
1
VIBE_EN
VIBE_PWM
Changed (P925 Rev.A)
0
EUSY0238306
9
R987
C986
2.2u
3.9n
R986
C987
470K
Changed (P925 Rev.A)
Figure 1 Vibrator Schematic
Figure 2 Vibrator Block Digram
LGE Internal Use Only
- 64 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3.14 HDMI
When the users desire to output video signals onto the outer display, they are supposed to open the cap first
and connect the suitable cable, which has to be HDMI type-D compatible, to the socket placed at the upper
center of the phone. It will automatically display the video contents on the desired display
5V_HDMI
CN1271
78618-0001
20
Changed Con. (Rev.B)
21
22
1
C_HDMI_HPD
2
R1271
100K
3
HDMI_D2+
4
5
HDMI_D2HDMI_D1+
6
7
8
HDMI_D1HDMI_D0+
9
10
11
HDMI_D0HDMI_CLK+
Removed (Rev.1.0)
HDMI_CLKC_HDMI_CEC
12
13
14
15
16
17
C_HDMI_SCL
C_HDMI_SDA
18
19
23
24
C1271
25
100n
Figure 1 HDMI Type D Connector Schematic
Figure 2 HDMI Type D Connector Pin Assignments
LGE Internal Use Only
- 65 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3.15 Compass Sensor
If a customer buy the application SW, The Sensor provides user with a Electric Compass function.
U1107 (AMI304) IC is interfaced to AP20(U401) using I2C interface.
SENSOR_3.0V
C978
1u
AMI304 Specifications (Preliminary)
[ 1 ] Scope of Application
U975
C975
4
5
2
1
GND
VSEL_1.8V
by Aichi Steel
AVDD
[ 2 ] General Description
COMPASS_INT
VREG
3
This specification applies to the 3-axis magnetic sensor AMI304AMI306
provided to
1u
Corporation.
INT
DVDD
10
SDA
ADDR
9
DRDY
VPP
Added (Rev.1.0)
SCL
The AMI304 is a n intelligent electronic compass that integrates three Magneto-Impedance sensor
C976
10n
elements (MI-element) with their controller IC in a single small package.
8
6
7
The controller IC of the AMI304 consists of a circuit for detecting the magnetic signals from three
I2C4_SDA
MI-sensor elements, an amplifier capable of compensating each sensors offset and setting appropriate
I2C4_SCL
sensitivity values, a thermal sensor for measuring the ambient temperature, a 12bit AD converter, an I2C
serial interface circuit and a constant voltage circuit for power control.
Figure. Compass Sensor Schematic
[ 3 ] Block Diagram
NC
NC
X-axis
VREG
Circuit for
MI-sensor
MI-Sensors
Data
Y-axis
MI-sensor
1.0uF
Z-axis
V
oltage
Vpp
12bit AD
Converter
Zero point
256 Bytes
VDD
Adjustment
C2
0.01uF
DVDD
ADDR
Thermal
sensor
VID
GNDS
INT
For Factory
Calibration
OTP-ROM
A
VDD
C1
0.47uF
GNDA
PGA
MI-sensor
Dropout
Regulator
Logic circuit
DRDY
Serial I/F
(I2C)
SCL
SDA
Figure. Compass Sensor Block Diagram
LGE Internal Use Only
- 66 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3.16 Motion Sensor
The motion sensor can sense gravity & accelerated motion. Therefore according to the direction of cell phone,
the phone screen is rotated automatically. And the motion sensor is connected with a gyro sensor to
supplement each data.
U971 : KXTF9 IC is interfaced to OMAP4430(U500) using I2C interface.
IME_DA
IME_CL
VSEL_1.8V
SDA
10
VSEL_1.8V
C971
2
0.1u
3
4
DNC1
DNC2
GND
SCL
U971
DNC4
KXTF9
INT
DNC3
9
R973
DNI
8
7
MOTION_INT
6
5
SENSOR_3.0V
IO_VDD
VDD
1
C972
C973
0.1u
1u
Figure. Motion Sensor Schematic
Figure. Motion Sensor Block Diagram
LGE Internal Use Only
- 67 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3.17 Gyro Sensor
The gyro sensor(MPU3050) can sense angular velocity not gravity and accelerated motion. The gyro sensor
applied in LG- P920 can detect 3-axis rotation force sensing X,Y and Z angular velocity. And the gyro sensor data
is supplemented by the motion sensor data. It make possible user to development application SW using gyro
sensor data like that motion games.
U961: MPU3050 IC is interfaced to OMAP4430(U500) using I2C interface.
SENSOR_3.0V
Added (P925 Rev.A)
C965
0.1u
VDD
15
13
16
17
14
NC6
NC7
NC8
NC 5
REGOUT
MPU3050A
SDA
AD0
VLOGIC
IME_CL
NC9
11
10
9
8
7
C963
C962
0.1u
0.1u
IME_CL
IME_DA
1
25
SCL
IME_DA
24
FSYNC
U961
CLKOUT
NC4
23
RESV2
GYRO_INT
12
6
I2C4_SCL
I2C4_SDA
VSEL_1.8V
INT
NC3
22
CPOUT
5
21
RESV1
4
20
NC2
19
3
2.2n
NC1
C961
CLKIN
R902
1.5K
2
R901
1.5K
GND
18
VSEL_1.8V
Figure. Gyro Sensor Schematic
X Gyro
Y Gyro
Temp
ADC
Z Accel
ADC
ADC
ADC
Digital
Control and
Processing
ADC
Y Accel
ADC
Z Gyro
X Accel
ADC
Digital
IC
Primary
Serial
Interface
Sensor IC
Interface
Figure. Gyro Sensor Block Diagram
LGE Internal Use Only
- 68 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3.18 Illumination & Proximity Sensor
Illumination Sensor adjusts LCD backlight current by detecting the surrounding brightness.
If user checks the automatic brightness menu, LCD backlight current adjusting is to be enable automatically.
When the call is connected and the object close to the proximity sensor,
LCD backlight and Touch screen are disable operation automatically.
U101 : APDS-9900 IC used I2C interface to OMAP4430
SENSOR_3.0V
PROXI_3.0V
Rev.B(Pull Up Move to Main PCB)
U101
1
I2C3_SDA
PROX_INT
2
3
4
SDA
VDD
INT
SCL
LDR
LEDK
GND
LEDA
8
7
I2C3_SCL
6
5
C102
1u
C101
1u
Figure. Illumination & Proximity Sensor Schematic
Figure. Illumination & Proximity Sensor Block Diagram
LGE Internal Use Only
- 69 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3.19 Touch Module
Touch module is connected to Main PCB with 10-pin connector.
The Touch module is controlled by I2C Interface in OMAP4430.
VSEL_1.8V
10K
R112
TOUCH_3.3V
1
CN102
10
I2C2_SCL
2
9
3
8
4
7
5
6
I2C2_SDA
TOUCH_RESET
TOUCH_INT_N
C120
1u
ZD106
ZD104
ZD103
ZD102
VA103
Rev.F
ZD101
2.2u
ZD105
C119
Rev.F
Rev.E
VSEL_1.8V
Rev.F
Rev.F
Figure. Schematic of Touch connector (Sub PCB side)
Pin Map
1
SCL
2
GND
3
SDA
4
VDD(3.3V)
5
INT
6
VBUS(1.8V)
7
Reset
8
GND
9
GND
10
GND
LGE Internal Use Only
- 70 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3.20 Main Features
3.23.1 LG-P920 Main Features
- DOP Type design
- UMTS 2100 + UMTS 1900 + UMTS900+ GSM 900 + DCS 1800 + PCS 1900 + GSM850 based
GSM/GPRS/EDGE/UMTS
- HSDPA 14.4Mbps, HSUPA 5.7Mbps
- Main LCD (WVGA)
TFT Main LCD (4.3", 480X800), 3D LCD
- Capacitive/Electrostatic Touch Window
- 5M AF 3D Camera, 0.3M VT Camera
- 3.5Phi Stereo Headset & Speaker phone
- MP3/ WMA / AAC/AAC+/WAV/AC3 decoder and play
- MPEG4 encoder/decoder and play/save
- JPEG en/decoder
- Supports Bluetooth and HS-USB
- Supports WLAN(802.11b, 802.11g, 802.11n)
- Supports FM Radio
- 1500 mAh (Li-Ion)
LGE Internal Use Only
- 71 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4. TROUBLE SHOOTING
4.1 RF Component
X184
TCXO(26MHz)
U181
RFIC(Tranceive)
U241
Tranceiver PMU
U220
PAM DCDC
U121
Duplexer(Bank)
U171
PAM(MMMB)
FL111
Filter(Seperator)
RF component (WCDMA / GSM)
LGE Internal Use Only
- 7 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.2 SIGNAL PATH
WCDMA 1,2,4,5,8 Band TX Signal PATH
A. WCDMA 2100 TX PATH
B. WCDMA 1900 TX PATH
C. WCDMA 1700 TX PATH
D. WCDMA 850 TX PATH
E. WCDMA 900 TX PATH
LGE Internal Use Only
F. COMMON TX/RX PATH\
- 73 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
WCDMA 1,2,4,5,8 Band RX Signal PATH
A. WCDMA 2100 RX PATH
B. WCDMA 1900 RX PATH
C. WCDMA 1700 RX PATH
D. WCDMA 850 RX PATH
E. WCDMA 900 RX PATH
LGE Internal Use Only
F. COMMON TX/RX PATH\
- 74 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
GSM 850,900,1800,1900 Band TX/RX Signal PATH
A. GSM 850 RX PATH
C. GSM 1800 RX PATH
E. GSM 850,900 TX PATH
B. GSM 900 RX PATH
D. GSM 1900 RX PATH
F. GSM 1800,1900 TX PATH
G. COMMON TX/RX PATH
LGE Internal Use Only
- 75 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.3 Checking TCXO Block
The output frequency (26MHz) of TCXO (X184) is used as the reference one of PMB5712
TP1
TP2
3
TP
2
X1841XXA26000FBA
OUT
VCC
GND
VCONT
4
1
TP1
26MHz
C184
C185
22n
10n
Schematic of the Crystal Part (26MHz)
Schematic of the Crystal Part (26MHz)
LGE Internal Use Only
- 76 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
Check TP1
VCC of TCXO
1.7V >= VCC >= 1.9V
No
Check the PMB571
Yes
Check TP
6 MHz Signal
No
Check soldering and
components
Yes
TCXO is OK
LGE Internal Use Only
- 77 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.4 Checking WCDMA Block
START
Check TCXO Block
Check RF Switch (M/S)
Check TX/RX Level
Re-download & Cal
Change the Board
LGE Internal Use Only
- 78 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.4.1. Checking RF TX Level
TP3
TP4
TP2
TP1
Test Point (TX Level)
LGE Internal Use Only
- 79 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
C105
TP1
100p
2
L102
COMMON
ANT
G4
2.2n
G1
ANT
1
G2
G3
4
3
C103
100n
C101
DNI
L104
L105
DNI
SW101
20279-001E-01
SW102
MS-156C
DNI
& lt; L102 & gt;
* Global : 2.2nH
* AT & T, TMUS : 100pF
GSM1800_RX
C116
33p
C117
33p
SDIO
18
1.2n
C132
TP
FRM
SCL
L131
19
2
4
5
6
8
10
33p
C133
DNI
15
13
14
LVDD
16
GND2
VDD
GND5
GND1
4
17
5
GND3
GND6
21
GND4
TRX_6
20
C112 10p
GSM_HB_TX
L142
DNI
VBAT
B4
L114
3n
TP
L141
DNI
C114
27p
U121
ANT-Band8
16
Rx-Band4_1
17
Rx-Band4_2
B40761DY2045L
GND1
GND2
GND3
GND4
GND5
GND6
24
Rx-Band5_1
25
Rx-Band5_2
26
Rx-Band8_1
27
Rx-Band8_2
9
L113
10n
SPI_CLK
SPI_DRW
SPI_SS
L112
Rev.1.1
2.2n
ANT-Band5
RX_GSM1800_M1X
RX_GSM1800_M1
RX_B1_H2X
RX_B1_H2
RX_B2_M2X
RX_B2_M2
RX_B4_H1X
RX_B4_H1
RX_B5_L2X
RX_B5_L2
RX_B8_L1X
RX_B8_L1
37
GND7
GND8
GND9
GND10
GND11
GND12
GND13
GND14
GND15
GND16
GND17
GND18
TRX_5
B2/GSM1900
1
52
Tx-Band8
HB_TX
TRX_4
2
Rx-Band2_1
21
Rx-Band2_2
1
TRX_3
3
20
ANT_Band4
Tx-Band1
6
7
DNI
PGND
L111
1.8p
TRX_2
FL111
BGSF18DM20
9
C109
LB_TX
10
GSM_LB_TX
TRX_1
18
ANT-Band2
GND19
38
GND20
39
GND21
40
GND22
12
13
15
28
29
30
31
32
33
34
35
36
54
ANT
8
12
L110 4.7n
22
Rx-GSM1800_1
23
Rx-GSM1800_2
Rx-Band1_1
19
Rx-Band1_2
Tx-Band5
14
ANT-Band1
3
C123
1p
ANT-GSM1800
Tx-Band2
58
11
TP
60
Tx-Band4
L122 2.2n
33p
11
56
C121
7
B1
GND23
GND24
GND25
GND26
GND27
GND28
GND29
GND30
GND31
GND32
GND33
GND34
GND35
GND36
GND37
41
42
43
44
45
46
47
48
49
50
51
53
55
57
59
L116
DNI
L143
DNI
L127 1n
L161 2.2n
C115
10n
C163
VSPI
B5/GSM850
TP
TP3
33p
L162
DNI
L128
DNI
L137 1n
C151
B8/EGSM
33p
C153
TP
TP3
22p
L138
DNI
L152
47n
L147 1.5n
TP3
L148
DNI
L158 1.5n
TP3
L159
DNI
TP3
L169
DNI
VBAT
VSPI
Removed (Rev.B)
PA_RF
CP_OUT
PA_POW_DET
L168 1.5n
Removed (Rev.E)
GSM_LB_TX
3
5
4
7
2
1
12
SPI_GND
VSPI
VBAT
RF_OUT
19
FB_AM
VCMOS
GSM_HB_TX
6
14
0.1u
18
C173
0.1u
17
C172
220n
20
C171
SPI_DRW
GSM_HB_TX
SPI_CLK
GSM_LB_TX
SPI_SS
B1_TX
B2_TX
U171
RF6260
VCC
HB_RFIN
B4_TX
LB_RFIN
B5_TX
NC
B8_TX
GND
10
11
9
L176 2.7n
SPI_DRW
SPI_CLK
VBAT_PAM
SPI_SS
C175
1p
TP4
TX_H
L177
DNI
16
8
L179 1.8n
15
13
C178
DNI
21
TP4
TX_L
L180
DNI
Schematic of WCDMA Band1,2,4,5,8 Tx Block
LGE Internal Use Only
- 80 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
For testing, Max power output is needed.
Check Power Level
Check TP1 Over 1dBm?
Yes
RF Tx Level is OK
No
Check TP Over 1dBm?
Yes
Check Separator
No
Check TP3 Over 1dBm?
Yes
Check Duplexer
No
Check TP4 Over 6dBm?
Yes
Check PAM
No
Check PMB571
LGE Internal Use Only
- 81 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.4.2. Checking RF Rx Level
TP2
TP1
Test Point (RF Rx Level)
LGE Internal Use Only
- 8 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
C105
TP1
100p
2
L102
COMMON
ANT
G4
L105
DNI
SW101
20279-001E-01
SW102
MS-156C
2.2n
G1
ANT
1
3
C103
100n
C101
DNI
L104
G2
G3
4
DNI
& lt; L102 & gt;
* Global : 2.2nH
* AT & T, TMUS : 100pF
GSM1800_RX
C116
33p
C117
33p
TRX_5
SDIO
L131
19
18
1.2n
C132
TP
FRM
SCL
20
33p
C133
DNI
15
13
14
LVDD
16
GND2
VDD
GND5
GND1
4
17
5
GND3
GND6
21
GND4
TRX_6
B2/GSM1900
1
C112 10p
GSM_HB_TX
L142
DNI
VBAT
B4
L114
3n
C114
27p
TP
L141
DNI
VSPI
U121
ANT-Band8
16
B40761DY2045L
GND1
GND2
GND3
GND4
GND5
GND6
Rx-Band4_1
17
Rx-Band4_2
24
Rx-Band5_1
25
Rx-Band5_2
26
Rx-Band8_1
27
Rx-Band8_2
RX_B1_H2X
RX_B1_H2
RX_B2_M2X
RX_B2_M2
RX_B4_H1X
RX_B4_H1
RX_B5_L2X
RX_B5_L2
RX_B8_L1X
RX_B8_L1
37
GND19
38
GND20
39
GND21
40
GND22
L143
DNI
L127 1n
L161 2.2n
C115
10n
2
4
5
6
8
10
ANT-Band5
9
L113
10n
SPI_CLK
SPI_DRW
SPI_SS
L112
Rev.1.1
2.2n
52
GND7
GND8
GND9
GND10
GND11
GND12
GND13
GND14
GND15
GND16
GND17
GND18
HB_TX
TRX_4
2
Tx-Band8
TRX_3
3
Rx-Band2_1
21
Rx-Band2_2
1
6
7
DNI
PGND
L111
1.8p
TRX_2
FL111
BGSF18DM20
9
C109
LB_TX
10
GSM_LB_TX
TRX_1
20
ANT_Band4
RX_GSM1800_M1X
RX_GSM1800_M1
12
13
15
28
29
30
31
32
33
34
35
36
54
ANT
8
12
L110 4.7n
18
ANT-Band2
Tx-Band5
11
14
22
Rx-GSM1800_1
23
Rx-GSM1800_2
Rx-Band1_1
19
Rx-Band1_2
3
C123
1p
ANT-Band1
Tx-Band2
58
ANT-GSM1800
Tx-Band4
TP
60
11
L122 2.2n
33p
Tx-Band1
56
C121
7
B1
GND23
GND24
GND25
GND26
GND27
GND28
GND29
GND30
GND31
GND32
GND33
GND34
GND35
GND36
GND37
41
42
43
44
45
46
47
48
49
50
51
53
55
57
59
L116
DNI
B5/GSM850
TP
C163
33p
L128
DNI
L162
DNI
L137 1n
C151
B8/EGSM
33p
TP
C153
22p
L138
DNI
L152
47n
L147 1.5n
L148
DNI
L158 1.5n
L159
DNI
L168 1.5n
L169
DNI
Removed (Rev.B)
Schematic of WCDMA Band1,2,4,5,8 Rx Block
LGE Internal Use Only
- 83 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
Set the phone Rx is ON
Check TP1 Signal exist?
No
Check RF Switch (M/S)
Yes
Check TP
Signal exist?
No
Check Separator
Yes
Check Duplexer, PMB571
LGE Internal Use Only
- 84 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.4 Checking WCDMA Block
START
Check TCXO Block
Check RF Switch (M/S)
Check TX/RX Level
Re-download & Cal
Change the Board
LGE Internal Use Only
- 85 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.5.1 Checking RF Tx Block
TP2
TP3
TP1
LGE Internal Use Only
- 86 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
C105
TP1
100p
2
L102
COMMON
ANT
G4
2.2n
G1
ANT
1
G2
G3
4
3
C103
100n
C101
DNI
L104
L105
DNI
SW101
20279-001E-01
SW102
MS-156C
DNI
& lt; L102 & gt;
* Global : 2.2nH
* AT & T, TMUS : 100pF
GSM1800_RX
C116
33p
C117
33p
SDIO
1.2n
C132
33p
18
C133
DNI
FRM
SCL
L131
19
2
4
5
6
8
10
15
13
14
LVDD
16
GND2
VDD
GND5
GND1
4
17
5
GND6
21
GND3
TRX_6
20
C112 10p
GSM_HB_TX
DNI
L113
10n
VBAT
B4
L114
3n
C114
27p
Rev.1.1
2.2n
L141
DNI
U121
ANT-Band8
16
Rx-Band4_1
17
Rx-Band4_2
B40761DY2045L
GND1
GND2
GND3
GND4
GND5
GND6
24
Rx-Band5_1
25
Rx-Band5_2
26
Rx-Band8_1
27
Rx-Band8_2
9
L112
SPI_CLK
SPI_DRW
SPI_SS
TP
L142
ANT-Band5
RX_GSM1800_M1X
RX_GSM1800_M1
RX_B1_H2X
RX_B1_H2
RX_B2_M2X
RX_B2_M2
RX_B4_H1X
RX_B4_H1
RX_B5_L2X
RX_B5_L2
RX_B8_L1X
RX_B8_L1
37
GND7
GND8
GND9
GND10
GND11
GND12
GND13
GND14
GND15
GND16
GND17
GND18
TRX_5
B2/GSM1900
1
52
Tx-Band8
HB_TX
TRX_4
2
Rx-Band2_1
21
Rx-Band2_2
1
TRX_3
3
20
ANT_Band4
Tx-Band1
ANT
6
GND4
DNI
7
L111
1.8p
PGND
C109
TRX_2
FL111
BGSF18DM20
9
TP
54
TRX_1
LB_TX
10
GSM_LB_TX
8
12
L110 4.7n
18
ANT-Band2
GND19
38
GND20
39
GND21
40
GND22
12
13
15
28
29
30
31
32
33
34
35
36
11
14
22
Rx-GSM1800_1
23
Rx-GSM1800_2
Rx-Band1_1
19
Rx-Band1_2
Tx-Band5
C123
1p
ANT-Band1
3
58
ANT-GSM1800
Tx-Band2
60
Tx-Band4
L122 2.2n
33p
11
56
C121
7
B1
GND23
GND24
GND25
GND26
GND27
GND28
GND29
GND30
GND31
GND32
GND33
GND34
GND35
GND36
GND37
41
42
43
44
45
46
47
48
49
50
51
53
55
57
59
L116
DNI
L143
DNI
L127 1n
L161 2.2n
C115
10n
C163
VSPI
B5/GSM850
33p
L128
DNI
L162
DNI
L137 1n
C151
33p
C153
B8/EGSM
22p
L138
DNI
L152
47n
L147 1.5n
L148
DNI
L159
DNI
VBAT
L168 1.5n
VSPI
PA_RF
PA_POW_DET
CP_OUT
L158 1.5n
L169
DNI
Removed (Rev.B)
Removed (Rev.E)
GSM_LB_TX
6
3
5
4
7
2
1
GSM_HB_TX
B2_TX
B4_TX
12
SPI_DRW
SPI_CLK
GSM_LB_TX
B1_TX
SPI_GND
VSPI
VBAT
RF_OUT
19
FB_AM
VCMOS
GSM_HB_TX
14
0.1u
18
C173
0.1u
17
C172
220n
20
C171
SPI_SS
U171
RF6260
VCC
HB_RFIN
LB_RFIN
B5_TX
NC
B8_TX
GND
10
11
9
L176 2.7n
SPI_DRW
SPI_CLK
SPI_SS
VBAT_PAM
C175
1p
TP3
TX_H
L177
DNI
16
8
L179 1.8n
15
13
21
C178
DNI
TP3
TX_L
L180
DNI
Schematic of GSM850/EGSM/DCS/PCS Tx Block
LGE Internal Use Only
- 87 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
For testing, Max power output is needed
Chenck Power Level
No
Check TP1
Over 31 dBm(GSM850, EGSM)
Over 8 dBm(DCS, PCS)
Yes
RF TX Level is OK
No
Check TP
Over 31 dBm(GSM850, EGSM)
Over 8 dBm(DCS, PCS)
Yes
Check Separator
No
Check TP3
Over 1 dBm
Yes
Check PAM
No
Check PMB571
LGE Internal Use Only
- 88 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.5.2 Checking RF Rx Block
TP2
LGE Internal Use Only
- 89 -
TP1
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
C105
TP1
100p
2
L102
COMMON
G4
L105
DNI
SW101
20279-001E-01
SW102
MS-156C
ANT
2.2n
G1
ANT
1
3
C103
100n
C101
DNI
L104
G2
G3
4
DNI
& lt; L102 & gt;
* Global : 2.2nH
* AT & T, TMUS : 100pF
GSM1800_RX
C116
33p
C117
33p
L116
DNI
TRX_5
SDIO
L131
19
18
1.2n
C132
TP
FRM
SCL
20
33p
C133
DNI
15
13
14
LVDD
16
GND2
VDD
GND5
GND1
4
17
5
GND3
GND6
21
GND4
TRX_6
B2/GSM1900
1
C112 10p
GSM_HB_TX
L142
DNI
VBAT
B4
L114
3n
C114
27p
TP
L141
DNI
VSPI
U121
ANT-Band8
16
B40761DY2045L
GND1
GND2
GND3
GND4
GND5
GND6
Rx-Band4_1
17
Rx-Band4_2
24
Rx-Band5_1
25
Rx-Band5_2
26
Rx-Band8_1
27
Rx-Band8_2
RX_B1_H2X
RX_B1_H2
RX_B2_M2X
RX_B2_M2
RX_B4_H1X
RX_B4_H1
RX_B5_L2X
RX_B5_L2
RX_B8_L1X
RX_B8_L1
37
GND19
38
GND20
39
GND21
40
GND22
L143
DNI
L127 1n
L161 2.2n
C115
10n
2
4
5
6
8
10
ANT-Band5
9
L113
10n
SPI_CLK
SPI_DRW
SPI_SS
L112
Rev.1.1
2.2n
52
GND7
GND8
GND9
GND10
GND11
GND12
GND13
GND14
GND15
GND16
GND17
GND18
HB_TX
TRX_4
2
Tx-Band8
TRX_3
3
Rx-Band2_1
21
Rx-Band2_2
1
6
7
DNI
PGND
L111
1.8p
TRX_2
FL111
BGSF18DM20
9
C109
LB_TX
10
GSM_LB_TX
TRX_1
20
ANT_Band4
RX_GSM1800_M1X
RX_GSM1800_M1
12
13
15
28
29
30
31
32
33
34
35
36
54
ANT
8
12
L110 4.7n
18
ANT-Band2
Tx-Band5
11
14
22
Rx-GSM1800_1
23
Rx-GSM1800_2
Rx-Band1_1
19
Rx-Band1_2
3
C123
1p
ANT-Band1
Tx-Band2
58
ANT-GSM1800
Tx-Band4
60
11
L122 2.2n
33p
Tx-Band1
56
C121
7
B1
GND23
GND24
GND25
GND26
GND27
GND28
GND29
GND30
GND31
GND32
GND33
GND34
GND35
GND36
GND37
41
42
43
44
45
46
47
48
49
50
51
53
55
57
59
TP
B5/GSM850
TP
C163
33p
L128
DNI
L162
DNI
L137 1n
C151
B8/EGSM
33p
TP
C153
22p
L138
DNI
L152
47n
L147 1.5n
L148
DNI
L158 1.5n
L159
DNI
L168 1.5n
L169
DNI
Removed (Rev.B)
Schematic of GSM850/EGSM/DCS/PCS Rx Block
LGE Internal Use Only
- 90 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
Set the phone Rx is On
Check TP1 Signal exist?
No
Check RF Switch (M/S)
Yes
Check TP Signal exist?
No
Check Separator
Yes
Check Duplexer, PMB571
LGE Internal Use Only
- 91 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.6. GPS/WIFI/BT RF components
4.6.1 GPS Module
GPS chip is made by Broadcom and name is BCM4751
U1831
GPS LDO
U1801
GPS LNA
FL1801
Separator
U1811
GPS IC
X1821
GPS TCXO
LGE Internal Use Only
- 9 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.6.2 Wifi/BT/FM Module
FL1901
Filter
U1902
RF3482
U1901
WL1271
LGE Internal Use Only
- 93 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.7 GPS/WIFI/BT SIGNAL PATH
4.7.1 GPS Signal Path
ANT
LGE Internal Use Only
- 94 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.7.2 Wifi/BT/FM Signal Path
ANT
Wifi Signal
BT Signal
FM Signal
LGE Internal Use Only
- 95 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.9 Power ON Troubleshooting
4.8
The main power source of LGP920 is provided by 2 chips which are TWL6030 and XMM6260 (Communication
processor). Since XMM6260 only powers up normally when OMAP4430 is properly powered therefore, TWL6030
is the actual one to take look at.
Power ON sequence of LGP920 is,
PWR key press
PM_ON_SW goes low (R1195, TWL6030 PWRON_ pin(L5))
SENSOR_3.0V
VSEL_1.8V (L803)
VPMIC_VCXIO
VSEL_VMEM (L806)
VSEL_VCORE3 (L802)
T WL6030 Power Up
VSEL_2.1V (L804)
VSEL_1.29V (L805)
VCORE1_OMAP_MPU (L800)
VCORE2_OMAP_IVAUD (L801) goes high
(if network connected
VSD1_1.3V
VSD2_1.8V)
External
peripherals
Phoenix Power
Device
OMAP4430
Power On Event: battery plug, power on button, remote power on, RTC wakeup,
battery Voltage & gt; Vbatmin thresold during charge
1
7ms(after debounce) - Phoenix intermal power up sequence
External Power IC: Enable
LPDDR: VDD1
CDC3S04: VDD_DIG
All peripherals: 1.8v lOs and cores
LPDDR: VDD
External Power IC: Enable
Phoenix Power IC tum
on time up to
REGEN1/
V1V8
VBAT
3
500us
VDDS_1P8
VDDS_DV_xxx@ 1.8v
VDDA_BG_VBB,
VDD_LDO_SRAM
4
VMEM @ 1.35V or
1.V wrt boot mode
1.8V
500us
1.35V if Phoenix BOOT1=0or1.V if BOOT1=1
5
500us
1.8V
SYSTEM
6
500us
.1V
'
Phoenix Audio: TBD
LPPDDR: VDDCA, VDDQ
All peripherals: 1.v lOs and cores
CDC3S04: IOs
VV1
VV9@ 1.V
VCXIO
VDDCA_LPDDR
VDDQ_LPDDR
VDD_LDO_EMU_WKUP
VDDS_1P
VDDS_DV_xxx@1.V
VDDS_DPLL, VDDA_DSI1/
VDDA_CSI1/, VDDA_UNI1,
VDDA_USB1OTG_1P8V,
VDDS_1P8_FREF
VCORE3
1.V
8
500us
9
VDD_MPU
VCORE
3'
500us
VDD_CORE
VDD_DLL0/1_LPDDR1/
VCORE1
7
VDD_IVA_AUDIO
T WL6030 Power on sequence
LGE Internal Use Only
- 96 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
XPMU
4. TROUBLE SHOOTING
Confidential
VBAT
LPBG
LPMU
LPMU@1.3V
LPMU@1.1V
LRTC
ON event
detected
ON event
High Precition Bandgap
Step-Down 1
Step-Down 2
LPLL
LIO_12
LUSB_PD
LUSB_ANA
LUSB_IO
REF_CLK_EN
XX
BaseBand reset
XX
20us
2180us
2560us
Battery insertion
1500us
Start-up
Figure 4
200us 200us
20us
200us 200us
20us
20us
16ms
Reset
PMU Start-up / Shut-down Timing sequence
XMM6260 PMU Power on
2.1
1520us
PAD Timing
LPMU
LRTC
VRTC Supplied Pads
VSD2
self enabling
pad
TM_EN
pad active
RESET_PWRDWN
pad active
POR enables
RESET pad
Power on Reset
VRTC Supplied Pads
PMU outputs
PMU inputs
ON1_i
LGE Internal Use Only
pad active
ON2_N_i
pad active
RESET_BB_N_i
pad active
TRIG_B_i
pad active
REF_CLK_EN_o
pad active
BaseBand reset_n
pad active
- 97 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
START
Battery voltage higher than 3.5V?
No
Change or charging the Battery
Yes
Press PWR Key
Check TP1 high to low?
No
Check the Power Key
Yes
Power Key is damaged?
No
Change the Power Key
Yes
Check TP voltage
0.6V & lt; TP, 3, 4 & lt; 1.3V
TP5 ? 1.8V
TP6 ? .1V
TP7, 8 ? 1.V
Voltage Range is O.K?
No
Change the Main board
Yes
Check TP9 Clock ?3.768Khz
Clock Range is O.K?
No
Change the TCXO and X-tal
Yes
Change the main board
LGE Internal Use Only
- 98 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
Power key of LGP920
TP1 (R1195),
PWR_ON_SW
TOP view of LGP920
TP9 (X800), CLOCk
TP6 (L804), VSEL_2.1V
TP4 (L802),
VSEL_VCORE3
TP7 (L805), VSEL1.29V
TP2 (L800),
VCORE1_OMAP_MPU
TP5 (L803), VSEL_1.8V
TP3 (L801), VCORE2_OMAP_IVAUD
LGE Internal Use Only
TP8 (L806), VSEL_VMEM
- 99 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
R1195
PWR_ON_SW
CN1195
1
TP1
2
ZD1195
Added (Rev.E)
ESD9B5_0ST5G
1K
VBAT
V2V1_IN_B1
V2V1_IN_B2
V2V1_FDBK
V2V1_SW_B1
V2V1_SW_B2
V2V1_GND_B1
V2V1_GND_B2
V1V29_IN_B1
V1V29_IN_B2
V1V29_FDBK
V1V29_SW_B1
V1V29_SW_B2
V1V29_GND_B1
V1V29_GND_B2
VMEM_IN_B1
VMEM_IN_B2
VMEM_FDBK
VMEM_SW_B1
VMEM_SW_B2
VMEM_GND_B1
VMEM_GND_B2
LGE Internal Use Only
T13
T14
R14
L15
N16
P16
P15
M16
L16
M15
C16
C15
F16
D16
D15
E16
E15
K16
K15
G16
J16
J15
H16
H15
T10
R10
R13
T11
R11
T12
R12
C808
VCORE1_OMAP_MPU
L800
0.68u
C813
4.7u
10u
TP
VBAT
FB801
120
VCORE2_OMAP_IVAUD
C815
C814
TP3
L801 0.47u
4.7u
VBAT
10u
FB802
120
VSEL_VCORE3
C818
C817
TP4
L802 0.47u
4.7u
VBAT
10u
FB803
220
FB804
120
C819
VSEL_1.8V
L803
0.68u
C821
4.7u
10u
TP5
VBAT
VSEL_2.1V
L804 0.47u
C825
C824
TP6
4.7u
VBAT
10u
FB805
FB806
VSEL_1.29V
L805 0.47u
C828
VSEL_VMEM
C831
120
TP7
10u
L806 0.47u
120
C826
V1V8_IN_B1
V1V8_IN_B2
V1V8_IN_B3
V1V8_FDBK
V1V8_SW_B1
V1V8_SW_B2
V1V8_SW_B3
V1V8_GND_B1
V1V8_GND_B2
V1V8_GND_B3
K1
K2
G1
J1
J2
H1
H2
220
4.7u
VCORE3_IN_B1
VCORE3_IN_B2
VCORE3_FDBK
VCORE3_SW_B1
VCORE3_SW_B2
VCORE3_GND_B1
VCORE3_GND_B2
T7
R7
R4
T6
R6
T5
R5
FB800
TP8
VBAT
C829
VCORE2_IN_B1
VCORE2_IN_B2
VCORE2_FDBK
VCORE2_SW_B1
VCORE2_SW_B2
VCORE2_GND_B1
VCORE2_GND_B2
T4
T3
R3
L2
N1
P1
P2
M1
L1
M2
4.7u
VCORE1_IN_B1
VCORE1_IN_B2
VCORE1_IN_B3
VCORE1_FDBK
VCORE1_SW_B1
VCORE1_SW_B2
VCORE1_SW_B3
VCORE1_GND_B1
VCORE1_GND_B2
VCORE1_GND_B3
10u
- 100 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.9 Charger Troubleshooting
.10
LGP920 micro USB is located at the side of the terminal set, charging current flows from external micro USB
Connector directly to the battery. The charger IC maximum charging current is set around 945mA
Charging Procedure
- Connect TA or u-USB Cable
- Control the charging current by RT9524 IC
- Charging current flows into the battery
Troubleshooting Check Point
- Connection of TA or USB Cable
- Charging current path (RT9524)
- Battery
During charging operation test point signal goes low and when stop charging goes high.
LGE Internal Use Only
- 101 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
START
Check the Connection
of uUSB and battery
Connection OK?
No
Change I/O connector
Yes
Is the uUSB Cable
voltage 4.8V (or 5.0V)
No
Change TA (or u-USB cable)
Yes
Is it charging properly
After turning on?
Yes
END
No
TP Signal is correct?
Yes
END
No
Change the Main Board
LGE Internal Use Only
- 10 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
During charging operation test point signal goes low and when stop charging goes high.
TP809, CHG_EN_SET/
USB_VBUS
0.15mm
VCHG
USB_VBUS
VCHG
1mm
1mm
U801
RT9524
1
2
3
4
(1%)
PGND
VIN
BATT
ISET
PGB
GND1
LDO
IEOC
CHGSB
GND2
EN_SET
11
R821
10K
(0603)
10
9
8
CHG_STATUS/
7
6
CHG_EN_SET/
C809
1u
R828
2Kohms
C811
1u
R827
560
(1%)
5
C810
1u
VSEL_1.8V
VBAT
TP809
Removed Res.
(Rev.C)
TP809 : Charging Enable Signal
LGE Internal Use Only
- 103 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.10 USB Trouble shooting
.11
The sequence of LGP920USB is,
USB connected to LGP920
USB_VBUS(C816) goes to 5V
USB_D+ go to 3.3V
USB_DATA is triggered
USB work
Block Diagram of USB & UART connection is shown below
START
Start
Cable is inserted?
No
Cable is inserted?
Yes
YES
TP1 is 5V?
C816 is 5V?
Yes
YES
USB_D+is 3.3V?
USB_D+ is 3.3V?
Yes
Insert cable
NO
Insert
No
NO
Check MUIC or Charger IC
Check MUIC or
Charger IC
NO
No
Check
Check U811
YES
Change the mainboard
Change the Main board
LGE Internal Use Only
- 104 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
VCHG
Changed (P925 Rev.A)
1u
D5
8
VBUS1
D- 2
USB_DM
USB_DP
USB_ID
D+3
ID 4
90ohm matching !!
C5
B5
B4
GND5
9
ZD802
10
R848
2.2K B1
ESD9B5_0ST5G
11
D1
GU077-5P-SD-E1500
Added (Rev.B)
C4
1u
C3
C820
VB
BAT
COMN1
DN1
COMP2
DP2
U811
UID
U1
MAX14526EEWP+TCC6
U2
RES
MIC
CAP
AUD1
AUD2
GND
IC
B2
C827
Changed (Rev.E,1.1)
SDA
C823
ISET
100n
D2
A4
A5
USB_DM_OMAP
USB_DP_OMAP
90ohm matching !!
B3
UART_RX
UART_TX
A3
A1
VSEL_1.8V
D4
D3
A2
R850
56K
C2
PSD12-LF
7
TP1 (USB_VBUS)
C822
0.1u
ZD801
6
1mm
INT
OUT
GND1 GND2
SC L
IN
CN801
VBAT
C1
FL800
NFM18PC104R1C3
Changed (Rev.C)
R853
1.5K
R854
1.5K
Added (P925 Rev.A)
I2C3_SCL
I2C3_SDA
MUIC_INT/
B4
USBA0_OTG_DM/UART3_TX_IRTX/UART2_TX/GPIO_180/SAFE_MODE
B5
USBA0_OTG_DP/UART3_RX_IRRX/UART2_RX/GPIO_179/SAFE_MODE
C3
USBA0_OTG_CE
LGE Internal Use Only
- 105 -
USB_DM_OMAP
USB_DP_OMAP
USB
MUIC
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
TP1 (USB_VBUS)
U811 (MUIC - MAXIM14526)
LGE Internal Use Only
- 106 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.11 Audio trouble
4.11.1 Speaker troubleshooting
Speaker control signals are generated by OMAP4430 (U500) and Power is supplied byTWL6040(U901).
START
Check the speaker sound and
reconnect the main ANT module
Is speaker sound OK?
Yes
END
No
Change the main ANT module.
Is speaker sound OK?
Yes
END
No
Change the RF key PCB.
Is speaker sound OK?
Yes
END
No
Change the TWL6040(U901)
Is speaker sound OK?
Yes
END
No
Change the mainboard
LGE Internal Use Only
- 107 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
RF Key PCB
TWL6040
TWL6040
LGE Internal Use Only
- 108 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.11.2 Receiver troubleshooting
Receiver control signals are generated by OMAP4430 (U500) and Power is supplied byTWL6040(U901).
START
Check the receiver sound
(loop back mode).
And reconnect Top FPCB
connector on main-board.
Is receiver sound OK?
Yes
END
No
Change upper module
(receiver + Top FPCB)
Yes
END
No
Change theTWL6040(U901)
Is speaker sound OK?
Yes
END
No
Change the mainboard
LGE Internal Use Only
- 109 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
Upper module :
Receiver + Top FPCB
Top_FPCB BTB BTB
Top_FPCB
connector
connector
TWL6040
TWL6040
LGE Internal Use Only
- 110 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.11.3 Main MIC troubleshooting
Main MIC signal is generate by MEMS MIC on RF-key PCB
START
Check the MIC signal by loop-back test
or voice recorder
Check the MIC hole to
make clear the voice signal path.
Is vioce signal OK?
Yes
END
No
Change the RF-key PCB.
And check the voice siganl.
Is voice signal OK?
Yes
END
No
Change the TWL6040(U901)
Is the voice siganl OK?
Yes
END
No
Change the mainboard
LGE Internal Use Only
- 111 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
RF Key PCB
TWL6040
TWL6040
LGE Internal Use Only
- 11 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.11.4 SUB MIC troubleshooting
Sub MIC signal is generate by MEMS MIC on Top FPCB
START
Check the MIC signal by loop-back test
or voice recorder
Check the MIC hole to
make clear the voice signal path.
Is vioce signal OK?
Yes
END
No
Change the Top FPCB.
Is voice signal OK
Yes
END
No
Change the TWL(U901)
Is the voice signal OK?
Yes
END
No
Change the mainboard
LGE Internal Use Only
- 113 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
Top FPCB
TWL6040
LGE Internal Use Only
- 114 -
TWL6040
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.11.5 Ear-MIC troubleshooting
Ear MIC control signal is generate by TWL6040 and OMAP4430.
- Disable to recognize headset insert
START
Check the 3.5pi headest FPCB
BtoB connector or change that FPCB
to new one.
Yes
END
No
Check the top FPCB BtoB
Connector or change that FPCB to
new one.
Yes
END
No
Check the left signal and
detectionline became short when
headset inserted
Yes
No
Change the P-channel MOCFET
END
Yes
Detecting headset insert well?
No
END
Yes
Change the TWL6040.
Detecting headset insert well?
No
Change the mainboard
LGE Internal Use Only
- 115 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
Check the left signal and detection line became short when headset inserted
27
8
26
9
25
10
24
11
23
12
22
13
FB1175
1800
21
14
FB1176
1800
20
15
19
16
C1175
C1176
18
17
0.1u
0.1u
AUD_RCV_P
AUD_RCV_N
FB1177
TP2
EAR_R
EAR_L
1800
C1177
33p
R1176
10K
4
5
6
Added (925 Rev.D)
Changed (Rev.1.0)
FB1173
1800
TP1
DNI
ZD1172
3
L1172
DNI
2
C1172
1
C1171 1n
ESD9B5_0ST5G
FM_ANT
D1175
VSMF05LCC
2
1
S
G
D
EAR_SENSE
3
2SJ347
R1174
200K
DNI
Added (Rev.E)
LGE Internal Use Only
Q1173
R1173 1M
R1172
TP2, FB1176
VSEL_1.8V
TP1, FB1173
- 116 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
- Disable to using headset MIC or headset receiver when voice call
START
Check the MIC hole to
make clear the voice signal path.
Is vioce signal OK?
Yes
END
No
Change the Top FPCB.
Is voice signal OK
Yes
END
No
Change the TWL(U901)
Is the voice signal OK?
Yes
END
No
Change the mainboard
LGE Internal Use Only
- 117 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.12 Camera trouble(5M/VGA)
4.12.1 Main 5M AF Camera troubleshooting
5M camera control signals are generated by OMAP4430(U500), and Power is supplied by LP870(U101)
START
Check the camera conn. and
revonnect thr camera
Camera is OK?
Yes
END
No
No
Check IOVDD(TP1),
DVDD(TP), AVDD(TP3)
Yes
Change the main board
No
Check the camera signals MCLK(TP4),
MIPI_CLK(TP5), MIPI_DATA(TP6)
Yes
Change the camera
Camera is OK?
LGE Internal Use Only
- 118 -
Yes
END
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
VBAT
1.2V_5M_VDIG
C1209
2.2u
E3
D4
VINB
FB
LDO1
VIN1
E4
D2
VIN2
L1201
2.2u
B3
C4
C3
D3
E2
CAM_SUBPM_EN
GNDB
IRQ_N
SDA
SCL
DVS
EN
LDO3
U1201
LP8720TLX
LDO4
R1202
100K
Changed (P925 Rev.A)
B2
C2
B4
AVDD : TP3 P
5M_VCM_V2V8_
SW
LDO2
I2C3_SDA
I2C3_SCL
5M_VANA_V2V7_P
A2
2.2u
VBATT
10u
C1210
2.2u
10u
A4
C1201
C1211
C1212
D1
Close to E4
DVDD : TP
DEFSEL
IDSEL
LDO5
A3
5M_VANA_V2V7_S
A1
1.8V_5M_VIO
IOVDD : TP1
C1
5M_VCM_V2V8_S
E1
C1204
C1206
C1207
C1208
1u
1u
1u
1u
B1
C1205
1u
GND
Added Res. (Rev.B)
5M_VCM_V2V8_S
CN1221
GB042-40S-H10-E3000
FL1221
ICMEF214P101M
1
P1
2
P2
3
P3
4
P4
5
P5
6
P6
7
P7
8
P8
MIPI_CLK: TP5
8
9
10
11
29
12
28
13
27
14
26
15
25
16
24
17
C1231
23
18
0.1u
19
21
ESD9B5_0ST5G
7
30
ESD9B5_0ST5G
ZD1225
6
34
31
ZD1224
PRIMARY_5M_MIPI_CLK_N
PRIMARY_5M_MIPI_CLK_P
5
35
22
5
P5
6
P6
7
P7
8
P8
4
36
FL1222
1
P1
2
P2
3
P3
4
P4
9
G1
10
G2
MCLK: TP4
3
37
32
5M_MCLK
2
38
SECONDARY_5M_RESET_N
PRIMARY_5M_RESET_N
1
39
9
G1
10
G2
40
33
SECONDARY_5M_MIPI_CLK_N
SECONDARY_5M_MIPI_CLK_P
SECONDARY_5M_MIPI_DATA0_N
SECONDARY_5M_MIPI_DATA0_P
20
5M_MCLK_CAM
I2C4_SCL
I2C4_SDA
C1235
1u
C1237
0.1u
5M_VANA_V2V7_S
1.2V_5M_VDIG
C1234
1.8V_5M_VIO
5M_VANA_V2V7_P
5M_MCLK_CAM
0.1u
C1233
0.1u
C1232
0.1u
I2C3_SCL
I2C3_SDA
5M_VCM_V2V8_P
C1228
ICMEF214P101M
C1236
4.7u
4.7u
C1229
1u
C1230
0.1u
FL1223
MIPI_DATA: TP6
LGE Internal Use Only
1
P1
2
P2
3
P3
4
P4
5
P5
6
P6
7
P7
8
P8
9
G1
10
G2
PRIMARY_5M_MIPI_DATA0_N
PRIMARY_5M_MIPI_DATA0_P
PRIMARY_5M_MIPI_DATA1_N
PRIMARY_5M_MIPI_DATA1_P
ICMEF214P101M
- 119 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
DVDD : TP2(L1201)
IOVDD : TP1(C1207)
AVDD : TP3(C1204)
MIPI_DATA: TP6(FL1223)
MIPI_CLk: TP5(FL1222)
MCLk: TP4(FL1222)
LGE Internal Use Only
- 10 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.12.2 Sub Vga Camera troubleshooting
VGA camera control signals are generated by OMAP4430(U500), and Power is supplied by LP870(U101)
TWL_LDO_2.8V
TWL_LDO_1.8V
CN103
1
VT_0.3M_MIPI_DATA0_N
VT_0.3M_MIPI_DATA0_P
18
4
17
5
16
6
15
14
8
VT_0.3M_MCLK
19
3
7
VT_0.3M_MIPI_CLK_N
VT_0.3M_MIPI_CLK_P
20
2
13
9
12
10
11
FB101
IOVDD & DVDD : TP1(FB101)
Rev.1.1 (VSEL 1.8V Remove)
Rev.B(Removed Bypass Cap)
AVDD : TP(C103)
C103
C104
0.1u
I2C3_SDA
I2C3_SCL
VT_CAM_PWDN
VT_CAM_RESET/
0.1u
IOVDD & DVDD :
TP1(FB101)
AVDD : TP2(C103)
LGE Internal Use Only
- 11 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.13 Main LCD trouble
4.13.1 2D LCD Display trouble
Main LCD control signals are generated by OMAP4430. Those signal's path are : OMAP4430 - & gt; LCD Module
START
Press PWR key turn the power On
Is the circuit powered?
No
Follow the Power ON
trouble shooting
Yes
Disconnect and reconnect
LCD connector(CN1141)
LCD display OK?
Yes
No
Change the LCD module
Yes
Yes
Check LCD Power
TP1, TP, TP3
LCD BL Boost output
TP4
No
Change the Main board
The LCD works
END
LGE Internal Use Only
- 1 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
1.8V_LCD_IOVCC
12V_3D_LCD
2.8V_3D_LCD
TP1
CN1141
24-5804-030-000-829+
30
9
10
11
19
12
18
13
14
16
15
3D_LCD_BANK_SEL_1
I2C2_SDA
I2C2_SCL
2.8V_LCD_VCC
2.8V_LCD_VCI
LED_C1
LED_C2
LED_A
TP3
FB1143
600
C1143
1u
ICVS0318150FR
VA1104
ICVS0318150FR
VA1102
ICMEF214P101M
4
2
TP
1
5
P5
6
P6
7
P7
8
P8
8
20
G2
10
G1
9
1
P1
2
P2
3
P3
4
P4
DNI
7
21
9
G1
10
G2
DSI2_LCD_MIPI_CLK_N
DSI2_LCD_MIPI_CLK_P
R1191
22
FL1142
DNI
6
23
ICMEF214P101M
R1190
17
DSI2_LCD_MIPI_D0_N
DSI2_LCD_MIPI_D0_P
DSI2_LCD_MIPI_D1_N
DSI2_LCD_MIPI_D1_P
5
24
1
P1
2
P2
3
P3
4
P4
4
26
25
5
P5
6
P6
7
P7
8
P8
3
27
FL1141
2
28
LCD_RESET_N
1
29
1u
3
C1141
Added (Rev.B)
Removeed VA1101, VA1103 (Rev.C)
VSEL_1.8V VBAT
Rev.B
C3
D1
B2
I2C2_SCL
I2C2_SDA
C2
IN
VIO
SCL
U1121
LM3528
SDA
GPIO1
OVP
MAIN
SUB/FB
HWEN/PGEN/GPIO
D3
B1
SW
1u
GND
R1103
1.5K
LED_A
C1122
D2
C1121
R1102
1.5K
TP4
D1122
L1121 10u
SET
1u
A1
A2
LED_C1
LED_C2
LCD_CP_EN
A3
C1
B3
R1125
12K
R1126
100K
Changed (P925 Rev.A)
Added Res. (Rev.B)
TP2,3
TP4
TP1
LGE Internal Use Only
- 13 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.13.2 3D LCD Display trouble
3D LCD enables by OMAP4430. Those signal's path are : OMAP4430 - & gt; LCD Module
START
Press PWR key turn the power On
Is the circuit powered?
No
Follow the Power ON
trouble shooting
Yes
Disconnect and reconnect
LCD connector(CN1141)
Enter the device test
(S3D LCD test)
3D display OK?
(Dedplay another color)
Yes
No
Change the LCD module
Yes
Yes
Check LCD Power
TP1, TP
Check 3D LCD conttol signal
TP3
No
Change the Main board
The 3D LCD works
END
LGE Internal Use Only
- 14 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
2.8V_3D_LCD
VBAT
U1106
BU28TD2WNVX
3D_LCD_EN
VIN
STBY
VOUT
GND
PGND
4
3
C1107
5
C1106
TP1
1
2
1u
1u
Changed (Rev.B)
VBAT
L1131 4.7u
2
C1132
0.1u
4
3
5
3D_BOOST_EN
6
R1133
51K
R1134
SW
CP1
VO
CP2
OUT
EN
FB
GND
SS
Exposed_GND
9
10
0.1u
TP
7
R1136
1
510K
11
0.1u
C1137
1u
Changed (P925 Rev.A)
28
3
27
4
26
5
R1190
DNI
25
6
R1191
DNI
24
7
23
8
22
9
21
10
20
11
19
12
18
13
17
14
16
15
3D_LCD_BANK_SEL_1
I2C2_SDA
I2C2_SCL
LED_C1
LED_C2
LED_A
ICVS0318150FR
VA1104
TP3
LGE Internal Use Only
12V_3D_LCD
C1138
8
C1134
200K
VIN
22K
4.7u
R1135
U1131
TPS61093
C1131
- 15 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
TP3
TP1
TP3
TP1
TP2
TP2
Figure. 3D LCD operating trouble
LGE Internal Use Only
- 16 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
.15
4.14 SIM detect Trouble shooting
The sequence of detecting LG-P920 SIM is,
SIM inserted to LG-P920
2.85V_SIM(C207) goes to 2.85V
Triggers SIM clock, reset and data.
Block Diagram of USB & UART connection is shown below
USIM_CLKK
CLK
USIM
RST
I_O
USIM_RESET
USIM_DATA
CC_CLK
CC_RST
CC_IO
MP-EHM
XMM6260
START
Start
Re-insert the SIM card
Re-insert the SIM card
Work well?
Yes
Work well?
No
Yes
END
End
No
NO
2.9V_SIM (C103) runs?
Change the main
No
.9V_SIM(C103)runs?
Change the main board
board
YES
Yes
Change SUB
Change SUB
Yes
Work well?
End
Work well?
No
Change SIM card
Yes
No
END
Change SIM card
Work well?
Yes
End
No
Work well?
Chan
Yes ge Main
END
No
Change Main
LGE Internal Use Only
- 17 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
* layout note : CLK and IO must be seperated
J101
VSIM_.9V : TP1(C103)
1
2
USIM_RESET/
USIM_CLK
3
7
C101
10p
VCC
GND
RST
VPP
CLK
GND1
I_O
GND2
4
4.7K
VSIM_2.9V
R101
VSIM_2.9V
5
6
USIM_DATA
8
C102
C103
C104
DNI
0.1u
10p
Rev 1.0 value change
Rev 1.0 value change
P920 SUB RFPCB
VSIM_2.9V : TP1(C103)
Check if SUB RFPCB is damaged
LGE Internal Use Only
- 18 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.15 Vibrator Troubleshooting
Check out the setting menu on the phone. If not, check Test points shown on the pictures.
START
Turn on the phone
Is the circuit powered?
No
Follow the power-on
trouble shooting
Yes
Check haltic feedback
on the setting menu
Vibration OK?
Yes
No
Change the vibrator
Yes
Check TP1, , 3
No
Change the main board
Vibrator works
END
LGE Internal Use Only
- 19 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
Added (P925 Rev.A)
TWL_LDO_3.0V
TP905
R982
DNI
GND
MODE
VDD
GAIN
VDN
NC3
4
PWM
11
R981
100K
VDP
NC2
3
ISA1000
EN
L989
8
82n
TP
7
6
L988
5
82n
TP3
VIB_L_P
VIB_L_N
NC1
2
U981
EUSY0238306
9
1
VIBE_EN
VIBE_PWM
Changed (P925 Rev.A)
TP1
0
10
R987
C986
2.2u
3.9n
R986
C987
470K
Changed (P925 Rev.A)
LGE Internal Use Only
- 130 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
TP1
LGE Internal Use Only
- 131 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.16 HDMI Troubleshooting
Check out the setting menu on the phone and then set the proper resolution for the outer display as shown below
START
Turn on the phone
Is the circuit powered?
No
Follow the power-on
trouble shooting
Yes
Connect the HDMI cable
Video ouput OK?
Yes
No
Set the resolution
suitable for the display
Yes
Check the setting on menu
No
Change the main board
HDMI woeks
END
LGE Internal Use Only
- 13 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
LGE Internal Use Only
- 133 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.17 Motion Sensor on/off trouble
When the motion sensor does not work, the reason is chip problem. If the motion sensor IC is damaged, it will do not
work even thought power is supplied and OMAP4430 controls normally. Therefore if the motion sensor is damaged,
change the motion sensor IC or main board.
START
Check the gyro & motion sensor function
Function is OK?
Yes
END
No
Change the Gyro Sensor
IC(U961)
Yes
Gyro-NG
No
Motion sensor-OK?
Yes
END
No
Change the motion sensor
IC(U971)
Gyro & motion
function is OK?
Yes
END
No
Change the main board
No
Function is OK?
LGE Internal Use Only
- 134 -
Yes
END
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
SENSOR_3.0V
Added (P925 Rev.A)
C965
0.1u
13
VDD
AD0
VLOGIC
IME_CL
NC9
11
10
9
8
7
C963
C962
0.1u
0.1u
IME_DA
IME_CL
15
16
17
14
NC5
NC6
NC7
NC8
MPU3050A
SDA
1
25
REGOUT
IME_DA
24
SCL
FSYNC
U961
CLKOUT
GYRO_INT
12
6
23
RESV2
NC4
I2C4_SCL
I2C4_SDA
VSEL_1.8V
INT
5
22
CPOUT
NC3
21
RESV1
4
20
NC2
19
3
2.2n
NC1
C961
CLKIN
R902
1.5K
2
R901
1.5K
GND
18
VSEL_1.8V
IME_DA
IME_CL
VSEL_1.8V
SDA
10
VSEL_1.8V
C971
2
0.1u
3
4
C972
DNC2
GND
U971
DNC4
KXTF9
INT
DNC3
9
8
7
R973
DNI
MOTION_INT
6
C973
0.1u
LGE Internal Use Only
DNC1
SCL
5
SENSOR_3.0V
IO_VDD
VDD
1
1u
- 135 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
Gyro Sensor
IC(U961)
Motion sensor
IC(U971)
LGE Internal Use Only
- 136 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.18 Gyro/Compass sensor troubleshooting
The compass sensor is calibrated by the gyro sensor data using SW algorithm. Therefore Gyro sensor error makes the
compass sensor malfunction.
START
Check the gyro & compass
sensor function
Function is OK?
Yes
END
No
Change the Gyro Sensor
IC(U961)
Yes
Gyro-NG?
No
Compass-OK?
Yes
END
No
Change the Compass Sensor IC(U975)
Compass Sensor
function is OK?
Yes
END
No
Change the main board
No
Gyro & compass
Function is OK?
LGE Internal Use Only
- 137 -
Yes
END
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
SENSOR_3.0V
Added (P925 Rev.A)
C965
0.1u
13
15
16
17
14
NC5
NC6
NC7
NC8
VDD
AD0
MPU3050A
SDA
VLOGIC
IME_CL
NC9
11
10
9
8
7
C963
C962
0.1u
0.1u
IME_CL
IME_DA
1
25
REGOUT
IME_DA
24
SCL
FSYNC
U961
CLKOUT
GYRO_INT
12
6
23
RESV2
NC4
I2C4_SCL
I2C4_SDA
INT
5
22
VSEL_1.8V
CPOUT
NC3
21
RESV1
4
20
NC2
19
3
2.2n
NC1
C961
CLKIN
R902
1.5K
2
R901
1.5K
GND
18
VSEL_1.8V
SENSOR_3.0V
C978
1u
1
VSEL_1.8V
AVDD
2
U975
AMI306
DVDD
10
SDA
ADDR
9
6
VPP
Added (Rev.1.0)
DRDY
INT
C976
10n
8
5
SC L
4
7
COMPASS_INT
VREG
1u
GND
3
C975
I2C4_SDA
I2C4_SCL
LGE Internal Use Only
- 138 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
Gyro Sensor
IC(U961)
LGE Internal Use Only
- 139 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.19 Proximity Sensor on/off trouble
Proximity Sensor is worked as below:
Send Key click - & gt; Phone number click - & gt; Call connected - & gt; Object moved at the sensor - & gt; Control the screen's on/off
operation automatically
START
Send Key click & Phone number click
& Call connected
Object moved at the
Proximity sensor
Change the vt_cam fpcb
LCD off?
Yes
END
No
Check TP1 & IC3_SDA & SCL
& TP Output
Output work well?
Yes
END
No
Change the main board
No
LGE Internal Use Only
Function is OK?
- 140 -
Yes
END
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
SENSOR_3.0V
PROXI_3.0V
Rev.B(Pull Up Move to Main PCB)
U101
I2C3_SDA
PROX_INT
1
2
3
4
SDA
VDD
INT
SCL
LDR
GND
LEDK
LEDA
TP1
8
7
I2C3_SCL
6
TP
5
C102
1u
Sensor_3.0V : TP1(C102)
LGE Internal Use Only
C101
1u
PROXI_3.0V : TP2(C101)
- 141 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.20 Illumination Sensor on/off trouble
Illumination Sensor is worked as below:
Menu Key click - & gt; Settings click - & gt; Display click - & gt; Brightness click - & gt; Automatic brightness click
START
Menu key click
- & gt; Settings click
- & gt; Display click
- & gt; Brightness click
- & gt; Automatic brightness click
Hide Illumination sensor by hand
Change the vt_cam fpcb
LCD brightness change?
Yes
END
No
Check Sensor_3.0V(TP1)
Output work well?
Yes
END
No
Change the main board
No
LGE Internal Use Only
Function is OK?
- 14 -
Yes
END
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
SENSOR_3.0V
PROXI_3.0V
Rev.B(Pull Up Move to Main PCB)
U101
I2C3_SDA
PROX_INT
1
2
3
4
SDA
VDD
INT
SCL
LDR
GND
LEDK
LEDA
TP1
8
7
I2C3_SCL
6
5
C102
1u
C101
1u
Sensor_3.0V : TP1(C102)
LGE Internal Use Only
- 143 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.21 Touch trouble
Touch control signals are generated by OMAP4430. Those signal's path are : OMAP4430 - & gt; Touch Module
START
Check the touch connector(CN10)
& sub BtB Connector(CN101)
Reconnect the touch connector(CN10)
& sub BtB Connector(CN101)
Change the vt_cam fpcb
Touch is OK?
Yes
END
No
Check Touch_3.3V(TP1)
& Touch_INT_N(TP)
& IC_SDA(TP3) & SCL(TP4) Output
Output work well?
Yes
END
No
Change the Sub Rfpcb
Touch is OK?
Yes
END
No
Change the main board
No
LGE Internal Use Only
Touch is OK?
- 144 -
Yes
END
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
VSEL_1.8V
CN102
IC_SCL: TP4(ZD103) 1
10
2
8
7
5
Touch_3.3V : TP1(C119)
3
4
IC_SDA: TP3(ZD10)
I2C2_SDA
9
6
TOUCH_RESET
Touch_INT_N: TP(VA103)
TOUCH_INT_N
C120
VSEL_1.8V
C119
ZD106
ZD104
ZD103
ZD102
ZD101
Rev.F
VA103
2.2u
ZD105
Rev.F
Rev.E
1u
I2C2_SCL
10K
R112
TOUCH_3.3V
Rev.F
Rev.F
2ch - & gt; 1ch (Rev.E)
Remove 0 ohm (Rev.G)
VBAT
TOUCH_3.3V
U102
VDD
CE
1
PGND
4
3
VOUT
2
GND
5
SENSOR_3.0V
C115
1u
LGE Internal Use Only
- 145 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
LGE Internal Use Only
- 146 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
I2C2_SDA: TP3(ZD102) I2C2_SCL: TP4(ZD103)
Touch_3.3V : TP1(C119)
Touch_INT_N: TP2(VA103)
LGE Internal Use Only
- 147 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. BLOCk DIAGRAM
5. BLOCk DIAGRAM
PMU
RF6590
GPS IN
1V2
Filter
B946
9
Diplexer
RD_H
RD_HX
1V8
2V852V65
VCTCXO
XO
AFC_DAC
26MHz
VCONT
PAM DCDC
RF6560
VOUT_FB
GSM_LB_TX VCC CP_OUT
GSM_HB_TX
TRX4
TRX5
TRX3
TRX2
TRX6
TRX1
Ant_B8
Ant_B5
Ant_B2
Ant_B1
Ant_B4
Ant_B3
B7953
B8 DPX
PM_L
B8_TX
B7671
B5 DPX
B7955
B2 DPX
B7696
B1 DPX
B7959
B4 DPX
B5_TX
MMMB
B2_TX
RF6260
PM_H
B1_TX
B4_TX
XMM6260
DCS
SAW filter
RX_L1X
RX_L1
RX_L2X
RX_L2
ST8T
BGSF18D
RX_M2X
RX_M2
RX_H2X
RX_H2
RX_H1X
RX_H1
RX_M1X
RX_M1
LGE Internal Use Only
Transceiver
PMB5712
- 148 -
SYS_CLK
SYS_CLK
SYS_CLK_EN
SYSCLKEN
REF_CLK_EN
REF_CLK_EN
DI3_TX_DAT
DI3_TX_DATX
Di3_TX_DAT
Di3_TX_DATX
DI3_RX_DAT
DI3_RX_DATX
Di3_RX_DAT
Di3_RX_DATX
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. BLOCk DIAGRAM
FM_ANT
LCD 4.3"
4.3" TFT 3D
LCD
(480x800)
Touch
LED
Backlight
Driver
Driver IC
DSI
I2C2
McBSP1(PCM)
McBSP3(I2S)
UART2
SDIO
5
McPDM
I2C2
Compass
POP
3D CAMERA
3D CAMERA
5M AF
MIPI(P)
5M AF
MIPI(S)
Keypad
2Gb-2ch
LPDDR2
eMMC (8Gb)
VT
0.3M
MIPI
I2C4
SDRC
OMAP4430
SDMMC2
KB_COL/ROW
GPIO_82
I2C3
UART4 USB
Accelerometer
I2C1
MIC2
MCLK
PMIC_AP
(TWL6030)
VCHG
LGE Internal Use Only
MIC1
MIC2
3.5 pi Ear MIC(Ear_Jack)
3.5 pi Ear_Jack
38.4MHZ
TCXO Driver
Fuel gauge
A-GPS
IPC_SRDY
IPC_MRDY
Key LED
JTAG
PMB5712
LNA
USIF3 DigRF
GPIO_34
NAND
GPIO_35
I2S2 XMM6260 DDR
MIPI_HSI
MCP
1Gb
NAND
512Mb
DDR
USB
JTAG
32.768KHz
FEM
USIM1
JTAG
JTAG
32.768KHz
PWR-ON KEY
Charge
r
Battery
HS_MIC
HSOLR
FM_ANT
USIF1
I2C
SPK
TWL6040
PDM
EAR_PIECE(RCV)
SPK
MIC1
Motor
McSPI4
GPIO_119
GPIO_120
MCSPI2(PCM)
MIPI_HSI
UART1
I2C4
AUXLR
Proximity
UART3
I2C2
FM_L/R
Light Sensor
GPIO
SDMMC1
I2C
HiFi & PCM Voice
GPIO_2
DMTIMER8_PWM_EV
5
T
I2C1
CSI2
HDMI
Gyro
BT/WLAN/FM
(WL1271)
I2C4
CSI1
5M CAM Flash
FM
EARO
MUIC
Coin cell
VBAT
- 149 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. BLOCk DIAGRAM
OMAP
4430
I2C1_SDA
I2C1_SCL
ABE_PDM_DL_DATA
ABE_PDM_UL_DATA
ABE_PDM_FRAME
SYS_NRESPWRON
ABE_McBSP3_CLKX
ABE_McBSP3_DR
ABE_McBSP1_FSX
ABE_McBSP1_DX
ABE_McBSP1_DR
ABE_McBSP1_CLKX
UART2_RTS/
UART2_CTS/
UART2_RX
UART2_TX
DPM_EMU10
ABE_McBSP2_CLKX
ABE_McBSP2_DR
ABE_McBSP2_DX
ABE_McBSP2_FSX
LGE Internal Use Only
FM_I2S_FSYNC
FM_I2S_DO
FM_I2S_CLK
FM_I2S_DI
BT_PCM_SYNC
BT_PCM_DOUT
BT_PCM_DIN
BT_PCM_CLK
BT_UART_RTS/
BT_UART_CTS/
BT_UART_RXD
BT_UART_TXD
BT / WiFi / FM
FM_I2S_FSYNC
FM_I2S_DI
FM_I2S_CLK
FM_I2S_DO
SPK
AUD_SPK_P
RCV
AUD_RCV_P
EARP
EARN AUD_RCV_N
AUDPWRON
NRESPWRON
SYS_nIRQ2
SYS NIRQ2
SYS_NIRQ2
ABE_McBSP3_DX
PDMCLK
PDMCLKLB
PDMFRAME
AUD_PWRON
SYS_nRESPWRON
HDQ_SIO
HFRP1
AUD_SPK_N
SDA
HFRN1
SCL (Audio Codec)
HFRP2
PDMDN
HFRN2
PDMUP
ABE_CLKS
PDM_CLK
PDM_FRAME
ABE_CLKS
ABE_PDM_LB_CLK
ABE_McBSP3_FSX
TWL6040
I2C1_SDA
I2C1_SCL
PDM_DL_DATA
PDM_UL_DATA
NAUDINT
FM_AUDIO_R
FM_AUDIO_L
AFML
AFMR
HBIAS
HS_MIC
HSL
HSR
ACCONN
HS_MICBIAS
HS_MIC
EAR_L
EAR_R
3.5
HOOK_ADC
PCM_AUD_FSYNC
PCM_AUD_IN
PCM_AUD_OUT
PCM_AUD_CLK
MBIAS
MMICP
MMICN
Analog
SBIAS
SMICP
SMICN
FM_ANT
Analog
MIC1
MIC2
EAR_SENSE
HCI_CTS
HCI_RTS
HCI_TX
HCI_RX
FM_ANT
EAR_SENSE
IPC_I2S_CLK
IPC_I2S_DOUT
IPC_I2S_DIN
IPC_I2S_SYNC
XMM6260
I2S2_CLK0
I2S2_TX
I2S2_RX
I2S2_WA0
- 150 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. BLOCk DIAGRAM
CAMERA
VT_IO_DVDD_1V8
CAM_MCLK
`
VT_PCLK
VT_HSYNC
VT_AVDD_2V8
EMI/ESD Filter
VT_VSYNC
1.3M Camera
VT_DATA[7:0]
VT_RESET_N
VT
VT_CAM_PWDN
LP8720
LP8720
SUB PMIC
CAM_I2C_SC
L
CAM_I2C_SD
A
CAM_SUBPM_EN
AP20
Common mode filter
CAM_VDIG_1V2
CAM_AVDD_2V8
CAM_VIO_1V8
CAM_AF_2V8
8M_MIPI_CLK_N
8M_MIPI_CLK_P
8M
8M_MIPI_DATA0_N
Camera
8M_MIPI_DATA0_P
8M_MIPI_DATA1_N
(LGIT)
(LGIT)
8M_MIPI_DATA1_P
8M_RESET_N
CAM_MCLK
8M
8M_CAM_VCM_EN
CAM_VIO_1V8
LGE Internal Use Only
- 151 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. CIRCUIT DIAGRAM
6. CIRCUIT DIAGRAM
B4 RX Diversity
Changed (P925 Rev.B)
2.7n
L212
M7
M2
L12
L11
L8
L3
K10
K6
K5
J10
J9
J7
J6
J3
H10
H6
H5
H4
H3
G10
G9
2
L213
O1 G1
1
IN
O2 G2
1.5p
2.7n
4
RD_B4_HX
1n
DPX_IN
TX_L
TX_H
PA_POW_DET
PA_RF
VSPI
SPI_CLK
5
FL211
B9469
2140MHz
L214
L215
DNI
4.7n
SPI_SS
SPI_DRW
PA_RAMP
RESET_N
C105
100p
2
SW102
MS-156C
L102
COMMON
G4
L105
DNI
ANT
2.2n
ANT
C103
G2
DNI
& lt; L102 & gt;
* Global : 2.2nH
* AT & T, TMUS : 100pF
3
2
X1841XXA26000FBA
OUT
VCC
GND
VCONT
C117
DNI
1
C184
VDD_1V8
C185
22n
33p
C182
DNI
4
26MHz
C116
C181
DNI
RD_B4_H
RD_B4_HX
RX_B8_L1X
RX_B8_L1
RX_B5_L2X
RX_B5_L2
RX_GSM1800_M1X
RX_GSM1800_M1
RX_B2_M2X
RX_B2_M2
RX_B1_H2X
RX_B1_H2
RX_B4_H1X
RX_B4_H1
C101
DNI
GSM1800_RX
C254
DNI
G1
1
3
100n
C253
DNI
G3
4
L104
C252
SW101
20279-001E-01
10n
CLK_ON
GPS_PWR_ON
26MHz_GPS_REF
33p
VBAT
C112 10p
VSPI
10n
B5/GSM850
C163
33p
L128
DNI
B8/EGSM
22p
C207
C208
C209
0.1u
0.1u
0.1u
2.2u
C197
C198
C199
C200
C201
C202
C203
C204
47n
47n
47n
0.1u
0.1u
0.1u
0.1u
0.1u
VDD_1V8
VDD_2V85
VDD_2V65
VDD_1V2
VSD2_1.8V
VBAT
6.8n
1n
C191
C192
C193
C194
C195
0.1u
4.7u
1u
0.1u
100n
6.8n
4.7n
DI3_SYS_CLK
DI3_SYS_CLK_EN
DI3_REF_CLK_EN
DI3_RX_DAT
R187
100
R114 must be close to Baseband
DI3_RX_DATX
DI3_TX_DAT
R186
100
Added (Rev.D)
Moved to CP (Rev1.0)
R113 must be close to PMB5712
DI3_TX_DATX
A3
A7
C3
C7
C8
C10
C11
D9
E1
E5
E6
F4
F5
F6
F8
F10
G3
G4
G6
G7
G8
L127 1n
6
GSM_HB_TX
3
5
C153
C206
47n
VSPI
0.1u
L137 1n
4
7
L152
47n
L138
DNI
2
1
GSM_HB_TX
SPI_SS
U171
RF6260
B2_TX
SPI_DRW
SPI_CLK
GSM_LB_TX
B1_TX
12
C173
0.1u
14
C172
220n
L162
DNI
33p
PA_RF
C171
GSM_LB_TX
C151
VBAT
VSPI
L161 2.2n
C115
C205
Removed (Rev.E)
L143
DNI
FB_AM
27p
L141
DNI
20
C114
Rev.1.1
2.2n
U181
PMB5712
J5
J4
C5
C6
J8
L10
D10
B9
F3
L2
F7
G5
L9
A6
D5
D2
E8
C9
B13
L13
K9
A9
C2
B2
F9
E12
B1
D8
C190
C4
C189
H9
C188
A10
C187
F13
F12
E13
C13
D13
C12
D12
E7
B5
A5
M8
M9
M10
K11 TP102
J11
37
GND19
38
GND20
39
GND21
40
GND22
SPI_GND
B4
L114
3n
RX_B5_L2X
RX_B5_L2
RX_B8_L1X
RX_B8_L1
VCMOS
VBAT
9
L113
10n
SPI_CLK
SPI_DRW
SPI_SS
DNI
26
Rx-Band8_1
27
Rx-Band8_2
RX_B4_H1X
RX_B4_H1
18
L142
L112
24
Rx-Band5_1
25
Rx-Band5_2
VBAT
GSM_HB_TX
B40761DY2045L
GND1
GND2
GND3
GND4
GND5
GND6
PA_POW_DET
33p
U121
ANT-Band8
17
C132
C133
DNI
2
4
5
6
8
10
RF_OUT
1.2n
18
FRM
SDIO
SCL
L131
19
15
13
14
VDD
GND1
GND2
GND3
GND4
GND5
LVDD
16
17
4
5
7
21
GND6
TRX_6
52
VDD2V5_RCRF
VD2V5_RCBB
VDD2V5_TXBIAS
VDD2V5_TXDCO
VDD2V5_RXDCO
VDD2V5_RFC
VDD2V5_FSYS
D2B_OUT
VDD1V8_RCBB
VDD1V8_RCRF
VDD1V8_RCMS
VDD1V8_RCLO
VDD1V8_RXDCO
VDD1V8_TXDCO
VDD1V8_TXLO
VDD1V8_FBR
VDD1V8_TXMS
VDD1V8_DIG
VDD1V8_SCU
VDD1V8_RFC
VDD1V8_RXPLL
VDDBAT
D2B_OUT_TXRF
VDD_TXRF
VDD1V2_DIG
VDD_IO
VDDBAT_TXRF
CEXT_TXPLL
CEXT_TXMS
CEXT_RXPLL
CEXT_DCXO
SYS_CLK
SYS_CLK_EN
REF_CLK_EN
DI3_RX_DAT
DI3_RX_DATX
DI3_TX_DAT
DI3_TX_DATX
GPO1
GPO2
GPO3
GPO4
GPO5
GPO6
GPO7
GPO8
RX_B2_M2X
RX_B2_M2
CP_OUT
TRX_5
20
RX_B1_H2X
RX_B1_H2
19
TRX_4
1
16
Rx-Band4_1
17
Rx-Band4_2
GND7
GND8
GND9
GND10
GND11
GND12
GND13
GND14
GND15
GND16
GND17
GND18
HB_TX
B2/GSM1900
2
Tx-Band8
TRX_3
ANT-Band5
1
6
PGND
DNI
9
L111
1.8p
TRX_2
FL111
BGSF18DM20
10
C109
TRX_1
LB_TX
20
Rx-Band2_1
21
Rx-Band2_2
RX_GSM1800_M1X
RX_GSM1800_M1
PM_L
PM_H
PA_POW_DET
PA_RF
VSPI
SPI_CLK
SPI_SS
SPI_DRW
PA_RAMP
PA_BIAS
RESET_N
RD_L2
RDL2x
RD_L1
RD_L1x
RD_M
RD_Mx
RD_H
RD_Hx
RX_L1X
RX_L1
RX_L2X
RX_L2
RX_M1X
RX_M1
RX_M2X
RX_M2
RX_H2X
RX_H2
RX_H1X
RX_H1
XO_SUP
XOX
XO
AFC_DAC
XO_EXT
CLK_ON
FSYS1_EN
FSYS1
FSYS2_EN
FSYS2
FSYS3_EN
FSYS3
NC1
NC2
NC3
NC4
VDD_TEST
MI1
MI2
12
13
15
28
29
30
31
32
33
34
35
36
8
12
L110 4.7n
GSM_LB_TX
18
ANT_Band4
Tx-Band5
ANT
54
3
22
Rx-GSM1800_1
23
Rx-GSM1800_2
Rx-Band1_1
19
Rx-Band1_2
ANT-Band2
Tx-Band4
11
14
ANT-Band1
Tx-Band2
60
58
C123
1p
3
33p
Tx-Band1
C121
ANT-GSM1800
7
56
L122 2.2n
11
B1
GND23
GND24
GND25
GND26
GND27
GND28
GND29
GND30
GND31
GND32
GND33
GND34
GND35
GND36
GND37
41
42
43
44
45
46
47
48
49
50
51
53
55
57
59
L116
DNI
A4
A2
D1
C1
E3
D3
E4
D4
M12
M11
K12
M3
M4
C183
L4
DNI
L5
M5
M6
L6
L7
F2
E2
G1
F1
H2
G2
J1
H1
L1
K1
K2
J2
B11
A12
A11
B10
B12
K13
G13
G12
H12
H13
J13
J12
A1
A13
M1
M13
E9
A8
B8
B4_TX
VCC
HB_RFIN
LB_RFIN
B5_TX
NC
B8_TX
GND
L176 2.7n
10
SPI_DRW
11
TX_H
SPI_CLK
9
C175
1p
VBAT_PAM
SPI_SS
L177
DNI
Tranceiver PMU
16
8
L179 1.8n
15
TX_L
13
C178
DNI
21
VSD2_1.8V
L180
DNI
CLK_ON
SPI_CLK
SPI_SS
SPI_DRW
C211
GND42
GND41
GND40
GND39
GND38
GND37
GND36
GND35
GND34
GND33
GND32
GND31
GND30
GND29
GND28
GND27
GND26
GND25
GND24
GND23
GND22
3
GND1
GND2
GND3
GND4
GND5
GND6
GND7
GND8
GND9
GND10
GND11
GND12
GND13
GND14
GND15
GND16
GND17
GND18
GND19
GND20
GND21
L211
RD_B4_H
L147 1.5n
VDD_1V2
C251
L148
DNI
0.1u
U220
RF6560
CP_OUT
D5
A6
PA_RAMP
C233
C5
B4
B5
B6
CC_N
VSDI
CA_P
CA_N
CP_OUT
CB_P
VRAMP
CB_N
SDI_EN
VOUT_FB
SDI_CLK
LOUTB
SDI_DATA
LOUTA
NC
B2
DNI
SPI_SS
SPI_CLK
SPI_DRW
CC_P
VBATT1B
LGE Internal Use Only
- 152 -
B3
D4
C232
220n
C231
C230
2.2u
D1
A1
A3
Changed
(Rev.1.1)
A5
B4
D4
C4
SPI_DRW
SPI_SS
VSNS_1V2
LX2
VSNS_1V8
VANA
LX3A
C241
1u
VSNS_2V85
C249
D3
L249
C250
2.2u
4.7u
1u
VDD_1V8
C3
D1
L247
4.7u
L244
4.7u
Removed(Rev.1.0)
VDD_2V85
L248 15n
C2
B1
L245 15n
A1
VBAT_PAM
OUT3B
A2
VDD_2V65
C247
C244
C248
C245
4.7u
4.7u
4.7u
1u
C243
4.7u
L227 20n
B1
C1
LX1
2.2u
C4
D3
Removed
(Rev.1.0)
CLK_ON
VDD_IO
4.7u
VPWR
SPI_CLK
B2
Changed
(Rev.1.1)
L226
1u
C226
GND2
1u
CWELL
VBATT1A
GND1A2
C225
VBATT2
GND1A1
A4
GND1B
A2
10n
A4
C242
U241
RF6590
C227
C228
C255
2.2u
2.2u
2.2n
DNI
C6
D2
10u
C3
D6
10u
C224
C2
100n
C223
VSPI
C221
D2
Removed (Rev.E)
C222
Removed (Rev.B)
220
C1
L168 1.5n
L169
DNI
FB201
PGND
L159
DNI
Rev.E
A3
VBAT
AGND
PAM DCDC
L158 1.5n
B3
VBAT
Copyright (C) 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. CIRCUIT DIAGRAM
BASE BAND PROCESSOR
C330
C329
C328
C327
0.1u
0.1u
0.1u
0.1u
0.1u
0.1u
0.1u
C341
10p
L17
C337
0.1u
M17
X300
FC-135
32.768KHz
C342
M16
N17
10p
R2
M14
L13
P13
N12
L11
M15
M13
A13
A11
A10
A9
A8
C12
B9
C9
A16
B17
C17
D17
E17
F17
G17
H17
J16
MIPI_HSI_AC_DATA
MIPI_HSI_AC_FLAG|McSPI4_SOMI
MIPI_HSI_AC_FLAG
VSD2_1.8V
McSPI4_SIMO
McSPI4_SOMI
McSPI4_CLK
A5
M5
MIPI_HSI_AC_WAKE
MIPI_HSI_CA_READY|McSPI4_CLK
MIPI_HSI_CA_DATA
MIPI_HSI_CA_FLAG
MIPI_HSI_CA_READY
MIPI_HSI_AC_READY
MIPI_HSI_CA_WAKE Rev.C
MEM_A[0]
MEM_A[1]
MEM_A[2]
MEM_A[3]
MEM_A[4]
MEM_A[5]
MEM_A[6]
MEM_A[7]
MEM_A[8]
MEM_A[9]
MEM_A[10]
MEM_A[11]
MEM_A[12]
MEM_A[13]
MEM_A[14]
MEM_A[15]
C356
0.1u
C357
0.1u
VCC1
VCC2
IO0
IO1
IO2
IO3
IO4
IO5
IO6
IO7
IO8
IO9
IO10
IO11
IO12
IO13
IO14
IO15
C358
2.2u
A9
B1
B5
B10
C9
D10
E9
F10
G9
H1
H9
J10
K10
L2
L9
M10
N6
N9
H16
J15
G15
VSS1
VSS4
VSS8
VSSQ5
VSSQ4
VSSQ9
VSSQ8
VSSQ3
VSS2
VSS3
VSSQ10
VSSQ1
VSSQ2
VSS5
VSSQ6
VSSQ7
VSS6
VSS7
/CE
/RE
/WE
CLE
ALE
/WP
R/B
M1
M2
M3
L5
N7
L6
M6
L8
N2
N3
M4
N4
N5
M7
L7
M8
MEM_AD[0]
MEM_AD[1]
MEM_AD[2]
MEM_AD[3]
MEM_AD[4]
MEM_AD[5]
MEM_AD[6]
MEM_AD[7]
A6
A3
A7
A4
B4
B3
B6
MEM_CS0_N
MEM_RD_N
MEM_WR_N
MEM_WAIT_N
MEM_ADV_N
MEM_WP
MEM_BUSY/
MEM_AD[8]
MEM_AD[9]
MEM_AD[10]
MEM_AD[11]
MEM_AD[12]
MEM_AD[13]
MEM_AD[14]
MEM_AD[15]
A1
A10
N1
N10
R1
P2
P1
N2
T9
N1
U9
K3
P12
U10
T8
T7
U8
U7
D4
F6
K4
J1
H3
E4
B4
F2
C4
H1
C3
A5
C314
220n
PT301
G1
F4
G2
F3
DN I
10K
N13
MIPI_HSI_AC_DATA|McSPI4_SIMO
NC1
NC26
NC28
NC29
220n
0.1u
220n
220n
C311
C308
0.1u
C301
C309
0.1u
C310
220n
H8
E3
K2
J3
J2
C2
A3
A2
H2
D3
E1
A4
VDD_VBAT_SD1
VDD_VBAT_SD2
VSS_SD1
VSS_SD2
SD1_SW1
SD1_SW2
SD1_FB
SD2_SW1
SD2_SW2
SD2_FB
ON1
ON2_N
RESET_PWRDWN_N
RESET_BB_N
FSS
RESET_ALL_N
M1
M2
M3
M4
VDD_VBAT_PMU
VPMU
VRTC
VSIM
VPLL
VDD_VSD2
VIO_12
VUSB_IO
VUSB_PD
VUSB_ANA
VSS_PMU
AGND
VREF
TM_EN
ANAMON
TRIG_B
Di3_RX_DAT
Di3_RX_DATX
Di3_TX_DAT
Di3_TX_DATX
SYS_CLK
SYSCLKEN
XRESET_N
ALERT_N
REF_CLK_EN
I2S2_CLK0
I2S2_CLK1
I2S2_RX
I2S2_TX
I2S2_WA0
I2S2_WA1
F14
Changed (Rev.E)
VRTC_1.8V
R5
MODEM_SEND
GSM_TXON_IND
Rev.1.0
E16
R384
D16
DNI
C16
VSD2_1.8V
B16
H11
G11
G9
D8
F9
E8
E9
D10
E11
A7
H10
D11
D12
D13
J12
F13
MEM_AD[0]
MEM_AD[1]
MEM_AD[2]
MEM_AD[3]
MEM_AD[4]
MEM_AD[5]
MEM_AD[6]
MEM_AD[7]
MEM_AD[8]
MEM_AD[9]
MEM_AD[10]
MEM_AD[11]
MEM_AD[12]
MEM_AD[13]
MEM_AD[14]
MEM_AD[15]
Added (P925 Rev.A)
Analog switch for USIF1
Changeed (Rev.C)
UART_TX_SW
UART_TX_IFX
C333
2
C334
1
C335
P3
USB_VBUS
10u
100K
R340
C344
S2 4
1
2
UART_RX_SW
C336
2B0
1B1
GND
UART_RX_IFX
100n
LGE Internal Use Only
- 153 -
U303
FSA2259UMX
VCC
1A
NTJD4105CT1G
3
4.7K
R342
10
G2 5
3 D2
(Active high)
2B1
D1 6
2 G1
IFX_USB_VBUS_EN
IFX_USB_VBUS
USB_D+_IFX
USB_D-_IFX
Removed
(Rev.1.0)
1 S1
USIF1_SW
VBAT
Q301
IFX_TRIG_IN
MON1
MON2
UART_TX_IFX
UART_RX_IFX
220n
USIM_CLK
USIM_RESET/
USIM_DATA
C343
4020
R336
IFX_USB_VBUS
8
T10
N4
9
P14
DSP_AUDIO_IN1
P10
MEM_BFCLKO
MEM_SDCLKO
DDR_CKE
MEM_CS1_N
DDR_RAS_N
DDR_CAS_N
MEM_WR_N
MEM_BC1_N
MEM_BC0_N
DDR_DQS[1]
DDR_DQS[0]
S2
N9
T15
N8
G8
F8
D3
H2
F2
G2
J1
D7
H8
D5
H7
2A
U15
VUSB_ANA_1.8V
B6
MEM_A[0]
MEM_A[1]
MEM_A[2]
MEM_A[3]
MEM_A[4]
MEM_A[5]
MEM_A[6]
MEM_A[7]
MEM_A[8]
MEM_A[9]
MEM_A[10]
MEM_A[11]
MEM_A[12]
MEM_A[13]
MEM_A[14]
MEM_A[15]
7
6
UART1_RX_IPC
1B 0
R12
P9
/CK
CK
CKE
/CS
/RAS
/CAS
/WED
UDQM
LDQM
UDQS
LDQS
K4
K5
K6
K7
J8
K8
J7
J5
E6
C5
D8
C6
C8
C7
B8
B7
S1
R16
4.7
N10
Removed (Rev 1.0)
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
NC27
NC20
NC21
NC9
NC19
NC8
NC11
NC12
NC17
NC18
NC7
NC16
NC25
NC6
NC10
NC5
NC13
NC14
NC4
NC2
NC24
NC22
NC23
NC15
NC3
MEM_AD[0]
MEM_AD[1]
MEM_AD[2]
MEM_AD[3]
MEM_AD[4]
MEM_AD[5]
MEM_AD[6]
MEM_AD[7]
MEM_AD[8]
MEM_AD[9]
MEM_AD[10]
MEM_AD[11]
MEM_AD[12]
MEM_AD[14]
MEM_AD[15]
5
R337
K10
IPC_SRDY
IPC_MRDY
OMAP_SEND
VDDQ1
VDDQ6
VDDQ5
VDDQ4
VDDQ10
VDDQ9
VDDQ2
VDDQ8
VDDQ7
VDDQ3
J4
K1
K2
K3
B2
C2
D1
C3
D2
C4
J3
E2
E1
H3
J2
4
T12
K16
VUSB_PD_1.1V
M8
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
BA0
BA1
UART1_TX_IPC
L8
Rev.B
M9
A2
D4
D6
E3
E4
E5
E7
E8
F1
F3
F4
F5
F6
F7
G3
G4
G5
G6
G7
H4
H5
H6
J6
L3
L4
VDD1
VDD2
VDD3
VDD5
VDD4
VDD6
R4
J17
Rev.B
U17
K11
U1
0.22u
A1
0.1u
A17
0.1u
T11
N11
U11
C325
P16
C324
N16
VSIM_2.9V
VUSB_IO_3.1V
VSD2_1.8V
VPLL_1.2V
VIO_1.2V
C323
T16
F15
R17
B11
T17
K8
Changed (Rev.E)
P17
R8
T1
K9
E12
U2
E13
U12
0.22u
U13
0.1u
VSD2_1.8V Changed (Rev.E)
U3
0.22u
T2
E10
T3
C318
P7
C317
0.1u
* C316, C318, C324 : L-W swapped Cap
C316
R6
C315
T5
H9
T4
K14
T6
N5
Removed (Rev.1.0)
U6
M6
U301
XMM6260
U5
M4
U4
M2
T13
M5
K1
M3
L5
Added (Rev.B)
Removed (925 Rev.D)
VSD1_1.3V
T14
L7
U14
B14
L9
B15
K5
A14
L2
G16
L4
A15
B10
L1
MEM_BFCLKO
DDR_CKE
F16
M1
A12
K7
MEM_BC0_N
MEM_BC1_N
DDR_DQS[0]
DDR_DQS[1]
MEM_SDCLKO
R9
G13
U16
B7
G14
D9
E14
L14
K17
L10
B12
L16
B13
J11
G10
MEM_ADV_N
MEM_RD_N
MEM_WR_N
MEM_WAIT_N
DDR_RAS_N
DDR_CAS_N
D1
C1
H13
P8
H14
J8
J13
IPC_I2S_CLK
IPC_I2S_DIN
IPC_I2S_DOUT
IPC_I2S_SYNC
CP_CRASH_INT
EINT1
EINT2
EINT3
I2C1_SCL
I2C1_SDA
DSP_AUDIO_IN1
CLKOUT0
CLKOUT2
T_OUT0
T_OUT1
RESET2_N
MIPI_HSI_RX_DATA
MIPI_HSI_RX_FLG
MIPI_HSI_RX_RDY
MIPI_HSI_RX_WAKE
MIPI_HSI_TX_DATA
MIPI_HSI_TX_FLG
MIPI_HSI_TX_RDY
MIPI_HSI_TX_WAKE
MEM_A_0
MEM_A_1
MEM_A_2
MEM_A_3
MEM_A_4
MEM_A_5
MEM_A_6
MEM_A_7
MEM_A_8
MEM_A_9
MEM_A_10
MEM_A_11
MEM_A_12
MEM_A_13
MEM_A_14
MEM_A_15
MEM_A_16
MEM_A_17
MEM_A_18
MEM_A_19
MEM_A_20
MEM_A_21
MEM_A_22
MEM_A_23
MEM_AD_0
MEM_AD_1
MEM_AD_2
MEM_AD_3
MEM_AD_4
MEM_AD_5
MEM_AD_6
MEM_AD_7
MEM_AD_8
MEM_AD_9
MEM_AD_10
MEM_AD_11
MEM_AD_12
MEM_AD_13
MEM_AD_14
MEM_AD_15
A8
C1
G1
G10
L1
N8
B9
C10
D9
E10
F9
H10
J9
K9
L10
M9
DI3_TX_DAT
DI3_TX_DATX
VSS_1
VSS_2
VSS_3
VSS_4
VSS_5
VSS_6
VSS_7
VSS_8
VSS_9
VSS_10
VSS_11
VSS_12
VSS_DIGRF
VSS_PLL
VSS_USB
ETM11_TRACECLK
ETM11_TRACEPKT0
ETM11_TRACEPKT1
ETM11_TRACEPKT2
ETM11_TRACEPKT3
ETM11_TRACEPKT4
ETM11_TRACEPKT5
ETM11_TRACEPKT6
ETM11_TRACEPKT7
CC_CLK
CC_RST
CC_IO
TDO
TDI
TMS
TCK
TRST_N
TRIG_IN
HW_MON1
HW_MON2
USIF1_TXD_MTSR
USIF1_RXD_MRST
USIF1_RTS_N
USIF1_CTS_N
USIF1_SCLK
HSIC_USB_DATA
HSIC_USB_STRB
USB_TEST
USB_DPLUS
USB_DMINUS
USB_TUNE
USB_ID
VBUS
DPLUS
DMINUS
NC1
NC2
NC3
NC4
NC5
A6
J14
C355
0.1u
TP311
TP313
TP310
TP312
FWP
FCDP_RBn
MEM_CS0_N
MEM_CS1_N
MEM_CS2_N
MEM_CS3_N
MEM_ADV_N
MEM_RD_N
MEM_WR_N
MEM_WAIT_N
MEM_RAS_N
MEM_CAS_N
MEM_BE0_N
MEM_BE1_N
MEM_BC0_N
MEM_BC1_N
MEM_BC2_N
MEM_BC3_N
MEM_SDCLKO
MEM_BFCLKO_0
MEM_BFCLKO_1
MEM_CKE
MMCI1_CMD
MMCI1_CLK
MMCI_DAT_0
MMCI1_DAT_1
MMCI1_DAT_2
MMCI1_DAT_3
MMCI1_CD
VDD_CORE_1
VDD_CORE_2
VDD_CORE_3
VDD_CORE_4
VDD_CORE_3G_1
VDD_CORE_3G_2
VDD_CORE_EBU
VDD_IO18_1
VDD_IO18_2
VDD_IO18_3
VDD_IO18_4
VDD_IO18_5
VDD_IO18_6
VDD_MMC
VDD_SIM
VDD_USBIO
VDD_MIPI
VDD_PLL
VDD_IO12
VPP
VDD_USB_PD
VDD_USB_ANA
VDD_DIGRF
F32K
OSC32K
VSS_RTC
VDD_RTC
G8
B8
MEM_WP
MEM_BUSY/
MEM_CS0_N
MEM_CS1_N
K13
DNI
R383
4.7K
D14
R382
B1
22u
F1
C306
VSD2_1.8V
C354
0.1u
DI3_SYS_CLK
DI3_SYS_CLK_EN
RESET_N
DI3_REF_CLK_EN
R306
TP301
PT200 close to TCXO
3.3u
TP300
22u
C353
0.1u
Rev.B
J5
L303
C307
J6
3.3u
C352
0.1u
DI3_RX_DAT
DI3_RX_DATX
10u
J4
L304
10u
RESET_PMU_N
C313
10u
Removed (Rev.1.0)
C312
2.2u
C305
H6
4.7K
VSD2_1.8V
VSD1_1.3V
U350
H8BCS0QG0MMR-46M
VBAT
FB302
60
N14
4.7K
FB301
60
R319
VSD1_1.3V
R316
VSD2_1.8V
IFX_PWR_ON_SW/
DSP_AUDIO_IN1
MON1
MON2
IFX_TRIG_IN
C302
4.7K
1u
C304
VBAT
R314
4.7K
P11
R313
VSD2_1.8V
C351
C303
VSD2_1.8V
VPMU_1.3V
VRTC_1.8V
VSIM_2.9V
VPLL_1.2V
VSD2_1.8V
VIO_1.2V
VUSB_IO_3.1V
VUSB_PD_1.1V
VUSB_ANA_1.8V
C301 close to BB
Boot Configuration
NAND MCP
Copyright (C) 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. CIRCUIT DIAGRAM
McSPI port usage
NO ASSIGN
VSEL_1.8V
3.3K
TCXO_BUFFER, TI PMIC, TI CODEC
R588
I2C1
DNI
IPC
DNI
SPI4
DNI
SPI3
I2C port usage
Port
R581
FM, SD/MMC5(WLAN)
DMB
R586
SPI2
R584
SPI1
PDM_UL_DATA
PDM_DL_DATA
PDM_FRAME
PDM_CLK
ABE_CLKS
PDM
AG25
AF25
AE25
AF26
AH26
TP512 TP513
AE24
AF24
AG24
AH24
IPC_SRDY
IPC_MRDY
IFX control
MODEM_SEND
OMAP_SEND
AE18
AG19
AF19
AE19
AF18
AG18
AE17
AF17
AH17
AE16
AF16
AG16
AF14
AE14
MIPI_HSI_CA_WAKE
MIPI_HSI_CA_DATA
MIPI_HSI_CA_FLAG
MIPI_HSI_AC_READY
MIPI_HSI_AC_WAKE
MIPI_HSI_AC_DATA
MIPI_HSI_AC_FLAG
MIPI_HSI_CA_READY
FM_I2S_DI
FM_I2S_DO
FM_I2S_CLK
FM_I2S_FSYNC
MIPI HSI
Rev.C
FM I2S
USB HSIC
SD/MMC1
MICROSD
D2
E3
E4
E2
E1
F4
F3
F1
G4
G3
MICROSD_CLK
MICROSD_CMD
MICROSD_DAT0
MICROSD_DAT1
MICROSD_DAT2
MICROSD_DAT3
GPIOs
1.8V & 3.0V_VIO
UART2
BT
AB26
AB27
AA25
AA26
BT_UART_CTS/
BT_UART_RTS/
BT_UART_RXD
BT_UART_TXD
AF22
AE22
AG22
AE23
AF23
AG23
AH23
F27
F28
G27
G28
UART1_RX_IPC
UART1
GPS_LNA_SD
UART1_TX_IPC
Rev.B
VIBE_PWM
3D_LCD_EN
TP525 TP524 TP523
McSPI4_CLK
McSPI4McSPI4_SIMOI
McSPI4_SOM
UART4
UART4_RX_OMAP
UART4_TX_OMAP
IFX_PWR_ON_SW/
LCD_CP_EN
CAM_SUBPM_EN
HDMI
HDMI_HPD
HDMI_CEC
HDMI_SCL
HDMI_SDA
HDMI_D0HDMI_D0+
HDMI_D1HDMI_D1+
HDMI_D2HDMI_D2+
HDMI_CLKHDMI_CLK+
Rev.B
AE21
AF20
AF21
AE20
AG20
AH19
H4
J2
G2
J1
K1
H2
H3
B9
B10
A8
B8
C10
D10
C9
D9
C8
D8
C11
D11
ABE_PDM_UL_DATA/ABE_McBSP3_DR/SAFE_MODE
ABE_PDM_DL_DATA/ABE_McBSP3_DX/SAFE_MODE
ABE_PDM_FRAME/ABE_McBSP3_CLKX/SAFE_MODE
ABE_PDM_LB_CLK/ABE_McBSP3_FSX/SAFE_MODE
ABE_CLKS/GPIO_118/SAFE_MODE
ABE_DMIC_CLK1/GPIO_119/USBB2_MM_TXSE0/SAFE_MODE
ABE_DMIC_DIN1/GPIO_120/USBB2_MM_TXDAT/SAFE_MODE
ABE_DMIC_DIN2/SLIMBUS2_CLOCK/GPIO_121/SAFE_MODE
ABE_DMIC_DIN3/SLIMBUS2_DATA/ABE_DMIC_CLK2/GPIO_122/SAFE_MODE
CSI22_DX0/GPI_77/SAFE_MODE
CSI22_DY0/GPI_78/SAFE_MODE
CSI22_DX1/GPI_79/SAFE_MODE
USBB1_ULPITLL_CLK/HSI1_CAWAKE/GPIO_84/USBB1_ULPIPHY_CLK/ATTILA_HW_DBG20/SAFE_MODE
CSI22_DY1/GPI_80/SAFE_MODE
USBB1_ULPITLL_STP/HSI1_CADATA/McBSP4_CLKR/GPIO_85/USBB1_ULPIPHY_STP/USBB1_MM_RXDP/ATTILA_HW_DBG21/SAFE_MODE CAM_SHUTTER/GPIO_81/SAFE_MODE
USBB1_ULPITLL_DIR/HSI1_CAFLAG/McBSP4_FSR/GPIO_86/USBB1_ULPIPHY_DIR/ATTILA_HW_DBG22/SAFE_MODE
CAM_STROBE/GPIO_82/SAFE_MODE
USBB1_ULPITLL_NXT/HSI1_ACREADY/McBSP4_FSX/GPIO_87/USBB1_ULPIPHY_NXT/USBB1_MM_RXDM/ATTILA_HW_DBG23/SAFE_MODE
CAM_GLOBALRESET/GPIO_83/SAFE_MODE
USBB1_ULPITLL_DAT0/HSI1_ACWAKE/McBSP4_CLKX/GPIO_88/USBB1_ULPIPHY_DAT0/USBB1_MM_RXRCV/ATTILA_HW_DBG24/SAFE_MODE
USBB1_ULPITLL_DAT1/HSI1_ACDATA/McBSP4_DX/GPIO_89/USBB1_ULPIPHY_DAT1/USBB1_MM_TXSE0/ATTILA_HW_DBG25/SAFE_MODE
CVIDEO_TVOUT
USBB1_ULPITLL_DAT2/HSI1_ACFLAG/McBSP4_DR/GPIO_90/USBB1_ULPIPHY_DAT2/USBB1_MM_TXDAT/ATTILA_HW_DBG26/SAFE_MODE
CVIDEO_VFB
USBB1_ULPITLL_DAT3/HSI1_CAREADY/GPIO_91/USBB1_ULPIPHY_DAT3/USBB1_MM_TXEN/ATTILA_HW_DBG27/SAFE_MODE
CVIDEO_RSET
USBB1_ULPITLL_DAT4/DMTIMER8_PWM_EVT/ABE_McBSP3_DR/GPIO_92/USBB1_ULPIPHY_DAT4/ATTILA_HW_DBG28/SAFE_MODE
USBB1_ULPITLL_DAT5/DMTIMER9_PWM_EVT/ABE_McBSP3_DX/GPIO_93/USBB1_ULPIPHY_DAT5/ATTILA_HW_DBG29/SAFE_MODE
DSI1_DX0
USBB1_ULPITLL_DAT6/DMTIMER10_PWM_EVT/ABE_McBSP3_CLKX/GPIO_94/USBB1_ULPIPHY_DAT6/ABE_DMIC_DIN3/ATTILA_HW_DBG30/SAFE_MODE
DSI1_DY0
USBB1_ULPITLL_DAT7/DMTIMER11_PWM_EVT/ABE_McBSP3_FSX/GPIO_95/USBB1_ULPIPHY_DAT7/ABE_DMIC_CLK3/ATTILA_HW_DBG31/SAFE_MODE
DSI1_DX1
DSI1_DY1
USBB1_HSIC_DATA/GPIO_96/SAFE_MODE
USBB1_HSIC_STROBE/GPIO_97/SAFE_MODE
DSI1_DX2
DSI1_DY2
SDMMC1_CLK/DPM_EMU19/GPIO_100/SAFE_MODE
DSI1_DX3
SDMMC1_CMD/UART1_RX/GPIO_101/SAFE_MODE
DSI1_DY3
SDMMC1_DAT0/DPM_EMU18/GPIO_102/SAFE_MODE
DSI1_DX4
SDMMC1_DAT1/DPM_EMU17/GPIO_103/SAFE_MODE
DSI1_DY4
SDMMC1_DAT2/DPM_EMU16/GPIO_104/JTAG_TMS_TMSC/SAFE_MODE
SDMMC1_DAT3/DPM_EMU15/GPIO_105/JTAG_TCK/SAFE_MODE
DSI2_DX0
SDMMC1_DAT4/GPIO_106/SAFE_MODE
DSI2_DY0
SDMMC1_DAT5/GPIO_107/SAFE_MODE
DSI2_DX1
DSI2_DY1
SDMMC1_DAT6/GPIO_108/SAFE_MODE
SDMMC1_DAT7/GPIO_109/SAFE_MODE
DSI2_DX2
DSI2_DY2
UART2_CTS/SDMMC3_CLK/GPIO_123/SAFE_MODE
UART2_RTS/SDMMC3_CMD/GPIO_124/SAFE_MODE
GPMC_AD0/SDMMC2_DAT0
UART2_RX/SDMMC3_DAT0/GPIO_125/SAFE_MODE
GPMC_AD1/SDMMC2_DAT1
UART2_TX/SDMMC3_DAT1/GPIO_126/SAFE_MODE
GPMC_AD2/SDMMC2_DAT2
GPMC_AD3/SDMMC2_DAT3
McSPI1_CLK/GPIO_134/SAFE_MODE
GPMC_AD4/SDMMC2_DAT4/SDMMC2_DIR_DAT0
McSPI1_SOMI/GPIO_135/SAFE_MODE
GPMC_AD5/SDMMC2_DAT5/SDMMC2_DIR_DAT1
McSPI1_SIMO/GPIO_136/SAFE_MODE
GPMC_AD6/SDMMC2_DAT6/SDMMC2_DIR_CMD
McSPI1_CS0/GPIO_137/SAFE_MODE
GPMC_AD7/SDMMC2_DAT7/SDMMC2_CLK_FDBK
McSPI1_CS1/UART1_RX/GPIO_138/SAFE_MODE
GPMC_AD8/KPD_ROW0/C2C_DATA15/GPIO_32
McSPI1_CS2/UART1_CTS/SLIMBUS2_CLOCK/GPIO_139/SAFE_MODE
GPMC_AD9/KPD_ROW1/C2C_DATA14/GPIO_33
McSPI1_CS3/UART1_RTS/SLIMBUS2_DATA/GPIO_140/SAFE_MODE
GPMC_AD10/KPD_ROW2/C2C_DATA13/GPIO_34
UART3_CTS_RCTX/UART1_TX/GPIO_141/SAFE_MODE
GPMC_AD11/KPD_ROW3/C2C_DATA12/GPIO_35
UART3_RTS_SD/GPIO_142/SAFE_MODE
GPMC_AD12/KPD_COL0/C2C_DATA11/GPIO_36
UART3_RX_IRRX/DMTIMER8_PWM_EVT/GPIO_143/SAFE_MODE
GPMC_AD13/KPD_COL1/C2C_DATA10/GPIO_37
UART3_TX_IRTX/DMTIMER9_PWM_EVT/GPIO_144/SAFE_MODE
GPMC_AD14/KPD_COL2/C2C_DATA9/GPIO38
GPMC_AD15/KPD_COL3/C2C_DATA8/GPIO39
McSPI4_CLK/SDMMC4_CLK/GPIO_151/SAFE_MODE
McSPI4_SIMO/SDMMC4_CMD/GPIO_152/SAFE_MODE
GPMC_A16/KPD_ROW4/C2C_DATAIN0/GPIO40/VENC_656_DATA0
McSPI4_SOMI/SDMMC4_DAT0/GPIO_153/SAFE_MODE
GPMC_A17/KPD_ROW5/C2C_DATAIN1/GPIO_41/VENC_656_DATA1/SAFE_MODE
McSPI4_CS0/SDMMC4_DAT3/GPIO_154/SAFE_MODE
GPMC_A18/KPD_ROW6/C2C_DATAIN2/GPIO_42/VENC_656_DATA2/SAFE_MODE
UART4_RX/SDMMC4_DAT2/GPIO_155/SAFE_MODE
GPMC_A19/KPD_ROW7/C2C_DATAIN3/GPIO_43/VENC_656_DATA3/SAFE_MODE
UART4_TX/SDMMC4_DAT1/GPIO_156/SAFE_MODE
GPMC_A20/KPD_COL4/C2C_DATAIN4/GPIO_44/VENC_656_DATA4/SAFE_MODE
GPMC_A21/KPD_COL5/C2C_DATAIN5/GPIO_45/VENC_656_DATA5/SAFE_MODE
SIM_IO/GPIO_WK0/SAFE_MODE
GPMC_A22/KPD_COL6/C2C_DATAIN6/GPIO_46/VENC_656_DATA6/SAFE_MODE
SIM_CLK/GPIO_WK1/SAFE_MODE
GPMC_A23/KPD_COL7/C2C_DATAIN7/GPIO_47/VENC_656_DATA7/SAFE_MODE
SIM_RESET/GPIO_WK2/SAFE_MODE
GPMC_A24/C2C_CLKOUT0/GPIO_48/SAFE_MODE
SIM_CD/GPIO_WK3/SAFE_MODE
GPMC_A25/C2C_CLKOUT1/GPIO_49/SAFE_MODE
SIM_PWR_CTRL/GPIO_WK4/SAFE_MODE
USBC1_ICUSB_DP/GPIO_98/SAFE_MODE
GPMC_nCS0/GPIO_50/SYS_NDMAREQ0
USBC1_ICUSB_DM/GPIO_99/SAFE_MODE
GPMC_nCS1/C2C_DATAOUT6/GPIO_51/SAFE_MODE
GPMC_nCS2/C2C_DATAOUT7/GPIO_52/SAFE_MODE
HDMI_HPD/GPIO_63/SAFE_MODE
GPMC_nCS3/GPMC_DIR/C2C_DATAOUT4/GPIO_53/SAFE_MODE
HDMI_CEC/GPIO_64/SAFE_MODE
GPMC_nWP/DSI1_TE0/GPIO_54/SYS_NDMAREQ1
HDMI_DDC_SCL/GPIO_65/SAFE_MODE
GPMC_CLK/GPIO_55/SYS_nDMAREQ2
HDMI_DDC_SDA/GPIO_66/SAFE_MODE
GPMC_nADV_ALE//DSI1_TE1/GPIO_56/SYS_NDMAREQ3
HDMI_DATA0X
GPMC_nOE/SDMMC2_CLK
HDMI_DATA0Y
GPMC_nWE/SDMMC2_CMD
HDMI_DATA1X
GPMC_NBE0_CLE/DSI2_TE0/GPIO_59
HDMI_DATA1Y
GPMC_nBE1/C2C_DATAOUT5/GPIO_60/SAFE_MODE
HDMI_DATA2X
GPMC_WAIT0/DSI2_TE1/GPIO_61
HDMI_DATA2Y
GPMC_WAIT1/C2C_DATAOUT2/GPIO_62/SAFE_MODE
HDMI_CLOCKX
HDMI_CLOCKY
U500
OMAP4430
PRIMARY_5M_MIPI_CLK_P
PRIMARY_5M_MIPI_CLK_N
PRIMARY_5M_MIPI_DATA0_P
PRIMARY_5M_MIPI_DATA0_N
PRIMARY_5M_MIPI_DATA1_P
PRIMARY_5M_MIPI_DATA1_N
VT_0.3M_MIPI_CLK_P
VT_0.3M_MIPI_CLK_N
VT_0.3M_MIPI_DATA0_P
VT_0.3M_MIPI_DATA0_N
M26
M25
N26
N25
T27
U27
V27
SECONDARY_5M_MIPI_CLK_P
SECONDARY_5M_MIPI_CLK_N
SECONDARY_5M_MIPI_DATA0_P
SECONDARY_5M_MIPI_DATA0_N
R510
1.5K
AA27
I2C1_SCL
I2C1_SDA
AE28
AE26
C26
D26
I2C2_SCL
I2C2_SDA
W27
Y27
I2C4_SCL
I2C4_SDA
SRI2C_SCL
SRI2C_SDA
AG21
AH22
AG9
AF9
SYS_nIRQ2
SYS_nIRQ1
SYS_PWRREQ
AF6
AE6
AH7
Composite
Video
DSI1
AG5
AH6
AH5
AG8
AD1
SYSTEM
OMAP_CLK_IN
OMAP_CLK_REQ
DSI2_LCD_MIPI_CLK_P
DSI2_LCD_MIPI_CLK_N
DSI2_LCD_MIPI_D1_P
DSI2_LCD_MIPI_D1_N
DSI2_LCD_MIPI_D0_P
DSI2_LCD_MIPI_D0_N
470K
SDMMC2_DAT[0]
SDMMC2_DAT[1]
SDMMC2_DAT[2]
SDMMC2_DAT[3]
SDMMC2_DAT[4]
SDMMC2_DAT[5]
SDMMC2_DAT[6]
SDMMC2_DAT[7]
R512
DNI
AUD_PWRON
CSI2_2
VSEL_1.8V
SYS_nRESWARM
SYS_nRESPWRON
MOTION_INT
CLK32K_MAIN
DSI2
eMMC4.4
UART_SW1
UART_SW2
Rev.1.0
COMPASS_INT
Rev.D TOUCH_RESET
SECONDARY_5M_RESET_N
PROX_INT
GPS_UART_TXD
GPS_UART_RXD
GPS_UART_RTS_N
GPS_UART_CTS_N
Rev.E, 1.0
FUEL_INT/
VT_CAM_PWDN
VT_CAM_RESET/
PRIMARY_5M_RESET_N
VIBE_EN
Rev.B CP_CRASH_INT
LCD_EN
GYRO_INT
Rev.C 3D_LCD_BANK_SEL
FLASH_EN
Added(Rev.D)
470K
MICROSD_DET/
HDMI_LS_OE
MICROSD_COVER_DET/
3D_BOOST_EN
HDQ_SIO/I2C3_SCCB/I2C2_SCCB/GPIO_127/SAFE_MODE
USBB2_HSIC_STROBE/GPIO_170/SAFE_MODE
USBB2_HSIC_DATA/GPIO_169/SAFE_MODE
USBB2_ULPITLL_DAT7/USBB2_ULPIPHY_DAT7/SDMMC3_CLK/GPIO_168/McSPI3_CLK/DISPC2_DATA11/RSVD
USBB2_ULPITLL_DAT6/USBB2_ULPIPHY_DAT6/SDMMC3_CMD/GPIO_167/McSPI3_SIMO/DISPC2_DATA12/RSVD
USBB2_ULPITLL_DAT5/USBB2_ULPIPHY_DAT5/SDMMC3_DAT3/GPIO_166/McSPI3_CS0/DISPC2_DATA13/RSVD
USBB2_ULPITLL_DAT4/USBB2_ULPIPHY_DAT4/SDMMC3_DAT0/GPIO_165/McSPI3_SOMI/DISPC2_DATA14/RSVD
USBB2_ULPITLL_DAT3/USBB2_ULPIPHY_DAT3/SDMMC3_DAT1/GPIO_164/HSI2_CAREADY/DISPC2_DATA15/RSVD
USBB2_ULPITLL_DAT2/USBB2_ULPIPHY_DAT2/SDMMC3_DAT2/GPIO_163/HSI2_ACFLAG/DISPC2_DATA18/RSVD
USBB2_ULPITLL_DAT1/USBB2_ULPIPHY_DAT1/SDMMC4_DAT3/GPIO_162/HSI2_ACDATA/DISPC2_DATA19/RSVD
USBB2_ULPITLL_DAT0/USBB2_ULPIPHY_DAT0/SDMMC4_DAT2/GPIO_161/HSI2_ACWAKE/DISPC2_DATA20/RSVD
USBB2_ULPITLL_NXT/USBB2_ULPIPHY_NXT/SDMMC4_DAT1/GPIO_160/HSI2_ACREADY/DISPC2_DATA21/RSVD
USBB2_ULPITLL_DIR/USBB2_ULPIPHY_DIR/SDMMC4_DAT0/GPIO_159/HSI2_CAFLAG/DISPC2_DATA22/RSVD
USBB2_ULPITLL_STP/USBB2_ULPIPHY_STP/SDMMC4_CLK/GPIO_158/HSI2_CADATA/DISPC2_DATA23/RSVD
USBB2_ULPITLL_CLK/USBB2_ULPIPHY_CLK/SDMMC4_CMD/GPIO_157/HSI2_CAWAKE/SAFE_MODE
I2C1_SCL
I2C1_SDA
I2C2_SCL/UART1_RX/GPIO_128/SAFE_MODE
I2C2_SDA/UART1_TX/GPIO_129/SAFE_MODE
I2C3_SCL/GPIO_130/SAFE_MODE
I2C3_SDA/GPIO_131/SAFE_MODE
I2C4_SCL/GPIO_132/SAFE_MODE
I2C4_SDA/GPIO_133/SAFE_MODE
SR_SCL
SR_SDA
10K
AF7
AE7
AG6
AG7
M2
N2
P2
V1
V2
W1
W2
W3
W4
Y2
Y3
Y4
AA1
AA2
AA3
AA4
AB2
AB3
AB4
AC4
A27
AE13
AF13
AE9
AG10
AF10
AE10
AH11
AG11
AF11
AE11
AG13
AE12
AF12
AG12
GPIOs1.2V_VIO
WLAN_EN
WLAN_HOST_WAKEUP
BT_EN
USIF1_SW
RESET_PMU_N
FUEL_SDA
R515 2.7K
R514 2.7K
FREF_XTAL_VSSOSC
FREF_XTAL_IN/C2C_WAKEREQIN
FREF_XTAL_OUT
FREF_SLICER_IN/GPI_WK5/C2C_WAKEREQIN/SAFE_MODE
FREF_CLK_IOREQ
UNIPRO_RY2/KPD_ROW5/GPI_3/SAFE_MODE
UNIPRO_RX2/KPD_ROW4/GPI_2/SAFE_MODE
UNIPRO_RY1/KPD_ROW3/GPI_178/SAFE_MODE
UNIPRO_RX1/KPD_ROW2/GPI_177/SAFE_MODE
UNIPRO_RY0/KPD_ROW1/GPI_176/SAFE_MODE
UNIPRO_RX0/KPD_ROW0/GPI_175/SAFE_MODE
U500
OMAP4430
SYS_NRESWARM
SYS_NRESPWRON
SYS_PWRON_RESET_OUT/GPIO_WK29
SYS_32K
UNIPRO_TY2/KPD_COL5/GPIO_1/SAFE_MODE
UNIPRO_TX2/KPD_COL4/GPIO_0/SAFE_MODE
UNIPRO_TY1/KPD_COL3/GPIO_174/SAFE_MODE
UNIPRO_TX1/KPD_COL2/GPIO_173/SAFE_MODE
UNIPRO_TY0/KPD_COL1/GPIO_172/SAFE_MODE
UNIPRO_TX0/KPD_COL0/GPIO_171/SAFE_MODE
USB_DM_OMAP
USB_DP_OMAP
K27
L27
K25
K26
J25
J26
KEY_R[1]
KEY_R[0]
H27
J27
H25
H26
G25
G26
GPS_RESET_N
GPS_PWR_ON
DPM_EMU0/GPIO_11/ATTILA_HW_DBG0/SAFE_MODE
DPM_EMU1/GPIO_12/ATTILA_HW_DBG1/SAFE_MODE
DPM_EMU2/USBA0_ULPIPHY_CLK/GPIO_13/DISPC2_FID/ATTILA_HW_DBG2/RSVD
DPM_EMU3/USBA0_ULPIPHY_STP/GPIO_14/DISPC2_DATA10/ATTILA_HW_DBG3/RSVD
DPM_EMU4/USBA0_ULPIPHY_DIR/GPIO_15/DISPC2_DATA9/ATTILA_HW_DBG4/RSVD
DPM_EMU5/USBA0_ULPIPHY_NXT/GPIO_16/RFBI_TE_VSYNC0/DISPC2_DATA16/ATTILA_HW_DBG5/RSVD
SYS_BOOT0/GPIO_184/SAFE_MODE
DPM_EMU6/USBA0_ULPIPHY_DAT0/UART3_TX_IRTX/GPIO_17/RFBI_HSYNC0/DISPC2_DATA17/ATTILA_HW_DBG6/RSVD
SYS_BOOT1/GPIO_185/SAFE_MODE
DPM_EMU7/USBA0_ULPIPHY_DAT1/UART3_RX_IRRX/GPIO_18/RFBI_CS0/DISPC2_HSYNC/ATTILA_HW_DBG7/RSVD
SYS_BOOT2/GPIO_186/SAFE_MODE
DPM_EMU8/USBA0_ULPIPHY_DAT2/UART3_RTS_SD/GPIO_19/RFBI_RE/DISPC2_PCLK/ATTILA_HW_DBG8/RSVD
SYS_BOOT3/GPIO_187/SAFE_MODE
DPM_EMU9/USBA0_ULPIPHY_DAT3/UART3_CTS_RCTX/GPIO_20/RFBI_WE/DISPC2_VSYNC/ATTILA_HW_DBG9/RSVD
SYS_BOOT4/GPIO_188/SAFE_MODE
DPM_EMU10/USBA0_ULPIPHY_DAT4/GPIO_21/RFBI_A0/DISPC2_DE/ATTILA_HW_DBG10/RSVD
SYS_BOOT5/GPIO_189/SAFE_MODE
DPM_EMU11/USBA0_ULPIPHY_DAT5/GPIO_22/RFBI_DATA8/DISPC2_DATA8/ATTILA_HW_DBG11/RSVD
SYSBOOT6/DPM_EMU18/GPIO_WK9/C2C_WAKEREQOUT/SAFE_MODE
DPM_EMU12/USBA0_ULPIPHY_DAT6/GPIO_23/RFBI_DATA7/DISPC2_DATA7/ATTILA_HW_DBG12/RSVD
SYSBOOT7/DPM_EMU19/GPIO_WK10/SAFE_MODE
DPM_EMU13/USBA0_ULPIPHY_DAT7/GPIO_24/RFBI_DATA6/DISPC2_DATA6/ATTILA_HW_DBG13/RSVD
DPM_EMU14/SYS_DRM_MSECURE/UART1_RX/GPIO_25/RFBI_DATA5/DISPC2_DATA5/ATTILA_HW_DBG14/RSVD
DPM_EMU15/SYS_SECURE_INDICATOR/GPIO_26/RFBI_DATA4/DISPC2_DATA4/ATTILA_HW_DBG15/RSVD
C2C_DATA15/DSI2_TE1/C2C_DATAOUT1/GPIO_104/SAFE_MODE
DPM_EMU16/DMTIMER8_PWM_EVT/DSI1_TE0/GPIO_27/RFBI_DATA3/DISPC2_DATA3/ATTILA_HW_DBG16/RSVD
C2C_DATA11/USBC1_ICUSB_TXEN/C2C_DATAOUT3/GPIO_100/SYS_NDMAREQ0/SAFE_MODE
DPM_EMU17/DMTIMER9_PWM_EVT/DSI1_TE1/GPIO_28/RFBI_DATA2/DISPC2_DATA2/ATTILA_HW_DBG17/RSVD
C2C_DATA12/DSI1_TE0/C2C_CLKIN0/GPIO_101/SYS_NDMAREQ1/SAFE_MODE
DPM_EMU18/DMTIMER10_PWM_EVT/DSI2_TE0/GPIO_190/RFBI_DATA1/DISPC2_DATA1/ATTILA_HW_DBG18/RSVD
C2C_DATA13/DSI1_TE1/C2C_CLKIN1/GPIO_102/SYS_NDMAREQ2/SAFE_MODE
DPM_EMU19/DMTIMER11_PWM_EVT/DSI2_TE1/GPIO_191/RFBI_DATA0/DISPC2_DATA0/ATTILA_HW_DBG19/RSVD C2C_DATA14/DSI2_TE0/C2C_DATAOUT0/GPIO_103/SYS_NDMAREQ3/SAFE_MODE
51K
R593
FREF_CLK1_OUT/GPIO_181/SAFE_MODE
FREF_CLK2_OUT/GPIO_182/SAFE_MODE
FREF_CLK3_REQ/FREF_CLK1_REQ/SYS_DRM_MSECURE/GPIO_WK30/C2C_WAKEREQIN/SAFE_MODE
FREF_CLK4_REQ/FREF_CLK5_OUT/GPIO_WK7
FREF_CLK4_OUT/GPIO_WK8
FREF_CLK0_OUT/FREF_CLK1_REQ/SYS_DRM_MSECURE/GPIO_WK6/SAFE_MODE
FREF_CLK3_OUT/FREF_CLK2_REQ/SYS_SECURE_INDICATOR/GPIO_WK31/C2C_WAKEREQOUT/SAFE_MODE
51K
AA28
Y28
AD3
AC2
AC3
AD2
AD4
MUIC
Key Pad
VSEL_1.8V
Added (Rev.E)
5M_MCLK
LCD_RESET_N
Rev.B
MUIC_INT/
SYS_DRM_MSEC
VT_0.3M_MCLK
F26
E27
E26
E25
D28
D27
AF8
AE8
D24
D23
A24
B24
C24
USB
KEY_C[1]
KEY_C[0]
R592
JTAG_TDO
JTAG_nTRST
JTAG_TMS_TMSC/SAFE_MODE
JTAG_TDI
JTAG_TCK/SAFE_MODE
JTAG_RTCK
VSEL_1.8V
Added (Rev.1.1)
FUEL_SCL
B4
USBA0_OTG_DM/UART3_TX_IRTX/UART2_TX/GPIO_180/SAFE_MODE
B5
USBA0_OTG_DP/UART3_RX_IRRX/UART2_RX/GPIO_179/SAFE_MODE
C3
USBA0_OTG_CE
SYS_NIRQ2/GPIO_183/SAFE_MODE
SYS_NIRQ1/SAFE_MODE
SYS_PWR_REQ
R516
AE2
AH2
AH1
AE1
AG1
AE3
Removed
(Rev.1.0)
JTAG
SD/MMC2
DN I
Changed(Rev.1.0)
R511
1.5K
I2C3_SCL
I2C3_SDA
2.7K
C12
D12
C13
D13
C15
D15
A16
B16
C16
D16
VSEL_1.8V
C17
D17
C18
D18
C19
R522
D19 R521
B25
C21
D21
C22
C25
B22
D25
B11
B12
C23
D22
B26
B23
CSI2_1
I2C
Rev.E
T3
T4
U3
U4
V3
V4
B17
A18
B18
A19
B19
B20
A21
B21
C20
D20
VSEL_1.8V
Added(Rev.C)
FRONT_KEY_LED_EN
CHG_EN_SET/
P3
P4
N3
N4
M3
M4
L3
L4
K3
K4
SYS_BOOT6
SYS_BOOT7
WLAN
R26
R25
T26
T25
U26
U25
V26
V25
W26
W25
B7
C7 R513
D7
TI PMIC
SRI2C
SD/MMC5
3.3K
CSI21_DX0/GPI_67/SAFE_MODE
CSI21_DY0/GPI_68/SAFE_MODE
CSI21_DX1/GPI_69/SAFE_MODE
CSI21_DY1/GPI_70/SAFE_MODE
CSI21_DX2/GPI_71/SAFE_MODE
CSI21_DY2/GPI_72/SAFE_MODE
CSI21_DX3/GPI_73/SAFE_MODE
CSI21_DY3/GPI_74/SAFE_MODE
CSI21_DX4/GPI_75/SAFE_MODE
CSI21_DY4/GPI_76/SAFE_MODE
SYS_BOOT1
SYS_BOOT2
SYS_BOOT4
R598
ABE_McBSP1_CLKX/ABE_SLIMBUS1_CLOCK/GPIO_114/SAFE_MODE
ABE_McBSP1_DR/ABE_SLIMBUS1_DATA/GPIO_115/SAFE_MODE
ABE_McBSP1_DX/SDMMC3_DAT2/ABE_MCASP_ACLKX/GPIO_116/SAFE_MODE
ABE_McBSP1_FSX/SDMMC3_DAT3/ABE_MCASP_AMUTEIN/GPIO_117/SAFE_MODE
2st 5M CAM, Gyro sensor, PROXI/ALC sensor
R597
AC26
AC25
AB25
AC27
I2C4
3.3K
R501 10
WLAN_CLK
WLAN_CMD
WLAN_SDIO[0]
WLAN_SDIO[1]
WLAN_SDIO[2]
WLAN_SDIO[3]
3.3K
BT PCM
AE5
AF5
AE4
AF4
AG3
AF3
3.3K
BT_PCM_CLK
BT_PCM_DIN
BT_PCM_DOUT
BT_PCM_SYNC
McBSP1
SDMMC5_CLK/MCSPI2_CLK/USBC1_ICUSB_DP/GPIO_145/SAFE_MODE
SDMMC5_CMD/MCSPI2_SIMO/USBC1_ICUSB_DM/GPIO_146/SAFE_MODE
SDMMC5_DAT0/MCSPI2_SOMI/USBC1_ICUSB_RCV/GPIO_147/SAFE_MODE
SDMMC5_DAT1/USBC1_ICUSB_TXEN/GPIO_148/SAFE_MODE
SDMMC5_DAT2/MCSPI2_CS1/GPIO_149/SAFE_MODE
SDMMC5_DAT3/MCSPI2_CS0/GPIO_150/SAFE_MODE
R591
IPC_PCM
ABE_McBSP2_CLKX/McSPI2_CLK/ABE_MCASP_AHCLKX/GPIO_110/USBB2_MM_RXDM/SAFE_MODE
ABE_McBSP2_DR/McSPI2_SOMI/ABE_MCASP_AXR/GPIO_111/USBB2_MM_RXDP/SAFE_MODE
ABE_McBSP2_DX/McSPI2_SIMO/ABE_MCASP_AMUTE/GPIO_112/USBB2_MM_RXRCV/SAFE_MODE
ABE_McBSP2_FSX/McSPI2_CS0/ABE_MCASP_AFSX/GPIO_113/USBB2_MM_TXEN/SAFE_MODE
1st 5M CAM, VT CAM, CAM PMU, MUIC
R596
AD27
AD26
AD25
AC28
IPC_I2S_CLK
IPC_I2S_DOUT
IPC_I2S_DIN
IPC_I2S_SYNC
McBSP2
TOUCH, LCD backlight booster, Flash LED driver, Compass sensor
I2C3
R500
10
R594
I2C2
SYS_BOOT1
SYS_BOOT2
SYS_BOOT4
SYSTEM
BOTTING
SYS_BOOT6
SYS_BOOT7
TP511
PROXI_LDO_EN
For Touch S/W control
ATESTV
Added (P925 Rev.A)
Removed (Rev.E)
CHG_STATUS/
TOUCH_INT_N
IFX_USB_VBUS_EN
SDMMC2_CLK
SDMMC2_CMD
HDMI_CT_CP_HPD
Reference Clock
JATG & UART INTERFACE
Removed (Rev.1.0)
VBAT
VCLKB_TCXO_VCC
ARRAY TP
VBAT
E2
C500
I2C1_SCL
I2C1_SDA
1u
VCHG
UAT500
ESD9B5_0ST5G
ESD9B5_0ST5G
ESD9B5_0ST5G
ZD593
ZD592
ZD591
PWR_ON_SW
E3
B2
SYS_nRESWARM
2.5G
UART_RX_IFX
UART_TX_IFX
E4
1
2
3
4
5
6
7
8
9
10
11
12
GND
RX
TX
NC1
ON_SW
VBAT
NC2
NC3
NC4
3G
GND
RX
TX
VCHAR
ON_SW
VBAT
PWR
URXD
UTXD
VCLKB_TCXO_VCC
4
1
C505
0.1u
A3
OMAP_CLK_REQ
WL_CLK_REQ
OUT
GND1
C3
C1
X500
VCC
A1
GND2
3
C504
0.1u
B1
D4
2
VBAT
VLDO
SCLH
VDD_ANA
SDAH
RESET
REQ1
REQ2
VDD_DIG
U502
CDC3S04
CLK1
CLK2
CLK3
CLK4
REQ3
REQ4
MCLK_REQ
MCLK_IN
GND_ANA
ADR_A0
GND_DIG
VPMIC_VDAC
VSEL_1.8V
E1
B3
D1
A4
C509
68p
A2
C508
68p
C4
C507
68p
C2
OMAP_CLK_IN
WL_CLK_IN
AUD_CLK_IN
C501
C502
C503
2.2u
1u
1u
D3
B4
D2
1XXB38400FAA
38.4MHz
DSR
RTS
CTS
UART_TP
LGE Internal Use Only
- 154 -
Copyright (C) 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. CIRCUIT DIAGRAM
OMAP POWER
C687
C688
4.7u
C619
1u
C620
1u
1u
0.47u
IN
OUT
GND
VCORE2_OMAP_IVAUD
Changed (Rev.E)
C626
C627
0.1u
Added (Rev.1.0)
V9
U9
V8
W8
W9
Y8
Y9
Y10
AA10
FL621
NFM18PS105R0J3D_
C621
1u
V21
W20
W21
Y18
Y19
Y20
Y21
AA17
AA19
AA18
FL627
NFM18PS105R0J3D_
IN
OUT
GND
Changed (Rev.E)
VSEL_1.8V
C640
C641
C642
0.1u
0.1u
H22
J22
U7
V7
AB7
W22
K7
0.1u
VPMIC_VCXIO
Y7
L1
L2
C685
220n
C686
C647
220n
220n
C649
W28
V28
VPMIC_VDAC
220n
Added (P925 Rev.A)
A11
G12
Added (P925 Rev.A)
C684
C652
C653
C658
0.1u
0.1u
0.1u
G13
C650
0.1u
P9
Y16
0.47u
C657 220n
T22
P7
N22
AB14
VSEL_1.8V
VSEL_1.29V
VSEL_1.8V
VSEL_1.8V
C663
220n
C667
220n
M28
VSEL_1.8V
C668
0.1u
A7
A5
VPMIC_VCXIO
VPMIC_VUSB
C669
220n
VSEL_1.8V
A13
C27
AH14
N1
P1
R28
C1
AG2
AG27
C670
220n
C673
C674
C675
C681
0.1u
0.1u
0.1u
0.47u
VSEL_VMEM
C677
C678
C679
C680
0.1u
0.1u
0.1u
A15
B15
AG14
N28
T1
T2
A3
C28
AF27
AH3
0.47u
VSEL_1.29V
C682
C683
0.1u
0.1u
Y14
R27
G15
T8
1%
R631
240 AH16
R632
240 AF28
A26
B2
VDDCA_LPDDR2_0
VDDCA_LPDDR2_1
VDDCA_LPDDR2_2
VDDCA_LPDDR2_3
VDDCA_LPDDR2_4
VDDCA_LPDDR2_5
VDDCA_LPDDR2_6
VDDCA_LPDDR2_7
VDDCA_LPDDR2_8
VDDCA_LPDDR2_9
VDD_IVA_AUDIO_0
VDD_IVA_AUDIO_1
VDD_IVA_AUDIO_2
VDD_IVA_AUDIO_3
VDD_IVA_AUDIO_4
VDD_IVA_AUDIO_5
VDD_IVA_AUDIO_6
VDD_IVA_AUDIO_7
VDD_IVA_AUDIO_8
VDD_IVA_AUDIO_9
VDDS_DV_BANK0
VDDS_DV_BANK1
VDDS_DV_BANK2_0
VDDS_DV_BANK2_1
VDDS_DV_BANK3
VDDS_DV_BANK4
VDDS_DV_BANK5
VDDS_DV_BANK6
U500
VDDS_1P8_0
VDDS_1P8_1
VDDS_1P8_2
VDDS_1P8_3
VDDS_1P8_4
VDDS_1P8_5
VDDS_1P8_6
47 K
47K
47 K
47K
47K
47K
47 K
47 K
47 K
R735
R736
R737
R738
R739
10
R722
10
R723
10
R724
10
R725
10
R726
10
R727
10
R728
10
H3
H4
H5
J2
J3
J4
J5
J6
SDMMC2_CLK
R729
10
W6
SDMMC2_CMD
R730
10
W5
C739
1u
C740
VSEL_1.29V
FB741
M6
N5
T10
U9
M7
P5
R10
U8
K4
Y2
Y5
AA4
AA6
K6
W4
Y4
AA3
AA5
600
C742
2.2u
0.1u
C744
2.2u
Voltage Level Check!!!
C618
0.47u
C741
C743
C617
0.1u
0.1u
VSEL_1.8V
FB743 600
VSEL_1.8V
C635
C636
C637
C639
0.1u
220n
0.1u
VDDS_DV_GPMC
VDDS_DV_FREF
0.1u
A4
A6
A9
A11
B2
B13
D1
D14
H1
H2
H6
H7
H8
H9
H10
H11
H12
H13
H14
J1
J7
J8
J9
J10
J11
J12
J13
J14
K1
K3
Added (Rev.E)
VDDS_SDMMC1_0
VDDS_SDMMC1_1
G20
C644
0.1u
C646
0.1u
C648
0.1u
C651
0.1u
W7
VSEL_1.8V
H7
G7
VPMIC_VMMC
G16
VDDA_DSI1
VDDA_DSI2
VDDS_DV_SDMMC2_0
H16
VDDS_DV_SDMMC2_1
VDDA_CSI21
VDDA_CSI22
VDDS_1P2
VDDS_DV_CAM
VDDA_HDMI_VDAC_0
VDDA_HDMI_VDAC_1
VDDS_SIM
AA16
VSEL_1.29V
V22
J7
VSEL_1.8V
G22
VDDA_DPLL_CORE_AUDIO
VSEL_VCORE3
VDDA_DLL0_LPDDR21
G9
VDDA_DLL1_LPDDR21
M7
VDDA_DLL0_LPDDR22
AB10
VDDA_DLL1_LPDDR22
VDDA_DPLL_MPU
VDDA_DPLL_IVA_PER
VDDA_LDO_SRAM_CORE
VDDA_LDO_EMU_WKUP
VDDA_LDO_SRAM_IVA_AUDIO
VDDA_LDO_SRAM_MPU
CAP_VBB_LDO_IVA_AUDIO
CAP_VDD_LDO_SRAM_IVA_AUDIO
CAP_VBB_LDO_MPU
CAP_VDD_LDO_SRAM_MPU
CAP_VDD_LDO_SRAM_CORE
CAP_VDD_LDO_EMU_WKUP
VDDA_UNI
VDDA_USBA0OTG_1P8V
VDDA_USBA0OTG_3P3V
PBIAS_SDMMC1
PBIAS_SIM
POP_VDD1_LPDDR21_A15
POP_VDD1_LPDDR21_C28
POP_VDD1_LPDDR21_AJ15
POP_VDD1_LPDDR22_N2
POP_VDD1_LPDDR22_R1
POP_VDD1_LPDDR22_P29
POP_VDD1_LPDDR2_SHARED_C1
POP_VDD1_LPDDR2_SHARED_AH2
POP_VDD1_LPDDR2_SHARED_AH28
VDDA_BDGP_VBB
A1
A2
AB12
C654
C659
1u
C660
C645
0.1u
0.1u
1u
C665
C656
0.1u
1u
C662
C655
0.1u
1u
C661
1u
AG28
RSVD1
RSVD2
RSVD3
RSVD4
RSVD5
RSVD6
RSVD7
RSVD8
RSVD9
LPDDR21_NCS0
NC1
NC2
NC3
NC4
NC5
NC6
NC7
NC8
NC9
NC74
NC75
NC76
NC77
NC78
NC79
NC144
NC81
NC82
NC83
NC84
NC85
NC86
RESET
NC153
NC150
NC148
NC91
NC92
NC93
NC94
NC95
NC96
NC97
NC98
NC99
NC100
NC101
NC102
NC103
NC104
NC105
NC106
NC107
NC108
NC109
NC110
NC111
NC112
NC113
NC114
NC115
NC116
NC117
NC118
NC119
NC120
NC121
NC122
NC123
NC142
NC125
NC126
NC127
NC128
NC129
NC130
NC131
NC132
NC133
NC134
NC135
NC136
NC137
NC138
NC139
DAT0
DAT1
DAT2
DAT3
DAT4
DAT5
DAT6
DAT7
CLK
CMD
VDDI
VCC1
VCC2
VCC3
VCC4
VSS1
VSS2
VSS3
VSS4
VSSQ1
VSSQ2
VSSQ3
VSSQ4
VSSQ5
VCCQ1
VCCQ2
VCCQ3
VCCQ4
VCCQ5
U721
SDIN5C2-8G-974D
NC1
NC2
NC3
NC4
NC5
NC6
NC7
NC8
NC9
NC10
NC146
NC147
NC13
NC14
NC15
NC16
NC17
NC18
NC19
NC20
NC21
NC22
NC23
NC24
NC25
NC26
NC27
NC28
NC29
NC30
R12
R13
R14
T1
T2
T3
T5
T12
T13
T14
U1
U2
U3
U5
U6
U7
U10
U12
U13
U14
V1
V2
V3
V12
V13
V14
W1
W2
W3
W7
W8
W9
W10
W11
W12
W13
W14
Y1
Y3
Y6
Y7
Y8
Y9
Y10
Y11
Y12
Y13
Y14
AA1
AA2
AA7
AA8
AA9
AA10
AA11
AA12
AA13
AA14
AE1
AE14
AG2
AG13
AH4
AH6
AH9
AH11
SYS_nRESWARM
VPMIC_OMAP_VPP_CUST
PoP LPDDR2
J8
VSENSE
AH27
IFORCE
NC140
VSEL_1.8V
VPP_CUST
Y22
VPP_STD
POP_VDD2_LPDDR21_A16
POP_VDD2_LPDDR21_B16
POP_VDD2_LPDDR21_AH15
POP_VDD2_LPDDR22_P28
POP_VDD2_LPDDR22_T1
POP_VDD2_LPDDR22_T2
POP_VDD2_LPDDR2_SHARED_A3
POP_VDD2_LPDDR2_SHARED_C29
POP_VDD2_LPDDR2_SHARED_AG28
POP_VDD2_LPDDR2_SHARED_AH3
VDDCA_VREF_LPDDR21
VDDCA_VREF_LPDDR22
VDDQ_VREF_LPDDR21
VDDQ_VREF_LPDDR22
POP_LPDDR21_ZQ_AJ17
POP_LPDDR22_ZQ_AG29
R21
N21
AB13
AB11
U22
T7
K2
0.1u
VPMIC_VAUX1
C671
0.1u
4Gb
C4
C5
C6
D3
D4
D5
D6
L22
N7
U701
1
Fiducial1
AH28
A28
B1
B28
T21
K21
K22
M27
N27
H15
Screw
Shield Can Clip (Top) Shield Can
SC791
1
SC793
1
SC795
1
LGE Internal Use Only
L4
R721
SDMMC2_DAT[0]
SDMMC2_DAT[1]
SDMMC2_DAT[2]
SDMMC2_DAT[3]
SDMMC2_DAT[4]
SDMMC2_DAT[5]
SDMMC2_DAT[6]
SDMMC2_DAT[7]
T28
AA22
AA21
AB22
AB28
AD28
AH18
AH20
AH25
AB21
AB16
AB20
AB8
AB19
AB18
AA7
AB17
AA14
R734
Changed (P925 Rev.A)
G17
VDDS_1P8_FREF
POP_VACC_LPDDR2_B28
POP_VACC_LPDDR2_B2
1u
VDDS_DV_C2C_0
G18
VDDS_DV_C2C_1
G19
VDDS_DV_C2C_2
OMAP4430
R15
R16
R17
T12
T13
T14
T15
T16
T17
U2
U8
U12
U13
U14
U15
U16
U17
U21
U28
Y25
Y26
AA11
AA12
AA20
K8
AB1
AE27
AF2
AG4
AG17
AG26
AH8
AH10
AH13
AH21
1%
VDD_MPU_0
VDD_MPU_1
VDD_MPU_2
VDD_MPU_3
VDD_MPU_4
VDD_MPU_5
VDD_MPU_6
VDD_MPU_7
VDD_MPU_8
eMMC 8GB
VSEL_1.8V
C605
0.1u
NC149
NC32
NC33
NC34
NC35
NC36
NC37
NC38
NC39
NC40
NC41
NC42
NC43
NC44
NC45
NC46
NC47
NC48
NC151
NC152
NC154
NC145
NC53
NC54
NC55
NC56
NC57
NC58
NC141
NC60
NC61
NC62
NC63
NC64
NC155
NC143
NC67
NC68
NC69
NC70
NC71
NC72
NC156
Added (P925 Rev.A)
C603
0.1u
K5
K7
K8
K9
K10
K11
K12
K13
K14
L1
L2
L3
L12
L13
L14
M1
M2
M3
M5
M8
M9
M10
M12
M13
M14
N1
N2
N3
N10
N12
N13
N14
P1
P2
P3
P10
P12
P13
P14
R1
R2
R3
R5
VCORE1_OMAP_MPU
C602
0.1u
R733
0.1u
C601
0.1u
R732
0.1u
C600
R731
0.1u
VSSA_CSI2
0.1u
VSSA_DSI_0
VSSA_DSI_1
0.1u
A4
A6
A9
A12
A17
A22
A25
D1
E28
G1
G8
G21
H8
H9
H20
H21
J28
M8
L7
L28
L8
U1
Y1
AA8
AA9
AB9
AC1
AF1
AH4
AH9
AH12
R22
0.1u
VDD_CORE_0
VDD_CORE_1
VDD_CORE_2
VDD_CORE_3
VDD_CORE_4
VDD_CORE_5
VDD_CORE_6
VDD_CORE_7
VDD_CORE_8
VDD_CORE_9
VDD_CORE_10
VDD_CORE_11
VDD_CORE_12
VDD_CORE_13
VDD_CORE_14
VDD_CORE_15
VDD_CORE_16
VDD_CORE_17
VDD_CORE_18
VDD_CORE_19
VDD_CORE_20
VDD_CORE_21
VDD_CORE_22
VDD_CORE_23
VDD_CORE_24
VDD_CORE_25
VDD_CORE_26
VDD_CORE_27
VDD_CORE_28
VSSA_HDMI_VDAC
1u
H12
H18
J9
J10
J11
J12
J13
J15
J16
J17
J18
J19
J20
K9
K20
L9
L20
M9
M20
N20
R20
T20
U20
Y11
Y12
Y13
AA13
T9
V20
VSSA_UNI
C614
VDDQ_LPDDR2_0
VDDQ_LPDDR2_1
VDDQ_LPDDR2_2
VDDQ_LPDDR2_3
VDDQ_LPDDR2_4
VDDQ_LPDDR2_5
VDDQ_LPDDR2_6
VDDQ_LPDDR2_7
VDDQ_LPDDR2_8
VDDQ_LPDDR2_9
VDDQ_LPDDR2_10
VDDQ_LPDDR2_11
VDDQ_LPDDR2_12
VDDQ_LPDDR2_13
VDDQ_LPDDR2_14
VDDQ_LPDDR2_15
VDDQ_LPDDR2_16
VDDQ_LPDDR2_17
VDDQ_LPDDR2_18
VDDQ_LPDDR2_19
VDDQ_LPDDR2_20
VDDQ_LPDDR2_21
VDDQ_LPDDR2_22
VDDQ_LPDDR2_23
VDDQ_LPDDR2_24
VDDQ_LPDDR2_25
VDDQ_LPDDR2_26
VDDQ_LPDDR2_27
VDDQ_LPDDR2_28
VDDQ_LPDDR2_29
VDDQ_LPDDR2_30
P8
N8
C613
G11
C612
VSSA_USBA0OTG
VSSA_USBA0OTG_3P3V
C611
H10
G10
C610
M22
C609
VSS_48
VSS_49
VSS_50
VSS_51
VSS_52
VSS_53
VSS_54
VSS_55
VSS_56
VSS_57
VSS_58
VSS_59
VSS_60
VSS_61
VSS_62
VSS_63
VSS_64
VSS_65
VSS_66
VSS_67
VSS_68
VSS_69
VSS_70
VSS_71
VSS_72
VSS_73
VSS_74
VSS_75
VSS_76
VSS_77
VSS_78
VSS_79
VSS_80
VSS_81
VSS_82
C607
VSS_0
VSS_1
VSS_2
VSS_3
VSS_4
VSS_5
VSS_6
VSS_7
VSS_8
VSS_9
VSS_10
VSS_11
VSS_12
VSS_13
VSS_14
VSS_15
VSS_16
VSS_17
VSS_18
VSS_19
VSS_20
VSS_21
VSS_22
VSS_23
VSS_24
VSS_25
VSS_26
VSS_27
VSS_28
VSS_29
VSS_30
VSS_31
VSS_32
VSS_33
VSS_34
VSS_35
VSS_36
VSS_37
VSS_38
VSS_39
VSS_40
VSS_41
VSS_42
VSS_43
VSS_44
VSS_45
VSS_46
VSS_47
A10
A20
A23
B3
B6
B13
B27
C2
F2
F25
H1
H11
H17
H19
H28
J3
J4
J21
K2
K28
N9
L21
L25
L26
M1
Y17
M13
M14
M15
M16
M17
M21
H13
N12
N13
N14
N15
N16
N17
P12
P13
P14
P15
P16
P17
R12
R13
R14
VSEL_1.29V
VSEL_VCORE3
- 155 -
SC792
Top
OJ701
OJ702
OJ703
OJ704
Bottom
1
SC794
1
SC797
1
SC798
1
SC799
1
SC796
1
Copyright (C) 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. CIRCUIT DIAGRAM
PCB VERSION CHECK
VPMIC_VRTC
SMPL DETECTION
0.113V
0.429V
B
1.8V
1.8V
0.720V
150K
130K
1.8V
Rev.B
0.561V
100K
D
R2
1%
68K
150K
0.836V
E
150K
180K
1.8V
0.982V
Rev.1.0
150K
240K
1.8V
1.108V
Rev.1.1
150K
330K
1.8V
# VBAT LINE WIDTH (STAR Connection)
GSM PA : 2mm - & gt; WCDMA PA 1mm
TWL6030 : 1.5mm
BOOT3
BOOT2
BOOT1
BOOT0
1.238V
10K
R809
330k
150K
C
PCB_VER_ADC
Changed ( Rev 1.0)
Added (P925 Rev.B)
VSEL_1.8V
Q801
NTUD3169CZ
4
R801
10K
5
6
S2
D2
G2
G1
PMB9801 : 1mm
CHARGER : 1mm
VBAT
VBAT
Deleted (Rev.B)
VBAT
VSEL_1.8V
CN800
3
C800
C801
C802
C803
C804
C805
100p
(0603)
10n
(0603)
10p
(0603)
6p
(0603)
3p
(0603)
100u
ZD803
D1
2
D2
2
BATT_THM_ADC
CELL
VDD
ALRT
D1
S1
Changed
(P925 Rev.A, Rev.E)
6
EAG62832401
1
QSTRT
4
C892
1u
SDA
GND
SCL
VBAT
K16
K15
G16
J16
J15
H16
H15
T10
R10
R13
T11
R11
T12
R12
C838
C839
C840
C834
C835
C836
2.2u
2.2u
2.2u
2.2u
2.2u
2.2u
2.2u
2
VIN
GND1
4
VBAT
FB801
C810
1u
120
C811
1u
IEOC
(1%)
560
(1%)
10u
PGB
CHGSB
LDO
5
C813
BATT
ISET
3
GND2
DNI
DNI
FUEL_SDA
FUEL_SCL
I2C1_SDA
I2C1_SCL
EN_SET
10
9
8
CHG_STATUS/
7
6
CHG_EN_SET/
C809
C814
L801 0.47u
4.7u
560 ohm- & gt; (910mA) 2K(10%)- & gt; 91mA
780 ohm- & gt; (680mA)
820 ohm- & gt; (646mA)
VBAT
C815
10u
FB802
FB803
220
FB804
GND pad on the bottom of chip has to be connected to main GND trace
through many vias for heat emission.
120
120
VSEL_VCORE3
C817
L802 0.47u
4.7u
VBAT
C818
10u
C819
VSEL_1.8V
L803
C821
4.7u
10u
MICRO USB CONN. + MUIC
0.68u
VBAT
VSEL_2.1V
C825
VCHG
C824
L804 0.47u
VBAT
10u
FB805
10u
GND1 GND2
C822
C823
0.1u
PSD12-LF
VBAT
1mm
Changed (P925 Rev.A)
1u
D5
8
VBUS1
D- 2
USB_DM
USB_DP
USB_ID
D+3
ID 4
VBAT
90ohm matching !!
C5
B5
B4
GND5
FB806
120
9
10
VSEL_VMEM
L806 0.47u
C831
OUT
ZD801
6
L805 0.47u
C828
IN
CN801
120
7
VSEL_1.29V
FL800
NFM18PC104R1C3
Changed (Rev.C)
4.7u
11
ZD802
R848
2.2K B1
ESD9B5_0ST5G
D1
GU077-5P-SD-E1500
Added (Rev.B)
C827
C4
1u
10u
C3
Changed (Rev.E,1.1)
0.05mm
BAT
COMN1
DN1
COMP2
UID
DP2
U811
U1
MAX14526EEWP+TCC6
U2
RES
MIC
CAP
AUD1
AUD2
GND
IC
ISET
D2
100n
A4
A5
USB_DM_OMAP
USB_DP_OMAP
90ohm matching !!
B3
UART_RX
UART_TX
A3
A1
VSEL_1.8V
D4
D3
A2
R850
56K
R853
1.5K
R854
1.5K
Added (P925 Rev.A)
MUIC_INT/
C890
2.2u
DP3T SWITCH
BAT800
311HR-VG1
U851
FSUSB63
VPMIC_VMMC
VPMIC_VDAC
VPMIC_VCXIO
UART_TX
1
HSD1+
D+
HSD2+
C841
C842
TWL_LDO_1.8V
HSD3+
1u
2.2u
TWL_LDO_2.8V
HSD1-
VBAT
VPMIC_VAUX1
UART_RX
2
12
TWL_LDO_3.0V
3
C844
C845
C848
C849
C850
C851
C852
C853
C854
C855
1u
2.2u
1u
1u
1u
2.2u
1u
2.2u
1u
1u
4
C820
VB
I2C3_SCL
I2C3_SDA
Added (Rev.E)
VPMIC_OMAP_VPP_CUST
2
Removed Res.
(Rev.C)
VCORE2_OMAP_IVAUD
VPMIC_VRTC
VSEL_2.1V
VSEL_1.8V
TP809
1u
SCL
C16
C15
F16
D16
D15
E16
E15
1
4.7u
0.68u
VPMIC_VUSB
C837
0
R821
10K
(0603)
11
SDA
T13
T14
R14
L15
N16
P16
P15
M16
L16
M15
C808
VCORE1_OMAP_MPU
L800
PGND
INT
K1
K2
G1
J1
J2
H1
H2
U801
RT9524
C2
T7
R7
R4
T6
R6
T5
R5
1mm
B2
VRTC
D7
K4
VPP
VMMC
J13
VDAC
VCXIO
G15
F15
VAUX2
VAUX1
VAUX3
R9
T9
T8
2.2u
N9
G13
B9
L4
Changed (Rev.E)
C832
VRTC_IN
VANA_IN
VPP_IN
C833
10p
OSC32KOUT
OSC32KCAP
D11
D10
J4
C830
10p
OSC32KIN
VDD_B1
VDD_B2
VDD_B3
VDD_B4
1
2
A8
E8
VMEM_IN_B1
VMEM_IN_B2
VMEM_FDBK
VMEM_SW_B1
VMEM_SW_B2
VMEM_GND_B1
VMEM_GND_B2
CLK32KG
VANA
A10
X800
FC-135
32.768KHz
CLK32KAO
VUSIM
J10
CLK32KAUDIO
B8
CLK32K_GATE
V1V29_IN_B1
V1V29_IN_B2
V1V29_FDBK
V1V29_SW_B1
V1V29_SW_B2
V1V29_GND_B1
V1V29_GND_B2
B10
E9
H10
CHRG_PMID_B1
CHRG_PMID_B2
CHRG_PMID_B3
CHRG_PMID_B4
CHRG_VREF
CHRG_PGND_B1
CHRG_PGND_B2
CHRG_PGND_B3
CHRG_PGND_B4
CLK32K_AUD
CLK32K_MAIN
V2V1_IN_B1
V2V1_IN_B2
V2V1_FDBK
V2V1_SW_B1
V2V1_SW_B2
V2V1_GND_B1
V2V1_GND_B2
CHRG_CSOUT
CHRG_AUXPWR
A5
A6
B6
B5
E1
F1
E2
F2
F5
CHRG_BOOT
CHRG_CSIN
GND_DIG_VIO
GND_DIG_VRTC
D4
E6
V1V8_IN_B1
V1V8_IN_B2
V1V8_IN_B3
V1V8_FDBK
V1V8_SW_B1
V1V8_SW_B2
V1V8_SW_B3
V1V8_GND_B1
V1V8_GND_B2
V1V8_GND_B3
CHRG_SW_B1
CHRG_SW_B2
CHRG_SW_B3
CHRG_SW_B4
M8
G4
G2
E4
VCORE3_IN_B1
VCORE3_IN_B2
VCORE3_FDBK
VCORE3_SW_B1
VCORE3_SW_B2
VCORE3_GND_B1
VCORE3_GND_B2
U800
TWL6030
GND_ANA_B1
GND_ANA_B2
GND_ANA_B3
GND_ANA_B4
GND_ANA_B5
GND_ANA_B6
GND_ANA_B7
A3
A4
B4
B3
CHRG_EXTCHRG_ENZ
VAC
CHRG_DET_N
CHRG_EXTCHRG_STATZ
CHRG_LED_TEST
CHRG_LED_IN
N8
M10
E11
L13
D9
H4
G7
J7
F4
E5
H7
D5
D6
ID
VBUS_B1
VBUS_B2
VBUS_B3
VBUS_B4
VAUX1_IN
VAUX2_IN
VAUX3_IN
VMMC_IN1
VMMC_IN2
VUSIM_IN1
VUSIM_IN2
VCXIO_IN
VDAC_IN
VIO
VBAT
4.7u
R895
VSEL_1.8V
VBAT
1mm
C1
VCORE2_IN_B1
VCORE2_IN_B2
VCORE2_FDBK
VCORE2_SW_B1
VCORE2_SW_B2
VCORE2_GND_B1
VCORE2_GND_B2
REFGND_B1
REFGND_B2
VCHG
R827
IREF
VCHG
USB_VBUS
R828
2Kohms
VBG
N7
N10
R8
J12
K13
D8
B7
F13
H13
M9
B13
C816
7
Changed (Rev.E, 1.1)
220
C 826
PBKG_B51
PBKG_B53
FB800
4.7u
VPROG
T4
T3
R3
L2
N1
P1
P2
M1
L1
M2
0.15mm
C829
K12
D12
B11
B14
A13
B12
A14
B15
A11
A12
GPADC_IN0
GPADC_IN1
GPADC_IN2
GPADC_IN3
GPADC_IN4
GPADC_IN5
GPADC_IN6
GPADC_VREF1
GPADC_VREF4
GPADC_START
D13
GGAUGE_RESN
E13
GGAUGE_RESP
PREQ3
PREQ2C
PREQ2B
PREQ2A
PREQ1
N6
M7
K8
K9
J9
N5
M5
K7
J5
L5
K5
M11
M12
N15
M6
H9
G9
G8
H8
L12
NRESPWRON
NRESWARM
REGEN1
REGEN2
PWRON
RPWRON
PWM1
PWM2
PWMFORCE
SYSEN
BOOT3
BOOT2
BOOT1
BOOT0
BATREMOVAL
N13
K10
INT
SRI2C_SDA
M13
SRI2C_SCL
N4
CTLI2C_SDA
M4
CTLI2C_SCL
VCORE1_IN_B1
VCORE1_IN_B2
VCORE1_IN_B3
VCORE1_FDBK
VCORE1_SW_B1
VCORE1_SW_B2
VCORE1_SW_B3
VCORE1_GND_B1
VCORE1_GND_B2
VCORE1_GND_B3
USB_VBUS
E12
C1
D1
C2
D2
USB_VBUS
VBAT
4.7u
A9
F12
CHARGER IC
Rev.B
VBACKUP
H12
C858
0
Removed HOOK_ADC (Rev.C)
VUSB
G12
1M
BATT_THM_ADC
PCB_VER_ADC
E10
R830
R894
R896
CTG
8
Added (Rev.1.1)
A7
C812 0.1u
FUEL_INT/
10n
1u
SYS_PWRREQ
Removed BAT_REMOVAL (Rev.C)
BOOT3
BOOT2
BOOT1
BOOT0
PWR_ON_SW
SYS_nIRQ1
SYS_nRESWARM
SENSOR_LDO_EN
SRI2C_SDA
SRI2C_SCL
SYS_DRM_MSEC
I2C1_SDA
I2C1_SCL
MICROSD_DET/
D NI
R818
A16
B16
SIM
M MC
TESTEN
TESTV
MSECURE
N12
N11
J8
A15
N2
B1
A2
A1
R16
T15
T16
H5
R1
T2
T1
PBKG_B43
PBKG_B42
PBKG_B41
PBKG_B33
PBKG_B32
PBKG_B31
PBKG_B2
PBKG_B13
PBKG_B12
PBKG_B11
Rev.C
5
C891
C807
0.47u
VSEL_1.8V
G10
3
R897
SYS_nRESPWRON
1
VA800
R893
150
U891 MAX17043G
Sensing node
1
PSD05-LF
Rev.B
Changed (P925 Rev.A)
R892
100K
R891
150
R811
80.6K
(1%)
3
R802
10K
2
Close to batt. connector
PGND
1.8V
FUEL GAUGE
9
1.8V
47K
10K
10K
150K
10 K
150K
A
BATTERY CONNECTOR
(Sudden Momentary Power Loss)
R800
ADC
10K
VDD
EVB
R1
1%
R2
R808
R804
150K
R1
R803
REV
R805
# PCB Revision Check ADC
ICVL0505101V150FR
VSEL_1.8V
HSD2D-
HSD3-
VCC
SEL1
GND
SEL0
6
8
10
5
7
9
11
4
UART4_TX_OMAP
UART_TX_SW
USB_D+_IFX
UART4_RX_OMAP
UART_RX_SW
USB_D-_IFX
UART_SW2
UART_SW1
Changed (Rev.C)
3
1
C846
1u
Changed (Rev.E)
LGE Internal Use Only
- 156 -
Copyright (C) 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. CIRCUIT DIAGRAM
GYRO SENSOR
AUDIO CODEC (TWL6040)
MOTION SENSOR
SENSOR_3.0V
VBAT
VSEL_1.8V
Added (P925 Rev.A)
VSEL_2.1V
IME_DA
C965
C934
C933 C932
0.1u
0.1u
2.2u
220n
2.2u
2.2u
100n
0.1u
C904
Removed (Rev.C)
Open/ground switch input
EAR_SENSE
HOOK_ADC
4.7u
C905
4.7u
L6
K6
L5
G5
E1
Microphone input
K2
A1
L1
A11
L11
AUD_CLK_IN
K7
CLK32K_AUD
H7
AUDPWRON
NRESPWRON
NAUDINT
GPO1
GPO2
GPO3
REFN
REFP
REF
PLUGDET
ACCONN
U901
TWL6040
HSL
SD A
15
16
13
VDD
17
14
NC5
NC8
N C6
NC7
GND
18
IME_DA
N C4
IME_DA
EAR_L
EAR_R
HFRN1
HFLP2
HFLN2
HFRP2
HFRN2
B4
B5
A9
A8
MCLK
CLK32K
PBKG1
PBKG2
PBKG3
PBKG4
PBKG5
DNC3
8
R973
DNI
7
MOTION_INT
6
C973
1u
SENSOR_3.0V
FB914
120
FB913
120
AUD_SPK_P
AUD_SPK_N
C913
SENSOR LDO
C978
C914
1n
1n
1u
C1
VIBLP
D3
VIBLN
A2
VIBRP
B1
VIBRN
GND
INT
Digital Compass Movee to MAIN (P925 Rev.B)
A4
HFLP1
A5
HFLN1
stereo speaker 1 B9
HFRP
filterless class-D outputs with B8
1.5W
KXTF9
9
Digital Compass Sensor
G3
AUXLP
F3
AUXLN
G4
AUXRP
stereo line outputs F4
AUXRN
ATEST
DTEST1
DTEST2
DTEST3
PROG
NC1
NC2
NC3
NC4
AUD_RCV_P
AUD_RCV_N
J11
stereo headphoneHSR K11
DNC2
DNC4
0.1u
0.1u
FM_AUDIO_R
FM_AUDIO_L
SCL
U971
DNC1
IME_CL
0.1u
B10
C11
earpiece
EARN
a differential class-AB driver
with 2 Vrms capability to a typical 32Ohm
0.1u
IO_VDD
SENSOR_3.0V
C962
C972
HS_MICBIAS
HS_MIC
VSEL_1.8V
6
0.1u
C915
5
C916
EARP
E6
E7
F8
G7
G8
D5
D6
D7
E5
F2
AFMR
AFML
a stereo line-input F1
C963
MMIC_N
SMIC_P
SMIC_N
1u
Removed (Rev.C)
4
COMPASS_INT
F5
F6
F7
E4
K10
5
VSEL_1.8V
U975
AMI306
C975
1
D4
B6
B7
0.1u
0
7
SENSOR_3.0V
VBAT
AVDD
D8
J9
E8
SDA
SCL
C917
R919
HBIAS
2.1V
H1
25
4
8
INT
DVDD
10
SDA
ADDR
9
Added (Rev.1.0)
1
C976
DRDY
AUD_PWRON
SYS_nRESPWRON
SYS_nIRQ2
HMICP
H2
HMICN
0.1u
J3
PDMDN DOWNLINK
PDMUP UPLINK
PDMCLK
PDMCLKLB
PDMFRAME
ICVS0318150FR
VA903
9
10n
2
SENSOR_LDO_EN
3
8
H6
G6
0.1u
C918
0
2
TP904
C919
R921
3
10
VLOGIC
IME_CL
NC9
2
0.1u
11
AD0
MPU3050A
SDA
GND
TP903
0.1u
SCL
C971
GYRO_INT
12
REGOUT
SCL
TP902
0.1u
C920
24
U961
CLKOUT
7
TP901
I2C1_SDA
I2C1_SCL
0.1u
C921
23
Added (P925 Rev.A)
FSYNC
3
K9
L8
L10
K8
H8
C922
22
I2C4_SCL
I2C4_SDA
MMIC_P
INT
RESV2
VREG
PDM_DL_DATA
PDM_UL_DATA
ABE_CLKS
PDM_CLK
PDM_FRAME
4.7u
ICVS0318150FR
VA902
1
VSEL_1.8V
CPOUT
VPP
4.7u
C903
Added (P925 Rev.A)
X
X
21
RESV1
6
C902
GNDREF
GNDHS
GNDAMIC
GNDDMIC
GNDLDO1
GNDLDO2
GNDVCM
GNDNCP1
GNDNCP2
GNDHFL1
GNDHFL2
GNDHFL3
GNDHFR1
GNDHFR2
GNDHFR3
GNDDIG
GNDVIBR
GNDVIBL
GNDIO
4.7u
J5
L4
K3
K1
J2
J4
H4
19
VA901
1u
DBIAS1
DBIAS2
MBIAS
2.1V
MMICP
MMICN
SMICP
SMICN
2.2n
20
4
I2C4_SDA
I2C4_SCL
K5
H9
H3
L3
E3
D9
J1
F10
G10
C5
C4
C6
C7
C8
C9
J6
B3
D2
J8
C901
VDDREGNCP
NCPOUT1
NCPOUT2
NCPFB
CFLYP
CFLYN
VDDVREF
VDDEAR
VDDHS
VDDUL
VDDDL
VDDPLL
VDDHFL1
VDDHFL2
VDDHFR1
VDDHFR2
VDDVIBL
VDDVIBR
VDDAMBIAS
VDDDMBIAS
VDDVIO
VSSEAR
VSSHS
VSSUL
VSSDL
VSSPLL
VDDV2V1
VDDLDO
VSSLDOIN
VSSLDO
H11
E10
E11
G9
G11
F11
N C5
N C6
N C7
N C8
N C9
FB901 120
C961
NC1
C923
R902
1.5K
CLKIN
2.2u
R901
1.5K
MICBIAS
NC 3
C924
Added (P925 Rev.A)
NC2
0.1u
4
0.47u
H5
B11
J10
G2
E9
J7
A3
A6
A7
A10
C2
B2
L2
K4
L9
C10
H10
G1
F9
L7
E2
D1
D11
D10
100n
2.2u
C925
C941
3
C927
120
0.1u
C926
FB941
470n
C928
VSEL_1.8V
2
C940
VBAT
VSEL_2.1V
IME_CL
0.1u
1
0.1u
ICVS0318150FR
0.1u
0.1u
VSEL_1.8V
C931 C930 C929
10
C935
VDD
C936
5
C937
C991
U991
RT9032AGQW
VIN
VOUT1
EN1
VOUT2
P2
P1
PGND
C938
9
C939
GND
EN2
PROXI_3.0V
8
7
6
5
PROXI_LDO_EN
C992
C993
1u
1u
1u
MOTOR DRIVER
Added (Rev.B)
Added (P925 Rev.A)
TWL_LDO_3.0V
TP905
R982
DNI
U981
ISA1000
EN
VDP
PWM
GND
MODE
VDD
GAIN
VDN
NC3
R981
100K
4
L989
82n
L988
8
82n
VIB_L_P
7
6
5
VIB_L_N
NC1
3
NC2
2
EUSY0238306
9
1
11
Changed (P925 Rev.A)
0
10
R987
VIBE_EN
VIBE_PWM
C986
2.2u
3.9n
R986
C987
470K
Changed (P925 Rev.A)
LGE Internal Use Only
- 157 -
Copyright (C) 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. CIRCUIT DIAGRAM
LCD Power
EN1
VOUT2
2
3
P2
4
P1
VSEL_1.8V VBAT
3D LCD CONNECTOR
7
6
GND
5
C1102
Rev.B
C1103
1u
EN2
9
1u
PGND
C1101
8
VOUT1
1u
D1122
L1121 10u
LED_A
1u
R1103
1.5K
C3
IN
D1
R1101
100K
Changed (P925 Rev.A)
VIO
B2
I2C2_SCL
I2C2_SDA
SCL
C2
Added Res. (Rev.B)
SW
R1102
1.5K
LCD_EN
C1122
D2
C1121
SDA
B1
MAIN
SUB/FB
HWEN/PGEN/GPIO
SET
1u
A1
A2
LED_C1
LED_C2
LCD_CP_EN
A3
C1
B3
R1125
12K
D3
GPIO1
OVP
U1121
LM3528
1.8V_LCD_IOVCC
12V_3D_LCD
2.8V_3D_LCD
R1126
100K
Changed (P925 Rev.A)
CN1141
24-5804-030-000-829+
C1141
30
C1107
22
VBAT
1u
OE_
FB
GND
SS
Exposed_GND
5
510K
0.1u
1u
Changed (P925 Rev.A)
3D_LCD_BANK_SEL_1
TOP FPCB Connector
KEY FPCB Connector
(0.9T, 20 Pin)
Changed Pin map (Rev.B)
KEY_C[1] - KEY_R[1] : Hot Key
Changed Pin map (Rev.D)
VSEL_1.8V
MICBIAS
SMIC_N
29
24
23
20
18
12
22
Rev.D
P925 Rev.B
Rev.E
FB1177
P4
13
FB1175
1800
21
14
FB1176
1800
20
15
4
19
16
17
P6
P2
C1175
1
2
C1176
0.1u
R1178
33p
12
C1171 1n
P3
P2
C1178
AUD_SPK_P
P4
3
4
C1172
L1172
DNI
DNI
470p
10u
Changed Pin map (Rev.B)
Changed (P925 Rev.B)
VSEL_1.8V
Volumm Key
Added (Rev.B)
Q1173
R1173 1M
D1175
VSMF05LCC
2
1
R1172
Changed (P925 Rev.A)
AUD_SPK_N
C1179
FM_ANT
ICMEF112P900M
10
VIB_L_N
Changed (Rev.1.0)
1800
P5 5
P1
9
MMIC_N
HS_MICBIAS
2.2K
10K
8
VIB_L_P
Added (925 Rev.D)
ZD1172
S
G
D
2SJ347
R1174
200K
DNI
Added (Rev.E)
CN1191
SIDEKEY_4P
EAR_SENSE
3
PWR On Key
1
KEY_C[0]
KEY_R[0]
KEY_R[1]
2
3
4
CN1195
1
R1195
2
1K
ZD1195
Added (Rev.E)
- 158 -
ESD9B5_0ST5G
PWR_ON_SW
ZD1191
Added (Rev.D)
LGE Internal Use Only
13
MMIC_P
HOOK_ADC
HS_MIC
1800
C1177
R1176
0.1u
ICMEF112P900M
6
VT_0.3M_MIPI_DATA0_N
VT_0.3M_MIPI_DATA0_P
EAR_R
EAR_L
7
KEY_R[1]
FB1173
FL1172
TOUCH_RESET
19
17
23
3
18
P3
P6
16
2
P1
6
21
15
VBAT
22
14
1
6
13
FLASH_EN
FL1171
VT_0.3M_MIPI_CLK_N
VT_0.3M_MIPI_CLK_P
4
25
GSM_TXON_IND Rev.B, Rev.D
PWR_ON_SW
UART_RX_IFX
UART_TX_IFX
TOUCH_INT_N
I2C2_SDA
I2C2_SCL
6
14
MICBIAS
HS_MIC|HOOK_ADC
AUD_RCV_P
AUD_RCV_N
3
26
12
11
5
27
11
10
24
2
28
10
25
5
KEY_C[1]
R1187
100K
1
29
USIM_RESET/
USIM_CLK
USIM_DATA
1
ESD9B5_0ST5G
30
9
9
FRONT_KEY_LED_EN
4
11
8
26
Q1186
UMT2222A
3
17
16
3
2
7
27
R1186 4.7K
6
28
I2C3_SCL
I2C3_SDA
VT_CAM_PWDN
VT_CAM_RESET/
VT_0.3M_MCLK
P5 5
31
8
MICROSD_DAT0
MICROSD_DAT1
MICROSD_DAT2
MICROSD_DAT3
MICROSD_CMD
MICROSD_DET/
MICROSD_COVER_DET/
32
7
5
PROX_INT
33
6
4
SMIC_P
34
5
3
31
1u
2
32
FB1174 120
R1171
4.7K
SENSOR_3.0V
4
33
27p
30
VSIM_2.9V
C1173
1
2
18
PROXI_3.0V
1
19
15
34
20
TWL_LDO_2.8V
CN1171
24-5804-034-000-829+
C1174
MICROSD_CLK
CN1181
24-5804-020-000-829+
TWL_LDO_1.8V
CN1161
24-5804-034-000-829+
VBAT
SENSOR_3.0V
VSEL_1.8V
(0.9T, 34 Pin)
3
2
1
C1137
4
SUB FPCB Connector
2
1u
Added (Rev.B)
Removeed VA1101, VA1103 (Rev.C)
R1136
1
(0.9T, 40 Pin)
1
FB1143 600
C1143
6
Rmoved (Rev.E)
VSEL_1.8V VPMIC_VMMC
VA1104
ICMEF214P101M
7
11
LED_C1
LED_C2
LED_A
ICVS0318150FR
0.1u
VA1102
12V_3D_LCD
C1138
8
ESD9B5_0ST5G
B
GND
EN
10
ZD1182
A
OUT
C1134
200K
CP2
9
15
ESD9B5_0ST5G
VCCB
VO
ZD1181
VCCA
R1134
SW
CP1
14
2.8V_LCD_VCC
2.8V_LCD_VCI
ESD9B5_0ST5G
3
6
R1133
51K
U1108
NLSV1T244MUTBG
VIN
ESD9B5_0ST5G
3D_LCD_BANK_SEL
5
3D_BOOST_EN
2.8V_LCD_VCC
2
4
3
Added (Rev.C)
1
0.1u
9
G1
10
G2
LCD Level Shifter
VSEL_1.8V
2
C1132
13
16
I2C2_SDA
I2C2_SCL
22K
4.7u
R1135
U1131
TPS61093
C1131
12
18
5
P5
6
P6
7
P7
8
P8
11
19
FL1142
1
P1
2
P2
3
P3
4
P4
DSI2_LCD_MIPI_CLK_N
DSI2_LCD_MIPI_CLK_P
L1131 4.7u
10
20
ZD1193
1u
9
21
ICMEF214P101M
Changed (Rev.B)
DNI
8
3D_LCD_BANK_SEL_1
ICVS0318150FR
3D LCD 12V Boost
1
2
5
C1106
VOUT
GND
DNI
R1191
7
23
ESD9B5_0ST5G
VIN
STBY
DSI2_LCD_MIPI_D0_N
DSI2_LCD_MIPI_D0_P
DSI2_LCD_MIPI_D1_N
DSI2_LCD_MIPI_D1_P
ZD1192
4
3
3D_LCD_EN
PGND
U1106
BU28TD2WNVX
G2
10
G1
9
VBAT
R1190
6
24
1
P1
2
P2
3
P3
4
P4
5
25
5
P5
6
P6
7
P7
8
P8
4
26
17
2.8V_3D_LCD
3
27
FL1141
2
28
LCD_RESET_N
1
29
1u
Added Res. (Rev.B)
Added (Rev.C)
4
VIN
GND
1
LCD BACKLIGHT LED Boost
1.8V_LCD_IOVCC
2.8V_LCD_VCC
U1101
RT9032AGQW
3
VBAT
KEY_C[0] - KEY_R[0] : Volume UP
KEY_C[0] - KEY_R[1] : Volume Down
Copyright (C) 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. CIRCUIT DIAGRAM
3D CAMERA MODULE
CAM POWER
Changed Pin Map (P & lt; -- & gt; S)(Rev.C)
Changed IC (Rev.C, 1.1)
5M_VCM_V2V8_S
VBAT
1.2V_5M_VDIG
2.2u
GNDB
LDO2
B3
C4
I2C3_SDA
I2C3_SCL
C3
D3
E2
CAM_SUBPM_EN
IRQ_N
SDA
LDO3
U1201
LP8720TLX
SCL
DVS
EN
LDO4
R1202
100K
A3
5M_VANA_V2V7_S
A1
C1
DEFSEL
IDSEL
LDO5
5M_MCLK
E1
C1204
C1206
C1207
C1208
1u
1u
1u
1u
B1
C1205
1u
GND
Added Res. (Rev.B)
PRIMARY_5M_MIPI_CLK_N
PRIMARY_5M_MIPI_CLK_P
1
P1
2
P2
3
P3
4
P4
8
9
10
30
11
29
12
28
13
27
14
26
15
25
16
24
17
C1231
23
18
0.1u
19
21
5
P5
6
P6
7
P7
8
P8
7
31
FL1222
B2
C2
6
34
5M_VCM_V2V8_S
5
35
1.8V_5M_VIO
4
36
SECONDARY_5M_RESET_N
PRIMARY_5M_RESET_N
9
G1
10
G2
Changed (P925 Rev.A)
5M_VCM_V2V8_P
B4
3
37
22
A2
LDO1
2
38
SW
1
39
9
G1
10
G2
FB
40
ESD9B5_0ST5G
D4
VINB
ESD9B5_0ST5G
ZD1225
E3
SECONDARY_5M_MIPI_CLK_N
SECONDARY_5M_MIPI_CLK_P
SECONDARY_5M_MIPI_DATA0_N
SECONDARY_5M_MIPI_DATA0_P
5M_VANA_V2V7_P
ZD1224
E4
D2
VIN2
A4
D1
C1209
2.2u
VBATT
L1201
2.2u
5
P5
6
P6
7
P7
8
P8
32
C1210
2.2u
10u
1
P1
2
P2
3
P3
4
P4
33
C1211
C1212
VIN1
Close to E4
FL1221
ICMEF214P101M
C1201
10u
CN1221
GB042-40S-H10-E3000
20
I2C4_SCL
I2C4_SDA
C1235
C1236
4.7u
1u
C1237
0.1u
5M_VANA_V2V7_S
1.2V_5M_VDIG
C1234
1.8V_5M_VIO
5M_VANA_V2V7_P
5M_MCLK_CAM
0.1u
C1233
0.1u
C1232
0.1u
I2C3_SCL
I2C3_SDA
5M_MCLK_CAM
5M_VCM_V2V8_P
C1228
ICMEF214P101M
4.7u
C1229
1u
C1230
0.1u
FL1223
1
P1
2
P2
3
P3
4
P4
5
P5
6
P6
7
P7
8
P8
9
G1
10
G2
PRIMARY_5M_MIPI_DATA0_N
PRIMARY_5M_MIPI_DATA0_P
PRIMARY_5M_MIPI_DATA1_N
PRIMARY_5M_MIPI_DATA1_P
ICMEF214P101M
HDMI Connector
Must Check Pin Map!!!
HDMI BackEnd IC
5V_HDMI
CN1271
78618-0001
20
Changed Con. (Rev.B)
21
5V_HDMI
22
1
C_HDMI_HPD
VBAT
4.7u
G2
L1251
4.7u
HDMI_SCL
HDMI_SDA
HDMI_CEC
HDMI_HPD
1u
F2
B1
C1
B2
C2
A3
A4
B4
C4
D4
E4
F4
G4
Removed (Rev.1.1)
LGE Internal Use Only
VBAT
5VOUT
SW
FB
SCL_A
CT_CP_HPD
SDA_A
LS_OE
CEC_A
HPD_A
D2+
D2-
U1251
TPD12S015
SCL_B
SDA_B
CEC_B
HPD_B
D1+
D1-
VCCA
D0+
D0-
GND0
GND1
CLK+
GND2
CLK-
GND3
PGND
F1
E1
D1
A1
E3
F3
D3
G3
E2
C3
4
5
6
7
8
HDMI_D1HDMI_D0+
HDMI_CT_CP_HPD
HDMI_LS_OE
C_HDMI_SCL
C_HDMI_SDA
C_HDMI_CEC
C_HDMI_HPD
9
10
11
HDMI_D0HDMI_CLK+
Removed (Rev.1.0)
HDMI_CLKC_HDMI_CEC
VSEL_1.8V
12
13
14
15
16
17
C_HDMI_SCL
C_HDMI_SDA
A2
D2
3
HDMI_D2+
HDMI_D2HDMI_D1+
C1252
C1241
2
R1271
100K
18
19
23
C1253
24
0.1u
C1271
25
100n
B3
G1
- 159 -
Copyright (C) 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. CIRCUIT DIAGRAM
GPS
LDO for GPS
VBAT
C1831
1u
PGND
VIN
STBY
VOUT
GND
VCC_GPS_2V8
1
2
C1832
5
4
3
GPS_PWR_ON
VCC_GPS_2V8
U1831
BU28TD2WNVX
1u
R1803
R1802
10
GPS_LNA_SD
1.5K
C1803
330p
C1801
47p
Changed (P925 Rev.A)
9
L1803 9.1n
FB1818
60
C1818
2.2u
C4
B5
B3
E4
D4
D3
SYNC/PPS_OUT
IFVALID
RST_N
REGPU
TM2
AVSS
VSSC1
VSSC2
VSSC3
2
240MHz
MURATA
ALM-2712
U1801
SFAC0002701
Changed (Rev.1.0,1.1)
L1810
Removed Mobile Switch
(Rev.B)
CN1803
1n
1
L1806
L1811
DNI
SDA1
SCL1
G1
L1807
6.8n
1n
L1810
A5
1nH
6.8nH
* TMUS
VDD_GPS_TCXO_1V8
G2
L1811
* Global, AT & T
F1
8.2nH
1.8pF
Changed (Rev.D)
26MHz_GPS_REF
D1
D5
CLK32K_GATE
D2
C1
C1822
E1
2.2u
C1821
22p
X1821
KT2520F26000ACW18TAK
6
VCC
GND1
NC2
NC1
OUT
GND2
1
A3
5
A2
B6
GPS_RESET_N
GPS_PWR_ON
G6
E6
A4
TP1803
GPS_26MHz
4
2
3
26MHz
TP1804
TCXO for GPS
C5
VSEL_1.8V
VSEL_1.8V
FB1815 60
FB1817 60
C1815
2.2u
LGE Internal Use Only
FL1801
LFD211G57DPMD153
1
6
P2
GND3
2
5
GND1
P3
3
4
P1
GND2
F2
E2
F3
VDDLNA
VDDIF
VDDPL
SCL2/UART_TX
SDA2/UART_RX
UART_nRTS
UART_nCTS
A6
C3
BCM4751
VDD_BAT
GPS_UART_RXD
GPS_UART_TXD
GPS_UART_CTS_N
GPS_UART_RTS_N
RFIP
G5
C6
VDD1P2_CORE
TP1801
REF_CAP
VDDIO
G4
TP1802
U1811
10n
1
(P925 Rev.A)
(Rev.1.1)
GPS_CAL
TCXO/TSXO
LPO_IN
ADCP
VDDADC
ADCN
F6
B2
C1812
VDD1P2_GRF
F4
B1
VDD_AUX_O
VDD_AUX_IN
HOST_REQ
LNA_EN
GND
Changed (P925 Rev.A)
L1802 100p
DPX_IN
VSSIF
VSSLNA
VDD_PRE
E5
CAL_REQ/ANT_SEL
VSSADC
VDDC2
VDDC1
E3
AUXOP
D6
C2
60
B4
A1
FB1812
F5
G3
RF_IN
RF_OUT
1.8p
VCC_GPS_2V8
C1814
VDD
C1808
VDD_GPS_TCXO_1V8
2.2u
8
VSD
11
C1802
0.1u
C1816
2.2u
C1817
2.2u
- 160 -
Copyright (C) 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. CIRCUIT DIAGRAM
BT/WIFI/FM
VBAT_FEM
Changed (P925 Rev.A)
+1.8V_BT
SWB_VIO_1.8V
1u
1u
C1901
1u
0.1u
C1912
1u
0.1u
C1910
C1911
1u
C1909
1u
0.1u
C1906
C1908
C1907
C1902
1u
1u
0.1u
C1914
C1905
0.1u
C1913
C1904
+1.8V_BT
0.1u
VBAT_FEM
C1903
+1.8V_BT
C1915
0.1u
C1916
220n
CN1904
J10
E4
O UT
GND1 GND2
IN
DNI
FL1901
LFB212G45SG8A166
2450MHz
A7
K11
FREFBGCAP
FMBGAPCAP
E3
C9
A6
M1
PMS_TEST_1P8V
LDO_IN_DCOW
VDD_LDO_INBT
C8
LDO_INW
A8
VDD_PPA_IFBT
VDD_CLASS1P5
B8
C5
C3
VCC_TXAW
VCC_TXBW
C 11
B2
VCC_RXW
VCC_ANAW
VDD_DCOBT
D2
B10
C4
VCC_DCOW
VDD1P8VFM
M6
K3
L8
VDD_RFBT
VDDS4
VDDS3
F9
G2
VDDS1
VDDS2
L6
M4
VDD7
VDD6
VDD5
J1
G9
G1
VDD4
VDD3
VDD2
M2
K1
F11
E10
VDD1
G6
PMS_VBAT
VDD_LDO_IN_CLASS1P5
J2
L1924
DNI
100n
WL_BTH_SW
WL_TX_SW
WL_RX_SW
D5
F1
L1926
1n
Changed (Rev.D)
F3
F2
L1925
DNI
C1932
100p
DNI
A4
BT
VBAT_FEM
M7
5
VB1
13
14
VB3
6
M8
TX_SW
PAEN
PGND
4
RX_SW
AUD_OUT
AUD_IN
BT_PCM_CLK
BT_PCM_SYNC
BT_PCM_DIN
BT_PCM_DOUT
H11
F7
F6
11
10
9
Added
(Rev.D)
WL_BTH_SW
WL_RX_SW
WL_TX_SW L1923
VBAT_FEM
3.3n
C1922
C1923
DNI
1u
Added
(Rev.C)
J7
F8
12
17
BT_RF
U1902
RF3482
GND1
PDET
BT_RF
K7
Removed
(Rev.D)
BTH_SW
PABC
A9
3
TXB
VB2
2
8
1
7
A5
ANT
16
A3
RXBP
RXBN
A2
GND2
B1
15
C1
C1920
1.5n
TESTPBT
FM_I2S_FSYNC
WLAN_IRQ
FM_I2S_CLK
WL_UART_DBG
FM_I2S_DI
FM_I2S_DO
VPP
FM_SCL
IFORCE
FM_IRQ
VSENSE
FM_SDA
DC_REQ
FMRFINP
DRPWPABC
FMRFINM
DRPWPDET
FMRFOUTP
DRPWTEST1
FMAUDLIN
DRPWTEST2
FMAUDRIN
DRPWTEST3
FMAUDLOUT
DRPWTEST4
FMAUDROUT
A1
NC6
Removed Cap.
(Rev.B)
TESTMODE
G4
TP1905 TP1906
WLAN_HOST_WAKEUP
F4
TP1901
H9
H7
H10
L1
DC_EN
D3
D4
B7
C6
C7
D6
M11
VSS_ANAW
J8
K8
J11
FM_AUDIO_L
FM_AUDIO_R
AUD_FSYNC
TESTMBT
VSS_BTDPLL
L10
BT_EN
WLAN_EN
C1917
B6
L9
BT_FUNC7
D 11
FM_ANT
AUD_CLK
VSS_RFW2
L11
BT_FUNC4
C2
L5
G5
TP1907
Changed Library
(Rev.B)
BT_FUNC5
VSS_RFW1
K5
JTAG_TMS
VSSAPASYNTHFM
M5
L1901 180n
BT_FUNC6
JTAG_TDI
JTAG_TCK
B4
L7
BT_FUNC2
JTAG_TDO
M9
J6
H6
BT_FUNC1
VSS_XTAL
H5
FM_I2S_FSYNC
FM_I2S_CLK
FM_I2S_DO
FM_I2S_DI
CLK_REQ_OUT_N
VSSAADCAPLLFM
A11
C10
CLK_REQ_OUT
VSSARFFM
E8
RFIOBT
U1901
WL1271
SLOWCLK
J9
E6
H8
XTALM
D9
E7
TP1902
TP1903 TP1904
XTALP
K10
E9
DRPWTXB
VSS_DCOW
F10
DRPWRXBM
VSS_DCOBT
20K
DRPWRXBP
HCI_RX
E2
R1902
DC_MODE
HCI_TX
B 11
F5
E5
NC4
VSS_DIG7
K9
CLK32K_GATE
WL_CLK_REQ
HCI_RTS
VSS_DIG6
D8
NC3
VSS_DIG5
WL_CLK_IN
NC2
HCI_CTS
G3
D7
1
C1918
C1933
WL_RS232_RX
D10
G7
WL_TX_SW
WL_RX_SW
H4
WL_RS232_TX
G10
G8
SDIO_D2
VSS_DIG4
G11
WL_BTH_SW
VSS_DIG3
E11
BT_UART_RTS/
BT_UART_CTS/
BT_UART_RXD
BT_UART_TXD
SDIO_D1
K6
H2
NC1
H3
SWB_VIO_1.8V
H1
TP1911 TP1912 TP1913 TP1914
WL_EN
WL_PAEN_B
VSS_DIG2
Changed (P925 Rev.A)
J3
FM_EN
BT_EN
SPI_CSX
A 10
WLAN_SDIO[1]
WLAN_SDIO[2]
Removed TP
(Rev.B)
SPI_DOUT
VSS_DIG1
J4
VSS_RFBT
J5
L4
K4
SPI_DIN
K2
L3
SPI_CLK
VDD_DIG_LDO
M3
VIN_DIG_LDO
Removed TP (P925 Rev.A)
WLAN_CLK
WLAN_CMD
WLAN_SDIO[0]
WLAN_SDIO[3]
VDD_MEM_LDO
L2
C1936 100p
Added (P925 Rev.A)
Removed (Rev.E)
Added (P925 Rev.A)
Removed (Rev.E)
VBAT_FEM
SWB_VIO_1.8V
VSEL_1.8V
FB1914 600
VBAT
R1905
Removed TP
(Rev.B)
Added(Rev.C)
Removed(Rev.1.0)
0
+1.8V_BT
U1904
TPS62611YFDR
A2
B2
DC_EN
C1930
2.2u
LGE Internal Use Only
C2
VIN
MODE
EN
SW
GND
FB
A1
B1
C1
DC_MODE
L1903
1.5u
C1931
4.7u
- 161 -
Copyright (C) 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. CIRCUIT DIAGRAM
USIM for XMM6260
Main2Sub B2B Con.
* layout note : CLK and IO must be seperated
VSIM_2.9V
VSIM_2.9V
12
23
13
22
14
21
15
20
16
19
17
DNI
DNI
DN I
R101
DNI
24
DNI
11
R109
25
R110
10
18
10p
Rev 1.0 value change
MICROSD_CLK
Rev 1.0 value change
S101
GND
Rev.B
Remove Series R
CMD
27
R118
VDD
CLK
27
VSS
MICROSD_DET/
MICROSD_DAT0
MICROSD_DAT1
MICROSD_COVER_DET/
VSIM_2.9V
I2C4 - & gt; GND(Rev.G)
CARD_DETECT
DAT0
DAT1
COVER_DETECT1
TOUCH_RESET Rev.E
3
USIM_DATA
C105
5
1
D101
D102
C106
0.1u
USIM_CLK
4
2
DAT2
CD_DAT3
R117
6
26
Rev.B
Rev.C
5
9
0.1u
MICROSD_DAT2
MICROSD_DAT3
MICROSD_CMD
4.7u
1
27
C104
4
8
USIM_DATA
8
2
28
GND2
3
7
I_O
GND1
C103
DNI
10p
GSM_TXON_INDRev.E
PWR_ON_SW
UART_RX_IFX
Rev.B
UART_TX_IFX
TOUCH_INT_N
I2C2_SDA
I2C2_SCL
CLK
C102
R106
29
7
C101
6
30
6
(Rev.E)
6
1
5
MICROSD_CLK
USIM_RESET/
USIM_CLK
USIM_DATA
3
R105
31
VPP
5
R104
32
4
RST
4
5
33
3
GND
4
2
USIM_RESET/
USIM_CLK
VCC
2
34
2
3
1
VBAT
VPMIC_VMMC
PU Resistor Moved to Main PCB
J101
1
CN101
4.7K
SENSOR_3.0V
Rev.E
FLASH_EN
VPMIC_VMMC
VSIM_2.9V
VSEL_1.8V VPMIC_VMMC
MICROSD_DAT0
MICROSD_DAT1
MICROSD_DAT2
MICROSD_DAT3
MICROSD_CMD
MICROSD_DET/
MICROSD_COVER_DET/
MicroSD Socket(Hinge Type)
USIM_RESET/
6
D103
Touch Connector
CAMERA FLASH LED
Zif - & gt; BtB (Rev.E)
NEST JIG
Must Check Schematic
Rev.C
VSEL_1.8V
TP gap(center to center) 2mm
(Rev.E)
Routing line must be thick enough to support 1A!!
VSEL_1.8V
10
L101
9
7
5
TOUCH_INT_N
C 120
1u
ZD104
ZD 106
ZD103
ZD102
VA103
ZD101
Rev.F
ZD105
2.2u
Rev.F
Rev.F
B3
C107
D4
FLASH_EN
I2C2_SCL
I2C2_SDA
Rev.E & 1.0
DNI R Added
GSM_TXON_IND
D3
D2
C3
R122
C2
DNI
D1
TP102
TP103
TP104
HWEN
U101
SCL
SDA
VBAT
10u
OUT1
OUT2
VSEL_1.8V
C119
Rev.F
IN
SW2
A3
6
C4
Rev.E
SW1
R121
TOUCH_RESET
LED1
LED2
A2
B2
A1
Routing line must be thick enough to support 1A!!
B1
STROBE
TX1/TORCH/GPIO1
TX2/INT/GPIO2
GND1
4
I2C2_SDA
TP101
TP105
8
A4
3
DNI
2
UART_RX_IFX
UART_TX_IFX
PWR_ON_SW
1u
LEDI/NTC
1
C1
GND2
CN102
I2C2_SCL
B4
1
Rev.B
VBAT
LD101
10K
R112
TOUCH_3.3V
2
C109
10u
Routing line must be thick enough to support 1A!!
VA102
Touch LDO
2ch - & gt; 1ch (Rev.E)
Remove 0 ohm (Rev.G)
VBAT
TOUCH_3.3V
VDD
CE
5
SENSOR_3.0V
PGND
U102
4
3
VOUT
GND
1
2
Camera Deco contact C-clip
CN110
1
C115
1u
LGE Internal Use Only
HJ-BCT-04Y
- 162 -
Rev.D
Copyright (C) 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. CIRCUIT DIAGRAM
Main2FPCB B2B
Must Check!!! Pin MAP
Proxi. Ambiant Sensor
SENSOR_3.0V
TWL_LDO_1.8V
34
MICBIAS
32
5
29
6
28
7
27
8
26
9
25
10
24
11
23
12
22
13
21
14
20
15
19
16
18
17
Rev.1.1 (VSEL 1.8V Remove)
1
I2C3_SDA
2
PROX_INT
3
HS_MIC
EAR_R
EAR_L
EAR_SENSE
4
SDA
VDD
INT
SCL
LDR
GND
LEDK
LEDA
7
5
8
6
EAR_R
7
I2C3_SCL
FM_ANT
6
5
L102
100n
C102
1u
C105
22p
C101
1u
VGA(MIPI)
(FPCB, Aptina 1/11 " , Hansung)
TWL_LDO_2.8V
1
TWL_LDO_1.8V
2
CN103
1
D102
VT_0.3M_MIPI_DATA0_N
VT_0.3M_MIPI_DATA0_P
2
19
3
18
4
17
5
16
6
15
14
8
VT_0.3M_MCLK
20
7
VT_0.3M_MIPI_CLK_N
VT_0.3M_MIPI_CLK_P
D101
8
4
EAR_SENSE
CN102
AUD_RCV_N
9
3
FM_ANT
Receiver
AUD_RCV_P
10
EAR_L
Rev.B(Pull Up Move to Main PCB)
U101
AUD_RCV_P
AUD_RCV_N
CN104
HS_MIC
2
4
30
VT_0.3M_MIPI_CLK_N
VT_0.3M_MIPI_CLK_P
VT_0.3M_MIPI_DATA0_N
VT_0.3M_MIPI_DATA0_P
3
31
PROX_INT
I2C3_SCL
I2C3_SDA
VT_CAM_PWDN
VT_CAM_RESET/
VT_0.3M_MCLK
2
1
PROXI_3.0V
1
33
SMIC_N
SMIC_P
SENSOR_3.0V
TWL_LDO_2.8V
PROXI_3.0V
CN101
13
9
12
10
11
FB101
Rev.1.1 (VSEL 1.8V Remove)
Rev.B(Removed Bypass Cap)
I2C3_SDA
I2C3_SCL
VT_CAM_PWDN
VT_CAM_RESET/
C103
SUB MIC
C104
0.1u
0.1u
Must Check Schematic
TOP
MIC101
1
MICBIAS
2
3
4
SMIC_P
P
G1
G2
O
D104
D103
SMIC_N
Rev.B(Bead Move to Main PCB)
LGE Internal Use Only
- 163 -
Copyright (C) 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. CIRCUIT DIAGRAM
3.5pi Ear Jack Connector
EAG62831701
1
CN101
10
HS_MIC
2
HS_MIC
EAR_L
4
M5-MIC
3
8
7
5
6
EAR_L
J101
EAR_SENSE
M4-L
4D
M4-DETECT
1
M1-R
6
M6-GND
EAG62831701
EAR_SENSE
EAR_R
FM_ANT
9
4
5
EAR_R
FM_ANT
Remove HS_GND
LGE Internal Use Only
- 164 -
Copyright (C) 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. CIRCUIT DIAGRAM
Main2Key B2B
VBAT
SPEAKER
MAIN KEY LED
L103
AUD_SPK_P
VBAT
L104
AUD_SPK_N
20
19
CN102
Rev.B
100n
SP101
1
2
100n
1
HIR-02A57-0000AA
2
LED_SINK
D101
C103
MICBIAS
33p
LD104
5
LD103
4
16
LD102
3
17
LD101
18
D102
KEY_C[1]
KEY_R[1]
MMIC_P
15
6
14
7
13
8
12
9
11
10
MMIC_N
R101
R102
R103
R104
130
VIB_L_P
130
130
130
MOTOR
AUD_SPK_P
VIB_L_N
Q-Motor(Not Fixed)
AUD_SPK_N
LED_SINK
L102
VIB_L_N
L101
VIB_L_P
3D HOT_KEY
KB101
KEY_R[1]
KEY_C[1]
VB101
82n
1
82n
2
MAIN MIC
Must Check Schematic!!!
TOP
MIC101
1
MICBIAS
2
FB103
MMIC_P
3
120
Rev.B
LGE Internal Use Only
- 165 -
C110
C113
33p
P
G1
G2
O
C114
27p
0.1u
DNI
MMIC_N
R 105
Volume Key
4
Copyright (C) 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. CIRCUIT DIAGRAM
MAIN ANT
SW101
ANT
CN103
1
G2
HJ-ICT-06Y
C106
CN104
1
L105 1.5n
G1
HJ-ICT-06Y
0.5p
LGE Internal Use Only
- 166 -
Copyright (C) 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. CIRCUIT DIAGRAM
POWER Key
ON/OFF/LOCK
KB101
PWR_ON_SW
CN101
1
2
LGE Internal Use Only
- 167 -
PWR_ON_SW
Copyright (C) 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. CIRCUIT DIAGRAM
UP DOWN
Volumm Key
KEY_C[0]
KEY_R[0]
KEY_R[1]
KB101
KB102
KEY_C[0]
KEY_R[0]
KEY_R[1]
4
3
2
1
SIDEKEY_4P
CN101
KEY_C[0] - KEY_R[0] : Volume UP
KEY_C[0] - KEY_R[1] : Volume Down
LGE Internal Use Only
- 168 -
Copyright (C) 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. BGA PIN MAP
U181 PMB5712 (Transceiver)
7. BGA PIN MAP
U181 PMB5712 (Transceiver)
Not Used
Used
LGE Internal Use Only
- 169 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. BGA PIN MAP
U301 PMB 9811 (Digital Baseband Processor,3G)
U301 PMB 9811 (Digital Baseband Processor,3G)
Not Used
Used
LGE Internal Use Only
- 170 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. BGA PIN MAP
U350 H8BCS0QG0MMR-46M
U350 H8BCS0QG0MMR-46M
LGE Internal Use Only
- 171 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. BGA PIN MAP
U701 k3PE4E400M-XGC1 4Gb LPDDR2 PoP
Not Used
Used
LGE Internal Use Only
- 17 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. BGA PIN MAP
U500 OMAP4430 IC, Application Processor
Not Used
Not Used
Used
LGE Internal Use Only
- 173 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. BGA PIN MAP
U800 PMIC
Not Used
LGE Internal Use Only
- 174 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. BGA PIN MAP
U721 SanDisk 8G NAND Flash
U721 SanDisk 8G NAND Flash
Used
Not Used
LGE Internal Use Only
- 175 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. BGA PIN MAP
U901 (TWL6040 Audio codec)
Not Used
LGE Internal Use Only
- 176 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. BGA PIN MAP
U811 MUCI
Not Used
Used
LGE Internal Use Only
- 177 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
8. PCB LAYOUT
8. PCB LAYOUT
X500 : 38.4Mhz X-tal
- no Booting
CN1195
ZD593
ZD591
TP1911
U721
R733
R736
R725
R735
R724
R734
U811
5
TP904
C1931
TP523
1
2
C190
28
C605
TP525
C614
C352
SC795
TP524
L1903
C1930
C682
U1904 : DCDC
- no Bluetooth/WiFI/FM
R382
C353
1
C658
C652
C642
C356
C662
C357
ZD1193
ZD1192
C354
10
R597
C679
C328
C335
17
C330
R337
R187
C971
U
T
R
N
P
M
L
H
K
G
J
F
E
D
C
1
TP310
TP312
C973
U971 : Motion sensor
- no Motion sensor
TP311
L988
L989
C987
R986
C986
U981
Q1186
R1186
R982
TP905
U981 : Motor D-IC
- no Vibration
R987
R981
SC793
R1187
R313
R319
R314
C306
C305
C309
C303
L303
C831
C314
L304
FB803
TP300
C834
FB806
L806
C819
C848
FB301
C846
C829
FB801
L801
C815
C814
C808
FB800
C312
C972
R973
U971
C315
C965
C318
C963
C962
C313
U301
C304
C307
U301 : CP modem
- no Service
U961 : Gyro sensor
- no Gyro sensor
- no Motion sensor
R593
TP313
L803
C961
U961
C337
SC794
C327
R592
T
L800
R853
R854
R901
R902
C334
R336
C323
C809
FB302
C851
C325
C317
C826
FB805
C821
P
R
C302
C344
C333
C828
U800
C342
C316
C850
L805
C341
C336
C825
C849
U303
C324
C824
C841
C343
C329
R809
R804
C812
L804
U303 : SPDT S/W
- no CP UART port
- no AP-CP UART port
R383
X300
B
C675
C639
FB804
16
L
M
N
C813
R830
1
C837
R818
C840
C844
C641
C830
C602
C833
C644
C603
C854
C663
C640
C619
G
H
J
K
C817
SC792
C811
U801
FB802
C653
C647
A
C845
X800
B
C
D
E
F
L802
C832
C838
C839
R340
R342
C816
C649
C687
C852
C621
FL621
C601
C651
C681
C612
C656
C611
Y
AA
AB
AC
AD
AE
AF
AG
AH
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
1
C600
C636
A
C670 C680 C607
R516
C355
R513
C358
C667
ZD1191
U500
C669
C684
U350 : CP memory
- no Service
R384
C661
U350
C650
R588
U701
C637
CN1191
A
B
C
F
E
D
H
G
J
L
K
N
M
C613
SC791
R598
R827
C853
C810
R828
R803
U1904
FB1914
R631
C671
R808
R805
C991
TP513
C351
C627
C818
R800
C992
C648
Q301
R821
U991
C993
TP902
C645
TP809
TP901
A
TP512
B
TP301
C
R632
C677
C617
R512
C685
C686
C683
R501
C635
C620
U801 : Charger IC
- no Charging
- no AP/CP USB
C657
C660
C674
C678
ZD801
Q301 : FET
- no CP USB
C668
R594
R584
C673
R586
R596
FL800
CN1271
CN1271 : HDMI Conn.
- no HDMI diplay
AF
TP1906 TP1905
SC796
C822
U500 + U701: AP + POP memory
- no Booting
AH
AE
FB743
C502
C509
C618
TP511
U991 : Dual LDO
- no Gyro sensor
- no Motion sensor
- no Compass sonsor
- no Proximity sensor
C744
4
1
C507
ZD802
C823
AG
AC
AD
Y
AB
W
AA
T
V
U
P
R
N
M
J
L
K
F
H
E
D
G
C
B
U502
C500
A
1
1
R581
C743
R731
R726
C505
C508
A
B
R739
R721
A
B
C
D
E
R848
C
D
CN801
R732
R730
R591
C827
R722
U721 : EMMC memory
- no Booting
- no Service
C742
FB741
C503
C501
U851
C820
R737
R723
X500
C504
R850
C855
R738
R727
C741
C739
C740
R728
U811 : MUIC
- no USB/UART
U800 : PMIC
- no Booting
- no Power On
- no Service
TP1912
14
R729
U851 : DP3T S/W
- no CP USB/UART port
- no AP UART port
CN801 : uUSB Conn.
- no USB/UART
- no Charging
TP1914
R1195
TP1913
U502 : Clock Buffer IC
- no Booting
- no BT/WiFi/FM
- no Audio
ZD1195
ZD592
LG-P920_MAIN_1.1_TOP
LGE Internal Use Only
- 178 -
Copyright (C) 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
8. PCB LAYOUT
CN1171 : Top FPCB Con.
- no Ear-jack
- no Sub MIC
- no Receiver
- no VT Camera
- no Illumination sensor
- no Proximity sensor
C1920
18
U1831
C1832
L1810
L1806
L1803
L1802
L215
L213
L214
L212
C 93 3
C1812
FB1818
C1822
C1815
C1818
VA902 C922
C938
TP903
C930
C917
C928
U901
U1831 : LDO (for GPS)
- no GPS
FL1801 : Diplexer (GPS/B4 Diversity)
- no GPS
U1801 : GPS RF Module
- no GPS
X1821 : 26Mhz X-tal
- no GPS
U1811 : GPS chip
- no GPS
U901 : Audio codec
- no Sound
C934
C913
C914
C1253
4
C117
1
F
E
G
L116
C1916
L1901
C609
C187
C205
C191
C200
C189
C204
C626
C248
L102
R511
SW101
L143
L141
L131
C151
C183
C1206
C1209
U241
C1231
C1232
C251
C1233
C1234
C1237
C1131
L169
C1236
1
A
C233
C231
U171
L152
C228
L176
C175
C835
U1108
C255
L179
C1143
FB1143
15
R514
R894
R895
C892
CN1141
B
C
D
C1141 VA1102
30
C221
C976
C225
C230
ZD1181
ZD1182
16
U891
R892
C978
C975
C227
L180
C310
R316
FL1221
R1134 C1134 R1133
C222
C112
C842
U1131
C232
C109
U1121
L159
FL1223
C1229
C243
L244
C1138
L138
C1204
C1230
L245
L112
L110
3
L128
U1201
C1207
TP1904
TP1903
R1136
D1122
C1122
FL1141
L1121
C1210
C1913
L1201
R1202
C1208
C244
U121
C123
C1121
U 11 0 6
C1106
C1107
R 11 2 5
R 1 10 2
R 1 10 3
FL1142
R1126
Q801
C1910
FL1222
L1131
L114
R510
M
L
K
J
H
G
F
E
D
C
B
A
C250
C242
C688
L111
C1909
C1914 R1902
C206
C192
C198
C133
C105
R500
CN1904
C1906
C1205
L248
C197
C114
L105
SW102
R8 0 2
R8 0 1
C836
R1191
R1190
C308
V A 1104
C3 0 1
C3 11
R891
U1101
C891
R893
C890
R811
VA800
R1101
BAT800
C805
C1103
R89 7
R8 9 6
C1101
C 807
C8 0 0
C 801
C8 0 4
C 802
C 8 03
C1102
ZD803
C8 5 8
R 515
11
C101
U1901
TP1907
C915
C916
R1172
C199
C659
FB901
L177
C1 72
C171
C 173
C178
U1121 : LCD LED boost
- no LCD backlight
SW102 : RF S/W
- no Service
C103
C610
L162
C1 15
L113
L227
C226
L226
FL111
C223
A
D
1
C224
C153
C1241
U 220
L1251
U1251 : HDMI IC
- no HDMI Display
FL111 : FEM
- no Service
- RF Sensitivity & TX Power
L104
C665
A
B
D
C
C116
L161
C121
C132
L142
R 12 7 1
U1251
L122
L148
C163
L147
L127
L137
L158
L168
C1137
R1135
6
C1252
C1902
C939
C654
C1908
1
C926
C935
FB913
FB914
C646
C 6 55
C924
U181 : Transceiver
- no Service
- RF Sensitivity & TX Power
U121 : Bank Duplexer
- no Service
- RF Sensitivity & TX Power
C1271
C1915
11
C1907
FB1176
C925
1
C918
C1912
C1911
C188
C1816
FB1815
11
C927
A
C9 4 0
B
R921
R1905
FB1175
M
L
K
J
H
G
F
E
D
C
B
A
C
C9 20 V A 9 0 3
E
D
R9 19
C902
F
C91 9
J
H
G
C921
C1179
PT301
R306
C1936
L1924
C1171
FB1812
R1802
K
C901
1
C19 5
FL627
C1 8 2
C903
U181
VA901 C923
ZD1172
FL1901
R522
R521
C1904 C1903
C1801
C93 6
C937
C211
C9 41
C905
C9 31
C 92 9
C 93 2
C2 07
C904
L211
FL1172
U1811
C1802
C1803
C1821
FL211
X1821
R1803
C 2 54
C2 03
C1 93
FB941
C1814
TP1801
TP1802
T P1 8 0 3
TP102
C2 02
C1 9 4
R1 8 6
20
C1808
FL1801
T P1 8 0 4
L1172
C1 17 2
U1801
C1932
C1923
CN1161
R1178
FL1171
FB1817
C1817
18
R 11 7 3
17
FB1173
13
C209
L
L1811
D1175
C2 01
C1 85
C 20 8
C 18 4
21
C1831
R1171
L1807
C117 4
CN1171
C1177
FB1177
Q1173
X184
C245
40
CN1803 : GPS Ant.
- no GPS
34
C1173
C 11 75 C 1 17 6
C25 2
C2 53
C18 1
L247
C1132
20
CN1181
CN800
10
U891 : Fuel gauge
- Battery-bar accuracy declined
FB201
U975
U220 : DCDC (for PAM)
- no Service
- RF Sensitivity & TX Power
BAT800 : Backup Cap.
- RTC Reset
C247
C241
C1235
X184 : 26Mhz X-tal
- no Service
CN1181 : Key FPCB Con.
- no 4 key LED
- no 3D key
- no Main MIC
- no Speaker
- no Vibrator
C249
L249
C1228
C N1 22 1
U975 : Compass sensor
- no compass sensor
R1174
C1901
C1211
U1131 : 3D LCD boost
- no 3D LCD
ZD1224 ZD1225
CN1221 : 3D Cam con.
- no 5M Camera
- no 3D Camera
R 11 7 6
C1905
4
C11 78
L1926
C1212
U241 : PMU(for Transceiver)
- no Service
- RF Sensitivity & TX Power
E
C1201
U1201 : Camera PMIC.
- no 5M Camera
- no VT Camera
L1925
U1901 : WiFi/BT/FM Module
- no WiFi connection
- no BT Connection
- no FM Radio
TP1902 TP1901
CN1904 : WiFi/BT Ant
- no WiFi/Bluetooth
17
FB1174
U1902
34
CN1803
C1922
C1933
C1918
C1917
U1902 : BT/WiFi RF Module
- no BT Connection
- no WiFi connection
L1923
CN1161 : Sub PCB Con.
-no SIM
-no T-flash memory
-no Flash LED
-no Touch
U1106 : LDO
- no 3D LCD
SW101 : Coaxial Conn.
- no Service
FL1141/FL1142 : EMI filter
- no Display
U1101 : Dual LDO
- no Display
CN1141 : LCD Conn.
- no Display
U171:MMMB (Multi PAM)
- no Service
- RF Sensitivity & TX Power
LG-P920_MAIN_1.1_BOT
LGE Internal Use Only
- 179 -
Copyright (C) 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
8. PCB LAYOUT
18
34
CN101
17
LG-P920_F_SUB_1.0_TOP
LGE Internal Use Only
- 180 -
Copyright (C) 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
8. PCB LAYOUT
S101
LD101
ZD105
ZD101
5
R1 0 9
C106
R1 1 0
CN102
D1 0 2
10
VA102
R118
D1 0 1
ZD103
CN110
6
ZD102
ZD104
R117
C120
ZD106
R1 0 6
R1 0 5
C119
VA103
C104
R1 0 4
R101
C105
R112
C101
R122
C115
C1 0 2
J 101
D1 0 3
C103
U102
R121
C107
U101
L101
TP105
TP104
T P103
TP101
C109
TP102
LG-P920_F_SUB_1.0_BOT
LGE Internal Use Only
- 181 -
Copyright (C) 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
8. PCB LAYOUT
10
MIC101
CN103
FB101
C104
D104
D103
C103
C102
11
20
C101
U101
CN102
D101
D102
LG-P920_F_VTCAM_1.1_TOP
LGE Internal Use Only
- 182 -
Copyright (C) 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
43
101NC
81
71
8. PCB LAYOUT
10
6
CN104
L102
C105
5
LG-P920_F_VTCAM_1.1_BOT
LGE Internal Use Only
- 183 -
Copyright (C) 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
8. PCB LAYOUT
LG-P920_F_EAR_1.0_TOP
LGE Internal Use Only
- 184 -
Copyright (C) 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
8. PCB LAYOUT
LG-P920_F_EAR_1.0_BOT
LGE Internal Use Only
- 185 -
Copyright (C) 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
8. PCB LAYOUT
KB101
SP101
LD104
LD103
LD102
L104
D102
LD101
FB103
R102
R101
C103
L102
L101
R 105
C 110
MIC101
C 114
R104
C 113
R103
L103
1
VB10
D101
LG-P920_RF_KEY_1.1_TOP
LGE Internal Use Only
- 186 -
Copyright (C) 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
8. PCB LAYOUT
20
CN102
10
11
LG-P920_RF_KEY_1.1_BOT
LGE Internal Use Only
- 187 -
Copyright (C) 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
8. PCB LAYOUT
L105
CN104
CN103
C106
S W10 1
LG-P920_E_PCB_1.0
LGE Internal Use Only
- 188 -
Copyright (C) 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
8. PCB LAYOUT
KB101
LG-P920_F_SK_PWR_1.0
LGE Internal Use Only
- 189 -
Copyright (C) 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
8. PCB LAYOUT
KB101
KB102
LG-P920_F_SK_VOL_1.0
LGE Internal Use Only
- 190 -
Copyright (C) 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
9. CALIBRATION
9. CALIBRATION
9.1 Configuration of Tachyon
9.1.1 Configuration of directory
P90/
LGP90
LGP90
LGP90
LGP90
LGE Internal Use Only
- 191 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
9. CALIBRATION
9.1.2 Description of basic folders
Folder
Description
Tachyon
Exe file and MFC dll, UI dll is present.
Common
Common dll files.
(XML Data I/O , Auto Test Logic, Tachyon Logic Control, Communication)
Config
Envirement files.
(Port configuration, Loss adjust)
Instrument
Tester control dll.
Model
Model files is present.
(Model - & gt; Solution (Qualcomm, EMP, ADI, INFINEON) - & gt; MODEL
NAME(LGGW620, LGSH470, ..) - & gt; BUYER NAME(SKT, TEL, VIVO, ...)
OCX
Conponent files.
PhoneCmd
Phone communication file
Report
Report Files is present.
(Cal data, test data)
9.1.3 Description of configuration files
File
Description
'MODEL NAME'_Calibration.XML
There are imformations to calibrate.
It consist of calibration items.
'MODEL NAME'_CallSetup.XML
There are imformations to call.
'MODEL NAME'_NV.INI
It consists of default values.
It is written when 'cal & auto' is begun.
'MODEL NAME'_Sequence.XML
It is described a testing procedures.
LGE Internal Use Only
- 19 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
9. CALIBRATION
9.2 How to use Tachyon
9.2.1 Model selection
Follow the procedure before start calibration & auto test
a. Click the icon,
in tool bar. Then, you can see the below screen.
b. Select Model "LGP90"
B
LGE Internal Use Only
- 193 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
9. CALIBRATION
c. Select the model : You should select "LGP90"
d. Select the buyer (must be double clicked) Then, you can see "PASS" in Config File Check.
e. Click select button
C
D
E
LGE Internal Use Only
- 194 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
9. CALIBRATION
9.2.2 Start cal & auto
a. Click calibration & autotest button,
in Tool bar.
LGP90
b. Calibration & autotest will be executed in order.
1) Precede Action.
- NV write
- Test command send.
) Calibration
3) Auto test
4) After action
- Phone reset
- Change UE to AMSS
LGE Internal Use Only
- 195 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
10. HIDDEN MENU
10. HIDDEN MENU
Hidden Menu Start
Start shortcut keys:3845#*90#
Hidden Menu List
Start the desired menu: Menu, click
Device Test
List:
Auto all Test: Device functionality testing at the factory to use
Accelerometer Test
ALC/Proximity Test
AutoDetecting Test
Bluetooth Scan Test
Camera Test
Compass Test
Gyroscope Test
External Memory Test
Font Test
Key/Compass Test
LCD Test
S3D LCD Test
3D LCD Test
RTC Test
Sound Test
Touch Test
Vibrator Test
Wifi Scan Test
Gyro Cal Test
EMI Test
HDMI Output Test
HDMI Test
Touch LED Brightness
Gesture Manager Test
Gmtest_app
Gesture Test
LGE Internal Use Only
- 196 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
10. HIDDEN MENU
Device Test List
Auto All Test :
- & gt; Auto All Test menu click
- & gt; Continuous information on the menu, giving you ability test
Accelerometer Test
Proximity Test
: Proximity Sensor
Phone contact with your fingers in the top of the sensor
determine the sensor response
- Far 1.0
- Near 0.0
Check the "Auto brightness mode"
- ALC level changed due to the brightness
LGE Internal Use Only
- 197 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
10. HIDDEN MENU
AutoDetecting Test
: USIM, SD card, Ear jack
Check the SIM card
Check the SD card
Check Ear phone(jack)
- Ejected ear jack is normal
Bluetooth Scan Test
Camera Test
Menu features disabled
This feature is part of Auto All Test replaced by
- & gt; Auto All Test
- & gt; Camera Preview
- & gt; VTCamera Preview
- & gt; 3DCamera Preview
LGE Internal Use Only
- 198 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
10. HIDDEN MENU
Camera Test 1
Camera Preview
Camera Test 2
VTCamera Preview
Camera Test 3
3DCamera Preview
LGE Internal Use Only
- 199 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
10. HIDDEN MENU
Compass Test
Compass Test
External Memory Test
SD Card
SD Card test
- & gt; Write a test check of the SD Card memory
LGE Internal Use Only
- 00 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
10. HIDDEN MENU
Font Test
Change native font
key/Compass Test
Up/Down key : Check Recognition
Menu key : Check Recognition
Home key : Check Recognition
Back key : Check Recognition
Search key : Check Recognition
3D key : Check recognition
End key : Check recognition
Phone contact with your fingers in the top of the sensor
determine the sensor response
Far 1.0
Near 0.0
- ALC Change
Compass test
LCD Test List
Manual Test : Click on the following screen
Automatic Test : Automatically, without clicking
Manual Test
Automatic Test
D pattern Test
3D pattern Test
Red Display
Green Display
Blue Display
White Display
Red, Green, Blue, White Display
Gradation brightness Display
LGE Internal Use Only
- 01 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
10. HIDDEN MENU
S3D LCD Test
3D LCD Test
RTC test
LGE Internal Use Only
- 0 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
10. HIDDEN MENU
Ring test
Touch window test
Write with finger
Vibrator test
A case-by-state vibration tests
LGE Internal Use Only
- 03 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
10. HIDDEN MENU
Wifi Scan test
Gyro Cal Test
Gyroscope calibration
EMI Test
Display EMI
LGE Internal Use Only
- 04 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
10. HIDDEN MENU
HDMI output Test
Using HDMI output
HDMI Test
Display HDMI
Touch LED Brightness
LGE Internal Use Only
- 05 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
10. HIDDEN MENU
Gesture Test
Audio Loop Back Test
Mic & Speak Phone loop Back test
ELT Test
Automatic Mode: Test Automatically
Manual Mode : Test selectivity
LGE Internal Use Only
- 06 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
10. HIDDEN MENU
ELT Test
Automatic Mode : LCD Automatic on/off test
- & gt; time setting
ELT Manual Test
LCD Backlight
Ringtone
Vibrator
Camera
Audio Loopback
- & gt; test on the device is working
(The ability to use plant)
SW Sanity Test
FPRI Test
CRC Test: BIN CRC
CAL CRC
EFS CRC
EFS CRC Detail
LGE Internal Use Only
- 07 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
10. HIDDEN MENU
Factory Reset
Format External SD card : External SD Card Data reset
Format Internal SD card : Internal SD Card Data reset
Factory Rest :Changing the Factory
Version Info
Classified Information representation
Module Test list
- BT DUT setting
- SMS Prefer set
- LCD Always ON
- Hidden Reset
- USB mode selection
- Reboot CP/AP
- Stability Test
- Charging Test
- FOTA Test
- Crash Handling
- SMPL Setting
- SMPL count
- Wakelock Monitoring Setting
LGE Internal Use Only
- 08 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
10. HIDDEN MENU
WLAN Test
WLAN performance on SW
ERS Menu
Contacts Test
LGE Internal Use Only
- 09 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
10. HIDDEN MENU
Contacts Test
Aging Test
Port Setting
Select - & gt; OK
kR Setting
- & gt; Select OK
LGE Internal Use Only
- 10 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
10. HIDDEN MENU
Log service
Browser Utility
AT Test
LGE Internal Use Only
- 11 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
10. HIDDEN MENU
Modem Setting
Menu:
Engineering Mode
Band Selection
Auto Call Answering
RRC Version Setting
QCRIL/Android Log On/Off
PDP Setting
HSDPA Category
GSM A5 Algorithm
Protocol Test
GCF Flag
Arm9 Log ON/Off
GPS Test
GPS HW Test
LGE Internal Use Only
- 1 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
10. HIDDEN MENU
SMS Test
- & gt; Automatic Memfull Test
DRM Test
Call Test
VC Auto answer
- & gt; Select Disable or Enable
LGE Internal Use Only
- 13 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
10. HIDDEN MENU
MMS Test
WPS test
Network Mode
LGE Internal Use Only
- 14 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
10. HIDDEN MENU
Network Mode
Preferred networks
FM radio Test
Input the Freq. & Volume
LGE Internal Use Only
- 15 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
10. HIDDEN MENU
Development Menu Setting
For monkey cage test
VT memu
Connectivity Test
LGE Internal Use Only
- 16 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
10. HIDDEN MENU
TouchArea Setting
Fake Language
LGE Internal Use Only
- 17 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
ACQ00
MCQ00
MJN00
SVLM00
EBR01
SVCY00
MBG01
ADV00
EBR02
SUMY00
EBP00
SWCC00
MEG00
SURY00
EBR04
MBG02
MBG00
MCQ02
MCQ01
EBR03
SUMY00
ACQ02
ACQ01
MBL01
EBR00
EAX01
MBK02
MBL00
EAX00
MBK03
GMEY01
MBK00
MBK04
MBK01
EBR05
GMZZ00
EAA00
EAC00
LGE Internal Use Only
GMEY00
- 218 -
Location
EBR00
MBK00
MBK01
MBK02
EAX00
MBK03
EAX01
MBK04
EBR01
SUMY00
EBR02
EBR03
EBR04
SUMY00
SVCY00
SVLM00
SWCC00
ADV00
GMEY00
MBG00
MBG01
MBG02
MCQ00
MCQ01
MCQ02
MEG00
MJN00
SURY00
EBP00
ACQ00
ACQ01
EAA00
MBL00
MBL01
EBR05
GMEY01
GMZZ00
EAC00
ACQ02
Description
PCB Assembly,Main
Can,Shield
Can,Shield
Can,Shield
PCB,Sidekey
Can,Shield
PCB,Sidekey
Can,Shield
PCB Assembly,Flexible
Microphone,Condenser
PCB Assembly,Flexible
PCB Assembly,Flexible
PCB Assembly,Flexible
Microphone,Condenser
Camera Module
LCD,Module-TFT
Cable,Assembly
Frame Assembly
Screw,Machine
Button
Button
Button
Damper,LCD
Damper
Damper
Holder
Tape
Receiver
Camera Module
Cover Assembly,Front
Cover Assembly,Rear
Antenna Assembly
Cap,Receptacle
Cap,Receptacle
PCB Assembly,Flexible
Screw,Machine
Screw,Machine
Rechargeable Battery,Lithium Ion
Cover Assembly,Battery
Copyright (C) 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
11
12.2 Replacement Parts
& lt; Mechanic component & gt;
Level
Location No.
Description
Note: This Chapter is used for reference, Part order is
ordered by SBOM standard on GCSC
PartNumber
Spec
1
AGQ000000 Phone Assembly
AGQ86509311
LGP920.ANEUML ML:Metal Black UADS : refer to
AGQ86509301
2
MEZ002100 Label, Approval
MLAA0062316
COMPLEX GU280 OREBK ZZ:Without Color
COMPLEX, (empty), , , , ,
2
ACQ100400
Cover Assembly,
EMS
ACQ85692012
LGP920.ANEUML ML:Metal Black -
3
EBR00
PCB Assembly,
Main
EBR73661711
LGP920.ANEUML 1.0 Main
4
EBR071800
PCB Assembly,
Main, SMT
EBR73661811
LGP920.ANEUML 1.0 Main
5
EBR071600
PCB Assembly,
Main,
SMT Bottom
EBR72793001
LGP920.ASFRZY 1.1 MAIN
6
MBK00
Can, Shield
MBK62874201 PRESS CU 0.2 LGP920.ASFRZY ZZ:Without Color -
6
BAT800
Capacitor Assembly
SMZY0023501
6
MBK01
Can, Shield
MBK63032501 PRESS STS 304 0.2mm LGP920.ASFRZY SV:Silver -
5
EBR071700
PCB Assembly,
Main,
SMT Top
EBR72793201
LGP920.ASFRZY 1.1 MAIN
6
EAX010000
PCB, Main
EAX63973701
LGP920.ASFRZY 1.1 FR-4 Any Layer 10 0.75 MAIN
6
MBK02
Can, Shield
Remark
MBK62874001 PRESS CU 0.2 LGP920.ASFRZY ZZ:Without Color MLAZ0038301
COMPLEX LG-VX6000 ZZ:Without Color PID Label 4
Array PRINTING,
PCB Assembly,
Main, Insert
EBR74043701
LGP920.AGBRML 1.1 Main
PCB, Sidekey
EAX64050301
LGP920.ASFRZY E POLYI Multi 2 0.18 SIDEKEY
5
MEZ000000 Label
4
EBR071500
5
EAX00
LGE Internal Use Only
PAS311HR-VG1 3.8 Backup Capacitor 0.03F, Module
Assembly, KOREA TAIYO YUDEN.CO., LTD.
- 19 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location No.
5
MBK03
5
EAX01
Description
PartNumber
Spec
Can, Shield
MBK62874101
PRESS STS 0.15 LGP920.ASFRZY ZZ:Without Color
-
PCB, Sidekey
EAX64144001
LGP920.AGBWBK 1.0 POLYI Double 2 0.18 Sidekey
5
MEV000000 Insulator
MEV63895901 COMPLEX LGP920.ASFRZY ZZ:Without Color -
5
MEV000001 Insulator
Remark
MEV63896101 COMPLEX LGP920.ASFRZY ZZ:Without Color -
Can, Shield
MBK63052601
PRESS STS 304 0.2 LGP920.ASFRZY ZZ:Without
Color -
6
MBK070300 Can, Shield
MBK62873901
PRESS STS 0.15 LGP920.ASFRZY ZZ:Without Color
-
6
MJN000001
Tape
MJN67868301
COMPLEX LGP920.ASFRZY ZZ:Without Color -
6
MJN000000
Tape
MJN67832201
COMPLEX LGP920.ASFRZY ZZ:Without Color -
5
RAA050100
Resin, PC
BRAH0001301 UF-1060
3
ACQ003400
Cover Assembly,
Bar
ACQ85692101
LGP920.AGBRML ML:Metal Black -
4
EBR01
PCB Assembly,
Flexible
EBR74043801
LGP920.AGBRML 1.0 Flexible
5
EBR070400
PCB Assembly,
Flexible, SMT
EBR74043901
LGP920.AGBRML 1.0 Flexible
6
EBR070300
PCB Assembly,
Flexible,
SMT Top
EBR74044101
LGP920.AGBRML 1.0 Flexible
7
EAX010700
PCB, Flexible
EAX63975101
LGP920.ASFRZY 1.1 POLYI Multi 5 - FLEXIBLE
7
SUMY00
Microphone,
Condenser
SPU0410HR5H -PB SPU0410HR5H -PB, UNIT, 42
SUMY0010609 dB, 3.76*2.95*1.1, mems smd mic KNOWLES
ACOUSTICS
6
EBR070200
PCB Assembly,
Flexible,
SMT Bottom
EBR74044001
LGP920.AGBRML 1.0 Flexible
4
EBR02
PCB Assembly,
Flexible
EBR74044201
LGP920.AGBRML 1.0 Flexible
5
EBR070400
PCB Assembly,
Flexible, SMT
EBR74044301
LGP920.AGBRML 1.0 Flexible
6
EBR070300
PCB Assembly,
Flexible,
SMT Top
EBR74044501
LGP920.AGBRML 1.0 Flexible
5
MBK04
LGE Internal Use Only
- 0 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location No.
7
EAX010700
PCB, Flexible
EAX64142901
LGP920.ASFRZY C POLYI Multi 3 - Flexible
6
EBR070200
PCB Assembly,
Flexible,
SMT Bottom
EBR74044401
LGP920.AGBRML 1.0 Flexible
4
EBR03
PCB Assembly,
Flexible
EBR74044601
LGP920.AGBRML 1.0 Flexible
5
EBR070400
PCB Assembly,
Flexible, SMT
EBR74044701
LGP920.AGBRML 1.0 Flexible
6
EBR070200
PCB Assembly,
Flexible,
SMT Bottom
EBR74044801
LGP920.AGBRML 1.0 Flexible
6
EBR070300
PCB Assembly,
Flexible,
SMT Top
EBR74044901
LGP920.AGBRML 1.0 Flexible
7
EAX010700
PCB, Flexible
EAX64132001
LGP920.ASFRZY 1.1 POLYI Double 2 0.18 Flexible
4
EBR04
PCB Assembly,
Flexible
EBR74045001
LGP920.AGBRML 1.0 Flexible
5
EBR070400
PCB Assembly,
Flexible, SMT
EBR74045101
LGP920.AGBRML 1.0 Flexible
6
EBR070300
PCB Assembly,
Flexible,
SMT Top
EBR74045301
LGP920.AGBRML 1.0 Flexible
7
EAX010700
PCB, Flexible
EAX63975001
LGP920.ASFRZY 1.0 POLYI Multi 4 0.4 Flexible
7
SUMY00
Microphone,
Condenser
SPU0410HR5H -PB SPU0410HR5H -PB, UNIT, 42
SUMY0010609 dB, 3.76*2.95*1.1, mems smd mic KNOWLES
ACOUSTICS
6
EBR070200
PCB Assembly,
Flexible,
SMT Bottom
EBR74045201
LGP920.AGBRML 1.0 Flexible
4
SVCY00
Camera Module
SVCY0027901
LM08MIFF LM08MI VGA Aptina 1/11 " , MIPI I/F,
FPCB type, 90deg HANSUNG ELCOMTEC CO.,
LTD.
4
SVLM00
LCD, Module-TFT
LH430WV2-SD01 WVGA 4.3INCH 480X800 170CD
SVLM0043201 COLOR 70% 15/9 1000:1 60Hz Inverter N 3D LCD LG
Display Co. Ltd.
4
SWCC00
Cable, Assembly
SWCC0010601
80186-202B-80L 80 mm, LINE, 20311-011R_20311011R, H=2.0, I-PEX CO., LTD
4
ADV00
Frame Assembly
ADV73885501
LGP920.ASFRZY BK:Black -
LGE Internal Use Only
Description
PartNumber
Spec
- 1 -
Remark
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location No.
Description
PartNumber
Spec
5
MCQ009400 Damper, Camera
MCQ66476601 COMPLEX LGP920.ASFRZY ZZ:Without Color -
5
MCQ000000 Damper
MCQ66476501 COMPLEX LGP920.ASFRZY ZZ:Without Color -
5
MJN009401
Tape, Camera
MJN67697901
COMPLEX LGP920.ASFRZY ZZ:Without Color -
5
MJN000000
Tape
MJN67710501
COMPLEX LGP920.ASFRZY ZZ:Without Color -
5
MJN000001
Tape
MJN67889001
COMPLEX LGP920.ASFRZY ZZ:Without Color -
5
MJN000002
Tape
MJN67889101
COMPLEX LGP920.ASFRZY ZZ:Without Color -
5
MCQ000001 Damper
MCQ66671001 COMPLEX LGP920.ASFRZY ZZ:Without Color -
5
MDQ000000 Frame
MDQ62840301 COMPLEX LGP920.ASFRZY SV:Silver -
5
MJN009400
Tape, Camera
MJN67710401
COMPLEX LGP920.ASFRZY ZZ:Without Color -
4
GMEY00
Screw, Machine
GMEY0018101
GMEY0018101 FH + 1.4mM 1.5mM SWCH FZB N KUMGANG SCREW CO., LTD
4
MBG00
Button
MBG64110501
MOLD PC LUPOY SC-1004A LGP920.ASFRZY
BK:Black -
4
MBG01
Button
MBG64110601
MOLD PC LUPOY SC-1004A LGP920.ASFRZY
BK:Black -
4
MBG02
Button
MBG64110701
MOLD PC LUPOY SC-1004A LGP920.ASFRZY
BK:Black -
4
MCQ00
Damper, LCD
MCQ66476801 COMPLEX LGP920.ASFRZY BK:Black -
4
MCQ01
Damper
MCQ66720201
4
MCQ02
Damper
MCQ66726801 COMPLEX LGP920.ASFRZY BK:Black -
4
MEG00
Holder
MEG62719101 MOLD NBR LGP920.ASFRZY BK:Black -
4
MJN000000
Tape
MJN67808901
COMPLEX LGP920.ASFRZY ZZ:Without Color -
4
MJN00
MJN000005
Tape
MJN67880801
COMPLEX LGP920.ASFRZY ZZ:Without Color -
4
MJN000001
Tape
MJN67889201
COMPLEX LGP920.ASFRZY ZZ:Without Color -
4
SURY00
Receiver
BWBR1207L-04B-P 30mW 32OHM 105DB
SURY0010114 0HZTO0HZ WIRE - BUJEON ELECTRONICS CO.,
LTD
4
EBP00
Camera Module
EBP61302201
HSIS-LM58SNAFVS HSIS-LM58SNAFVS 5M AF
Dual Sony 1/4 CIS, MIPI, RFPCB 0degree HANSUNG
ELCOMTEC CO., LTD.
4
MJN000002
Tape
MJN67889301
Remark
COMPLEX LGP920.ASFRZY ZZ:Without Color -
LGE Internal Use Only
MOLD URETHANE LGP920.ASFRZY ZZ:Without
Color P920 Pad LCD Rubber
- -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location No.
4
ACQ00
Description
Cover Assembly,
Front
PartNumber
ACQ85371101
Spec
Remark
LGP920.ASFRZY BK:Black -
5
MCQ000001 Damper
MCQ66723401 COMPLEX LGP920.ASFRZY ZY:Color Unfixed -
5
MJN000001
Tape
MJN67901801
COMPLEX LGP920.ASFRZY ZZ:Without Color -
5
MJN000000
Tape
MJN67787901
COMPLEX LGP920.ASFRZY ZZ:Without Color -
5
MJN020801
Tape, Decor
MJN67787801
COMPLEX LGP920.ASFRZY ZZ:Without Color -
5
MJN020800
Tape, Decor
MJN67787701
COMPLEX LGP920.ASFRZY ZZ:Without Color -
5
MEG000001 Holder
MEG62719001 MOLD NBR LGP920.ASFRZY BK:Black -
5
MEG000000 Holder
MEG62706101 MOLD NBR LGP920.ASFRZY BK:Black -
5
MEA000000 Guide
MEA62590801
MOLD PC LGP920.ASFRZY ZZ:Without Color light
plate
5
MDJ000000
MDJ63124501
COMPLEX LGP920.ASFRZY ZZ:Without Color -
5
MCR000002 Decor
MCR64356501 PRESS STS 304 0.3 LGP920.ASFRZY BK:Black -
5
MCQ000000 Damper
MCQ66687601 COMPLEX LGP920.ASFRZY ZZ:Without Color -
5
MCQ009400 Damper, Camera
MCQ66627301 COMPLEX LGP920.ASFRZY ZZ:Without Color -
5
MCQ074200 Damper, Speaker
MCQ66627201 COMPLEX LGP920.ASFRZY ZZ:Without Color -
5
MCK032700 Cover, Front
MCK66589601 MOLD PC LGP920.ASFRZY BK:Black -
6
MET099500 INSERT, NUT
MICE0016909
5
MCR000000 Decor
MCR64367501 MOLD PC+ABS LGP920.ASFRZY BK:Black -
5
MCR000001 Decor
MCR64367401 MOLD PC+ABS LGP920.ASFRZY BK:Black -
5
EBD030100
Touch Window
Assembly
EBD61005201
S09CL04301B CAPACITIVE TOUCH G/G Synaptics
Gen3 4.3 BB - Kyoshin Technosonic(Korea)Co., LTD.
5
MDJ000001
Filter
MDJ63124401
COMPLEX LGP920.ASFRZY ZZ:Without Color -
4
MEZ000000 Label
MLAZ0038303
COMPLEX LG-LC3200 WA:White PRINTING, PPRI
PRINTING
4
MJN000006
Tape
MJN67928901
COMPLEX LGP920.ASFRZY ZZ:Without Color -
4
MJN000004
Tape
MJN67905401
COMPLEX LGP920.ASFRZY ZZ:Without Color -
4
MJN000003
Tape
MJN67902001
COMPLEX LGP920.ASFRZY ZZ:Without Color P920
USP Film, Europe
LGE Internal Use Only
Filter
MECH_COMMON ZY, ZZ, PRESS, STS, , , , ,
- 3 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location No.
Description
PartNumber
Spec
3
ACQ01
Cover Assembly,
Rear
ACQ85531901
LGP920.ASFRZY BK:Black -
4
EAA00
Antenna Assembly
EAA62609302
P920-MODULE-LAIRD LGP925.AATTDB Black Black
Black LAIRD TECHNOLOGIES KOREA
4
ACW000000 Decor Assembly
ACW73637101 LGP920.ASFRZY ZZ:Without Color -
5
MCQ000000 Damper
MCQ66627401 COMPLEX LGP920.ASFRZY ZZ:Without Color -
5
MJN000001
Tape
MJN67853301
COMPLEX LGP920.ASFRZY ZZ:Without Color -
5
MJN000000
Tape
MJN67788101
COMPLEX LGP920.ASFRZY ZZ:Without Color -
5
MCR000000 Decor
MCR64367601 CASTING AL LGP920.ASFRZY SV:Silver -
5
MJN009400
Tape, Camera
MJN67788001
COMPLEX LGP920.ASFRZY ZZ:Without Color -
4
MBL00
Cap, Receptacle
MBL64823201
MOLD PC LUPOY SC-1004A LGP920.ASFRZY
BK:Black -
4
MBL01
Cap, Receptacle
MBL64837601
Remark
MOLD PC LUPOY SC-1004A LGP920.ASFRZY
BK:Black MOLD PC LUPOY SC-1004A LGP920.ASFRZY
BK:Black GF 10%
4
MCK063300 Cover, Rear
MCK66589801
4
MCQ000000 Damper
MCQ66627501 COMPLEX LGP920.ASFRZY ZZ:Without Color -
4
MCQ000001 Damper
MCQ66627601 COMPLEX LGP920.ASFRZY ZZ:Without Color -
4
MCQ000003 Damper
MCQ66627701 COMPLEX LGP920.ASFRZY ZZ:Without Color -
4
MCQ000002 Damper
MCQ66627801 COMPLEX LGP920.ASFRZY ZZ:Without Color -
4
MCQ000004 Damper
MCQ66627901 COMPLEX LGP920.ASFRZY ZZ:Without Color -
4
MCQ000005 Damper
MCQ66628001 COMPLEX LGP920.ASFRZY ZZ:Without Color -
4
MCQ000006 Damper
MCQ66650901 COMPLEX LGP920.ASFRZY ZZ:Without Color -
4
EAA030100
PIFA Antenna,
Multiple
EAA62546001
ACB-00103 DUAL -2DB 3:1 Planar Inverted F Type MOBITECH CORPORATION
4
MEZ000900
Label,
After Service
MLAB0001102
COMPLEX C2000 CGRSV WA:White C2000 USASV
DIA 4.0 PRINTING,
4
MKC009400 Window, Camera
MKC63903301
CUTTING SODA LIME GLASS LGP920.ASFRZY
ZZ:Without Color -
4
MGJ000000 Plate
MGJ63003001
COMPLEX LGP920.ASFRZY BK:Black -
4
MFB029600 Lens, Flash
MFB62473601
MOLD PMMA LGP920.ASFRZY ZZ:Without Color -
LGE Internal Use Only
- 4 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location No.
Description
PartNumber
Spec
3
EBR05
PCB Assembly,
Flexible
EBR74045401
LGP920.AGBRML 1.0 Flexible
4
EBR070400
PCB Assembly,
Flexible, SMT
EBR74045501
LGP920.AGBRML 1.0 Flexible
5
EBR070300
PCB Assembly,
Flexible,
SMT Top
EBR74045701
LGP920.AGBRML 1.0 Flexible
6
EAX010700
PCB, Flexible
EAX63974901
LGP920.ASFRZY G POLYI Multi 4 0.4 FLEXIBLE
5
EBR070200
PCB Assembly,
Flexible,
SMT Bottom
EBR74045601
LGP920.AGBRML 1.0 Flexible
3
GMEY01
Screw, Machine
GMEY0007902
GMEY0007902 CS + 2.7M 4.5M SWRH BLACK N A
KUMGANG SCREW CO., LTD
3
GMZZ00
Screw, Machine
GMZZ0017701
GMZZ0017701 BH + 1.4mM 3mM MSWR NI PLT N ASIA BOLT
1
AAD000000
Addition Assembly
AAD85849712
LGP920.ANEUML ML:Metal Black -
2
ACQ02
Cover Assembly,
Battery
ACQ85513201
LGP920.ASFRZY BK:Black LG-P920 ASFRZY, Cover
Assy Battery
3
MCR000000 Decor
MCR64356401 PRESS AL 0.3 LGP920.ASFRZY BK:Black -
3
MCK004100 Cover, Battery
MCK66590101
MOLD PC LUPOY SC-1004A LGP920.AGBRML
ML:Metal Black GF10%
3
MGJ000000 Plate
MGJ63107801
COMPLEX LGP920.ASFRZY ZZ:Without Color -
3
MJN000000
Tape
MJN67907401
COMPLEX LGP920.ASFRZY ZZ:Without Color -
2
EAD010000
Cable, Assembly
EAD61875101
LG0050 USB USB 1.2M 5pin BLACK halogen free N
ningbo broad telecommunication co., ltd
1
AGF000000
Package Assembly
AGF76258517
LGP920.ANEUML ZZ:Without Color
LGP920_COSMO1 NEU Palletizing_700ea
2
MAY084000 Box, Unit
MAY65193101
COMPLEX LGP920.ACISML ZZ:Without Color
COSMO 1_H/Case Upper_LG-P920_Small ENG_EU
STD / CIS
2
MAY084001 Box, Unit
MAY65193102
COMPLEX LGP920.ACISML ZZ:Without Color
COSMO 1_H/Case Lower_LG-P920_Small ENG_EU
STD / CIS
2
MAY047100 Box, Master
MAY65217301
Remark
COMPLEX LGP920.AFRAML ZZ:Without Color
COSMO 1 M/Box_LGP920_None_EU STD / CIS
LGE Internal Use Only
- 5 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location No.
Description
PartNumber
Spec
2
MEZ084100 Label, Unit Box
MEZ64160701
COMPLEX LGP920.ADEUML ZZ:Without Color
COSMO_USP Label_LGP920_ENG_ENG STD
2
MEZ003500 Label, Barcode
MEZ64187101
COMPLEX LGP920.ADEUML ZZ:Without Color -
2
MEZ047200 Label, Master Box
MLAJ0004402
PRINTING CG300 CGR DG ZZ:Without Color LABEL
MASTER BOX(for CGR TDR 2VER. mbox_label) GSM
standard_master box label
2
MEZ000000 Label
MLAZ0050901
COMPLEX KU990.AGBRBK ZZ:Without Color Battery
W arning Label (Lithium ion Battery Label)
2
AGJ000000
Pallet Assembly
AGJ73398303
LGP920.ADEUML ZZ:Without Color COSMO1
NEU_Body 1200*800(9501)_700ea
3
MBL007000
Cap, Box
MCCL0001710 COMPLEX LGP920.ANLDML ZZ:Without Color 2/700
3
MAY010800 Box, Carton
MBEC0003012 COMPLEX LGP920.ANLDML ZZ:Without Color 1/700
3
MGA000000 Pallet
MPCY0009501
Remark
LGE Internal Use Only
COMPLEX G7100 ORUBK BK:Black PALLET(G7100
for Orange UK_EUR) COMPLEX,
- 6 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
12.2 Replacement Parts
11
& lt; Main component & gt;
Note: This Chapter is used for reference, Part order is
ordered by SBOM standard on GCSC
Level
Location No.
Description
PartNumber
6
L113
Inductor, Multilayer,
Chip
ELCH0001048
1005GC2T10NJLF 10NH 5% - 250mA 0.42OHM
2.5GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
PILKOR ELECTRONICS LTD.
6
C211
Capacitor, Ceramic,
Chip
ECZH0000822
C1005C0G1H1R5CT000F 1.5pF 0.25PF 50V NP0 55TO+125C 1005 R/TP - TDK KOREA
COOPERATION
6
C244,
C247
Capacitor, Ceramic,
Chip
ECCH0006201
C1608X5R0J475KT000N 4.7uF 10% 6.3V X5R 55TO+85C 1608 R/TP - TDK CORPORATION
6
C1209,
C1210,
C1211,
C227,
C835,
C836,
C842,
C890,
C934,
C935
Capacitor, Ceramic,
Chip
CL05A225MP5NSNC 2.2uF 20% 10V X5R ECCH0007804 55TO+85C 1005 R/TP 0.5MM SAMSUNG
ELECTRO-MECHANICS CO., LTD.
6
C1107,
C1173,
C1204,
C1205,
C1206,
C1207,
C1208,
C1832,
C1901,
C1902,
C1905,
C193,
C241,
C245,
C250,
C659,
C665
Capacitor, Ceramic,
Chip
ECCH0004904
6
C1201
Capacitor, Ceramic,
Chip
GRM188R60J106M 10000000 pF, 6.3V, M, X5R, TC,
ECCH0005604 1608, R/TP, 0.8 mm MURATA MANUFACTURING
CO., LTD.
LGE Internal Use Only
Spec
Remark
GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C
1005 R/TP - MURATA MANUFACTURING CO., LTD.
- 7 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location No.
Description
PartNumber
6
C1101,
C1102,
C1103,
C1106,
C1121,
C1831,
C1923,
C891,
C975,
C978
Capacitor, Ceramic,
Chip
ECZH0001215
C1005X5R1A105KT000F 1uF 10% 10V X5R 55TO+85C 1005 R/TP - TDK KOREA
COOPERATION
6
R811
Resistor, Chip
ERHZ0000318
MCR01MZP5F8062 80.6KOHM 1% 1/16W 1005 R/TP
- ROHM.
6
C1122,
C1137
Capacitor, Ceramic,
Chip
ECZH0003503
GRM188R61E105K 1uF 10% 25V X5R -55TO+85C
1608 R/TP - MURATA MANUFACTURING CO., LTD.
6
C1812,
C1815,
C1816,
C1817,
C1818,
C1822,
C209,
C230,
C231,
C249,
C924,
C927,
C937
Capacitor, Ceramic,
Chip
CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R ECCH0000198 55TO+85C 1005 R/TP . SAMSUNG ELECTROMECHANICS CO., LTD.
6
R1803
Resistor, Chip
ERHZ0000220
MCR01MZP5F1501 1.5KOHM 1% 1/16W 1005 R/TP ROHM.
6
C115,
C1814,
C185,
C801,
C858
Capacitor, Ceramic,
Chip
ECCH0009106
C0603X7R1C103KT 10nF 10% 10V X7R 55TO+125C 0603 R/TP - TDK CORPORATION
6
R1176,
R801,
R802
Resistor, Chip
ERHY0009505
MCR006YZPJ103 10KOHM 5% 1/20W 0603 R/TP ROHM.
6
C105,
C1932,
C1936,
L1802
Capacitor, Ceramic,
Chip
ECZH0000813
C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C
1005 R/TP - TDK KOREA COOPERATION
6
R1125
Resistor, Chip
ERHY0009555
MCR006YZPF1202 12KOHM 1% 1/20W 0603 R/TP ROHM.
LGE Internal Use Only
Spec
- 8 -
Remark
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location No.
6
ZD1172,
ZD1181,
ZD1182,
ZD1224,
ZD1225
6
Description
PartNumber
Spec
Diode, TVS
EDTY0010101
ESD9B5.0ST5G ESD9B5.0ST5G, SOD-923, 5 V, 300
mW, R/TP, 15pF SCG HONG KONG SAR LTD.
L131
Inductor, Multilayer,
Chip
ELCH0001411
LL1005-FHL1N2S 1.2NH 0.3NH - 400mA 0.1OHM
16GHZ 7 SHIELD NONE 1.0X0.5X0.5MM R/TP
TOKO, INC.
6
C1228,
C1235,
C1241,
C1252,
C192,
C243,
C248,
C901,
C902,
C903,
C904,
C905
Capacitor, Ceramic,
Chip
CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R ECCH0017601 55TO+85C 1005 R/TP 0.5MM SAMSUNG
ELECTRO-MECHANICS CO., LTD.
6
U1121
IC, DC, DC
Converter
EUSY0430301
LM3528TMX 2.5 to 5.5V adj 0W CSP R/TP 12P NATIONAL SEMICONDUCTOR ASIA PACIFIC PTE.
LTD.
6
C114,
C1174
Capacitor, Ceramic,
Chip
ECCH0009506
MCH032A270JK 27pF 5% 25V NP0 -55TO+125C
0603 R/TP - ROHM.
6
R1190,
R1191,
R896,
R897
PCB ASSY,
MAIN,
PAD OPEN
SAFO0000401
AX3100 ATL SV_SHIPBACK, MAIN, A, 0OHM DNI
6
R1102,
R1103,
R510,
R511
Resistor, Chip
ERHY0009511
MCR006YZPJ152 1.5KOHM 5% 1/20W 0603 R/TP ROHM.
6
L179
Inductor, Multilayer,
Chip
ELCH0003847
LQG15HS1N8S02D 1.8NH 0.3NH - 300mA 0.1OHM
6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
MURATA MANUFACTURING CO., LTD.
ALM-2712 0DBM 14.2DB 0% 0A 200mA 0DB 80DBM
1.26DBM 0P 3.0x2.5x1.0MM - AVAGO
SMZY0027801
TECHNOLOGIES INTERNATIONAL SALES PTE.
LIMITED
6
U1801
Module, RF
Amplifier
6
U975
IC, Magnetic Sensor
EBD60985501
6
C187
Capacitor, Ceramic,
Chip
Remark
GRM033R61A472K 4700pF 10% 10V X5R ECCH0009228 55TO+85C 0603 R/TP - MURATA
MANUFACTURING CO., LTD.
LGE Internal Use Only
AMI306 1.7 to 3.6V - QFN R/TP 8P - AICHI STEEL
CORPORATION
- 9 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location No.
Description
6
C1141,
C1229,
C1236,
C1904,
C1906,
C1908,
C1909,
C1910,
C225,
C688,
C892,
C923
Capacitor, Ceramic,
Chip
CL03A105MQ3CSNH 0.000001F 20% 6.3V X5R ECCH0017301 45TO+85C 0603 R/TP - SAMSUNG ELECTROMECHANICS CO., LTD.
6
FB1812,
FB1815,
FB1817,
FB1818
Filter, Bead
EAM62150301
6
C221,
C976
Capacitor, Ceramic,
Chip
MCH153CN103KK 10nF 10% 16V X7R -55TO+125C
ECCH0000155 1005 R/TP - ROHM Semiconductor KOREA
CORPORATION
6
C1143
Capacitor, Array
EAE62463801
GNM0M2R60J105ME18D 1uF2 20% 6.3V 2R SMD
R/TP 4P MURATA MANUFACTURING CO., LTD.
6
C1171,
C189,
C913,
C914
Capacitor, Ceramic,
Chip
ECZH0025920
GRM033R71C102K 1nF 10% 16V X7R -55TO+125C
0603 R/TP - MURATA MANUFACTURING CO., LTD.
6
R1905,
R894,
R895,
R919,
R921
PCB ASSY, MAIN,
PAD SHORT
SAFP0000401
LG-LU3000 LGTBK, MAIN, A,
6
X1821
Oscillator, TCXO
EXST0002501
KT2520F26000ACW18TAK 26 MHz, 2 PPM, 10 pF,
SMD, 2.5*2.0*0.8, 2ppm, 26, 1.8V, 2.5, 2.0, 0.8, SMD,
R/TP KYOCERA CORP.
6
CN800
Connector, Terminal
Block
EAG62832401
04-9254-003-037-037-829+ 3P 2.50MM ANGLE SMD
T/REEL - KYOCERA ELCO KOREA SALES CO.,
LTD.
LGE Internal Use Only
PartNumber
Spec
Remark
CIM05J600NC 60 ohm 1.0X0.5X0.5 25% 0.2 ohm
0.65A SMD R/TP 2P 0 SAMSUNG ELECTROMECHANICS CO., LTD.
- 30 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location No.
Description
PartNumber
6
C1134,
C1175,
C1176,
C1230,
C1231,
C1232,
C1233,
C1234,
C1237,
C1253,
C173,
C1802,
C1903,
C1907,
C191,
C1911,
C1912,
C1913,
C1914,
C1915,
C194,
C200,
C201,
C202,
C203,
C204,
C206,
C207,
C208,
C251,
C301,
C609,
C610,
C626
Capacitor, Ceramic,
Chip
ECCH0009101
C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R 55TO+85C 0603 R/TP - TDK CORPORATION
6
C646,
C654,
C655,
C915,
C916,
C917,
C918,
C919,
C920,
C921,
C922,
C925,
C928,
C929,
C930,
C931,
C932,
C938,
C939
Capacitor, Ceramic,
Chip
ECCH0009101
C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R 55TO+85C 0603 R/TP - TDK CORPORATION
LGE Internal Use Only
Spec
- 31 -
Remark
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location No.
6
FB201
Filter, Bead
EAM62070801
BLM15EG221SN1D 220 ohm 1.0X0.5X0.5 25% 0.28
ohm 0.7A SMD R/TP 2P 0 MURATA
MANUFACTURING CO., LTD.
6
D1122
Diode, Switching
EDSY0011901
SDB310Q 340mV 30V 200mA 1A 0SEC 150mW
EMD2 R/TP 2P 1 AUK CORP
6
FL111
Filter Separator
SFAY0015301
BGSF18DM20 800, 1900, 1.0 dB, 1.0 dB, 25 dB, 25
dB, 3226, 3228Size INFINEON TECHNOLOGIES
(ASIA PACIFIC) PTE LTD.
6
R1134,
R1174
Resistor, Chip
ERHY0009547
MCR006YZPF2003 200KOHM 1% 1/20W 0603 R/TP ROHM.
6
C1131,
C242
Capacitor, Ceramic,
Chip
CL10A475KP8NNNC 4.7uF 10% 10V X5R ECCH0007802 55TO+85C 1608 R/TP - SAMSUNG ELECTROMECHANICS CO., LTD.
6
C1178
Capacitor, Ceramic,
Chip
GRM033R71C471K 470pF 10% 16V X7R ECCH0009231 55TO+125C 0603 R/TP - MURATA
MANUFACTURING CO., LTD.
6
L1807,
L1810,
L1926
Inductor, Multilayer,
Chip
ELCH0003831
LQG15HS1N0S02D 1NH 0.3NH - 300mA 0.07OHM
10GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
MURATA MANUFACTURING CO., LTD.
6
C1138
Capacitor, Ceramic,
Chip
ECZH0003504
GRM188R71E104K 100nF 10% 25V X7R 55TO+125C 1608 R/TP - MURATA
MANUFACTURING CO., LTD.
6
C800
Capacitor, Ceramic,
Chip
ECCH0009103
C0603C0G1H101JT00NN 100pF 5% 50V X7R 55TO+125C 0603 R/TP - TDK CORPORATION
6
C1821
Capacitor, Ceramic,
Chip
ECCH0009216
GRM0335C1E220J 22pF 5% 25V X7R -55TO+125C
0603 R/TP - MURATA MANUFACTURING CO., LTD.
6
R521,
R522
Resistor, Chip
ERHY0009528
MCR006YZPJ474 470KOHM 5% 1/20W 0603 R/TP ROHM Semiconductor KOREA CORPORATION
6
L102,
L122,
L142,
L161
Inductor, Multilayer,
Chip
ELCH0003832
LQG15HS2N2S02D 2.2NH 0.3NH - 300mA - 0.12OHM 6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM
R/TP MURATA MANUFACTURING CO., LTD.
6
L127,
L137,
L213
Inductor, Multilayer,
Chip
ELCH0001403
LL1005-FHL1N0S 1NH 0.3NH - 400mA 0.1OHM
20GHZ 7 SHIELD NONE 1.0X0.5X0.5MM R/TP
TOKO, INC.
6
U181
IC, RF Transceiver,
3G
EUSY0432901
PMB5712 XMM6260 RFIC , ; , IC, Tx/Rx WFWLB
R/TP 138P INFINEON TECHNOLOGIES (ASIA
PACIFIC) PTE LTD.
LGE Internal Use Only
Description
PartNumber
Spec
- 3 -
Remark
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location No.
Description
PartNumber
Spec
6
U1901
IC, WiFi
EUSY0378501
6
C1916,
C308,
C310,
C311,
C936
Capacitor, Ceramic,
Chip
GRM033R60J224M 0.00000022F 20% 6.3V X5R ECCH0032801 55TO+85C 0603 R/TP 0.3MM MURATA
MANUFACTURING CO., LTD.
6
U891
IC, Fuel Gauge
EAN61958601
MAX17043G 2.5 to 4.5V Vbat 0W DFN R/TP 8P MAXIM INTEGRATED PRODUCTS INC.
6
L1131
Inductor, Wire
Wound, Chip
ELCP0008019
VLS252010ET- 4R7M 4.7UH 20% - 800mA
0.332OHM - - NON SHIELD 2.5X2X1MM NONE TDK CORPORATION
Filter, Saw
SFSY0035004
B9469 2140 MHz, 1.4*1.1*0.45, SMD, 2110M~2170M,
IL 2.5, 5pin, U-B, 50-100, BAND I DIVERSITY,
2140MHz, 1.4*1.1*0.45, SMD, R/TP EPCOS PTE
LTD.
Connector, BtoB
ENBY0057501
Remark
24-5804-034-000-829+ 34, 0.4 mm, STRAIGHT, gold,
34, 0.40MM, STRAIGHT, FEMALE, SMD, 0.9T,
KYOCERA ELCO KOREA SALES CO., LTD.
1005GC2T2N7SLF 2.7NH 0.3NH - 300mA 0.17OHM
5.5GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
PILKOR ELECTRONICS LTD.
WL1271BYFFR 0VTO0V 0W 137P - WLCSP R/TP
137P TEXAS INSTRUMENTS KOREA LTD,
HONGKONG BRANCH.
6
FL211
6
CN1161,
CN1171
6
L176,
L211,
L212
Inductor, Multilayer,
Chip
ELCH0001056
6
C803
Capacitor, Ceramic,
Chip
GRM0335C1E6R0D 6pF 0.5PF 25V X7R ECCH0009213 55TO+125C 0603 R/TP - MURATA
MANUFACTURING CO., LTD.
6
VA1102,
VA1104,
VA901,
VA902,
VA903
Varistor
SEVY0008901
ICVS0318150FR 18V 0% 15pF 0.6*0.3*0.33 NONE
SMD R/TP INNOCHIPS TECHNOLOGY
6
L244,
L247,
L249
Inductor, Wire
Wound, chip
ELCP0008014
MIPSZ2012D4R7 MIPSZ2012D4R7, 4.7 uH, N,
2.0X1.2X1.0, R/TP FDK CORPORATION.
6
FL1141,
FL1142,
FL1221,
FL1222,
FL1223
Filter, EMI/Power
SFEY0015901
ICMEF214P101MFR ICMEF214P101MFR, SMD,
ESD Common mode Filter INNOCHIPS
TECHNOLOGY
6
PT301
Thermistor, NTC
SETY0006301
NCP15XH103J03RC 10KOHM 5% 0V 0A 3.35KK
SMD P/TP 1005size MURATA MANUFACTURING
CO., LTD.
LGE Internal Use Only
- 33 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location No.
6
FB1173,
FB1175,
FB1176,
FB1177
Filter, Bead
SFBH0008102
BLM15HD182SN1D 1800 ohm 1.0X0.5X0.5 25% 2.2
ohm 0.2A SMD R/TP 2P 0 MURATA
MANUFACTURING CO., LTD.
6
U1131
IC, DC, DC
Converter
EAN61841601
TPS61093 1.6 to 6V adj 1.6W DFN R/TP 10P TEXAS INSTRUMENTS KOREA LTD, HONGKONG
BRANCH.
6
C116,
C117,
C121,
C132,
C151,
C163
Capacitor, Ceramic,
Chip
ECZH0000830
C1005C0G1H330JT000F 33pF 5% 50V NP0 55TO+125C 1005 R/TP - TDK KOREA
COOPERATION
6
Q1173
FET
EQFP0000101
2SJ347 P-CHANNEL MOSFET -20V -7 -0.05A
40OHM 100mW SSM R/TP 3P TOSHIBA
6
R514,
R515
Resistor, Chip
ERHY0009593
MCR006YZPJ272 2.7KOHM 5% 1/20W 0603 R/TP ROHM.
6
VA800
Varistor
SEVY0003601
ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55
NONE SMD R/TP INNOCHIPS TECHNOLOGY
6
U1108
IC, Level Translator
EUSY0391601
NLSV1T244-D 0.9~4.5V - LEVEL SHIFTER - R/TP 6P
- SCG HONG KONG SAR LTD.
6
R1136
Resistor, Chip
ERHZ0000296
MCR01MZP5F5103 510KOHM 1% 1/16W 1005 R/TP
- ROHM.
6
R892
Resistor, Chip
ERHZ0000204
MCR01MZP5F1003 100KOHM 1% 1/16W 1005 R/TP
- ROHM.
6
R186
Resistor, Chip
ERHY0009503
MCR006YZPJ101 100OHM 5% 1/20W 0603 R/TP ROHM.
6
CN1803,
CN1904
Contact
MCE62252901
COMPLEX LGP999BN ZZ:Without Color LG-P999
CLIP_SUB
6
C197,
C198,
C199,
C205
Capacitor, Ceramic,
Chip
GRM033R60J473KE19D 47nF 10% 6.3V X5R ECCH0009201 55TO+85C 0603 R/TP - MURATA
MANUFACTURING CO., LTD.
6
C153
Capacitor, Ceramic,
Chip
MCH155A220JK 22pF 5% 50V NP0 -55TO+125C
ECCH0000115 1005 R/TP - ROHM Semiconductor KOREA
CORPORATION
6
FB1174,
FB901,
FB913,
FB914,
FB941
Filter, Bead
SFBH0007101
LGE Internal Use Only
Description
PartNumber
Spec
Remark
BLM15AG121SN1D 120 ohm 1.0X0.5X0.5 25% 0.25
ohm 0.5A SMD R/TP 2P 0 MURATA
MANUFACTURING CO., LTD.
- 34 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location No.
Description
PartNumber
6
C1271,
C195,
C222,
C933,
C941
Capacitor, Ceramic,
Chip
EAE62286801
6
C1920
Capacitor, Ceramic,
Chip
MCH155CN152KK 1.5nF 10% 50V X7R -55TO+125C
ECCH0000145 1005 R/TP - ROHM Semiconductor KOREA
CORPORATION
6
L1923
Inductor, Multilayer,
Chip
ELCH0001034
HK1005 3N3S-T 3.3NH 0.3NH - 300mA 0.16OHM
6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP TAIYO
YUDEN CO., LTD
6
U1106,
U1831
IC, LDO Voltage
Regulator
EUSY0407101
BU28TD4WNVX SSON004, 4, R/TP, 2.8V 150mA
Single LDO, IC, LDO Voltage RegulatorIC, LDO Voltage
Regulator ROHM.
6
R1171,
R316
Resistor, Chip
ERHY0009526
MCR006YZPJ472 4.7KOHM 5% 1/20W 0603 R/TP ROHM.
6
SW102
Connector, RF
ENWY0008701
MS-156C NONE STRAIGHT SOCKET SMD T/REEL
AU 50OHM 400mDB HIROSE KOREA CO., LTD
6
L226
Inductor, Wire
Wound, chip
ELCP0009408
LQM2HPN1R0MG0 LQM2HPN1R0MG0, 1 uH, N,
2X2.5X1.0, R/TP, Chip power MURATA
MANUFACTURING CO., LTD.
6
C228
Capacitor, Ceramic,
Chip
ECCH0009230
GRM033R61A222K 2.2nF 10% 25V X5R -55TO+85C
0603 R/TP - MURATA MANUFACTURING CO., LTD.
6
L1803
Inductor, Multilayer,
Chip
ELCH0003818
LQG15HS9N1J02D 9.1NH 5% - 300mA 0.26OHM
3.4GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
MURATA MANUFACTURING CO., LTD.
6
C807,
C926
Capacitor, Ceramic,
Chip
CL03A474MQ3NNNH 0.47 uF, 6.3V, M, X5R, HD,
0603, R/TP, 0.0000047, 20%, 6.3V, X5R, -55TO+85C,
ECCH0034801
0603, R/TP, .3 mm SAMSUNG ELECTROMECHANICS CO., LTD.
6
R1802,
R500
Resistor, Chip
ERHY0009502
MCR006YZPJ100 10OHM 5% 1/20W 0603 R/TP ROHM.
6
FL627
Filter, EMI/Power
EAM62230801
NFM18PS105R0J3D_ EMI 0HZ 1uF 0H SMD R/TP
6.3V, 2A, 0.03ohm MURATA MANUFACTURING
CO., LTD.
6
C805
Capacitor, TA,
Conformal
ECTH0002703
TCTAL1A107M8R 0.0001F 20% 10V 50UA 55TO+125C 0OHM 3.2x1.6x1.1 NONE SMD R/TP
ROHM CO., LTD.
6
R1902
Resistor, Chip
ERHY0009554
MCR006YZPF2002 20KOHM 1% 1/20W 0603 R/TP ROHM.
LGE Internal Use Only
Spec
Remark
CL03A104KP3NNNC 0.0000001F 10% 10V X5R 55TO+85C 0603 R/TP 0.3 SAMSUNG ELECTROMECHANICS CO., LTD.
- 35 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location No.
6
U901
IC, Audio Codec
EUSY0424501
TWL6040 BGA, 120, R/TP, 6X6, OMAP4XXX, IC,
Audio Codec TEXAS INSTRUMENTS KOREA LTD,
HONGKONG BRANCH.
6
C1803
Capacitor, Ceramic,
Chip
ECCH0009109
C0603X7R1H331KT00NN 330pF 10% 50V X7R 55TO+125C 0603 R/TP - TDK CORPORATION
6
C226
Capacitor, Ceramic,
Chip
ECCH0005603
GRM188R61A225K 2.2uF 10% 10V X5R -55TO+85C
1608 R/TP - MURATA MANUFACTURING CO., LTD.
6
C172
Capacitor, Ceramic,
Chip
ECCH0000182
GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C
1005 R/TP - MURATA MANUFACTURING CO., LTD.
6
R1178
Resistor, Chip
ERHZ0000243
MCR01MZP5F2201 2.2KOHM 1% 1/16W 1005 R/TP ROHM.
6
L147,
L158,
L168
Inductor, Multilayer,
Chip
ELCH0001404
LL1005-FHL1N5S 1.5NH 0.3NH - 400mA 0.13OHM
15GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
TOKO, INC.
6
FB1143
Filter, Bead
SFBH0008101
BLM15AG601SN1D 600 ohm 1.0X0.5X0.5 25% 0.6
ohm 0.3A SMD R/TP 2P 0 MURATA
MANUFACTURING CO., LTD.
6
FL1171,
FL1172
Filter, EMI/Power
SFEY0016301
ICMEF112P900M COMMON MODE NOISE FILTER
0HZ 0F 0H SMD R/TP INNOCHIPS TECHNOLOGY
6
C188
Capacitor, Ceramic,
Chip
ECZH0001108
C1005X7R1E682KT000F 6.8nF 10% 25V X7R 55TO+125C 1005 R/TP - TDK KOREA
COOPERATION
6
D1175
Diode, TVS
EDTY0009801
VSMF05LCC 5V 6V 12V 2A 25W SOT-963 R/TP 6P 5
PROTEK DEVICES INC.
6
C1179,
C1212,
C223,
C224
Capacitor, Ceramic,
Chip
CL10A106MP8NNNC 10uF 20% 10V X5R ECCH0007803 55TO+85C 1608 R/TP 0.8MM SAMSUNG
ELECTRO-MECHANICS CO., LTD.
6
C1801
Capacitor, Ceramic,
Chip
ECZH0025917
6
C112
Capacitor, Ceramic,
Chip
MCH155A100D 10pF 0.5PF 50V NP0 -55TO+125C
ECCH0000110 1005 R/TP - ROHM Semiconductor KOREA
CORPORATION
6
C802
Capacitor, Ceramic,
Chip
ECCH0009514
MCH032A(AN)100DK 10pF 0.5PF 25V X7R 55TO+125C 0603 R/TP - ROHM.
6
CN1181
Connector, BtoB
ENBY0053601
24-5804-020-000-829+ 20P 0.40MM STRAIGHT
FEMALE SMD R/TP 900mM - KYOCERA ELCO
KOREA SALES CO., LTD.
LGE Internal Use Only
Description
PartNumber
Spec
Remark
GRM0335C1E470J 47pF 5% 25V NP0 -55TO+125C
0603 R/TP - MURATA MANUFACTURING CO., LTD.
- 36 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location No.
6
L1251
Inductor, Wire
Wound, chip
ELCP0008015
MIPSTZ2012D1R0 MIPSTZ2012D1R0, 1.0 uH, N,
2*1.25*0.8, R/TP FDK CORPORATION.
6
U220
IC, DC, DC
Converter
EUSY0264510
RF6560 2.9 to 5.1V adj 0W CSP R/TP 24P - RF
MICRO DEVICES INC
6
R1101,
R1126,
R1202,
R1271
Resistor, Chip
ERHY0009506
MCR006YZPJ104 100KOHM 5% 1/20W 0603 R/TP ROHM.
6
L110,
L215
Inductor, Multilayer,
Chip
ELCH0001035
HK1005 4N7S-T 4.7NH 0.3NH - 300mA 0.21OHM
4GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP TAIYO
YUDEN CO., LTD
6
U241
IC, MM PMIC
EUSY0264511
RF6590 CSP , 16 , R/TP , 3B, 2LDO, CSP,
1.732X1.722 , ; , IC, DC, DC Converter MICRO
DEVICES, INC.
6
C1132
Capacitor, Ceramic,
Chip
ECZH0003103
GRM36X7R104K10PT 100nF 10% 10V X7R 55TO+125C 1005 R/TP - MURATA
MANUFACTURING CO., LTD.
6
FL1901
Filter, Ceramic
SFCY0000901
LFB212G45SG8A166 BPF 2.45KHZ 100Hz SMD
R/TP 4P MURATA MANUFACTURING CO., LTD.
6
U1902
Module, WLAN
RF3482 TI WLAN WL1271 COB 3x3 SP3T + PAM +
SMZY0027002 DET + Balun + Tx Filter, RF Module RF MICRO
DEVICES INC
6
C109,
C1808
Capacitor, Ceramic,
Chip
GRM1555C1H1R8C 1.8pF 0.25PF 50V NP0 ECCH0000183 55TO+125C 1005 R/TP - MURATA
MANUFACTURING CO., LTD.
6
U121
Filter, Multiplexer
EAM62070401
B40761DY2045L Duplexer Bank for UE2j,
Band1/2/4/5/8+DCS1800, 10.4*3.6*1.0 KOREA
TAIYO YUDEN.CO., LTD.
6
L1201
Inductor, Wire
Wound, chip
ELCP0008013
MIPSZ2012D2R2 MIPSZ2012D2R2, 2.2 uH, N,
2.0X1.2X1.0, R/TP FDK CORPORATION.
6
U1811
IC, GPS
EUSY0415301
BCM4751IUB2G , 42, BCM4750 Shrink version 65nm,
IC, GPS WLBGA R/TP 42P BROADCOM CORP
6
U1251
IC, I/O Support Chip
EUSY0426301
TPD12S015 ESD protection HDMI companion chip , ; ,
IC, CMOS WCSP R/TP 28P TEXAS INSTRUMENTS
KOREA LTD, HONGKONG BRANCH.
6
CN1221
Connector, BtoB
ENBY0036001
GB042-40S-H10-E3000 40P 0.4MM STRAIGHT
SOCKET SMD R/TP 1M ENGINEERING PLASTIC
UL94V-0 AU OVER NI LS Mtron Ltd.
LGE Internal Use Only
Description
PartNumber
Spec
- 37 -
Remark
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location No.
Description
PartNumber
Spec
6
C171,
C232
Capacitor, Ceramic,
Chip
ECZH0001216
C1005X5R1A224KT000E 220nF 10% 10V X5R 55TO+85C 1005 R/TP - TDK KOREA
COOPERATION
6
U1101
IC, LDO Voltage
Regulator
EUSY0407401
RT9032 WDFN8L, 8, R/TP, Programmable Dual LDO,
IC, LDO Voltage RegulatorIC, LDO Voltage Regulator
RICHTEK TECHNOLOGY CORP.
6
L1811
Inductor, Multilayer,
Chip
ELCH0009109
0402CS-6N8XJEW 6.8NH 5% - 680mA 0.083OHM
4.8GHZ 20 NON SHIELD NONE 1.19X0.64X0.66MM
R/TP COILCRAFT SINGAPORE PTE LTD.
6
L114
Inductor, Multilayer,
Chip
ELCH0003820
LQG15HS3N0S02D 3NH 0.3NH - 300mA 0.17OHM
6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
MURATA MANUFACTURING CO., LTD.
6
C804
Capacitor, Ceramic,
Chip
GRM0335C1E3R0BD01D 3 pF, 25V, B, C0G, TC,
0603, R/TP, 0.000000000003, 0.1PF, 25V, C0G, ECCH0042009
55TO+125C, 0603, R/TP, 0.3 mm MURATA
MANUFACTURING CO., LTD.
6
U1201
IC, MM PMIC
EUSY0227205
LP8720TLX 2.7 To 5.5V Adj 1.2W CSP R/TP 20P NATIONAL SEMICONDUCTOR ASIA PACIFIC PTE.
LTD.
6
U171
Module, Tx Module
SMRH0006901
RF6260 0DBM 0DB 0% 0A 0A 0DB 0DBM 0DBM 0P
0.0x0.0x0.0MM - RF MICRO DEVICES INC
6
R1173
Resistor, Chip
ERHY0009527
MCR006YZPJ473 47KOHM 5% 1/20W 0603 R/TP ROHM.
6
R891,
R893
Resistor, Chip
ERHY0024601
RC0603J151CS 150OHM 5% 1/20W 0603 R/TP SAMSUNG ELECTRO-MECHANICS CO., LTD.
SFAC0002701
LFD211G57DPMD153 0.67 13.5 - 2050, 240 MHz,
0.67 dB, 13.5 dB, 1575, 6 MHz, 0.88 dB, 18.3 dB,
SMD, ETC, diplexer, GPS/PCS, 2.0*1.25, MURATA
MANUFACTURING CO., LTD.
6
FL1801
Filter, Separator,
Spdt
6
L1901
Inductor, Multilayer,
Chip
ELCH0003830
LQG15HSR18J02D 180NH 5% - 130mA 3.38OHM
500MHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
MURATA MANUFACTURING CO., LTD.
6
Q801
FET, Array
EBK61611301
NTUD3169CZ N/P-CHANNEL 20 8 0.22(0.2) 2(6)
0.125 SOT-963 R/TP 6P 2 ON SEMICONDUCTOR
6
C1177,
C184
Capacitor, Ceramic,
Chip
ECCH0009110
C0603X7R0J223KT 22nF 10% 6.3V X7R 55TO+125C 0603 R/TP - TDK CORPORATION
6
R1133
Resistor, Chip
ERHY0042406
Remark
RC0201JR-0751KL 51KOHM 5% 1/20W 0603 R/TP YAGEO CORPORATION
LGE Internal Use Only
- 38 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location No.
6
L1121
6
CN1141
6
X184
6
PartNumber
Spec
Inductor, Wire
Wound, Chip
EAP61747901
VLS3010ET-100M 10UH 20% - 630mA 0.39OHM
1.8MHZ 19 SHIELD 3.03x3.03x1.0 NONE R/TP TDK
KOREA COOPERATION
Connector, BtoB
ENBY0053801
24-5804-030-000-829+ 30P 0.40MM STRAIGHT
FEMALE SMD R/TP 900mM - KYOCERA ELCO
KOREA SALES CO., LTD.
Oscillator, VCTCXO
EAW61443801
1XXA26000FBA 26MHZ 1PPM 1.8V 2.5x2.0x0.8MM ;
SMD R/TP DAISHINKU CORPORATION.
R1135
Resistor, Chip
ERHZ0000244
MCR01MZP5F2202 22KOHM 1% 1/16W 1005 R/TP ROHM.
6
C940
Capacitor, Ceramic,
Chip
ECZH0001217
GRM155R60J474K 470nF 10% 6.3V X5R -25TO+70C
1005 BK-DUP - MURATA MANUFACTURING CO.,
LTD.
6
L227
Inductor, Wire
Wound, Chip
EAP61785901
LQW15CN18NJ00D 18NH 5% - 1.4A - - 0.046OHM
3GHZ - SHIELD 1.0X0.5X0.5MM NONE R/TP
MURATA MANUFACTURING CO., LTD.
6
C123,
C175
Capacitor, Ceramic,
Chip
ECZH0000802
C1005C0G1H010CT 1pF 0.25PF 50V NP0 55TO+125C 1005 R/TP - TDK KOREA
COOPERATION
6
L104,
L1924
Inductor, Multilayer,
Chip
ELCH0001430
LL1005-FHLR10J 100NH 5% - 150mA 2.2OHM
1.03GHZ 10 SHIELD NONE 1.0X0.5X0.5MM R/TP
TOKO, INC.
6
L152
Inductor, Multilayer,
Chip
ELCH0003813
LQG15HN47NJ02D 47NH 5% - 200mA 1.15OHM
1GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
MURATA MANUFACTURING CO., LTD.
6
ZD803
Diode, TVS
EDTY0008601
PSD05-LF 5V 6 13.5V 42A 500W SOD323 R/TP 2P 1
PROTEK DEVICES INC.
6
L245,
L248
Inductor, Multilayer,
Chip
ELCH0012510
LQW15AN15NG00D 15NH 2% - 460mA 0.16OHM
5GHZ 30 NON SHIELD NONE 1.0X0.5X0.5MM R/TP
MURATA MANUFACTURING CO., LTD.
6
SW101
Connector, RF
ENWY0005501
20279-001E-01 NONE STRAIGHT SOCKET SMD
R/TP AU 50OHM 400mDB I-PEX CO., LTD
6
C1271,
C195,
C222,
C933,
C941
Capacitor, Ceramic,
Chip
EAE62286801
CL03A104KP3NNNC 0.0000001F 10% 10V X5R 55TO+85C 0603 R/TP 0.3 SAMSUNG ELECTROMECHANICS CO., LTD.
LGE Internal Use Only
Description
- 39 -
Remark
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location No.
Description
PartNumber
Spec
6
C1107,
C1173,
C1204,
C1205,
C1206,
C1207,
C1208,
C1832,
C1901,
C1902,
C1905,
C193,
C241,
C245,
C250,
C659,
C665
Capacitor, Ceramic,
Chip
ECCH0004904
GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C
1005 R/TP - MURATA MANUFACTURING CO., LTD.
6
C1134,
C1175,
C1176,
C1230,
C1231,
C1232,
C1233,
C1234,
C1237,
C1253,
C173,
C1802,
C1903,
C1907,
C191,
C1911,
C1912,
C1913,
C1914,
C1915,
C194,
C200,
C201,
C202,
C203,
C204,
C206,
C207,
C208,
C251,
C301,
C609,
C610,
C626
Capacitor, Ceramic,
Chip
ECCH0009101
C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R 55TO+85C 0603 R/TP - TDK CORPORATION
LGE Internal Use Only
- 40 -
Remark
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location No.
Description
PartNumber
6
C646,
C654,
C655,
C915,
C916,
C917,
C918,
C919,
C920,
C921,
C922,
C925,
C928,
C929,
C930,
C931,
C932,
C938,
C939
Capacitor, Ceramic,
Chip
ECCH0009101
6
C1179,
C1212,
C223,
C224
Capacitor, Ceramic,
Chip
CL10A106MP8NNNC 10uF 20% 10V X5R ECCH0007803 55TO+85C 1608 R/TP 0.8MM SAMSUNG
ELECTRO-MECHANICS CO., LTD.
6
FL627
Filter, EMI/Power
EAM62230801
6
C1228,
C1235,
C1241,
C1252,
C192,
C243,
C248,
C901,
C902,
C903,
C904,
C905
Capacitor, Ceramic,
Chip
CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R ECCH0017601 55TO+85C 1005 R/TP 0.5MM SAMSUNG
ELECTRO-MECHANICS CO., LTD.
6
C1201
Capacitor, Ceramic,
Chip
GRM188R60J106M 10000000 pF, 6.3V, M, X5R, TC,
ECCH0005604 1608, R/TP, 0.8 mm MURATA MANUFACTURING
CO., LTD.
6
ZD801
Diode, TVS
EDTY0008602
PSD12-LF 12V 13.3 25.9V 21A 500W SOD323 R/TP
2P 1 PROTEK DEVICES INC.
6
U500
IC, Application
Processor
EUSY0425001
OMAP4430 , 54, 547pin, IC, Digital Signal Processors
BGA R/TP 547P TEXAS INSTRUMENTS KOREA
LTD, HONGKONG BRANCH.
6
U303
IC, Analog Switch
EUSY0186504
FSA2259UMX QFN , 8 , R/TP , Dual SPDT , ; , IC,
Analog Switch FAIRCHILD SEMICONDUCTOR
LGE Internal Use Only
Spec
Remark
C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R 55TO+85C 0603 R/TP - TDK CORPORATION
NFM18PS105R0J3D_ EMI 0HZ 1uF 0H SMD R/TP
6.3V, 2A, 0.03ohm MURATA MANUFACTURING
CO., LTD.
- 41 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location No.
6
R588,
R591,
R594,
R596,
R597
Resistor, Chip
ERHY0009522
MCR006YZPJ332 3.3KOHM 5% 1/20W 0603 R/TP ROHM.
6
C1143
Capacitor, Array
EAE62463801
GNM0M2R60J105ME18D 1uF2 20% 6.3V 2R SMD
R/TP 4P MURATA MANUFACTURING CO., LTD.
6
C807,
C926
Capacitor, Ceramic,
Chip
CL03A474MQ3NNNH 0.47 uF, 6.3V, M, X5R, HD,
0603, R/TP, 0.0000047, 20%, 6.3V, X5R, -55TO+85C,
ECCH0034801
0603, R/TP, .3 mm SAMSUNG ELECTROMECHANICS CO., LTD.
6
R1802,
R500
Resistor, Chip
ERHY0009502
6
C1916,
C308,
C310,
C311,
C936
Capacitor, Ceramic,
Chip
GRM033R60J224M 0.00000022F 20% 6.3V X5R ECCH0032801 55TO+85C 0603 R/TP 0.3MM MURATA
MANUFACTURING CO., LTD.
6
C1141,
C1229,
C1236,
C1904,
C1906,
C1908,
C1909,
C1910,
C225,
C688,
C892,
C923
Capacitor, Ceramic,
Chip
CL03A105MQ3CSNH 0.000001F 20% 6.3V X5R ECCH0017301 45TO+85C 0603 R/TP - SAMSUNG ELECTROMECHANICS CO., LTD.
6
R1176,
R801,
R802
Resistor, Chip
ERHY0009505
MCR006YZPJ103 10KOHM 5% 1/20W 0603 R/TP ROHM.
6
U1904
IC, DC, DC
Converter
EUSY0416301
TPS62611YFDR CSP, 6, R/TP, DCDC Converter for
WiFi BT Module Power, IC, DC, DC Converter TEXAS
INSTRUMENTS KOREA LTD, HONGKONG
BRANCH.
6
CN1271
Connector, I/O
EAG62832201
78618-0001 19P 0.40MM ANGLE RECEPTACLE DIP
R/TP - HANKOOK MOLEX
6
C316,
C318,
C325
Capacitor, Low ESL
EAE62487001
LLL153C80J224ME14E 0.22uF 20% 6.3V X6S 55TO+105C 1005 R/TP 0.35T max. MURATA
MANUFACTURING CO., LTD.
6
FB1812,
FB1815,
FB1817,
FB1818
Filter, Bead
EAM62150301
CIM05J600NC 60 ohm 1.0X0.5X0.5 25% 0.2 ohm
0.65A SMD R/TP 2P 0 SAMSUNG ELECTROMECHANICS CO., LTD.
LGE Internal Use Only
Description
PartNumber
Spec
Remark
MCR006YZPJ100 10OHM 5% 1/20W 0603 R/TP ROHM.
- 4 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location No.
6
R514,
R515
Resistor, Chip
ERHY0009593
MCR006YZPJ272 2.7KOHM 5% 1/20W 0603 R/TP ROHM.
6
C507,
C508,
C509
Capacitor, Ceramic,
Chip
ECCH0009206
GRM0335C1E680J 68pF 5% 25V X7R -55TO+125C
0603 R/TP - MURATA MANUFACTURING CO., LTD.
6
R1171,
R316
Resistor, Chip
ERHY0009526
MCR006YZPJ472 4.7KOHM 5% 1/20W 0603 R/TP ROHM.
6
ZD1172,
ZD1181,
ZD1182,
ZD1224,
ZD1225
Diode, TVS
EDTY0010101
ESD9B5.0ST5G ESD9B5.0ST5G, SOD-923, 5 V, 300
mW, R/TP, 15pF SCG HONG KONG SAR LTD.
6
U981
IC, Motor Driver
EUSY0238306
ISA1000 2.4~3.6V 150mV~300mV 0W DFN R/TP 8P -
6
U1101
IC, LDO Voltage
Regulator
EUSY0407401
RT9032 WDFN8L, 8, R/TP, Programmable Dual LDO,
IC, LDO Voltage RegulatorIC, LDO Voltage Regulator
RICHTEK TECHNOLOGY CORP.
6
SC791,
SC792,
SC793,
SC794,
SC795,
SC796
Clip
MCGY0003801 COMPLEX LG-KH3900 KTF ZZ:Without Color -
6
R804
Resistor, Chip
ERHZ0000222
MCR01MZP5F1503 150KOHM 1% 1/16W 1005 R/TP
- ROHM.
6
R827
Resistor, Chip
ERHZ0000298
MCR01MZP5F5600 560OHM 1% 1/16W 1005 R/TP ROHM.
6
FB1143
Filter, Bead
SFBH0008101
BLM15AG601SN1D 600 ohm 1.0X0.5X0.5 25% 0.6
ohm 0.3A SMD R/TP 2P 0 MURATA
MANUFACTURING CO., LTD.
6
C823
Capacitor, Ceramic,
Chip
ECZH0001420
C1608X5R1A105KT000E 1uF 10% 10V X5R 55TO+85C 1608 R/TP - TDK KOREA
COOPERATION
6
U301
IC, Digital Baseband
EUSY0432001
Processor, 3G
6
Q1186
TR, Bipolar
LGE Internal Use Only
Description
PartNumber
Spec
Remark
PMB9811 1.7VTO2V, 1.7VTO2V, 1.7VTO2V 100mW
300P - BGA P/TP 300P INFINEON TECHNOLOGIES
(ASIA PACIFIC) PTE LTD.
UMT2222A NPN 6V 75V 40V 600mA 100mA 100~300
EQBN0005301 200mW UMT3 R/TP 3P ROHM Semiconductor
KOREA CORPORATION
- 43 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location No.
6
L801,
L802,
L804,
L805,
L806
6
PartNumber
Spec
Inductor, Wire
Wound, chip
ELCP0014001
CIG21LR47MNE 0.47 uH, M, 2.0*1.25*1.0, R/TP,
0.0000047, 20%, 1.3A, 0.08 ohm, SHIELD,
2X1.25X1MM, NONE, R/TP, Inductor, Wire Wound,
Chip SAMSUNG ELECTRO-MECHANICS CO., LTD.
R1133
Resistor, Chip
ERHY0042406
RC0201JR-0751KL 51KOHM 5% 1/20W 0603 R/TP YAGEO CORPORATION
6
X300,
X800
Crystal
EXXY0018701
FC-135(12.5PF, +-20PPM) 32.768KHZ 20PPM
12.5PF 32*15 SMD R/TP SEIKO EPSON CORP
6
R1102,
R1103,
R510,
R511
Resistor, Chip
ERHY0009511
MCR006YZPJ152 1.5KOHM 5% 1/20W 0603 R/TP ROHM.
6
R830
Resistor, Chip
ERHY0009553
MCR006YZPF1004 1MOHM 1% 1/20W 0603 R/TP ROHM Semiconductor KOREA CORPORATION
6
U801
IC, Charger
EUSY0410801
RT9524 DFN, 10, R/TP, DFN Cal Test Mode Single
Charger IC for Micro USB, IC, ChargerIC, Charger
RICHTEK TECHNOLOGY CORP.
6
R631,
R632
Resistor, Chip
EBC61856201
RC0201FR-07240RL 240OHM 1% 1/20W 0603 R/TP
- YAGEO CORPORATION
6
U350
IC, MCP, NAND
EUSY0425901
H8BCS0QG0MMR-46M NAND/1G SDRAM/512M
0VTO0V 8.0x9.0x1.0 TR 130P NAND+DRAM BGA HYNIX SEMICONDUCTOR INC.
6
R336
Resistor, Chip
ERHY0035301
RC1005F4021CS 4.02KOHM 1% 1/16W 1005 R/TP SAMSUNG ELECTRO-MECHANICS CO., LTD.
6
C1209,
C1210,
C1211,
C227,
C835,
C836,
C842,
C890,
C934,
C935
Capacitor, Ceramic,
Chip
CL05A225MP5NSNC 2.2uF 20% 10V X5R ECCH0007804 55TO+85C 1005 R/TP 0.5MM SAMSUNG
ELECTRO-MECHANICS CO., LTD.
6
C802
Capacitor, Ceramic,
Chip
ECCH0009514
MCH032A(AN)100DK 10pF 0.5PF 25V X7R 55TO+125C 0603 R/TP - ROHM.
6
L800,
L803
Inductor, Wire
Wound, Chip
ELCP0013901
XPL2010-681MEC 680NH 20% - 2.1A 2.19 2.1
0.057OHM 152MHZ - SHIELD 2X2X1.2MM NONE
R/TP COILCRAFT INC.
6
R850
Resistor, Chip
ERHY0009561
MCR006YZPF5602 56KOHM 1% 1/20W 0603 R/TP ROHM.
LGE Internal Use Only
Description
- 44 -
Remark
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location No.
6
L303,
L304
Inductor, Wire
Wound, Chip
ELCP0008007
6
C306,
C307
Capacitor, Ceramic,
Chip
CL10A226MQ8NRNE 22uF 20% 6.3V X5R ECCH0017501 55TO+85C 1608 R/TP 0.8MM SAMSUNG
ELECTRO-MECHANICS CO., LTD.
6
R1195
Resistor, Chip
ERHY0009504
MCR006YZPJ102 1KOHM 5% 1/20W 0603 R/TP ROHM.
6
Q301
FET
EQFP0003601
NTJD4105CT1G P-CHANNEL MOSFET 20V +-12
660mA 0.63OHM 270mW SC70 R/TP 6P ON
SEMICONDUCTOR
6
C1101,
C1102,
C1103,
C1106,
C1121,
C1831,
C1923,
C891,
C975,
C978
Capacitor, Ceramic,
Chip
ECZH0001215
C1005X5R1A105KT000F 1uF 10% 10V X5R 55TO+85C 1005 R/TP - TDK KOREA
COOPERATION
6
C1132
Capacitor, Ceramic,
Chip
ECZH0003103
GRM36X7R104K10PT 100nF 10% 10V X7R 55TO+125C 1005 R/TP - MURATA
MANUFACTURING CO., LTD.
6
U811
IC, MUIC
EUSY0371201
MAX14526EEWP+TCC6 MAX14526EEWP+TCC6,
WLP, MUIC for 5Pin Micro USB WLP R/TP 20P
MAXIM INTEGRATED PRODUCTS INC.
6
R1173
Resistor, Chip
ERHY0009527
MCR006YZPJ473 47KOHM 5% 1/20W 0603 R/TP ROHM.
6
FL800
Filter, EMI/Power
SFEY0015301
NFM18PC104R1C3 ESD/EMI 0HZ 0.1uF 0H SMD
R/TP MURATA MANUFACTURING CO., LTD.
6
U721
IC, MCP, eMMC
EUSY0431102
SDIN5C2-8G-974D FBGA, 166, ETC, 8GB eMMC
v4.41 / 12.0x16.0x1.2 / 169ball, ;, IC, MCP SANDISK
CORPORATION
6
L988,
L989
Inductor, Multilayer,
Chip
ELCH0001444
0402AF-101XJEW 100NH 5% - 900mA 0.16OHM
1.4GHZ 8 NON SHIELD NONE 1.12X0.66X0.66MM
R/TP COILCRAFT SINGAPORE PTE LTD.
6
R1190,
R1191,
R896,
R897
PCB ASSY,
MAIN,
PAD OPEN
SAFO0000401
AX3100 ATL SV_SHIPBACK, MAIN, A, 0OHM DNI
6
R828
Resistor, Chip
ERHZ0000236
MCR01MZP5F2001 2KOHM 1% 1/16W 1005 R/TP ROHM.
LGE Internal Use Only
Description
PartNumber
Spec
Remark
MIPS2520D3R3M 3.3UH 30% - 1A 0.12OHM - SHIELD 2.5X2X1MM NONE R/TP FDK
CORPORATION.
- 45 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location No.
6
R986
6
C1812,
C1815,
C1816,
C1817,
C1818,
C1822,
C209,
C230,
C231,
C249,
C924,
C927,
C937
6
R848
6
6
Description
PartNumber
Spec
Resistor, Chip
ERHZ0000487
MCR01MZP5J474 470KOHM 5% 1/16W 1005 R/TP ROHM.
Capacitor, Ceramic,
Chip
CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R ECCH0000198 55TO+85C 1005 R/TP . SAMSUNG ELECTROMECHANICS CO., LTD.
Resistor, Chip
ERHY0009516
MCR006YZPJ222 2.2KOHM 5% 1/20W 0603 R/TP ROHM.
FB741,
FB743
Filter, Bead
SFBH0006806
CIM05J601NC 600 ohm 1.0X0.5X0.5 25% 0.6 ohm
0.3A SMD R/TP 2P 0 SAMSUNG ELECTROMECHANICS CO., LTD.
CN801
Connector, I/O
GU077-5P-SD-E1500 5, 0.65 mm, ETC, 0.64MM,
ENRY0011501 RECEPTACLE, DIP, R/TP, Reverse, Offset (1.50mm),
SUS plate LS Mtron Ltd.
6
U502
IC, Buffer
EUSY0428301
CDC3S04 1.65~1.95 999 999 999W 999W 33~68 4
WCSP R/TP 20P Quad Sine-wave Clock Buffer
TEXAS INSTRUMENTS KOREA LTD, HONGKONG
BRANCH.
6
R809
Resistor, Chip
ERHZ0000538
MCR01MZP5F3303 330KOHM 1% 1/16W 1005 R/TP
- ROHM.
6
R186
Resistor, Chip
ERHY0009503
MCR006YZPJ101 100OHM 5% 1/20W 0603 R/TP ROHM.
6
U800
IC, PMIC
EAN62093401
TWL6030B107CMR 2.5 to 4.8V adj 1.7W BGA R/TP
187P - TEXAS INSTRUMENTS KOREA LTD,
HONGKONG BRANCH.
6
R337
Resistor, Chip
ERHY0040202
Remark
RC0201FR-074R7L 4.7OHM 1% 1/20W 0603 R/TP YAGEO CORPORATION
6
U701
IC, MCP, NAND
EUSY0429001
K3PE4E400M-XGC1 4096MBIT 1.14VTO1.3V,
1.7VTO1.95V 12.0x12.0x0.71 TR 216P DRAM FBGA
4Gb LPDDR2 PoP 216ball for OMAP4 Series Chipset
(44nm) SAMSUNG ELECTRONIC CO., LTD
6
C986
Capacitor, Ceramic,
Chip
ECZH0001120
CC1005X7R1H392KT000F 3.9nF 10% 50V X7R 55TO+125C 1005 R/TP - TDK KOREA
COOPERATION
LGE Internal Use Only
- 46 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location No.
6
X500
6
R1101,
R1126,
R1202,
R1271
6
Description
PartNumber
Spec
Oscillator, TCXO
EXST0002601
1XXB38400FAA 38.4 MHz, 1.5 PPM, 10 pF, SMD,
2.5*2.0*0.8, 38.4, 1.5PPM, 1.8V, 2.5, 2.0, 0.8, SMD,
R/TP DAISHINKU CORPORATION.
Resistor, Chip
ERHY0009506
MCR006YZPJ104 100KOHM 5% 1/20W 0603 R/TP ROHM.
U971
IC, Acceleration
Sensor
EUSY0410101
KXTF9 1.8V to 3.6V 400KHZ 12BIT 1SPS 1W LGA
R/TP 10P Accelerometer Sensor - LGA R/TP 10P KIONIX, INC.
6
U961
IC, Gyro Sensor
EUSY0434601
MPU3050 1.8~3.6 Gyro Sensor - QFN R/TP 24P INVENSENSE
6
U851
IC, Analog Switch
EAN61871401
FSUSB63 2.7~4.3V 400NSEC 45NSEC 0W MLP
R/TP 12P 1 FAIRCHILD SEMICONDUCTOR HONG
KONG LTD.
6
R1905,
R894,
R895,
R919,
R921
PCB ASSY,
MAIN,
PAD SHORT
SAFP0000401
LG-LU3000 LGTBK, MAIN, A,
6
C188
Capacitor, Ceramic,
Chip
ECZH0001108
C1005X7R1E682KT000F 6.8nF 10% 25V X7R 55TO+125C 1005 R/TP - TDK KOREA
COOPERATION
6
C961
Capacitor, Ceramic,
Chip
ECCH0000147
MCH155CN222KK 2.2nF 10% 50V X7R -55TO+125C
1005 R/TP - ROHM.
6
FB800,
FB803
Filter, Bead
EAM62071001
BLM18KG221SN1D 220 ohm 1.6X0.8X0.8 25% 0.05
ohm 2.2A SMD R/TP 2P 0 MURATA
MANUFACTURING CO., LTD.
6
FB801,
FB802,
FB804,
FB805,
FB806
Filter, Bead
EAM62071101
BLM15PD121SN1D 120 ohm 1.0X0.5X0.5 25% 0.09
ohm 1.3A SMD R/TP 2P 0 MURATA
MANUFACTURING CO., LTD.
6
L1903
Inductor, Wire
Wound, chip
ELCP0012801
MIPS2520D1R5 1.6 uH, N, 2.5*2.0*1.0, R/TP,
0.0000015, 30%, 1.2A, 0.1 OHM, 2.5X2X1MM, NONE,
R/TP, Inductor, Wire Wound, Chip FDK
CORPORATION.
7
D101,
D102,
D103,
D104
Diode, TVS
EDTY0008606
PRSB6.8C 4.7V 5.7 - - 10W - R/TP 2P 1 PROTEK
DEVICES INC.
7
CN103
Connector, BtoB
ENBY0039601
Remark
GB042-20S-H10-E3000 20P 0.4MM STRAIGHT
SOCKET SMD R/TP 1M - LS Mtron Ltd.
LGE Internal Use Only
- 47 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location No.
Description
PartNumber
7
C1101,
C1102,
C1103,
C1106,
C1121,
C1831,
C1923,
C891,
C975,
C978
Capacitor, Ceramic,
Chip
ECZH0001215
C1005X5R1A105KT000F 1uF 10% 10V X5R 55TO+85C 1005 R/TP - TDK KOREA
COOPERATION
7
C1132
Capacitor, Ceramic,
Chip
ECZH0003103
GRM36X7R104K10PT 100nF 10% 10V X7R 55TO+125C 1005 R/TP - MURATA
MANUFACTURING CO., LTD.
7
U101
IC, Ambient Light
Sensor
EUSY0431901
APDS-9900 - - - - - - AVAGO TECHNOLOGIES
INTERNATIONAL SALES PTE. LIMITED
7
FB741,
FB743
Filter, Bead
SFBH0006806
CIM05J601NC 600 ohm 1.0X0.5X0.5 25% 0.6 ohm
0.3A SMD R/TP 2P 0 SAMSUNG ELECTROMECHANICS CO., LTD.
7
L988,
L989
Inductor, Multilayer,
Chip
ELCH0001444
0402AF-101XJEW 100NH 5% - 900mA 0.16OHM
1.4GHZ 8 NON SHIELD NONE 1.12X0.66X0.66MM
R/TP COILCRAFT SINGAPORE PTE LTD.
7
CN104
Connector, BtoB
ENBY0052001
24-5804-010-000-829+ 10P 0.40MM STRAIGHT
FEMALE SMD R/TP 900mM - KYOCERA ELCO
KOREA SALES CO., LTD.
7
CN101
Connector, BtoB
ENBY0057401
14-5804-034-000-829+ 34, 0.4 mm, STRAIGHT, gold,
34, 0.40MM, STRAIGHT, MALE, SMD, 0.9T,
KYOCERA ELCO KOREA SALES CO., LTD.
7
C153
Capacitor, Ceramic,
Chip
MCH155A220JK 22pF 5% 50V NP0 -55TO+125C
ECCH0000115 1005 R/TP - ROHM Semiconductor KOREA
CORPORATION
7
CN101
Connector, BtoB
ENBY0051901
14-5804-010-000-829+ 10P 0.40MM STRAIGHT
MALE SMD R/TP 900mM - KYOCERA ELCO KOREA
SALES CO., LTD.
7
J101
Jack, Phone
EAG62831701
KJA-PH-3-0176 4P 4P ANGLE R/TP 3.5M BLACK 5P
6.5x12.6x4.0t, Short Detect, All DIP type KSD CO.,
LTD
7
CN103,
CN104
Contact
MCIZ0008401
COMPLEX LG-C900 ATTDW ZZ:Without Color
PRESS, BeCu, , 3.0, 1.2, 1.5,
7
C106
Capacitor, Ceramic,
Chip
ECZH0001002
C1005CH1H0R5BT000F 0.5pF 0.1PF 50V NP0 55TO+125C 1005 R/TP - TDK KOREA
COOPERATION
7
L147,
L158,
L168
Inductor, Multilayer,
Chip
ELCH0001404
LL1005-FHL1N5S 1.5NH 0.3NH - 400mA 0.13OHM
15GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
TOKO, INC.
LGE Internal Use Only
Spec
- 48 -
Remark
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location No.
7
SW101
Connector, RF
ENWY0005501
20279-001E-01 NONE STRAIGHT SOCKET SMD
R/TP AU 50OHM 400mDB I-PEX CO., LTD
7
LD101,
LD102,
LD103,
LD104
LED, Chip
EDLH0015109
19-219UTD-S592/TR8 WHITE 2.7~3.1 25mA
112~285mcd x, y 95mW 1608 R/TP 2P EVERLIGHT ELECTRONICS CO., LTD.
7
L988,
L989
Inductor, Multilayer,
Chip
ELCH0001444
0402AF-101XJEW 100NH 5% - 900mA 0.16OHM
1.4GHZ 8 NON SHIELD NONE 1.12X0.66X0.66MM
R/TP COILCRAFT SINGAPORE PTE LTD.
7
L101,
L102
Inductor, Multilayer,
Chip
ELCH0004717
1005GC2T82NJLF 82NH 5% - 150mA 2.1OHM
700MHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
PILKOR ELECTRONICS LTD.
7
R101,
R102,
R103,
R104
Resistor, Chip
ERHZ0000415
MCR01MZP5J131 130OHM 5% 1/16W 1005 R/TP ROHM.
7
C116,
C117,
C121,
C132,
C151,
C163
Capacitor, Ceramic,
Chip
ECZH0000830
C1005C0G1H330JT000F 33pF 5% 50V NP0 55TO+125C 1005 R/TP - TDK KOREA
COOPERATION
7
ZD1172,
ZD1181,
ZD1182,
ZD1224,
ZD1225
Diode, TVS
EDTY0010101
ESD9B5.0ST5G ESD9B5.0ST5G, SOD-923, 5 V, 300
mW, R/TP, 15pF SCG HONG KONG SAR LTD.
7
C172
Capacitor, Ceramic,
Chip
ECCH0000182
GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C
1005 R/TP - MURATA MANUFACTURING CO., LTD.
7
FB1174,
FB901,
FB913,
FB914,
FB941
Filter, Bead
SFBH0007101
BLM15AG121SN1D 120 ohm 1.0X0.5X0.5 25% 0.25
ohm 0.5A SMD R/TP 2P 0 MURATA
MANUFACTURING CO., LTD.
7
C110
Capacitor, Ceramic,
Chip
CL05C270JB5NNNC 27pF 5% 50V NP0 -55TO+125C
ECCH0000117 1005 R/TP 0.5 SAMSUNG ELECTRO-MECHANICS
CO., LTD.
7
CN102
Connector, BtoB
ENBY0053501
14-5804-020-000-829+ 20P 0.40MM STRAIGHT
MALE SMD R/TP 900mM - KYOCERA ELCO KOREA
SALES CO., LTD.
6
CN101
Connector, BtoB
ENBY0057401
14-5804-034-000-829+ 34, 0.4 mm, STRAIGHT, gold,
34, 0.40MM, STRAIGHT, MALE, SMD, 0.9T,
KYOCERA ELCO KOREA SALES CO., LTD.
LGE Internal Use Only
Description
PartNumber
Spec
- 49 -
Remark
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location No.
Description
PartNumber
6
C103,
C105
Capacitor, Ceramic,
Chip
ECCH0002001
C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P 30TO+85C 1005 R/TP - TDK CORPORATION
6
CN102
Connector, BtoB
ENBY0051001
GB042-10S-H10-E3000 10P 0.4MM STRAIGHT
FEMALE SMD R/TP 1M - LS Mtron Ltd.
6
R117,
R118
Resistor, Chip
ERHY0000193
RC1005F270CS 27OHM 1% 1/16W 1005 R/TP SAMSUNG ELECTRO-MECHANICS CO., LTD.
6
ZD1172,
ZD1181,
ZD1182,
ZD1224,
ZD1225
Diode, TVS
EDTY0010101
ESD9B5.0ST5G ESD9B5.0ST5G, SOD-923, 5 V, 300
mW, R/TP, 15pF SCG HONG KONG SAR LTD.
6
VA103
Varistor
SEVY0003901
EVL5M02200 5.5V 0% 480F 1.0*0.5*0.6 NONE SMD
R/TP AMOTECH CO., LTD.
6
R112
Resistor, Chip
ERHZ0000405
MCR01MZP5J103 10KOHM 5% 1/16W 1005 R/TP ROHM.
6
R101
Resistor, Chip
ERHY0000254
MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP ROHM.
6
S101
Socket, Card
ENSY0023802
SCHB1B0201 Micro-SD 8P ANGLE SMD R/TP ALPS ELECTRIC KOREA CO., LTD.
6
C1201
Capacitor, Ceramic,
Chip
GRM188R60J106M 10000000 pF, 6.3V, M, X5R, TC,
ECCH0005604 1608, R/TP, 0.8 mm MURATA MANUFACTURING
CO., LTD.
6
C1228,
C1235,
C1241,
C1252,
C192,
C243,
C248,
C901,
C902,
C903,
C904,
C905
Capacitor, Ceramic,
Chip
CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R ECCH0017601 55TO+85C 1005 R/TP 0.5MM SAMSUNG
ELECTRO-MECHANICS CO., LTD.
6
U101
IC, DC, DC
Converter
EAN61850201
6
C112
Capacitor, Ceramic,
Chip
MCH155A100D 10pF 0.5PF 50V NP0 -55TO+125C
ECCH0000110 1005 R/TP - ROHM Semiconductor KOREA
CORPORATION
LGE Internal Use Only
Spec
Remark
LM3559TLX 2.5 to 5.5V adj 0W MICRO SMD R/TP
16P - NATIONAL SEMICONDUCTOR ASIA PACIFIC
PTE. LTD.
- 50 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location No.
Description
6
C1812,
C1815,
C1816,
C1817,
C1818,
C1822,
C209,
C230,
C231,
C249,
C924,
C927,
C937
Capacitor, Ceramic,
Chip
CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R ECCH0000198 55TO+85C 1005 R/TP . SAMSUNG ELECTROMECHANICS CO., LTD.
6
CN110
Contact
MCIZ0008701
COMPLEX L-04C, ANTTWV ZZ:Without Color
PRESS, YCUT-FX, 4.2, 2.5, 1.5,
6
U102
IC, LDO Voltage
Regulator
EUSY0353801
RP103K331D 1.7V TO 5.25V 3.3V 400mW DFN R/TP
4P - RICOH COMPANY, LTD.
6
LD101
LED, Chip
EDLM0009501
LXCL-PWF4 WHITE 2.8~4.6 150mA 28~59cd NA 1W
2016 R/TP 2P - LUMILEDS LIGHTING U.S., LLC
6
L101
Inductor, Wire
Wound, chip
ELCP0008008
MIPS2520D1R0M MIPS2520D1R0M, 1 uH, M,
2.0x2.5x1.0, R/TP, MLCI FDK CORPORATION.
6
D1175
Diode, TVS
EDTY0009801
VSMF05LCC 5V 6V 12V 2A 25W SOT-963 R/TP 6P 5
PROTEK DEVICES INC.
6
C1101,
C1102,
C1103,
C1106,
C1121,
C1831,
C1923,
C891,
C975,
C978
Capacitor, Ceramic,
Chip
ECZH0001215
C1005X5R1A105KT000F 1uF 10% 10V X5R 55TO+85C 1005 R/TP - TDK KOREA
COOPERATION
6
J101
Card Socket
ENSY0022101
GCA26C-6S-H15-E1500 GCA26C-6S-H15-E1500, 6,
ETC2.54 mm, H=1.5 LS Mtron Ltd.
6
VA102
Varistor
SEVY0001001
EVLC14S02050 14V 0% 50F 1.0*0.5*0.6 NONE SMD
R/TP AMOTECH CO., LTD.
LGE Internal Use Only
PartNumber
Spec
- 51 -
Remark
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
11
12.3 Accessory
Level
Location No.
2
EAB010200
Note: This Chapter is used for reference, Part order is
ordered by SBOM standard on GCSC
Description
PartNumber
Spec
EAB62410801
COSMO 3mW 16OHM 5DB 20HZTO20KHZ 1M
BLACK 4 POLE PLUG - CRESYN CO., LTD
Rechargeable
Battery,
Lithium Ion
EAC61679801
Remark
FL-53HN_WWU_TOCAD PRISMATIC 3.7V 1.5AH
300mAH 45x53x5.3 54.5x47.8x5.7 BLACK Frame Type
534553, 1500mAh, Frame, WW, Up TOCAD
DONG-HWA CO., LTD
Earphone, Stereo
2
EAC00
2
EAY060000
Adapters
EAY62531701
SC0600LGA 100-240V 5.0V 1A 50-60Hz CB, CE
WALL 2P USB - SALCOMP OY
2
AFN053800
Manual Assembly,
Operation
AFN75494322
LGP920.ANEUMN ZZ:Without Color LGP920 manual
assy for NEU
3
MBM062602
Card, Quick
Reference
MBM63496413
COMPLEX LGP920.ADEUML ZZ:Without Color
NORWEGIAN_Simple Manual
3
MBM062601
Card, Quick
Reference
MBM63496412
COMPLEX LGP920.ADEUML ZZ:Without Color
FINNISH_Simple Manual
3
MBM062600
Card, Quick
Reference
MBM63496411
COMPLEX LGP920.ADEUML ZZ:Without Color
DANISH_Simple Manual
3
MBM062603
Card, Quick
Reference
MBM63496414
COMPLEX LGP920.ADEUML ZZ:Without Color
SWEDISH_Simple Manual
3
MFL053800
Manual,
Operation
MFL67303501
COMPLEX LGP920.ANEUML ZZ:Without Color Safety
Guide for P920 NEU
3
MBM087200
CARD,
WARRANTY
MCDF0001123 KP202 TNR BK, ZZ, PRINTING
LGE Internal Use Only
- 5 -
Copyright (C) 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes