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Internal Use Only

Service Manual

LG-P920

Date: June, 2011 / Issue 1.0

Table Of Contents
1. INTRODUCTION�� 3

4.6 GPS/WIFI/BT RF components�� 92

1.1 Purpose��3

4.7 GPS/WIFI/BT SIGNAL PATH�� 94

1.2 Regulatory Information��3

4.8 Power ON Troubleshooting�� 96

1.3 Abbreviations��5

4.9 Charger Troubleshooting��101

2. PERFORMANCE�� 7
2.1 Product Name��7
2.2 Supporting Standard��7
2.3 Main Parts : GSM Solution��7
2.4 HW Features��8
2.5 SW Features�� 10
2.6 HW SPEC. �� 13
2.7 P920 Figures�� 23

4.10 USB Trouble shooting��104
4.11 Audio trouble��107
4.12 Camera trouble(5M/VGA)��118
4.13 Main LCD trouble��122
4.14 SIM detect Trouble shooting��127
4.15 Vibrator Troubleshooting��129
4.16 HDMI Troubleshooting��132
4.17 Motion Sensor on/off trouble��134
4.18 Gyro/Compass sensor troubleshooting��137

3. TECHNICAL BRIEF�� 24

4.19 Proximity Sensor on/off trouble��140

3.1 Radio Part General�� 25

4.20 Illumination Sensor on/off trouble��142

3.2 Radio Part Rx Section�� 26

4.21 Touch trouble��144

3.3 Radio Part Tx Section�� 27
3.4 Radio Part Interfaces�� 28
3.5 Digital Baseband (OMAP4430)�� 29
3.6 Hardware Architecture�� 31
3.7 Subsystem (PMB9811_X-GOLDTM626)�� 32
3.8 Power Block�� 45
3.9 External memory interface�� 52
3.10 Audio and sound�� 53
3.11 Main (5M pixels) & Sub (VGA) Camera�� 58
3.12 Display�� 60
3.13 Vibrators�� 64

5. Block diagram�� 148
6. CIRCUIT DIAGRAM�� 152
7. BGA PIN MAP�� 169
8. PCB LAYOUT�� 178
9. CALIBRATION�� 191
9.1 Configuration of Tachyon��191
9.2 How to use Tachyon��193
10. HIDDEN MENU�� 196

3.14 HDMI�� 65
3.15 Compass Sensor�� 66

11. EXPLODED VIEW & REPLACEMENT PART LIST �� 218

3.16 Motion Sensor�� 67

11.1 EXPLODED VIEW��218

3.17 Gyro Sensor�� 68

11.2 Replacement Parts��219

3.18 Illumination & Proximity Sensor�� 69

11.3 Accessory��252

3.19 Touch Module�� 70
3.20 Main Features�� 71
4. TROUBLE SHOOTING�� 72
4.1 RF Component�� 72
4.2 SIGNAL PATH�� 73
4.3 Checking TCXO Block�� 76
4.4 Checking WCDMA Block�� 78
4.5 Checking GSM Block�� 85
LGE Internal Use Only

--

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

1. INTRODUCTION
1. INTRODUCTION
1. INTRODUCTION
1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of this model.

1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system. There are may be risks of toll fraud associated
with your telecommunications system. System users are responsible for programming and configuring the
equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune
from the above case but will prevent unauthorized use of common-carrier telecommunication service of
facilities accessed through or connected to it.
The manufacturer will not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone service
until repair can be done. A telephone company may temporarily disconnect service as long as repair is not
done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the this phone or compatibility with the
network, the telephone company is required to give advanced written notice to the user, allowing the user
to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorized
agent. The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and
may void any remaining warranty.

4/140

LGE Internal Use Only

--

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

1. INTRODUCTION
2. INTRODUCTION

E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information such
as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation
Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from
unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices

ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated
by the sign. Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat
which is also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective
package as described.

5/140

LGE Internal Use Only

--

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

1. INTRODUCTION
1. INTRODUCTION
1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
APC

Automatic Power Control

BB

Baseband

BER

Bit Error Ratio

CC-CV

Constant Current – Constant Voltage

DAC

Digital to Analog Converter

DCS

Digital Communication System

dBm

dB relative to 1 milli watt

DSP

Digital Signal Processing

EEPROM

Electrical Erasable Programmable Read-Only Memory

ESD

Electrostatic Discharge

FPCB

Flexible Printed Circuit Board

GMSK

Gaussian Minimum Shift Keying

GPIB

General Purpose Interface Bus

GSM

Global System for Mobile Communications

IPUI

International Portable User Identity

IF

Intermediate Frequency

LCD

Liquid Crystal Display

LDO

Low Drop Output

LED

Light Emitting Diode

OPLL

Offset Phase Locked Loop

6/140

LGE Internal Use Only

--

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

1. INTRODUCTION

1. INTRODUCTION
PAM

Power Amplifier Module

PCB

Printed Circuit Board

PGA

Programmable Gain Amplifier

PLL

Phase Locked Loop

PSTN

Public Switched Telephone Network

RF

Radio Frequency

RLR

Receiving Loudness Rating

RMS

Root Mean Square

RTC

Real Time Clock

SAW

Surface Acoustic Wave

SIM

Subscriber Identity Module

SLR

Sending Loudness Rating

SRAM

Static Random Access Memory

PSRAM

Pseudo SRAM

STMR

Side Tone Masking Rating

TA

Travel Adapter

TDD

Time Division Duplex

TDMA

Time Division Multiple Access

UART

Universal Asynchronous Receiver/Transmitter

VCO

Voltage Controlled Oscillator

VCTCXO

Voltage Control Temperature Compensated Crystal Oscillator

WAP

Wireless Application Protocol

7/140
LGE Internal Use Only

--

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

2. PERFORMANCE

2. PERFORMANCE
2.1 Product Name
P920 : WCDMA900/1700/1900/2100+EGSM/GSM850/DCS/PCS
(HSUPA 5.8Mbps(cat6)/HSDPA 14.4Mbps(cat10)/GPRS Class12/EDGE Class12)

2.2 Supporting Standard
Item

Feature

Comment

Supporting Standard

WCDMA(FDD1,2,8)/EGSM/GSM850/DCS1800/PCS1900
with seamless handover
Phase 2+(include AMR)
SIM Toolkit
: Class 1, 2, 3, C-E

Frequency Range

WCDMA(FDD1) TX : 1920 – 1980 MHz
WCDMA(FDD1) RX : 2110 – 2170 MHz
WCDMA(FDD2) TX : 1850 – 1910 MHz
WCDMA(FDD2) RX : 1930 – 1990 MHz
WCDMA(FDD4) RX : 2112 – 2153 MHz
WCDMA(FDD4) TX : 1712 – 1753 MHz
WCDMA(FDD8) TX : 880 – 915 MHz
WCDMA(FDD8) RX : 925 – 960 MHz
EGSM TX : 880 – 915 MHz
EGSM RX : 925 – 960 MHz
GSM850 TX: 824 – 849 MHz
GSM850 RX: 869 – 894 MHz
DCS1800 TX: 1710 – 1785 MHz
DCS1800 RX: 1805 – 1880 MHz
PCS1900 TX: 1850 – 1910 MHz
PCS1900 RX: 1930 – 1990 MHz

Application Standard

2.3 Main Parts : GSM Solution
Item

Part Name

AP Chip

OMAP 4430 : TI

CP Chip

XMM6260 : Infineon

LGE Internal Use Only

Comment

--

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

2. PERFORMANCE

2.4 HW Features
Item

Feature

Comment

Form Factor

DOP type

Battery

1) Capacity
Standard : Li-Ion Polymer, 1500mAh
2) Packing Type : Soft Pack

Size

Standard :128.8 x 68 x 11.9mm

Weight

162g

Volume

TBD

PCB

L1B1 type, 10 Layers , 0.8t

Stand by time

2G Up to 500 hrs
3G Up to 500 hrs

@ Paging Period 9 (2G)
@ DRX 7 (3G)

Charging time

3 hrs

@ Power Off / 1500mAh

Talk time

2G Up to 1200mins
3G Up to 600 mins

@ Tx=Max(2G)
@ Tx = 12dBm (3G)

RX sensitivity

WCDMA(FDD1) : -106.7 dBm
WCDMA(FDD2) : -106.7 dBm
WCDMA(FDD8) : -106.7 dBm
EGSM
: -105 dBm
GSM850
: -105 dBm
DCS 1800
: -105 dBm
PCS 1900
: -105 dBm

TX
output
power

WCDMA/
GSM/
GPRS

WCDMA : 24dBm/3.84MHz,+1/-3dBm
EGSM
: 33dBm
GSM850
: 33 dBm
DCS 1800
: 30 dBm
PCS 1900
: 30 dBm

Class3(WCDMA)
Class4 (EGSM)
Class4 (GSM850)
Class1 (PCS)
Class1 (DCS)

EDGE

GSM 900
DCS 1800
PCS 1900

E2 (GSM900)
E2 (PCS)
E2 (DCS)

GPRS compatibility

EDGE Class 12

SIM card type

: 27 dBm
: 26 dBm
: 26 dBm

GPRS Class 12

EDGE compatibility

With Battery

Plug-In SIM
2.85V /1.8V

LGE Internal Use Only

--

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

2. PERFORMANCE

Display

Main LCD (WVGA)
TFT Main LCD(4.3”, 480X800)

Built-in Camera

3D Camera, VGA secondary

Status Indicator

No

Keypad

Function Key : 4
Side Key
:4

ANT

Main : LDS(Laser Direct Structure) type
Sub : DPA type(Directed Print Antenna)

System connector

5 Pin Micro USB

Ear Phone Jack

3.5Phi, 4 Pole, Stereo

PC synchronization

Yes

Memory(AP)

eMMC : 8GB
LP-DDR2 : 512MB

Speech coding

FR, EFR, HR, AMR

Data & Fax

Built in Data & Fax support

Vibrator

Built in Vibrator

BlueTooth

V2.1 + EDR

MIDI(for Buzzer
Function)

72 Poly, MP3 Ringtone

Music Player

MP3/ WMA/AAC/AAC+/WAV/AC3

Video Player

MPEG4, H.263, H.264 @ Full HD 30fps/ Divx HD

Camcorder

MPEG4, H.264, H.263 @ 3D : 720p 2D : 1080p
30pfs

Voice Recording

Yes

Speaker Phone mode
Support

Yes

Travel Adapter

Yes

CDROM

No

Stereo Headset

Yes

Data Cable

Yes

T-Flash
(External Memory)

Yes

LGE Internal Use Only

5M AF CMOS CAM 2EA
Function Key:
Home,Back, menu,serach
Side Key :
Volume up,down, power key,
3D key

2.0 HS

Upto 32GB

--

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

2. PERFORMANCE

2.5 SW Features
Item

Feature

RSSI

0 ~ 4 Levels

Battery Charging

0 ~ 6 Levels

Key Volume

0 ~ 7 Level

Audio Volume

1 ~ 15 Level

Time / Date Display

Yes

Multi-Language

Yes

Quick Access Mode

Phone / Contacts / Messaging / Menu

PC Sync

Yes

Speed Dial

Yes

Voice mail center - & gt; 1 key

Profile

Yes

not same with feature phone setting

CLIP / CLIR

Yes

Phone Book

Name / Number / Email / Chat Id /
Website / Postal addresses /
Organizations / Groups / BirthdayNotes /
Ringtone

There is no limitation on the number of
items.
It depends on available memory
amount.

Last Dial Number

Yes

There is no limitation on the number of
items.
It depends on available memory
amount.

Last Received
Number

Yes

There is no limitation on the number of
items.
It depends on available memory
amount.

Last Missed Number

Yes

There is no limitation on the number of
items.
It depends on available memory
amount.

Search by Number
/ Name

Name / N

Group

Yes

LGE Internal Use Only

Comment

CZECH , DUTCH , FRENCH , GERMAN ,
GREEK , ITALIAN , PORTUGUESE ,
SPANISH , ARABIC , HEBREW , T CHINESE
TW , S CHINESE , ROMANIAN ,
HUNGARIAN , SLOVAK , CROATIAN ,
BULGARIAN , MACEDONIAN , ICELANDIC

There is no limitation on the number of
items.
It depends on available memory
amount.
- 10 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

2. PERFORMANCE

Fixed Dial Number

Yes

Service Dial Number

No

Own Number

Yes

Read only
(add/edit/delete are not supported)

Voice Memo

Yes

Support voice recorder

Call Reminder

Yes

Missed call popup

Network Selection

Automatic

Mute

Yes

Call Divert

Yes

Call Barring

Yes

Call Charge (AoC)

Yes

Call Duration

Yes

SMS (EMS)

There is no limitation on the number of
items.
It depends on available memory
amount.

SMS Over GPRS

No

EMS Melody / Picture
Send / Receive / Save

No
No

MMS MPEG4
Send / Receive / Save

Yes
Yes

Long Message

MAX 1000 characters

Cell Broadcast

Yes

Download

Over the Web

Game

Yes

Calendar

Yes

Memo

Yes

World Clock

Yes

Unit Convert

No

Stop Watch

Yes

Wall Paper

Yes

WAP Browser

No

WAP stack and wml are not supported.

Download Melody /
Wallpaper

Yes

Over web browser

SIM Lock

Yes

Operator Dependent

SIM Toolkit

Class 1, 2, 3, C, D

MMS

Yes

EONS

Yes

LGE Internal Use Only

EMS does not support.

SMS 10 concatenated

There is no limitation on the number of
items.
It depends on available memory
amount.

- 11 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

2. PERFORMANCE

CPHS

Yes

ENS

Yes

Camera

Yes

5M AF /
Digital Zoom : x8

JAVA

No

Android do not support JAVA

Voice Dial

No

IrDa

No

Bluetooth

Yes

FM radio

Yes

GPRS

Yes

Class 12

EDGE

Yes

Class 12

Hold / Retrieve

Yes

Conference Call

Yes

DTMF

Yes

Memo pad

Yes

TTY

No

AMR

Yes

SyncML

Yes

IM

Yes

Email

Yes

LGE Internal Use Only

V4.2

Ver. 2.1+EDR
(GAP, A2DP, AVRCP, DUN, FTP, GAVDP,
GOEP, HFP, HSP, OPP, SDAP, SPP)

Max. 6
Rich Note

Gtalk

- 12 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

2. PERFORMANCE

2.6 HW SPEC.
1) GSM transceiver specification
Item

Specification

Phase Error

Rms : 5°
Peak : 20 °

Frequency Error

GSM : 0.1 ppm
DCS/PCS : 0.1 ppm

EMC(Radiated Spurious Emission
Disturbance)

GSM/DCS : & lt; -28dBm

Transmitter Output power and Burst
Timing

GSM : 5dBm – 33dBm ± 3dB
DCS/PCS : 0dBm – 30dBm ± 3dB

Burst Timing

& lt; 3.69us

Spectrum due to modulation out to less
than 1800kHz offset

200kHz : -36dBm
600kHz : -51dBm/-56dBm

Spectrum due to modulation out to larger
than 1800kHz offset to the edge of the
transmit band

GSM :
1800-3000kHz : & lt; -63dBc(-46dBm)
3000kHz-6000kHz : & lt; -65dBc(-46dBm)
6000kHz & lt; : & lt; -71dBc(-46dBm)
DCS :
1800-3000kHz : & lt; -65dBc(-51dBm)
6000kHz & lt; : & lt; -73dBc(-51dBm)

Spectrum due to switching transient

400kHz : -19dBm/-22dBm(5/0), -23dBm
600kHz : -21dBm/-24dBm(5/0), -26dBm

Reference Sensitivity – TCH/FS

Class II(RBER) : -105dBm(2.439%)

Usable receiver input level range

0.012(-15 - -40dBm)

Intermodulation rejection – Speech
channels

± 800kHz, ± 1600kHz
: -98dBm/-96dBm (2.439%)

AM Suppression
GSM : -31dBm
- DCS : -29dBm

-98dBm/-96dBm (2.439%)

Timing Advance

± 0.5T

LGE Internal Use Only

- 13 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

2. PERFORMANCE

2) WCDMA transmitter specification
Item

Specification

Transmit Frequency

BD1: 1920MHz ~ 1980 MHz
BD2: 1850~1910 MHz
BD8: 880 MHz ~ 915 MHz

Maximum Output Power

+24 dBm / 3.84 MHz, +1 / -3 dB

Frequency Error

within ±0.1 PPM

Open Loop Power Control

Normal Conditions : within ±9 dB,
Extreme Conditions : within ±12 dB

Minimum Transmit Power

& lt; -50 dBm /3.84 MHz

Occupied Bandwidth

& lt; 5 MHz at 3.84 Mcps (99% of power)

Adjacent Channel Leakage
Power Ratio (ACLR)

& gt; 33 dB @ ±5 MHz,
& gt; 43 dB @ ±10 MHz

Spurious Emissions
|f-fc| & gt; 12.5 MHz

& lt; -36 dBm / 1 kHz RW @ 9 kHz ≤ f & lt; 150 kHz
& lt; -36 dBm / 10 kHz RW @ 150 KHz ≤ f & lt; 30 MHz
& lt; -36 dBm / 100 kHz RW @ 30 MHz ≤ f & lt; 1 GHz
& lt; -30 dBm / 1 MHz RW @ 1 GHz ≤ f & lt; 12.75 GHz
& lt; -60 dBm / 3.84 MHz RW @ 869 MHz ≤ f ≤ 894 MHz
& lt; -60 dBm / 3.84 MHz RW @ 1930 MHz ≤ f ≤ 1900 MHz
& lt; -60 dBm / 3.84 MHz RW @ 2110 MHz ≤ f ≤ 2155 MHz
& lt; -67 dBm / 100 kHz RW @ 925 MHz ≤ f ≤ 935 MHz
& lt; -79 dBm / 100 kHz RW @ 935 MHz & lt; f ≤ 960 GHz
& lt; -71 dBm / 100 kHz RW @ 1805 MHz ≤ f ≤ 1880 MHz
& lt; -41 dBm / 300 kHz RW @ 1884.5 MHz & lt; f & lt; 1919.6 MHz

Transmit Intermodulation

& lt; -31 dBc @ 5 MHz & & lt; -41 dBc @ 10 MHz
when Interference CW Signal Level = -40 dBc

Error Vector Magnitude

& lt; 17.5 %, when Pout ≥ -20 dBm

Peak Code Domain Error

& lt; -15 dB at Pout -20 dBm

LGE Internal Use Only

- 14 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

2. PERFORMANCE

3) WCDMA receiver specification
Item

Specification

Receive Frequency

BD1: 2110 MHz ~2170 MHz
BD2: 1850~1910 MHz
BD8: 925 MHz ~ 960 MHz

Reference Sensitivity Level

Band1 : BER & lt; 0.001 when Îor = -106.7 dBm / 3.84 MHz
Band2 : BER & lt; 0.001 when Îor = -106.7 dBm / 3.84 MHz
Band8 : BER & lt; 0.001 when Îor = -106.7 dBm / 3.84 MHz

Maximum Input Level

BER & lt; 0.001 when Îor = -25 dBm / 3.84 MHz

Adjacent Channel Selectivity
(ACS)

ACS & gt; 33 dB where BER & lt; 0.001 when
Îor = -92.7 dBm / 3.84 MHz
& Ioac = –52 dBm / 3.84 MHz @ ±5 MHz

Blocking Characteristic

BER & lt; 0.001 when Îor = -103.7 dBm / 3.84 MHz
& Iblocking = -56 dBm / 3.84 MHz @ Fuw(offset) = ±10 MHz
or Iblocking = -44 dBm / 3.84 MHz @ Fuw(offset) = ±15 MHz

Spurious Response

BER & lt; 0.001 when Îor = -103.7 dBm / 3.84 MHz
& Iblocking = -44 dBm

Intermodulation

BER & lt; 0.001 when Îor= -103.7 dBm / 3.84 MHz
& Iouw1 = -46 dBm @ Fuw1(offset) = ±10 MHz
& Iouw2 = -46 dBm / 3.84 MHz @ Fuw2(offset) = ±20 MHz

Spurious Emissions

& lt; -57 dBm / 100 kHz BW @ 9 kHz ≤ f & lt; 1 GHz
& lt; -47 dBm / 1 MHz BW @ 1 GHz ≤ f ≤ 12.75 GHz

Inner Loop Power Control
In Uplink

LGE Internal Use Only

Adjust output(TPC command)
cmd
1dB
2dB
+1
+0.5/1.5
+1/3
0
-0.5/+0.5
-0.5/+0.5
-1
-0.5/-1.5
-1/-3
group(10equal command group)
+1
+8/+12
+16/+24

- 15 -

3dB
+1.5/4
-0.5/+0.5
-1.5/-4

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

2. PERFORMANCE

4) HSDPA transmitter specification
Item

Specification

Transmit Frequency

BD1: 1920MHz ~ 1980 MHz
BD2: 1850~1910 MHz
BD8: 880 MHz ~ 915 MHz

Maximum Output
Power

Sub-Test
1=2/15,
2=12/15
3=15/8
4=15/4

25.7~20.3dBm / 3.84 MHz
25.7~20.3dBm / 3.84 MHz
25.7~19.8dBm / 3.84 MHz
25.7~19.8dBm / 3.84 MHz

Sub-Test : 1=2/15, 2=12/15, 3=15/8, 4=15/4
Frequency offset from
carrier f

Measurement
Bandwidth

2.5 ~ 3.5 MHz

-35-15×( f-2.5)dBc

30 kHz

3.5 ~ 7.5 MHz

-35-1×( f-3.5)dBc

1 MHz

7.5 ~ 8.5 MHz

-35-10×( f-7.5)dBc

1 MHz

8.5 ~ 12.5 MHz

Spectrum
Emission Mask

Minimum requirement

-49dBc

1 MHz

Adjacent Channel
Leakage
Power Ratio (ACLR)

Sub-Test : 1=2/15, 2=12/15, 3=15/8, 4=15/4
& gt; 33 dB @ ±5 MHz
& gt; 43 dB @ ±10 MHz

Error Vector
Magnitude

& lt; 17.5 %, when Pout ≥ -20 dBm

5) HSDPA receiver specification
Item

Specification

Receive Frequency

BD1: 2110 MHz ~2170 MHz
BD2: 1850~1910 MHz
BD8: 925 MHz ~ 960 MHz

Maximum Input Level
(BLER or R), 16QAM Only

Sub-Test : 1=2/15, 2=12/15, 3=15/8, 4=15/4
BLER & lt; 10% or R & gt; = 700kbps

LGE Internal Use Only

- 16 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

2. PERFORMANCE

6) HSUPA Tx, Rx specification
Item

Specification

Maximum Output
Power

Sub-Test
1=11/15
2=6/15
3=15/9
4=2/15
5=15/15

25.7~17.3dBm / 3.84 MHz
25.7~16.8dBm / 3.84 MHz
25.7~17.8dBm / 3.84 MHz
25.7~16.8dBm / 3.84 MHz
25.7~20.3dBm / 3.84 MHz

Sub-Test : 1=11/15, 2=6/15, 3=15/9, 4=2/15, 5=15/15
Frequency offset from
carrier f

-35-15×( f-2.5)dBc

30 kHz

-35-1×( f-3.5)dBc

1 MHz

-35-10×( f-7.5)dBc

1 MHz

8.5 ~ 12.5 MHz

LGE Internal Use Only

2.5 ~ 3.5 MHz

7.5 ~ 8.5 MHz

Adjacent Channel
Leakage
Power Ratio (ACLR)

Measurement
Bandwidth

3.5 ~ 7.5 MHz

Spectrum Emission
Mask

Minimum requirement

-49dBc

1 MHz

Sub-Test : 1=11/15, 2=6/15, 3=15/9, 4=2/15, 5=15/15
& gt; 33 dB @ ±5 MHz
& gt; 43 dB @ ±10 MHz

- 17 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

2. PERFORMANCE

7) WLAN 802.11b transceiver specification
Item

Specification

Transmit Frequency

2400 MHz ~ 2483.5 MHz ( CH1~CH13 )

Tx Power Level

≤ 20dBm under (Europe), ≤ 30dBm under (USA)

Frequency Tolerance

within ±25 PPM

Chip clock Frequency
Tolerance

within ±25 PPM

Spectrum Mask

≤ -30 @ fc-22MHz & lt; f & lt; fc-11MHz and fc+11MHz & lt; f & lt; fc+22MHz
≤ -50 @ f & lt; fc-22MHz and f & gt; fc+22MHz

Power ramp on/off time

≤ 2us

Carrier Suppression

≤ -15dB

Modulation Accuracy
(Peak EVM)

≤ 35%

Spurious Emissions

& lt; -36 dBm @ 30MHz ~ 1GHz
& lt; -30 dBm above @ 1GHz ~ 12.75GHz
& lt; -47 dBm @ 1.8GHz ~ 1.9GHz
& lt; -47 dBm @ 5.15GHz ~ 5.3GHz

Rx Min input Sensitivity

≤ -76dBm(1Mbps,2Mbps,5.5Mbps,11Mbps) @ FER ≤ 8%

Rx Max input Sensitivity

≥ -10dBm(1Mbps,2Mbps,5.5Mbps,11Mbps) @ FER ≤ 8%

Rx Adjacent Channel
Rejection

≥ 35dB @FER ≤ 8%,
interference input signal -70dBm@fc±25MHz(11Mbps)

LGE Internal Use Only

- 18 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

2. PERFORMANCE

8) WLAN 802.11g transceiver specification
Item

Specification

Transmit Frequency

2400 MHz ~ 2483.5 MHz ( CH1~CH13 )

Tx Power Level

≤ 20dBm under (Europe), ≤ 30dBm under (USA)

Frequency Tolerance

within ±25 PPM

Chip clock Frequency
Tolerance

within ±25 PPM

Spectrum Mask

≤ -20 @ ±11MHz offset (9Mhz ~ 11MHz)
≤ -28 @ ±20MHz offset (11MHz ~ 20Mhz)
≤ -40 @ ±30MHz offset (20MHz ~ 30Mhz)

Transmitter constellation error
(rms EVM)

≤ -5dB@6Mbps, ≤ -8dB@9Mbps, ≤ -10dB@12Mbps,
≤ -13dB@18Mbps, ≤ -16dB@24Mbps, ≤ -19dB@36Mbps,
≤ -22dB@48Mbps, ≤ -25dB@54Mbps

Spurious Emissions

& lt; -36 dBm @ 30MHz ~ 1GHz
& lt; -30 dBm above @ 1GHz ~ 12.75GHz
& lt; -47 dBm @ 1.8GHz ~ 1.9GHz
& lt; -47 dBm @ 5.15GHz ~ 5.3GHz

Rx Min input Sensitivity

PER ≤ 10%
-82dBm@6Mbps, -81dBm@9Mbps, -79dBm@12Mbps
-77dBm@18Mbps, -74dBm@24Mbps, -70dBm@36Mbps
-66dBm@48Mbps, -65dBm@54Mbps

Rx Max input Sensitivity

≥ -20dBm(6,9,12,18,24,36,48,54Mbps) @ PER ≤ 10%

Rx Adjacent Channel
Rejection

PER ≤ 10%,
ACR ≥ 16dB@6Mbps, ACR ≥ 15dB@9Mbps,
ACR ≥ 13dB@12Mbps, ACR ≥ 11dB@18Mbps,
ACR ≥ 8dB@24Mbps, ACR ≥ 4dB@36Mbps
ACR ≥ 0dB@48Mbps, ACR ≥ -1dB@54Mbps
ACR shall be measured by setting the desired signal's strength 3 dB
above the rate-dependent
sensitivity specified in min input sensitivity

LGE Internal Use Only

- 19 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

2. PERFORMANCE

9) WLAN 802.11n transceiver specification
Item

Specification

Transmit Frequency

2400 MHz ~ 2483.5 MHz ( CH1~CH13 )

Tx Power Level

≤ 20dBm under (Europe), ≤ 30dBm under (USA)

Frequency Tolerance

within ±25 PPM

Chip clock Frequency
Tolerance

within ±25 PPM

Spectrum Mask

≤ -20 @ ±11MHz offset (9Mhz ~ 11MHz)
≤ -28 @ ±20MHz offset (11MHz ~ 20Mhz)
≤ -45 @ ±30MHz offset (20MHz ~ 30Mhz)

Transmitter constellation error
(rms EVM)

≤ -5dB@6.5Mbps, ≤ -10dB@13Mbps, ≤ -13dB@19.5Mbps,
≤ -16dB@26Mbps, ≤ -19dB@39Mbps, ≤ -22dB@52Mbps,
≤ -25dB@58.5Mbps, ≤ -28dB@65Mbps

Spurious Emissions

& lt; -36 dBm @ 30MHz ~ 1GHz
& lt; -30 dBm above @ 1GHz ~ 12.75GHz
& lt; -47 dBm @ 1.8GHz ~ 1.9GHz
& lt; -47 dBm @ 5.15GHz ~ 5.3GHz

Rx Min input Sensitivity

PER ≤ 10%
-82dBm@6.5Mbps, -79dBm@13Mbps, -77dBm@19.5Mbps
-74dBm@26Mbps, -70dBm@39Mbps, -66dBm@52Mbps
-65dBm@58.5Mbps, -64dBm@65Mbps

Rx Max input Sensitivity

≥ -20dBm(6.5,13,19.5,26,39,52,58.5,65Mbps) @ PER ≤ 10%

Rx Adjacent Channel
Rejection

PER ≤ 10%,
ACR ≥ 16dB@6.5Mbps, ACR ≥ 13dB@13Mbps,
ACR ≥ 11dB@19.5Mbps, ACR ≥ 8dB@26Mbps,
ACR ≥ 4dB@39Mbps, ACR ≥ 0dB@52Mbps
ACR ≥ -1dB@58.5Mbps, ACR ≥ -2dB@65Mbps
ACR shall be measured by setting the desired signal's strength 3 dB above
the rate-dependent
sensitivity specified in min input sensitivity

LGE Internal Use Only

- 20 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

2. PERFORMANCE

10) GPS receiver specification
Item

Specification

Receive Frequency

1574.42 MHz ~ 1576.42 MHz

Minimum Sensitivity

1 satellite ≥-142dBm, 7 satellites ≥ -147dBm at coarse time aiding

11) Current consumption
Stand by
Bluetooth Off

Bluetooth Connected

Voice Call

VT

WCDMA
Only

4.0 mA under
(DRX=1.28)

7 mA under
(DRX=1.28)

350 mA under
(Tx=12dBm)

NA

GSM
Only

4.0 mA under
(Paging=5 period)

7 mA under
(Paging=5 period)

350 mA under
(Tx=Max)

12) FM Radio Current consumption
FM Radio Play 2G

Current Consumption
45mA

FM Radio Play 3G

45mA

Reason
Mixing FM radio sound and Android sound
requires enabling ABE, so FM Radio current is
higher than other models using external audio
codec only.

13) Battery life time
Stand by

Voice Call

VT

WCDMA

350 hours over
(DRX = 1.28)

250 min over
(TX = 12dBm,
Low Pwr mode)

NA

GSM

350 hours over
(Paging Period = 9)

250 min over
(TX Level = Max)

LGE Internal Use Only

- 21 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

2. PERFORMANCE

14) Charging hour
3.5hour under ( 1500mAh battery, 1A TA)

15) RSSI indicator (Based on Cell power)
BAR

WCDMA

GSM/DCS/PCS

4

Over -88±2dBm

Over -91 ±2dBm

4 3

-88 ±2dBm

-91 ±2dBm

3 2

-96 ±2dBm

-99 ±2dBm

2 1

-104 ±2dBm

-103 ±2dBm

1 0

-110 ±2dBm

-105 ±2dBm

LGE Internal Use Only

- 22 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

2. PERFORMANCE

16) Battery indicator
Battery Bar

Specification

BAR 6 (Full)

90% over

BAR 6 -- & gt; 5

90% 89%

BAR 5 -- & gt; 4

70% 69%

BAR 4 -- & gt; 3

50% 49%

BAR 3 -- & gt; 2

30% 29%

BAR 2 -- & gt; 1

15% 14%

BAR 1 -- & gt; 0

5% 4%

Low Battery Pop-up

4% ~ 15% : One Time popup (No call)

Critical Low Battery Pop-up

0% ~ 3% : Every Level change popup (No call)

POWER OFF

0%

remain%

2.7 P920 Figures

LGE Internal Use Only

- 23 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

3. Technical Brief

3. TECHNICAL BRIEF
The LG-P920 supports UMTS-900, UMTS-1900, UMTS-2100, GSM-850, GSM-900, GSM-1800, and GSM-1900 based
GSM/GPRS/EDGE/UMTS. All receivers and the UMTS transmitter use the radio One Zero-IF architecture to
eliminate intermediate frequencies, directly converting signals between RF and baseband. The quad-band GSM
transmitters use a baseband-to-IF up-conversion followed by an offset phase-locked loop that translates the
GMSK-modulated or 8-PSK-modulated signal to RF.

PMU
RF6590

GPS IN
1V2

Filter
B946
9

Diplexer

RD_H
RD_HX
RD HX

1V8

2V852V65

VCTCXO

XO
AFC_DAC
AFC DAC

26MHz
VCONT

PAM DCDC
RF6560
VOUT_FB
VOUT FB

GSM_LB_TX VCC CP_OUT
GSM_HB_TX
TRX4
TRX5
TRX3
TRX2
TRX6
TRX1

Ant_B8
Ant B8
Ant_B5
Ant_B2
Ant_B1
Ant_B4
Ant B4
Ant_B3

B7953
B8 DPX

PM_L
PM L

B8_TX
B8 TX

B7671
B5 DPX
B7955
B2 DPX
B7696
B1 DPX
B7959
B4 DPX

B5_TX

MMMB

B2_TX

RF6260

PM_H

Transceiver
PMB5712

B1_TX
B4_TX
B4 TX

XMM6260

DCS
SAW filter

RX_L1X
RX_L1
RX_L2X
RX_L2
_

ST8T
BGSF18D

RX_M2X
RX_M2
RX_H2X
RX_H2
RX_H1X
RX_H1
RX_M
M1X
RX_M1

SYS_CLK

SYS_CLK

SYS_CLK_EN

SYSCLKEN
REF_CLK_EN

REF_CLK_EN
DI3_TX_DAT
DI3_TX_DATX

Di3_TX_DAT
Di3_TX_DATX

DI3_RX_DAT
DI3_RX_DATX

Di3_RX_DAT
Di3_RX_DATX

[Figure 3-1] Total Block diagram of RF part

LGE Internal Use Only

- 24 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

3. Technical Brief

3.1 Radio Part General
SMARTi™ UE2 is a highly integrated UMTS/GSM-transceiver, with all necessary features to enable multi mode,
multi band mobile cellular devices. It incorporates a fully integrated dual mode receiver with main and diversity
chains, 2 multi band TX outputs, control, Digitally controlled crystal support, a measurement interface,
DigRFV3.09 compliant high speed data and control interface, a multi mode timer unit and all necessary front end
signals for the complete RF Engine control. Overall the IC directly supports RF engines with up to 4 GSM bands
and typical 4 UMTS (can be less or more depending on engine setup) bands without additional discrete RF path
switches.

W1

PMU

Power
Control

GW2

Diversity
Receiver

GW5
GW6

W1
Xtal
GW2

Main
Receiver

G1300
GW5
GW6

DigRF 3G
V3_09

Data
&
Control

FE CTRL
(GPO/SPI)
Ctrl
Lo band

Digital
Modulator

Det

Hi band
Ctrl

DC/DC

[Figure 3-2] SMARTi UE2 main feature

-. 3GPP release 7 (HSPA+)
-. Up to 5 UMTS-FDD / 4 EDGE Bands
* Band I ~ VI, VIII ~ X

* EGPRS MSC 33 / 34

* 28Mbps DL / 11.5Mbps UL (HSPA+ 64 / 16QAM)
* 14.4Mbps HSDPA / 5.76Mbps HSUPA (cat 10 / 6)
-. Standard DigRF V3.09 interface to Digital BB
-. Multi-Mode / Multi-Band Single-Chain Tx Concept

LGE Internal Use Only

- 25 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

3. Technical Brief

3.2 Radio Part Rx Section
For the RX section the IC features 6 RX inputs, 4 of those might be used for multi mode receive, this means they
can be used for GSM and UMTS (the IC can be reconfigured to achieve in spec performance) operation. The
highband input are for UMTS operation only. The multi mode inputs include first LNA (for GSM and UMTS)
without and additional external LNA and inter-stage filter. The receiver structure is optimized for compressed
mode operation, thus only a single base band chain is used, saving area and optimizes power consumption. The
receiver AGC can be aligned to the UMTS frame structure.
Additionally to the normal receiver the IC contains a diversity receiver part, enabling up to 4 band Rx diversity for
GSM and UMTS mode without external LNA’s and inter-stage filters.

RD_L1

S & H

RD_L1X

2G Mode
RD_L2
RD_L2X

LPF

S & H

ADC
MUX

RD_M
LPF

RD_MX
RD_H

ADC

FIR
MUX
FIR

HPF

3G Mode

0/90°

RD_HX

HPF

RX synthesizer

RX_L1

DigRF

RX_L1X
RX_L2
RX_L2X

S & H

0/90°

2G Mode

RX_M1
RX_M1X

LPF

S & H

ADC
MUX

RX_M2
RX_M2X

LPF

ADC

FIR
MUX
FIR

HPF

3G Mode
RX_H1
RX_H1X

HPF

RX_H2
RX_H2X

[Figure 3-3] 2G / 3G Rx Block Diagram

LGE Internal Use Only

- 26 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

3. Technical Brief

3.3 Radio Part Tx Section
The TX features 2 RF outputs, which are directly matched to 50

impedance for easy connection to external

power amplifiers, which reduces significantly external component count. Those 2 outputs are high power, small
signal polar modulated outputs for the GSM and UMTS system, with low sensitivity to PA harmonics. They are
capable to perform GMSK or 8-PSK as well as UMTS modulation signals with excellent noise performance, thus
no inter-stage filter in between transceiver and PA is required. The transmitter outputs are broadband, one
covers all low bands (Band V, VI, and VII), the higher band output covers all GSM and UMTS bands Band I, II, III, IV,
IX and X. The output driver is capable to support high output powers to enable low cost single chain PA’s.
The IC features additionally closed loop power control for GSM and for UMTS, thus supporting TRP requirements
in cooperation with the power amplifier and the antenna design. There is one input ball for the power detector
voltage coming from the PA, and one input ball for the RF signal fed back to the TRX. The complete loop circuits
are implemented in the digital domain, which enables a high reliability of the loop performance for both
standards.

AM-Path

I/Q to R/Phi

TX-Disruptor
PM-Path

I/Q to R/Phi

I/Q-Chain

2G
Modulator

12 bit
sign

AM-Path

PM-Path

to signal
chain

Feedback Sifnal
Processing

0C HIP

I/Q-Chain

DIG RF
3G

FIFO

1C HIP
12 bit
sign

Feedback RX

Detector ADC

[Figure 3-4] Single Chain PA’s Tx Architecture

LGE Internal Use Only

- 27 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

3. Technical Brief

3.4 Radio Part Interfaces
The base band is connected via a DigRF V3.09 high speed data interface with a maximum clock frequency of 312
MHz. The pure digital interface enables the digital baseband to shrink efficiently, as all the analog functionality is
within the RFIC. All data and control traffic is multiplexed via the RX and TX interface lines. The IC features a high
level programming model enabling the complete compressed mode operation of the device in an RF engine
environment. It handles RX and TX power control, also incorporating the calibration data.
The complete timing is optimized for compressed mode operation of the transceiver, it controls the front end
components of the engine (PA´s, switches, Antenna switches etc…). Additionally a SPI control bus for front end
component control is available on the IC, which also enables the read back of data from external components,
thus the handling of functions like PA saturation, mismatch detection, overheating (incorporated in the closed
loop power control) can be adopted.

Data
DI3_RX_DAT
DI3_RX_DATX

RLVDS
Driver

P/S
Converter

Framer

Control
SYS_CLK

SysClk
Driver

SYS_CLK_EN

Digital
Baseband IC

RF IC

PLL

312 MHz

Control

DI3_TX_DAT
DI3_TX_DATX

RLVDS
Receiver

Phase
Correlator

Retimed
Data

S/P
Converter

Retimed
Data

Deframer

Data

[Figure 3-5] DigRF Architecture
Table 3-1. DigRF I/F path’s Data Rates

LGE Internal Use Only

- 28 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

3. TECHNICAL BRIEF

Public Version

3.5www.ti.com Baseband (OMAP4430)
Digital

Environment

1.2 Environment
The OMAP4430 high-performance multimedia application device is based on enhanced OMAPTM architecture
This section provides an overview of the OMAP environment. The device is associated with power and

audio technology. The (ICs). is associated with solution with the integrated circuits(ICs) that
and used 45-nm integrated circuits deviceTI provides a globalpower and audioTWL6030/TWL6040 devices. is called

Y

Figure 1-1 is an
TWL6030 and TWL6040. overview of a nonexhaustive environment for the high-tier OMAP4430 device.
Figure 1-1. OMAP4430 High-Tier Environment
Handset
microphones x2

Ear
speaker

HF speakers
x2

AR

Headset

Vbat

Backup
battery

Buckboost
Main
battery

Hands-free
amplifier

Speakers

Micro
Power

Boost

Vibrator/
actuator
x2

Vibrators

Gas
gauge
TWL6040

TWL6030

Charger
interface

Keypad

USB
charger

Headset

DVFS Ctrl

I2C Ctrl

SR

I2C1

*
7
4
1

Audio

I2C Ctrl

#
9
6
3

WL1283 BT/FM/GPS/WLAN

IN

AC
charger
BQ24156

0
8
5
2

S/PDIF

Micro USB

MCASP

MCPDM

KEYBOARD

DMIC

SLIMBUS1

SDMMC5

MCBSP2

Other flash
memory
SDMMC2

(Nor, Nand,
OneNand, ...)
NVM LPDDR 2
memory

2 or 4x
LPDDR2
SDRAM

GPMC

IM

eMMC
(JC64)

MCSPI2

MCBSP1

UART2

USBA0OTG

I2C2

SDMMC4

LPDDR22

MCSPI3
MCBSP2
UART3

USBB1ULPI/HSIC

SDMMC 1

PR
EL
NFC

Mobile TV

C2C

OMAP4430

SD/MMC

MCSPI4

LPDDR21

HSI

3G

MCBSP2

IrDA
UART3

I2C4

DISPC2

MCSPI1

RFBI

Fingerprint
/ Slide pad

MCSPI
RFBI

DISPC2

I2C2

Touchscreen

DSI1

Main display

I2C2

CVIDEO

DSI2

HDMI

CCP2
CSI2-A

I2C3

CSI2-B

HDMI companion
(LS+ESD+StepUp)
Touchscreen

Subdisplay

TVout

Primary
camera

Secondary
camera

PicoDLP®

intro-002

OMAP4430 Block Diagram (Typical Connections Shown)

SWPU231M – July 2010 – Revised November 2010

Introduction

257

Copyright © 2010, Texas Instruments Incorporated

LGE Internal Use Only

- 9 -

Copyright © 011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

3. Technical Brief

Cortex-A9 MPU Subsystem
Two ARM Coretex-A9 MPCore
IVA-HD Subsystem
The IVA-HD subsystem is a set of video encoder/decoder hardware accelerators. It supports up to 1080p x 30 fps,
slow-motion camcorder, triple play (HD and SD capture and JPEG capture), real-time transcoding of up to 720p,
and video conferencing up to 720p.
The IVA-HD supports:
MPEG-1/2/4, Divx 5.02, H.263 P0 (encode/decode) and P3 (decode), H.264 Annex G (scalable baseline profile up
to 720p), H.264 BL/MP/HP, H.264 Annex H(partial), Stereoscopic video, JPEG(encode/decode), VC-1 SP/MP/AP,
AVS-1.0, RealVideo 8/9/10 (decode only), On2 VP6.2/VP7 (decode only)
Display Subsystem
Display controller
: Three video pipelines, one graphic pipelines, and write-back pipeline.
Two LCD outputs, One TV output.
Remote frame buffer interface (RFBI) module
Two MIPI display serial interface (DSIs)
High-definition multimedia interface (HDMI) encoder
: HDMI 1.3, HDCP 1.2, and DVI 1.0 compliant
Deep-color mode support (10-bit for up to 1080p and up to 12-bit for 1080i/720p)
NTSC/PAL video encoder
ABE (Audio Back End) Subsystem
The ABE subsystem handles audio processing for the application. It manages the audio and voice streams
between the Cortex-A9 MPU subsystem and/or DSP, and the physical interfaces.
Imaging Subsystem (ISS)
The ISS processes data coming from the image, memory, and IVA-HD subsystem. The ISS is responsible for
multimedia applications such as : camera viewfinder, video record with up to 1080p at 30 fps with digital zoom
and still image processing, such as image capture up to 16 Mp with digital zoom and rotation. The ISS supports a
pixel throughput of up to 200Mp/s. It assures good performance with sensors up to 16 Mp and more (higher
resolution can be achieved through multiple passes).
2D/3D Graphics Accelerator
The 2D/3D graphics accelerator subsystem in based on POWERVR

SGX540 core from Imagination

Technologies. The SGX can process different data types simultaneously.
In addition to its processing elements, an extensive set of peripheral interfaces enables communication with all
necessary external devices.
LGE Internal Use Only

- 30 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
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3. Technical Brief

3.6 Hardware Architecture
& lt; System HW Block & gt;
FM_ANT

LCD 4.3”
4.3
4.3” TFT 3D
LCD
(480x800)

Touch

LED
Backlight
Driver IC

DSI

I2C2

McBSP1(PCM)
McBSP3(I2S)
UART2
SDIO
5
McPDM

I2C2

Compass
2Gb-2ch
LPDDR2

POP
3D CAMERA

5M AF
MIPI(P)
5M AF
MIPI(S)
Keypad

eMMC (8Gb)
VT
0.3M
MIPI

I2C4
SDRC
SDMMC2

UART4 USB

Accelerometer

A-GPS

I2C1

MCLK

JTAG

PMB5712

LNA

Key LED

USIF3 DigRF
GPIO_34
NAND
GPIO_35
I2S2 XMM6260 DDR
MIPI_HSI

32.768KHz

FEM

MCP

1Gb
NAND
512Mb
DDR

USIM1
JTAG

JTAG
32.768KHz

PWR-ON KEY

Charge
r

Battery

38.4MHZ

USB

JTAG

PMIC_AP
(TWL6030)

VCHG

3.5 pi Ear_Jack

FM_ANT

USIF1
I2C

MIC2
3.5 pi Ear MIC(Ear_Jack)

TCXO Driver

IPC_SRDY
IPC_MRDY

GPIO_82

I2C3

MIC2

HS_MIC
HSOLR

MIC1

Fuel gauge

McSPI4
GPIO_119
GPIO_120
MCSPI2(PCM)
MIPI_HSI
UART1

KB_COL/ROW

SPK

MIC1

TWL6040
PDM

EAR_PIECE(RCV)

SPK

Motor

UART3

I2C4

AUXLR

Light Sensor

GPIO

I2C2

EARO

Proximity

GPIO_2
DMTIMER8_PWM_EV
5
T
I2C1

SDMMC1

I2C

HiFi & PCM Voice

OMAP4430

CSI2
HDMI

Gyro

BT/WLAN/FM
(WL1271)

I2C4

CSI1

5M CAM Flash

FM

FM_L/R

MUIC

Coin cell
VBAT

Figure. Block Diagram

LGE Internal Use Only

- 31 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

3. TECHNICAL BRIEF

3.7 Subsystem (PMB9811_X-GOLDTM626)
The X-GOLD™ 626 is a 3GPP Release 7 dual-mode baseband modem which is expected to connect to an
application processor in order to create a high-end smartphone solution. It can be used to create a data-card
solution as well. This section provides a high-level view of the chip architecture. More details can be found in the
X-GOLD™ 626
PMB 9811

sections that follow.

The X-GOLD™ 626 can be broken into 6 major subsystems: Backbone, Connectivity, Audio, 2GL1, 3GL1, and PMU.
CONFIDENTIAL ci

X-GOLD™ 626 Architecture Concepts

Each of these subsystems play important roles for operation of the modem.
01
02

Audio

Backbone

Audio
DSP1

03

ARM11

ETM11

04
05

ABW

08

DMA1
8-ch

L2 Cache
256 kB

09

CEU

CGU

GPTU 0

DMA2
2-ch

SPCU

GPTU 1

I2S2

DSP
Interrupt

CAPCOM1

RTC

07

SCU

STM

06

Audio
DSP2

CAPCOM0

32kB I-Cache
32kB D-Cache
8kB I-TCM
8kB D-TCM

I2S1

6
6

DSP
Timer

Shared Mem

CPU XBAR

Bridge

Peripheral XBAR

13
14

EBU

17

or
L
n

62

Shared
Mem

19
3GCU

ARM7
ETM7
ICU
USIF5

24
25

DL-MACPHY
UL-MACPHY

27
29

7

33
35
37

40
41

TxBitProc
TxMod
DPE
Searcher
OLP
MRAM

USIM

DSP
Timer
RF IF

USB-FS
ICU

GSM
Cipher

USB-HS

Channel Equalizer
Decoder Accelerator

USIF1
USB-HSIC

DSP
Interrupt

MIPI HSI
USIF3

IR
Memory

SD-MMC1
I2C1

DigRF 3.09

PMU
SD2
(VDDIO)

MIPI PTI
POR

PCL/GPIO

VANA

VUSB

VSIM

VMIPI

DAP

VPMU

VRTC

SSC

1
3 (+2)
2
(+4)
6
5
2
8
(+5)
7
2
7 (+7)
2 (+10)
5

USIF2

Measurement
TSMU

36

39

FCDP

VPLL

31

34

38

SYNC_TX

Rake
3G DSP

SD1
(VDDCore)

32

GSM
Timer

ORX

Rake

30
31

Connectivity

2GL1

2G DSP1 2G DSP2

R99ORX

HSIRX
HSORX

MACPHY

26

COMRAM

HSDPA

MCU

23

28

USI

Co
p

22

Pr
ov

21

yf

3GL1

20

GSI

de

18

dU

16

GUCIPH

LMU
RAM
LMU
ROM

ide

15

DA

12

rN

11

GE

10

Control Unit
BB_ ArchitectureOverview.vsd

Figure 6

Architecture Block Diagram of the X-GOLD™ 626

4.1.2

Architectural Characteristics

Fig.3.7 Architecture Block Diagram of X-GOLD™ 626

The X-GOLD™ 626 comes along with the following architecture units.
42
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57
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Copyright © 011 LG Electronics. Inc. All right reserved.
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Revision 1.0, 2010-04-26
EDD 3.4

3. Technical Brief

3.7.1 The Backbone Subsystem
The backbone subsystem contains elements which handle the main processing in the system. The protocol stack
is expected to execute here. The ARM™1176 acts as the main CPU, it is connected via the CPU XBAR with the
internal memories (RAM, ROM), the external bus interface, and the 8-channel DMA (DMA1). There is level 1 cache
and tightly-coupled memory incorporated within the ARM which help with the performance of the CPU. A level
2 cache is also added to this which helps even further with the system performance. Given that the modem is
expected to support high data rates for HSDPA (category 14) and HSUPA (category 7), these additional elements
are necessary. The ARM™1176 also has the capability of controlling the peripherals in the device that are
connected to the Peripheral XBAR via a bus bridge. This 32-bit multi master AHB bus is connected to all
peripherals.
The Clock and System Control Unit (CSC) consists of the system control unit (SCU), system power control unit
(SPCU) and the clock generation unit (CGU). These units are responsible for the reset handling, the clock
multiplexing and switching and the power control of the device.

3.7.2 The Connectivity Subsystem
There are a rich set of peripherals included in the connectivity subsystem which allow interfacing to external
devices. It is required that we have connectivity for inter-process communications (IPC) with the AP, SIM card
support, external interrupts, external memory cards, trace and debug, external device control (A-GPS), and
general purpose I/O. For IPC there are 3 generic interfaces: USB HSIC, MIPI HSI, and USIF3 (which provides UART
and SPI operation). SIM and FS-USB interfaces are dedicated to the SIM-Card. External interrupts are included for
waking the modem from low power modes. There is a SD-MMC interface for utilizing memory cards in datacards
applications. The USB-HS, USIF1, and MIPI PTI interfaces can be used for tracing purposes. NAND flash can be
connected to the FCDP interface for supporting memory accesses. External devices can be controlled by the
baseband through the I2C interface. There are also generic input/output pins that can be used to connect the
baseband to external components in the system. These peripherals occupy a different number of pins as
indicated in Fig.3.7. The number in parentheses refer to additional signals which are available only as alternate
functions behind other functions.

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3. Technical Brief

3.7.3 2GL1 Subsystem
While the upper layers of the modem software stack run on the main CPU, physical layer processing takes place
in the layer-1 subsystems. The 2GL1 subsystem contains 2 DSPs, which help with layer-1 processing in 2G modes.
The added DSP helps with higher performance use cases such as receive diversity and multi-slot classes. It
contains a set of dedicated HW peripherals (equalizer, etc) and connects to the digital RF interface.

3.7.4 3GL1 Subsystem
While in 3G modes, assistance is required from the 3GL1 subsystem. An ARM™7 CPU deals with the
communication of the 3G subsystem with the stack SW running on the ARM™1176 and handles the scheduling
of the different activities between the 3G HW peripherals (RAKE, DPE, Searcher, HSDPA Inner Receiver, Rel99and HSDPA-Outer Receiver). The signal processing tasks are handled by the 3G DSP. The up-link and downlink
data will be buffered in the COMRAM which connects to the ARM™1176 system via the MACPHY peripherals.
Connection to the RF is managed by the DigRF peripheral.

3.7.5 The Integrated PMU Subsystem
The integrated PMU subsystem contains all of the supplies necessary for powering the baseband in the platform.
There are two step down converters for the digital core voltage (SD1) and digital IO voltage (SD2). Seven linear
voltage regulators provide the supply voltages for various internal and external components.

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3. Technical Brief

3.7.6 Audio Subsystem
An overview of the Audio Subsystem hardware architecture can be found in Figure 3.7.6.
The three main entities relevant for the audio processing are
• ARM™1176 Embedded Microcontroller Unit core (ARM™1176)
• Embedded Digital Signal Processor cores (DSPs)
• 3rd Party IP CODEC

Fig.3.7.6 Audio Subsystem Block Diagram
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3. Technical Brief

ABE Overview
The audio back end (ABE) module is a subsystem that manages various audio and voice uplink and downlink
streams between the initiator (the Cortex™-A9 microprocessor unit [MPU], digital signal processor [DSP], or
direct memory access [DMA] controller) and the peripheral physical interfaces (multichannel buffered serial port
[McBSP], SLIMbus®, digital microcontroller [DMIC], multichannel pulse density modulation [McPDM], and
multichannel audio serial port [McASP]).
The ABE module handles the audio processing for the applications. It receives voice or audio samples from the
initiator or the external audio chip (TWL6040 or other) and sends them to the peripheral interfaces or memories
after processing. The ABE can perform buffering of audio samples, mix audio with a voice down stream and/or a
microphone up stream (sidetone), and can apply some post-processing.
The ABE integrates the following modules:
• Peripheral physical interfaces:
– Three McBSP modules
– One McASP module
– One mobile industry processor interface (MIPI) SLIMbus interface
– One DMIC module to support up to six mono and up to three stereo digital microphones
– One McPDM module to support interconnect with an external audio chip.
• Audio engine (AE):
– Performs real-time signal processing like sample rate conversion, filtering, equalizing, and side-tone
– Audio traffic controller (ATC):
• Performs data move in the ABE
• Generates interrupt requests to the DSP and Cortex-A9 interrupt controllers
– On-chip memory:
• 64KB of RAM; 32-bit data memory (DMEM)
• 6KB for coefficient memory RAM (CMEM)
• 18KB for sample memory RAM (SMEM)
• 8KB for program memory RAM (PMEM)
• Local L4 interconnect (L4_ABE) to:
– L3 interconnect
– Cortex-A9 MPU
– DSP

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3. Technical Brief

The Cortex-A9 MPU and the DSP have private access to the L4_ABE interconnect. All other initiators (sDMA) can
access the L4_ABE only through the L3 interconnect.
• Timers:
– Four general-purpose (GP) timers
– One watchdog timer
• Clock and reset management: Receives clock and reset signals from the device PRCM module. The audio
engine operates from the DPLL_ABE, which is in the PRCM module. The ABE modules can be supplied with clock
signals from the DPLL_ABE or the DPLL_PER. The ABE has its own hardware reset domain (AUDIO_RST).
• Power management: The ABE module is power-independent. It has its own dedicated power domain (PD_ABE)
and can execute audio processing with the rest of the device in retention or in off mode.
• Each peripheral in the ABE can be accessed directly by the initiator when the AE is bypassed (legacy mode, for
old software compatability).
Figure 3.7.6.1 is a high-level overview of the ABE.

Fig.3.7.6.1 Audio Back End
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3. Technical Brief

AE Subsystem
The AE is the core of the ABE subsystem. It performs the real-time audio processing within the ABE:
mixing, muxing, volume control, smooth muting, sampling rate conversion, and side-tone equalization. The AE
subsystem also processes and executes all data transfers. To optimize the global processing, the ATC moves the
data. An IRQ/DMA controller controls system IRQ and DMA requests. Input DMA requests come from the ABE
peripherals, and output DMA requests and IRQ are generated and sent to the system (Cortex-A9 MPU interrupt
controller, DSP interrupt controller, system DMA [sDMA], and the DSP enhanced direct memory access controller
[eDMA]).
The AE subsystem contains:
• AE: processes and executes the micro code with its own RAMs:
– SMEM
– CMEM
– PMEM
• DMEM contains the audio buffer and communication circular buffer.
• ATC: Transfers data between all modules in the ABE
• IRQ DMA controller
For more information about the audio engine, see the Audio Back-End (ABE) and Hardware Abstraction Layer
(HAL) Addendum.

Multichannel Audio Serial Port
The multichannel audio serial port (McASP) is a GP audio serial port. It is useful for intercomponent (DIT)
transmission. The McASP is intended to be flexible enough so that it may connect gluelessly to audio A/D, D/A,
CODEC and SPDIF transmit physical layer components.
McASP has the following features:
• 2-interconnect slave interface supports:
– One interconnect configuration slave interface
– One interconnect DMA slave interface
– 32-bit data bus width
– 16- and 32-bit access
– 10-bit address bus width
– Burst not supported
– WNP

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3. Technical Brief

• Supports idle request/acknowledge protocol
• Buffers for transmit/receive operations
• DMA requests (one per direction) link with the 32-bit register
• Up to four transmit channels
• Four serializers implemented
• Support of disconnect protocol

Multichannel Buffered Serial Port
There are three McBSP instantiations: McBSP1 through McBSP3. They provide a full-duplex direct serial interface
between the ABE and external devices, such as other modems, BT chips, or codecs. Because of its versatility, a
McBSP can accommodate a wide range of peripherals and clocked frame-oriented protocols (I2S, PCM, TDM).
List of recommended usage per McBSP:
• MCBSP1: BT voice/audio data
• MCBSP2: Digital baseband (DBB) voice data
• MCBSP3: MIDI FM data
The McBSP has the following features:
• Interconnect slave interface (internal interconnect) supports:
– 32-bit data bus width
– 8-, 16-, and 32- bit access
– 10-bit address bus width
– Burst not supported
– WNP
• Buffers for transmit/receive operations: 128/128 32-bit words (McBSP1, 2, 3)
• Interrupts configurable in legacy mode (two requests) or PRCM-compliant (one request)
• DMA requests (one per direction) triggered with programmable FIFO thresholds
• Multidrop support
• Serial interface description
• Four-pin configuration (McBSP1, 2, 3)
• Full-duplex communication
• Multichannel selection modes
• Support to enable or block transfers in each channel
• Up to 128 channels for transmission and for reception
• Supported protocols

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3. Technical Brief

• Direct interface to industry-standard codecs, analog interface chips (AICs), and other serially connected A/D
and D/A devices:
– I2S-compliant devices
– TDM bus devices
– PCM devices
• A wide selection of data sizes: 8, 12, 16, 20, 24, and 32 bits
• Supports idle request/acknowledge protocol
• Clock generation support:
– Independent clocking and framing for reception and for transmission up to 48 MHz
– Support for external generation of clock signals and frame-synchronization (frame-sync) signals
– A programmable sample rate generator for internal generation and control of clock signals and
frame-sync signals
• Support of disconnect protocol

Multichannel Pulse Density Modulation Module
The McPDM is a proprietary interface based on multichannel pulse density modulation. The module consists of
five downlinks and three uplinks. Two other uplink channels are reserved for status communication.
The McPDM has the following features:
• Interconnect slave interface (L4_ABE internal interconnect) supports:
– 32-bit data bus width
– 10-bit address bus width
– Burst not supported
– WNP
• Full-duplex communication:
– Five audio downstream channels
– three audio upstream channels
• RX/TX FIFO operations: 32-bit words per channels
• Complies with PRCM interrupts:
– One to the MPU subsystem
– One to the DSP subsystem
• DMA requests (one per direction) triggered with programmable FIFO thresholds; depending on the FIFO
implementation, one per channel or one per direction
• Decimation filter for embedded uplink paths (five paths if two status paths)

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3. Technical Brief

• Oversampling for embedded uplinks (five paths)
• Sigma delta for embedded downlinks (three paths)
• Deserializers for the two status upstream channels
• Support of disconnect protocol

Interface
Phoenix audio comprehend 3 different interfaces:
1. I2C interface for the information with non-critical latency.
2. PDM interface for the audio signal and the register associated with audio path (gain, control)
3. GPO for audio IC interacting with Phoenix audio (drivers, power provider)
Some “dual access” registers (addresses 0x0A to 0x1B) can be accessed by both I2C and PDM.
By default, the concurrent access is disabled and only the PDM
interface can write in these registers. The R/W access can be switched to I2C only by setting bit
I2CSEL. A concurrent access by both I2C and PDM interfaces is also possible by setting bit
PDMI2CSEL. In this last case, Phoenix audio will not provide arbitration of simultaneous accesses and
the functionality of the system will not be guaranteed if this happens. In this mode, the software must ensure
that access by one interface is complete before using the other one, in order to avoid any
collision

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3. Technical Brief

PDM Interface
The PDM interface is the over-sampled serial interface used for communication between Phoenix audio and the
application processor companion chip.
PDM_CLK is 19.2 MHz or 17.64 MHz and data rate represented by PDM_FRAME is respectively 1.92 MHz or 1.764
MHz. Words of data can be transmitted from OMAP to ABB chip using PDM_DN line (downlink path) but words
of data can also be transmitted from ABB chip to OMAP using PDM_UP line (uplink path).
Both chips are synchronized through PDM_FRAME line. By default OMAP is the owner of PDM_FRAME but
during transmission, ABB chip can send back to OMAP some low-latency data by using frame line. This will be
detailed later in this chapter.
Phoenix audio PDM interface consists of three different modes, Normal mode, Command mode and Test mode.
Normal mode and Command mode are intended to use with OMAP McPDM. Test mode is designed for
evaluation and production test.

Fig.3.7.6.2 PDM Interface connectivity between Phoenix and OMAP4 McPDM

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3. Technical Brief

3.7.7 Vocoder Subsystem
FR, HR, EFR speech channels (TCH/FS, TCH/HS, TCH/EFS)
• NAMR/WAMR speech channels over GMSK and 8PSK
• Mandatory sub-functions for speech channels:
– Discontinous transmission (DTX)
– Voice activity detection (VAD)
– Background noise calculation
• Fullrate and halfrate data channels (F14.4, F9.6, F4.8, F2.4, H4.8, H2.4)

3.7.8 Memory Subsystem
The X-GOLD™626 can use the general term SDRAM as a shortcut for Mobile DDR SDRAM.
A total of up to four external memories is supported, chip selects can be dynamically allocated to one of the two
external memory controllers of X-GOLD™626. Only two memory devices can be connected to the SDRAM
controller if DDR support is required.

3.7.9 Battery Management – Hardware Configurations
The X-GOLD™626 chip has an internal PMU that will provide power supply for the chip itself, memory and the
attached RF. The X-GOLD also holds a measurement unit that can perform all necessary battery measurements
through external HW. This is sufficient for a modem only design where charging is controlled by another chip.

3.7.10 Clocking
The clocking system is based on 2 different clocks, a 26 MHz reference clock generated within the RF Engine and
a 32 kHz real-time clock (RTC) generated in the baseband. The 26 MHz clock provided by the RF engine is the
main reference clock for the RF circuit and the X-GOLD™626. Also other system components may be supplied
with 26 MHz reference clocks. A 32 kHz oscillator located at the X-GOLD™626 supplies the RTC with the reference
clock for the real time clock application, as well as provides a low power standby clock for system sleep mode
operation. This clock is available
also for other system components like GPS.
.

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3. Technical Brief

3.7.11 USB
The XMM™6260 platform provides two USB interfaces compliant to the USB2.0 standard:
• High speed interface (480 Mbps) for communication with external devices acting both as host or device
• Full speed interface (12 Mbps) for communication with the UICC using the IC-USB standard acting as host
The USB solution is based on USB controller hardware IP, which is integrated in the X-GOLD™626 baseband chip
including both USB transceivers for high and full speed and the USB Stack software that implements the
different USB device classes and features.
The HS USB component supports the following features:
• Modem connection for Dial Up Networking and AT command interface (CDC-ACM)
• Tracing over USB (CDC-ACM)
• File System Access (Mass Storage Device)
• Audio over USB
• Suspend/Resume and Remote Wakeup and selective suspend (for power saving)
• Software download
The IC-USB component supports the following features:
• UICC-Terminal USB interface according to ETSI TS 102 600 (ICCD / Mass Storage / CDC-EEM)
• Suspend/Resume and Remote Wakeup (for power saving)
The USB HSIC component supports the following features:
• Modem connection for DialUp Networking and AT command interface (CDC-ACM)
• Tracing over USB (CDC-ACM)
• Suspend/Resume and Remote Wakeup, device triggered suspend (for power saving)
• LPM according to " USB 2.0 Link Power Management Addendum " , Remote Wakeup (for power saving)
• Wake-up by sideband signals (optional for optimized power consumption)
• Software download, flashless boot
The USB HSIC component supports the following features:
• Modem connection for DialUp Networking and AT command interface (CDC-ACM)
• Tracing over USB (CDC-ACM)
• Suspend/Resume and Remote Wakeup, device triggered suspend (for power saving)
• LPM according to “USB 2.0 Link Power Management Addendum”, Remote Wakeup (for power saving)
• Wake-up by sideband signals (optional for optimized power consumption)
• Software download, flashless boot

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3. Technical Brief

3.8 Power Block
3.8.1 General
Since P920 uses two individual chips, XMM6260 (IFX Modem) uses integrated PMIC and OMAP4430 uses
TWL6030 as a main PMIC.

X-GOLD™ 626
PMU Sub-System

3.8.2 XMM6260 (IFX Modem)
Confidential

General Overview

X-GOLD™ 626 is a GSM/UMTS/GPRS/EDGE/HSDPA/HSUPA Baseband Controller with integrated modem power

1.1

PMU Block diagram

management unit. This system on chip is designed with the latest low power CMOS process technologies which
provides significant performance to meet the ever increasing demands of the cellular subscriber market for

FSS

eFuses

Digital Control

M4

M3

M2

M1

REF_CLK_EN

RESET_BB_N

ON2_N

TM_EN

TRIG_B

Ball

ON1

feature rich terminals at lowest power consumption and a very competitive cost position.

MU

SSC

VDD_VBAT_SD1

VREF

Bandgap

AGND

B

LSD1
V
CVSD1

VSS_SD1

CVDD_SD1

VDD_VSD2

VSIM

VDD_VBAT_SD2

LSIM

CVSIM

SD2

VPMU

XGOLD626 PMU

LPMU

CVPMU

VRTC

2x

SD2_SW

LIO_12

B

LSD2
V

SD2_FB
VSS_SD2

LRTC

CVRTC

CVSD2

CVDD_SD2

VIO_12
CVIO_12

VUSB_IO

LUSB_IO

CVUSB_IO

VPLL

LPLL

CVPLL

VUSB_ANA

POR

VUSB_PD

Battery
Supervision

LUSB_PD
VSS_PMU

CVUSB_PD

PMU Overview

LGE Internal Use Only

RESET_PWRDWN_N

OSC

LUSB_ANA

CVUSB_ANA

Figure 1

SD1_SW
SD1_FB

ANAMON

ANAMON

CVRTC_BUF

SD1

VDD_VBAT_PMU

CVREF

2x

CVDD_VBAT

DCDC
Supervision

Battery

Figure. LGP920 Modem Power Block Diagram

- 45 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

3. Technical Brief

3.8.3 TWL6030
The TWL6030 is an integrated Power Management IC for applications powered by a rechargeable battery. The
device provides 7 configurable step-down converters with up to 1.5A capability for Memory, Processor Core, IO,
auxiliary, pre-regulation for LDOs, etc. It contains also 11 LDO regulators which can be supplied either from
battery or from pre-regulated supply. Power up / power down controller is configurable and can support any
Power up / down sequences (EPROM based).
The Real Time clock (RTC) provides 32KHz output buffer, seconds, minutes, hours, day, month, and year
information as well as Alarm wake up. The TWL6030 supports 32KHz clock generation based on crystal oscillator.
The device integrates also a Switch mode charger allowing faster battery charge, higher efficiency & less power
dissipation.
The TWL6030 generates power supplies for OMAP4 and operates together with TWL6040 which includes all
audio and related detection features. For audio IC parameters, see TWL6040 Datasheet. In addition TWL6030 can
be used as PMIC for several other processors, thanks to the programmable startup/shutdown controller and
default supply voltage levels. The TWL6030 is available in an nFBGA package 7.0mm x 7.0mm with 0.4mm ball
pitch.

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TI Confidential — NDA Restrictions

3. Technical Brief
TWL6030

www.ti.com

SWCS045 – JANUARY 2010

PWMFORCE
BOOT0
BOOT1
BOOT2
BOOT3
RESPWRON
NRESWARM
PWRON
RPWRON
PREQ1
PREQ2A
PREQ2B
PREQ2C
PREQ3
INT
SYSEN
REGEN1
REGEN2
TESTEN

REFGND

VBG

IREF

VAUX2_IN

VAUX2

VAUX1

Control Ols

VPP

VMMC

VUSIM

REFS

TESTV

VCORE1_IN
VCORE1_SW
VCORE1
VCORE1_FDBK

SR bus
Events bus

VCORE1_GND
VCORE2_IN
VCORE2_SW

Events detect

SRI2C_SCL
SRI2C_SDA
MSECURE

VCORE2

I2C SmartReflex

VCORE2_FDBK
OCP bus

OSC32KIN
OSC32KCAP
OSC32KOUT

VAUX2

VAUX1

VAUX1_IN

VUSIM_IN1
VUSIM_IN2
_IN2: spareinput
VUSIM

VMMC_IN1
VMMC_IN2
_IN2: spareinput
VMMC

VPP

VPP_IN

VIO

GND_DIG_VIO

DEVICE INFORMATION

Xtal
32K

RC
32K

RC
24M

VCORE2_GND
VCORE3_IN

Power control

VCORE3_SW
CLK32KAO
CLK32KG
CLK32KAUDIO

VCORE3

ID

USB SRP

CTLI2C_SCL

VCORE3_GND
VMEM_IN

I2C control

VMEM_SW
CTLI2C_SDA

VMEM
VMEM_FDBK

I2C to OCP

SIM
MMC
BATREMOVAL
PWM1
PWM2

VMEM_GND
V1V8_IN

Card detect
and
PWM

V1V8_SW
V1V8
V1V8_FDBK

MUX

Scalers

GPADC_IN0
GPADC_IN1
GPADC_VREF1
GPADC_IN2
GPADC_IN3
GPADC_IN4
GPADC_VREF4
GPADC_IN5
GPADC_IN6

V1V8_GND
V1V2_IN

Control, data,
and
test logic

10-bit
ADC

V2V1_SW
V 2V1
V2V1_FDBK

GGAUGE_RESN

V2V1_GND
V1V29_IN

GGAUGE_RESP

Auto calib

GPADC_START

13-bit
��
ADC

Digital
filter

V1V29_SW
V1V29
V1V29_FDBK
Interrupt handler

CHRG_EXTCHRG_ENZ
CHRG_EXTCHRG_STATZ
VAC

Ext
charger
ctl

V1V29_GND
VANA_IN

OSC
3 MHz

VANA
VANA

VBUS
CHRG_PMID

VRTC_IN

VAUX3

CHRG_GND

VRTC
VRTC

VCXIO

CHRG_CSOUT

VDAC

USB
charger
and
VBUS
OTG

VUSB

CHRG_SW
CHRG_CSIN

CHRG_AUXPWR

GND_DIG_VRTC

VAUX3_IN
GND_ANA_B1
GND_ANA_B2
GND_ANA_B3
GND_ANA_B4
GND_ANA_B5
GND_ANA_B6
GND_ANA_B7
VDD_B1
VDD_B2
VDD_B4

VAUX3

VCXIO_IN

VCXIO

VDAC_IN

VDAC

VDD_B3
CHRG_PMID

VUSB

CHRG_LED_IN

CHRG_LED_TEST

CHRG_VREF

CHRG_DET_N

VBAT

SWCS045-001

Figure 1. TWL6030 Block Diagram
Figure. TWL6030 functional block diagram
Copyright © 2010, Texas Instruments Incorporated

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PRODUCT�PREVIEW

VCORE3_FDBK
RTC

3. Technical Brief

3.8.3.1 Charging control
P920 uses individual Charger IC which is RT9524.

Features
30V Maximum Rating for DC Adapter
Internal Integrated Power MOSFETs
Support 4.2V/2.3A Factory Mode
50mA Low Dropout Voltage Regulator
Status Pin Indicator
Programmed Charging Current
Under Voltage Lockout
Over Voltage Protection
Thermal Feedback Optimized Charge Rate
RoHS Compliant and Halogen Free

Typical Application Circuit

Functional Pin Description

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3. Technical Brief

3.3.8.2 Constant Current Charging Battery Pre-Charge Current
During a charge cycle, if the battery voltage is below the pre-charge threshold, the RT9524 enters the pre-charge
mode. This feature revives deeply discharged cells and protects battery. Under USB100 Mode, the pre-charge
current is internally set to 95mA. When the RT9524 is under USB500 and ISET Mode, the pre-charge current is
20% of fast-charge current set by external resistor RISET.
Battery Fast-Charge Current ISET Mode
The RT9524 offers ISET pin to program the charge current. The resistor RISET is connected to ISET and GND. The
parameter KISET is specified in the specification table.

LGE Internal Use Only

- 49 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

3. Technical Brief

Battery Voltage Regulation (CV Mode)
The battery voltage regulation feedback is through BATT pin. The RT9524 monitors the battery voltage between
BATT and GND pins. When the battery voltage closes to battery regulation voltage threshold, the voltage
regulation phase begins and the charging current begins to taper down. When the charging current falls below
the programmed end-of-charge current threshold, the CHG_S pin goes high to indicate the termination of
charge cycle. The end-of-charge current threshold is set by the IEOC pin. The resistor RIEOC is connected to IEOC
and GND. The parameters KIEOC and IEOC are specified in the specification table.

The current threshold of IEOC (%) is defined as the percentage of fast-charge current set by RISET. After the
CHGSB pin pulled to high, the RT9524 still monitors the battery voltage. Charge current is resumed when the
battery voltage goes to lower than the battery regulation voltage threshold.

LGE Internal Use Only

- 50 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

3. Technical Brief

3.8.3.3 Constant Voltage Charging
Constant voltage charging begins when the battery voltage reaches a target voltage, 4.2V. The end of constant
voltage charging is commonly detected around 240mA from Travel adaptor.

3.8.3.4 LGP920 Charging Specification
-Charging Method : CC & CV (Constant Current & Constant Voltage)
-Maximum Charging Voltage : 4.2V
-Maximum Charging Current : 948mA
-Nominal Battery Capacity : 1500mAh
-Charging time : Max. 3h 30m
- Full charge indication current (icon stop current) : 248mA

3.8.3.5 LGP920 battery bar icon display
Battery Bar Number

Specification

BAR 6 (Full)

90% over

BAR 6 -- & gt; 5

90%

89%

BAR 5 -- & gt; 4

70%

69%

BAR 4 -- & gt; 3

50%

49%

BAR 3 -- & gt; 2

30%

29%

BAR 2 -- & gt; 1

15%

14%

BAR 1 -- & gt; 0

5%

Low Battery Pop-up

4% ~ 15% : One Time popup

Critical Low Battery Pop-up

0% ~ 3% : Popup at every level change

POWER OFF

0%

Remain %

4%

Table. LGP920 battery bar specification

LGE Internal Use Only

- 51 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

3. Technical Brief

3.9 External memory interface
3.9.1 Introduction
Since LG-P920 contains communication and application processor, memory is dedicated only for each processor.
XMM6260 (IFX modem) uses MCP (Multi Chip Package) 1Gb Nand / 512Mb LPDDR1 and OMAP4430 uses POP
(Package on Package) 512MB LPDDR2 and 8GB eMMC Nand memory.

3.9.2 LG-P920 XMM6260 (IFX Modem) memory Interface
-Multi Chip Package : DDR SDRAM and NAND Flash merged 1 package
-512Mbit Mobile DDR SDRAM / 1Gbit NAND Flash
Interface Spec
Part Name
H8BCS0QG0MMR46M

Product Gr

Maker

Operation Voltage

Speed

NAND

Hynix

1.8V

45ns

1.8V

166MHz

SDRAM

3.9.3 LG-P920 OMAP4430 memory Interface
- Package on Package on OMAP4430: DDR2 SDRAM
- 8GB eMMC 4.41 version
LPDDR2
Interface Spec
Part Name

Product Gr

Maker

Operation Voltage

Speed

K3PE4E400M-XGC1

SDRAM

Samsung

1.8V/1.2/1.2/1.2

DDR2 800
(400MHz)

8GB NAND
Interface Spec
Part Name

Product Gr

Maker

Operation Voltage

Speed

SDIN5C2-8G-974D

NAND

Sandisk

2.8V

15MB/s for read
9MB/s for write

3.9.4 External SD card memory Interface
OMAP4430 supports external SD card which supports up to 32GB (SDHC compatible)

LGE Internal Use Only

- 52 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

3. Technical Brief

3.10 Audio and sound
3.10.1 Overview of Audio path
OMAP
4430

ABE_PDM_UL_DATA
ABE_CLKS
ABE_PDM_LB_CLK
ABE_PDM_FRAME

ABE_McBSP3_DR
ABE_McBSP1_FSX
ABE_McBSP1_DX
ABE_McBSP1_DR
ABE_McBSP1_CLKX
ABE M BSP1 CLKX
UART2_RTS/
UART2_CTS/
UART2_RX
UART2_TX
DPM_EMU10
DPM EMU10

ABE_McBSP2_CLKX
ABE_McBSP2_DR
ABE_McBSP2_DX
ABE M BSP2 DX
ABE_McBSP2_FSX

FM_I2S_FSYNC
FM_I2S_DO
FM_I2S_CLK
FM_I2S_DI
BT_PCM_SYNC
BT_PCM_DOUT
BT_PCM_DIN
BT_PCM_CLK
BT_UART_RTS/
BT_UART_CTS/
BT_UART_RXD
BT_UART_TXD

BT / WiFi / FM
FM_I2S_FSYNC
FM_I2S_DI
FM_I2S_CLK
FM I2S CLK
FM_I2S_DO

SPK

AUD_SPK_P
AUD_SPK_N
AUD SPK N

HFRP2
HFRN2

RCV

AUD_RCV_P
AUD RCV P
EARP
EARN AUD_RCV_N

AUDPWRON
NRESPWRON

SYS_nIRQ2

SYS_NIRQ2
SYS NIRQ2

ABE_McBSP3_CLKX
ABE McBSP3 CLKX

PDMCLK
PDMCLKLB
PDMFRAME

PDMDN
PDMUP

AUD_PWRON
SYS_nRESPWRON

HDQ_SIO
SYS_NRESPWRON

ABE_McBSP3_DX

SCL (Audio Codec)

ABE_CLKS
PDM_CLK
PDM CLK
PDM_FRAME

I2C1_SCL
ABE_PDM_DL_DATA

ABE_McBSP3_FSX

HFRP1

SDATWL6040 HFRN1

I2C1_SDA
I2C1 SDA
I2C1_SCL
PDM_DL_DATA
PDM_UL_DATA

I2C1_SDA
I2C1 SDA

NAUDINT
FM_AUDIO_R
FM_AUDIO_L

AFML
AFMR

HBIAS
HS_MIC
HSL
HSR
ACCONN

HS_MICBIAS
HS_MIC
EAR_L
EAR_R
HOOK_ADC

3.5

PCM_AUD_FSYNC
PCM_AUD_IN
PCM_AUD_OUT
PCM_AUD_CLK
PCM AUD CLK

MBIAS
MMICP
MMICN

Analog

SBIAS
SMICP
SMICN

FM_ANT

Analog

MIC1
MIC2
EAR_SENSE

HCI_CTS
HCI_RTS
HCI_TX
HCI_RX

FM_ANT

EAR_SENSE

IPC_I2S_CLK
IPC_I2S_DOUT
IPC_I2S_DIN
_
_
IPC_I2S_SYNC

XMM6260

I2S2_CLK0
I2S2_TX
I2S2_RX
I2S2 RX
I2S2_WA0

Figure. Block diagram of Audio & Sound path

LGE Internal Use Only

- 53 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

3. Technical Brief

3.10.2 TWL6040 (Audio Codec)
The TWL6040 is an audio codec with a high level of integration providing analog audio codec functions for
portable applications, as shown in Figure 3.10.2. It contains multiple audio analog inputs and outputs, as well as
microphone biases and accessory detection. It is connected to the OMAP4 host processor through a proprietary
PDM interface for audio data communication enabling partitioning with optimized power consumption and
performance. Multichannel audio data is multiplexed to a single wire for downlink (PDML) and uplink (PDMUL).
The OMAP4 device provides a TWL6040 with five PDM audio-input channels (DL0–DL4). Channels DL0–DL3 are
connected to four parallel DAC channels multiplexed to stereo headphone (HSL, HSR), stereo speaker (HFL,HFR),
and earpiece (EAR) or stereo line outputs (AUXL, AUXR).
The stereo headphone path has a low-power (LP) mode operating from a 32-kHz sleep clock to enable over 100
hours of MP3 playback time. Very-high dynamic range of 104 dBA is achieved when using the system clock input
and DAC path high-performance (HP) mode. Headphone drivers provide a 1-Vrms output and are ground
centered for capless connection to headphone, thus enabling system size and cost reduction. The earpiece
driver is a differential class-AB driver with 2 Vrms capability to a typical 16Ohm or 32 Ohm load.
Stereo speaker path has filterless class-D outputs with 1.5W capability per channel. For output power
maximization supply connection to an external boost is supported. Speaker drivers support also hearing aid coil
loads. For vibrator and haptic feedback support TWL6040 has two PWM channels with independent input
signals from DL4 or I2C. Vibra drivers are differential H-bridge outputs, enabling fast acceleration and
deceleration of vibra motor. An external driver for a hearing aid coil or a piezo speaker requiring high voltage
can be connected to line outputs.
The TWL6040 supports three differential microphone inputs (MMIC, HMIC, SMIC) and a stereo line-input (AFML,
AFMR) multiplexed to two parallel analog-to-digital converters (ADCs). The PDM output from the ADCs is
transmitted to the OMAP4 through UL0 and UL1. Two LDOs provide a voltage of 2.1 V to bias analog
microphones (MBIAS and HBIAS). The maximum output current is 2 mA for each analog bias, allowing up to 2
microphones on one bias. Two LDOs provide a voltage of 1.8 V/1.85 V to bias digital microphones (DBIAS1 and
DBIAS2). One bias generator can bias up several digital microphones at the same time, with a total maximum
output current of 10 mA.

LGE Internal Use Only

- 54 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

3. Technical Brief

The TWL6040 has an integrated negative charge pump and two LDOs (HS LDO and LS LDO) for high PSRR.
The only external supply needed is 2.1 V, which is available from the TWL6040 PMIC in the OMAP4 system. All
other supply inputs can be directly connected to battery or system 1.8-V I/O.
Two integrated phase-locked loops (PLLs) enable operatation from a 12-/19.2-/26738.4-MHz system clock
(MCLK) or, in LP playback mode, from a 32-kHz sleep clock (CLK32K). The frequency plan is based on a 48-kS/s
audio data rate for all channels, and host processor uses sample-rate converters to interface with different
sample rates (e.g., 44.1 kHz). In the specific case of low-power audio playback, the 44.1-kS/s and 48-kS/s rates are
supported by the TWL6040. Transitions between sample rates or input clocks are seamless.
Accessory plug and unplug detections are supported (PLUGDET). Some headsets have a manual switch for
submitting send/end signal to the terminal through the microphone input pin. This feature is supported by a
periodic accessory button press detection to minimize current consumption in sleep mode. Detection cycle
properties can be programmed according to system requirements.
Figure 3.10.2 shows a simplified block diagram of the device.

LGE Internal Use Only

- 55 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

3. Technical Brief

Figure 3.10.2. Simplified Block diagram

LGE Internal Use Only

- 56 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

3. Technical Brief

VBAT

VSEL_1.8V

VSEL_2.1V

C939

C938

C937

C936

C935

C934

C933 C932

C931 C930 C929

0.1u

0.1u

2.2u

220n

2.2u

2.2u

100n

0.1u

0.1u

0.1u
C940

0.1u

C924

2.2u

Added (P925 Rev.A)

C923

C902
4.7u

C903
4.7u

K9
L8
L10
K8
H8

PDM_DL_DATA
PDM_UL_DATA
ABE_CLKS
PDM_CLK
PDM_FRAME

TP901

TP902

TP903

TP904

I2C1_SDA
I2C1_SCL

H6
G6

AUD_PWRON
SYS_nRESPWRON
SYS_nIRQ2

D8
J9
E8
D4
B6
B7
C904

4.7u

C905

Removed (Rev.C)
Open/ground switch input

4.7u

L6
K6
L5
G5
E1

EAR_SENSE
HOOK_ADC

Microphone input
K2
A1
L1
A11
L11

AUD_CLK_IN

K7

CLK32K_AUD

H7

MMIC_P

ICVS0318150FR
VA902
C922

0.1u

C921

0.1u

C919

R921

0

R919

0.1u

C918

0

MMIC_N
SMIC_P
SMIC_N

0.1u

F2

C916

0.1u

C915

HS_MICBIAS
HS_MIC

0.1u

C917

0.1u

AFMR
AFML

a stereo line-input F1

FM_AUDIO_R
FM_AUDIO_L

B10

AUD_RCV_P
AUD_RCV_N

EARP
earpiece
C11
EARN
a differential class-AB driver

with 2 Vrms

AUDPWRON
NRESPWRON
NAUDINT

U901
TWL6040

GPO1
GPO2
GPO3
REFN
REFP
REF
PLUGDET
ACCONN

capability to a typical 32Ohm
HSL

stereo headphoneHSR
AUXLP
AUXLN
AUXRP
stereo line outputs
AUXRN

Added (P925 Rev.A)

ICVS0318150FR
VA903

0.1u

C920

HMICP
H2
HMICN

SDA
SCL

J11
K11

EAR_L
EAR_R

G3
F3
G4
F4
A4

HFLP1
A5
HFLN1

B9
stereo speaker
HFRP1
filterless class-D outputs with B8
1.5W

HFRN1
HFLP2
HFLN2
HFRP2
HFRN2

ATEST
DTEST1
DTEST2
DTEST3
PROG

FB914

120

FB913

120

B4
B5
A9
A8

AUD_SPK_P
AUD_SPK_N
C913

C914

1n

1n

C1

VIBLP
D3
VIBLN
A2
VIBRP
B1
VIBRN

MCLK
CLK32K
NC1
NC2
NC3
NC4

Added (P925 Rev.A)

HBIAS
2.1V
H1

E6
E7
F8
G7
G8

D5
D6
D7
E5

J5
L4 X
K3 X
K1
J2
J4
H4
J3

PDMDN DOWNLINK
PDMUP UPLINK
PDMCLK
PDMCLKLB
PDMFRAME

GNDREF
GNDHS
GNDAMIC
GNDDMIC
GNDLDO1
GNDLDO2
GNDVCM
GNDNCP1
GNDNCP2
GNDHFL1
GNDHFL2
GNDHFL3
GNDHFR1
GNDHFR2
GNDHFR3
GNDDIG
GNDVIBR
GNDVIBL
GNDIO

4.7u

DBIAS1
DBIAS2
MBIAS
2.1V
MMICP
MMICN
SMICP
SMICN

PBKG1
PBKG2
PBKG3
PBKG4
PBKG5

Removed (Rev.C)

F5
F6
F7
E4
K10

K5
H9
H3
L3
E3
D9
J1
F10
G10
C5
C4
C6
C7
C8
C9
J6
B3
D2
J8

C901

VDDREGNCP
NCPOUT1
NCPOUT2
NCPFB
CFLYP
CFLYN

VDDVREF
VDDEAR
VDDHS
VDDUL
VDDDL
VDDPLL
VDDHFL1
VDDHFL2
VDDHFR1
VDDHFR2
VDDVIBL
VDDVIBR
VDDAMBIAS
VDDDMBIAS
VDDVIO
VSSEAR
VSSHS
VSSUL
VSSDL
VSSPLL
VDDV2V1
VDDLDO
VSSLDOIN
VSSLDO

H11
E10
E11
G9
G11
F11

NC5
NC6
NC7
NC8
NC9

FB901 120

MICBIAS

VA901

1u

H5
B11
J10
G2
E9
J7
A3
A6
A7
A10
C2
B2
L2
K4
L9
C10
H10
G1
F9
L7
E2
D1
D11
D10

100n

0.47u

C925

C941

2.2u

C926

VSEL_2.1V

0.1u

C927

120

470n

C928
FB941

ICVS0318150FR

0.1u

VBAT

HS_MIC|HOOK_ADC
FB1177
FB1175

1800

FB1176

1800

EAR_R
EAR_L

C1175

C1176
0.1u

C1177

R1178

33p

HS_MICBIAS

2.2K

R1176

0.1u

HOOK_ADC
HS_MIC

1800

10K

C1178

C1179

470p

10u

Added (925 Rev.D)
Changed (Rev.1.0)
FB1173
1800

Q1173

R1173 1M
2
1
R1172

Changed (P925 Rev.B)

VSEL_1.8V

S
G

D

EAR_SENSE

3

2SJ347

R1174
200K

DNI

LGE Internal Use Only

- 57 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

3. Technical Brief

3.11 Main (5M pixels) & Sub (VGA) Camera
LG-P920 supports two cameras. One is 5M pixels, main camera, the other is VGA, sub camera used VT & self
camera scene.
5M_VCM_V2V8_S

CN1221
GB042-40S-H10-E3000

FL1221
ICMEF214P101M
1
P1
2
P2
3
P3
4
P4

5
P5
6
P6
7
P7
8
P8

35

8
9
10
11

29

12

28

13

27

14

26

15

25

16

24

17

C1231

23

18

0.1u

19

21

ESD9B5_0ST5G

7

30
ESD9B5_0ST5G
ZD1225

6

34

31

ZD1224

9
G1
10
G2

PRIMARY_5M_MIPI_CLK_N
PRIMARY_5M_MIPI_CLK_P

5

22

5
P5
6
P6
7
P7
8
P8

4

36

FL1222
1
P1
2
P2
3
P3
4
P4

3

37

32

5M_MCLK

2

38

SECONDARY_5M_RESET_N
PRIMARY_5M_RESET_N

1

39

9
G1
10
G2

40

33

SECONDARY_5M_MIPI_CLK_N
SECONDARY_5M_MIPI_CLK_P
SECONDARY_5M_MIPI_DATA0_N
SECONDARY_5M_MIPI_DATA0_P

20

I2C4_SCL
I2C4_SDA

C1235

C1236

4.7u

1u

C1237
0.1u

5M_VANA_V2V7_S
1.2V_5M_VDIG

C1234

1.8V_5M_VIO
5M_VANA_V2V7_P

5M_MCLK_CAM

0.1u
C1233
0.1u

C1232
0.1u

I2C3_SCL
I2C3_SDA

5M_MCLK_CAM

5M_VCM_V2V8_P

C1228

ICMEF214P101M

4.7u

C1229
1u

C1230
0.1u

FL1223
1
P1
2
P2
3
P3
4
P4

5
P5
6
P6
7
P7
8
P8
9
G1
10
G2

PRIMARY_5M_MIPI_DATA0_N
PRIMARY_5M_MIPI_DATA0_P
PRIMARY_5M_MIPI_DATA1_N
PRIMARY_5M_MIPI_DATA1_P

ICMEF214P101M

Figure. Main 5M Camera Schematic

TWL_LDO_2.8V
TWL_LDO_1.8V
CN103
1

VT_0.3M_MIPI_DATA0_N
VT_0.3M_MIPI_DATA0_P

18

4

17

5

16

6

15
14

8

VT_0.3M_MCLK

19

3

7

VT_0.3M_MIPI_CLK_N
VT_0.3M_MIPI_CLK_P

20

2

13

9

12

10

11

FB101

Rev.1.1 (VSEL 1.8V Remove)
Rev.B(Removed Bypass Cap)
I2C3_SDA
I2C3_SCL
VT_CAM_PWDN
VT_CAM_RESET/
C103

C104

0.1u

0.1u

Figure. VGA Camera Schematic

LGE Internal Use Only

- 58 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

3. Technical Brief

VBAT

2.2u

E4
D2
E3
D4

VINB
FB

5M_VANA_V2V7_P

A2
VIN1

D1

L1201
2.2u

C1209

2.2u

VIN2

10u

C1210

2.2u

10u

A4

C1201

C1211

C1212

VBATT

Close to E4

1.2V_5M_VDIG

LDO1

SW
GNDB
LDO2

B3
C4

I2C3_SDA
I2C3_SCL

C3
D3
E2

CAM_SUBPM_EN

IRQ_N
SDA

U1201
LP8720TLX

SCL
DVS
EN

LDO3

LDO4
R1202
100K

Changed (P925 Rev.A)

B2
C2

5M_VCM_V2V8_P

B4

DEFSEL
IDSEL

LDO5

A3

5M_VANA_V2V7_S

A1

1.8V_5M_VIO

C1

5M_VCM_V2V8_S

E1

C1204

C1206

C1207

C1208

1u

1u

1u

1u

B1

C1205

1u

G ND

Added Res. (Rev.B)

Figure. Camera Sub PMIC Schematic

CAMERA
VT_IO_DVDD_1V8
VT IO DVDD 1V8

CAM_MCLK

`

VT_PCLK
VT_HSYNC

VT_AVDD_2V8

EMI/ESD Filter

VT_VSYNC
VT VSYNC

1.3M Camera

VT_DATA[7:0]
VT_RESET_N
VT_CAM_PWDN
VT CAM PWDN

LP8720
SUB PMIC

CAM_I2C_SC
L
CAM_I2C_SD
A
CAM_SUBPM_EN

AP20
Common mode filter
CAM_VDIG_1V2
CAM_AVDD_2V8
CAM_VIO_1V8
CAM_AF_2V8

8M_MIPI_CLK_N
8M MIPI CLK N
8M_MIPI_CLK_P

8M

8M_MIPI_DATA0_N

Camera

8M_MIPI_DATA0_P
8M_MIPI_DATA1_N
8M MIPI DATA1 N

(LGIT)

8M_MIPI_DATA1_P
8M_RESET_N
CAM_MCLK
8M_CAM_VCM_EN
8M CAM VCM EN
CAM_VIO_1V8

Figure. Camera Block diagram

LGE Internal Use Only

- 59 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

3. Technical Brief

3.12 Display
LCD module is connected to Main PCB with 30-pin connector.
The LCD is controlled by MIPI Interface in OMAP4430
1.8V_LCD_IOVCC
12V_3D_LCD
2.8V_3D_LCD

CN1141
24-5804-030-000-829+
30

11

19

12

18

13
14
15

3D_LCD_BANK_SEL_1
2.8V_LCD_VCC

4

2.8V_LCD_VCI

2

I2C2_SDA
I2C2_SCL

LED_C1
LED_C2
LED_A

FB1143 600

C1143

1

1u

ICVS0318150FR

VA1104

ICVS0318150FR

VA1102

ICMEF214P101M

10

20

G2
10
G1
9

9
G1
10
G2

DSI2_LCD_MIPI_CLK_N
DSI2_LCD_MIPI_CLK_P

9

21

5
P5
6
P6
7
P7
8
P8

8

16

1
P1
2
P2
3
P3
4
P4

DNI

7

22

FL1142

DNI

R1191

23

ICMEF214P101M

R1190

6

17

DSI2_LCD_MIPI_D0_N
DSI2_LCD_MIPI_D0_P
DSI2_LCD_MIPI_D1_N
DSI2_LCD_MIPI_D1_P

5

24

1
P1
2
P2
3
P3
4
P4

4

26
25

5
P5
6
P6
7
P7
8
P8

3

27

FL1141

2

28

LCD_RESET_N

1

29

1u

3

C1141

Added (Rev.B)
Removeed VA1101, VA1103 (Rev.C)

Figure. Schematic of LCD connector (Main Board)

Table. Interface between LCD Module and MAIN Board
LGE Internal Use Only

- 60 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

3. Technical Brief

LG-P920 supports 3D LCD(Glassless)
The 3D LCD is controlled by 3D control IC(ISL24832)(3D Control IC is in LCD Module)
OMP4430 is supplying power for the 3D LCD, control signals are supplied.

2.8V_3D_LCD

VBAT

U1106
BU28TD2WNVX

3D_LCD_EN

VIN
STBY

VOUT
GND

PGND

4
3

C1107

5

C1106

1
2

1u

1u

Figure. Schematic of 3D PWR LDO(Main Board)

Changed (Rev.B)

VBAT

L1131 4.7u

2
C1132

0.1u

4
3
5

3D_BOOST_EN

6
R1133
51K

R1134

SW

CP1

VO

CP2

OUT

EN

FB
GND

SS

C1134

200K

VIN

0.1u

Exposed_GND

9
10

12V_3D_LCD
C1138

0.1u

8
7

R1136

1

510K

11

C1137
1u

22K

4.7u

R1135

U1131
TPS61093

C1131

Changed (P925 Rev.A)

Figure. Schematic of 3D LCD Boost(VREF)(Main Board)

LGE Internal Use Only

- 61 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

3. Technical Brief

3D Mode On Sequence : 3D PWR On

VREF On

BANK_SEL On

Figure. 3D Mode On Sequence

3D Mode Off Sequence : BANK_SEL Off

VREF Off

3D PWR Off

Figure. 3D Mode Off Sequence

LGE Internal Use Only

- 62 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

3. Technical Brief

LCD Block Diagram

Figure. LG-P920 LCD Module Block Diagram

LGE Internal Use Only

- 63 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

3. Technical Brief

3.13 Vibrators
The Linear motor, creates a certain kind of vibration controlled and defined uniquely by LG Electronics. The
followings are the certain examples of conditions that the users may feel the vibration from the phone:
Incoming Call (in Silence Mode), Google Keys Pressed, Turn-on / -off, Dialing, and Text Messaging.

Added (P925 Rev.A)
TWL_LDO_3.0V
TP905

3

R982

GND

MODE

VDD

GAIN

VDN

11

DNI

PWM

NC3

4

VDP

10

R981
100K

ISA1000

EN

NC2

2

U981

L989

8

82n

VIB_L_P

7
6

L988

5

82n

VIB_L_N

NC1

1

VIBE_EN
VIBE_PWM

Changed (P925 Rev.A)

0

EUSY0238306

9

R987

C986

2.2u

3.9n

R986

C987

470K

Changed (P925 Rev.A)

Figure 1 Vibrator Schematic

Figure 2 Vibrator Block Digram

LGE Internal Use Only

- 64 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

3. Technical Brief

3.14 HDMI
When the users desire to output video signals onto the outer display, they are supposed to open the cap first
and connect the suitable cable, which has to be HDMI type-D compatible, to the socket placed at the upper
center of the phone. It will automatically display the video contents on the desired display

5V_HDMI

CN1271
78618-0001
20

Changed Con. (Rev.B)

21
22
1

C_HDMI_HPD

2
R1271
100K

3

HDMI_D2+

4
5

HDMI_D2HDMI_D1+

6
7
8

HDMI_D1HDMI_D0+

9
10
11

HDMI_D0HDMI_CLK+
Removed (Rev.1.0)
HDMI_CLKC_HDMI_CEC

12
13
14
15
16
17

C_HDMI_SCL
C_HDMI_SDA

18
19
23
24
C1271

25

100n

Figure 1 HDMI Type D Connector Schematic

Figure 2 HDMI Type D Connector Pin Assignments
LGE Internal Use Only

- 65 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

3. Technical Brief

3.15 Compass Sensor
If a customer buy the application SW, The Sensor provides user with a Electric Compass function.
U1107 (AMI304) IC is interfaced to AP20(U401) using I2C interface.

SENSOR_3.0V

C978
1u

AMI304 Specifications (Preliminary)

[ 1 ] Scope of Application

U975

C975

4
5

2

1

GND

VSEL_1.8V

by Aichi Steel

AVDD

[ 2 ] General Description
COMPASS_INT

VREG

3

This specification applies to the 3-axis magnetic sensor AMI304AMI306
provided to
1u
Corporation.
INT

DVDD

10

SDA

ADDR

9

DRDY

VPP

Added (Rev.1.0)

SCL

The AMI304 is a n intelligent electronic compass that integrates three Magneto-Impedance sensor
C976
10n

elements (MI-element) with their controller IC in a single small package.
8

6

7

The controller IC of the AMI304 consists of a circuit for detecting the magnetic signals from three
I2C4_SDA

MI-sensor elements, an amplifier capable of compensating each sensors offset and setting appropriate
I2C4_SCL
sensitivity values, a thermal sensor for measuring the ambient temperature, a 12bit AD converter, an I2C
serial interface circuit and a constant voltage circuit for power control.

Figure. Compass Sensor Schematic

[ 3 ] Block Diagram

NC
NC

X-axis

VREG

Circuit for

MI-sensor

MI-Sensors
Data

Y-axis
MI-sensor

1.0µF

Z-axis

V
oltage

Vpp

12bit AD
Converter

Zero point

256 Bytes

VDD

Adjustment

C2
0.01µF
DVDD
ADDR

Thermal
sensor

VID

GNDS
INT

For Factory
Calibration
OTP-ROM

A
VDD

C1
0.47µF

GNDA
PGA

MI-sensor

Dropout
Regulator

Logic circuit

DRDY

Serial I/F
(I2C)

SCL
SDA

Figure. Compass Sensor Block Diagram

LGE Internal Use Only

- 66 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

3. Technical Brief

3.16 Motion Sensor
The motion sensor can sense gravity & accelerated motion. Therefore according to the direction of cell phone,
the phone screen is rotated automatically. And the motion sensor is connected with a gyro sensor to
supplement each data.
U971 : KXTF9 IC is interfaced to OMAP4430(U500) using I2C interface.

IME_DA
IME_CL
VSEL_1.8V

SDA

10

VSEL_1.8V

C971

2

0.1u

3
4

DNC1
DNC2
GND

SCL

U971

DNC4

KXTF9

INT
DNC3

9
R973
DNI

8
7

MOTION_INT

6

5

SENSOR_3.0V

IO_VDD

VDD

1

C972

C973

0.1u

1u

Figure. Motion Sensor Schematic

Figure. Motion Sensor Block Diagram

LGE Internal Use Only

- 67 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

3. Technical Brief

3.17 Gyro Sensor
The gyro sensor(MPU3050) can sense angular velocity not gravity and accelerated motion. The gyro sensor
applied in LG- P920 can detect 3-axis rotation force sensing X,Y and Z angular velocity. And the gyro sensor data
is supplemented by the motion sensor data. It make possible user to development application SW using gyro
sensor data like that motion games.
U961: MPU3050 IC is interfaced to OMAP4430(U500) using I2C interface.

SENSOR_3.0V

Added (P925 Rev.A)
C965
0.1u

VDD

15

13

16

17

14

NC6

NC7

NC8

NC 5

REGOUT

MPU3050A

SDA

AD0
VLOGIC
IME_CL

NC9

11
10
9
8
7

C963

C962

0.1u

0.1u

IME_CL

IME_DA

1

25

SCL

IME_DA

24

FSYNC

U961

CLKOUT

NC4

23

RESV2

GYRO_INT

12

6

I2C4_SCL
I2C4_SDA

VSEL_1.8V
INT

NC3

22

CPOUT

5

21

RESV1

4

20

NC2

19

3

2.2n

NC1

C961

CLKIN

R902
1.5K

2

R901
1.5K

GND

18

VSEL_1.8V

Figure. Gyro Sensor Schematic

X Gyro

Y Gyro

Temp
ADC

Z Accel

ADC

ADC

ADC

Digital
Control and
Processing

ADC

Y Accel

ADC

Z Gyro
X Accel

ADC

Digital
I2C

Primary
Serial
Interface

Sensor I2C
Interface

Figure. Gyro Sensor Block Diagram
LGE Internal Use Only

- 68 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

3. Technical Brief

3.18 Illumination & Proximity Sensor
Illumination Sensor adjusts LCD backlight current by detecting the surrounding brightness.
If user checks the automatic brightness menu, LCD backlight current adjusting is to be enable automatically.
When the call is connected and the object close to the proximity sensor,
LCD backlight and Touch screen are disable operation automatically.
U101 : APDS-9900 IC used I2C interface to OMAP4430

SENSOR_3.0V
PROXI_3.0V
Rev.B(Pull Up Move to Main PCB)
U101
1

I2C3_SDA
PROX_INT

2
3
4

SDA

VDD

INT

SCL

LDR
LEDK

GND
LEDA

8
7

I2C3_SCL

6
5

C102
1u

C101
1u

Figure. Illumination & Proximity Sensor Schematic

Figure. Illumination & Proximity Sensor Block Diagram
LGE Internal Use Only

- 69 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

3. Technical Brief

3.19 Touch Module
Touch module is connected to Main PCB with 10-pin connector.
The Touch module is controlled by I2C Interface in OMAP4430.
VSEL_1.8V

10K

R112

TOUCH_3.3V

1

CN102

10

I2C2_SCL
2

9

3

8

4

7

5

6

I2C2_SDA
TOUCH_RESET
TOUCH_INT_N

C120
1u

ZD106

ZD104

ZD103

ZD102

VA103

Rev.F
ZD101

2.2u

ZD105

C119

Rev.F

Rev.E

VSEL_1.8V

Rev.F
Rev.F

Figure. Schematic of Touch connector (Sub PCB side)

Pin Map
1

SCL

2

GND

3

SDA

4

VDD(3.3V)

5

INT

6

VBUS(1.8V)

7

Reset

8

GND

9

GND

10

GND

LGE Internal Use Only

- 70 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

3. Technical Brief

3.20 Main Features
3.23.1 LG-P920 Main Features
- DOP Type design
- UMTS 2100 + UMTS 1900 + UMTS900+ GSM 900 + DCS 1800 + PCS 1900 + GSM850 based
GSM/GPRS/EDGE/UMTS
- HSDPA 14.4Mbps, HSUPA 5.7Mbps
- Main LCD (WVGA)
TFT Main LCD (4.3”, 480X800), 3D LCD
- Capacitive/Electrostatic Touch Window
- 5M AF 3D Camera, 0.3M VT Camera
- 3.5Phi Stereo Headset & Speaker phone
- MP3/ WMA / AAC/AAC+/WAV/AC3 decoder and play
- MPEG4 encoder/decoder and play/save
- JPEG en/decoder
- Supports Bluetooth and HS-USB
- Supports WLAN(802.11b, 802.11g, 802.11n)
- Supports FM Radio
- 1500 mAh (Li-Ion)

LGE Internal Use Only

- 71 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

4. TROUBLE SHOOTING
4.1 RF Component

X184
TCXO(26MHz)
U181
RFIC(Tranceive)

U241
Tranceiver PMU

U220
PAM DCDC

U121
Duplexer(Bank)

U171
PAM(MMMB)
FL111
Filter(Seperator)

RF component (WCDMA / GSM)

LGE Internal Use Only

- 72 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

4.2 SIGNAL PATH

WCDMA 1,2,4,5,8 Band TX Signal PATH
A. WCDMA 2100 TX PATH

B. WCDMA 1900 TX PATH

C. WCDMA 1700 TX PATH

D. WCDMA 850 TX PATH

E. WCDMA 900 TX PATH

LGE Internal Use Only

F. COMMON TX/RX PATH\

- 73 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

WCDMA 1,2,4,5,8 Band RX Signal PATH
A. WCDMA 2100 RX PATH

B. WCDMA 1900 RX PATH

C. WCDMA 1700 RX PATH

D. WCDMA 850 RX PATH

E. WCDMA 900 RX PATH

LGE Internal Use Only

F. COMMON TX/RX PATH\

- 74 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

GSM 850,900,1800,1900 Band TX/RX Signal PATH
A. GSM 850 RX PATH
C. GSM 1800 RX PATH
E. GSM 850,900 TX PATH

B. GSM 900 RX PATH
D. GSM 1900 RX PATH
F. GSM 1800,1900 TX PATH

G. COMMON TX/RX PATH

LGE Internal Use Only

- 75 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

4.3 Checking TCXO Block
The output frequency (26MHz) of TCXO (X184) is used as the reference one of PMB5712

TP1
TP2

3

TP2

2

X1841XXA26000FBA
OUT

VCC

GND

VCONT

4
1

TP1

26MHz

C184

C185

22n

10n

Schematic of the Crystal Part (26MHz)

Schematic of the Crystal Part (26MHz)

LGE Internal Use Only

- 76 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

Check TP1
VCC of TCXO

1.7V ≥ VCC ≥ 1.9V

No

Check the PMB5712

Yes
Check TP2

26 MHz Signal

No

Check soldering and
components

Yes
TCXO is OK

LGE Internal Use Only

- 77 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

4.4 Checking WCDMA Block
START

Check TCXO Block

Check RF Switch (M/S)

Check TX/RX Level

Re-download & Cal

Change the Board

LGE Internal Use Only

- 78 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

4.4.1. Checking RF TX Level

TP3

TP4
TP2

TP1

Test Point (TX Level)

LGE Internal Use Only

- 79 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

C105

TP1

100p

2

L102

COMMON

ANT

G4

2.2n

G1
ANT

1

G2

G3

4

3

C103

100n

C101

DNI

L104

L105
DNI

SW101
20279-001E-01

SW102
MS-156C

DNI

& lt; L102 & gt;
* Global : 2.2nH
* AT & T, TMUS : 100pF

GSM1800_RX

C116

33p

C117

33p

SDIO

18

1.2n

C132

TP2

FRM

SCL

L131

19

2
4
5
6
8
10

33p

C133
DNI

15

13

14

LVDD

16

GND2

VDD

GND5

GND1

4

17

5

GND3

GND6

21

GND4

TRX_6

20

C112 10p

GSM_HB_TX

L142

DNI

VBAT

B4

L114
3n

TP2
L141
DNI

C114
27p

U121

ANT-Band8

16

Rx-Band4_1
17
Rx-Band4_2

B40761DY2045L

GND1
GND2
GND3
GND4
GND5
GND6

24

Rx-Band5_1
25
Rx-Band5_2
26

Rx-Band8_1
27
Rx-Band8_2

9

L113
10n

SPI_CLK
SPI_DRW
SPI_SS

L112

Rev.1.1

2.2n

ANT-Band5

RX_GSM1800_M1X
RX_GSM1800_M1
RX_B1_H2X
RX_B1_H2
RX_B2_M2X
RX_B2_M2
RX_B4_H1X
RX_B4_H1
RX_B5_L2X
RX_B5_L2
RX_B8_L1X
RX_B8_L1

37

GND7
GND8
GND9
GND10
GND11
GND12
GND13
GND14
GND15
GND16
GND17
GND18

TRX_5

B2/GSM1900

1

52

Tx-Band8

HB_TX

TRX_4

2

Rx-Band2_1
21
Rx-Band2_2

1

TRX_3

3

20

ANT_Band4

Tx-Band1

6

7

DNI

PGND

L111

1.8p

TRX_2

FL111
BGSF18DM20

9

C109

LB_TX

10

GSM_LB_TX

TRX_1

18

ANT-Band2

GND19
38
GND20
39
GND21
40
GND22

12
13
15
28
29
30
31
32
33
34
35
36

54

ANT
8

12

L110 4.7n

22

Rx-GSM1800_1
23
Rx-GSM1800_2
Rx-Band1_1
19
Rx-Band1_2

Tx-Band5

14

ANT-Band1

3

C123
1p

ANT-GSM1800

Tx-Band2

58

11

TP2

60

Tx-Band4

L122 2.2n

33p

11

56
C121

7

B1

GND23
GND24
GND25
GND26
GND27
GND28
GND29
GND30
GND31
GND32
GND33
GND34
GND35
GND36
GND37

41
42
43
44
45
46
47
48
49
50
51
53
55
57
59

L116
DNI

L143
DNI

L127 1n
L161 2.2n

C115
10n

C163

VSPI

B5/GSM850
TP2

TP3

33p

L162
DNI

L128
DNI

L137 1n

C151

B8/EGSM

33p

C153

TP2

TP3

22p

L138
DNI

L152
47n
L147 1.5n

TP3

L148
DNI

L158 1.5n

TP3

L159
DNI

TP3

L169
DNI

VBAT

VSPI

Removed (Rev.B)

PA_RF

CP_OUT

PA_POW_DET

L168 1.5n

Removed (Rev.E)

GSM_LB_TX

3
5
4
7
2
1

12

SPI_GND

VSPI

VBAT

RF_OUT

19

FB_AM

VCMOS

GSM_HB_TX

6

14

0.1u

18

C173

0.1u

17

C172

220n

20

C171

SPI_DRW

GSM_HB_TX

SPI_CLK

GSM_LB_TX

SPI_SS

B1_TX
B2_TX

U171
RF6260

VCC
HB_RFIN

B4_TX

LB_RFIN

B5_TX

NC

B8_TX

GND

10
11
9

L176 2.7n

SPI_DRW
SPI_CLK

VBAT_PAM

SPI_SS

C175
1p

TP4

TX_H
L177
DNI

16
8
L179 1.8n

15
13

C178
DNI

21

TP4

TX_L
L180
DNI

Schematic of WCDMA Band1,2,4,5,8 Tx Block

LGE Internal Use Only

- 80 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

For testing, Max power output is needed.

Check Power Level

Check TP1 Over 21dBm?

Yes

RF Tx Level is OK

No

Check TP2 Over 21dBm?

Yes

Check Separator

No

Check TP3 Over 21dBm?

Yes

Check Duplexer

No

Check TP4 Over 6dBm?

Yes

Check PAM

No
Check PMB5712

LGE Internal Use Only

- 81 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

4.4.2. Checking RF Rx Level

TP2

TP1

Test Point (RF Rx Level)

LGE Internal Use Only

- 82 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

C105

TP1

100p

2

L102

COMMON

ANT

G4

L105
DNI

SW101
20279-001E-01

SW102
MS-156C

2.2n

G1
ANT

1

3

C103

100n

C101

DNI

L104

G2

G3

4

DNI

& lt; L102 & gt;
* Global : 2.2nH
* AT & T, TMUS : 100pF

GSM1800_RX

C116

33p

C117

33p

TRX_5

SDIO

L131

19
18

1.2n

C132

TP2

FRM

SCL

20

33p

C133
DNI

15

13

14

LVDD

16

GND2

VDD

GND5

GND1

4

17

5

GND3

GND6

21

GND4

TRX_6

B2/GSM1900

1

C112 10p

GSM_HB_TX

L142

DNI

VBAT

B4

L114
3n

C114
27p

TP2
L141
DNI

VSPI

U121

ANT-Band8

16

B40761DY2045L

GND1
GND2
GND3
GND4
GND5
GND6

Rx-Band4_1
17
Rx-Band4_2
24

Rx-Band5_1
25
Rx-Band5_2
26

Rx-Band8_1
27
Rx-Band8_2

RX_B1_H2X
RX_B1_H2
RX_B2_M2X
RX_B2_M2
RX_B4_H1X
RX_B4_H1
RX_B5_L2X
RX_B5_L2
RX_B8_L1X
RX_B8_L1

37

GND19
38
GND20
39
GND21
40
GND22

L143
DNI

L127 1n
L161 2.2n

C115
10n

2
4
5
6
8
10

ANT-Band5

9

L113
10n

SPI_CLK
SPI_DRW
SPI_SS

L112

Rev.1.1

2.2n

52

GND7
GND8
GND9
GND10
GND11
GND12
GND13
GND14
GND15
GND16
GND17
GND18

HB_TX

TRX_4

2

Tx-Band8

TRX_3

3

Rx-Band2_1
21
Rx-Band2_2

1

6

7

DNI

PGND

L111

1.8p

TRX_2

FL111
BGSF18DM20

9

C109

LB_TX

10

GSM_LB_TX

TRX_1

20

ANT_Band4

RX_GSM1800_M1X
RX_GSM1800_M1

12
13
15
28
29
30
31
32
33
34
35
36

54

ANT
8

12

L110 4.7n

18

ANT-Band2

Tx-Band5

11

14

22

Rx-GSM1800_1
23
Rx-GSM1800_2
Rx-Band1_1
19
Rx-Band1_2

3

C123
1p

ANT-Band1

Tx-Band2

58

ANT-GSM1800

Tx-Band4

TP2

60

11

L122 2.2n

33p

Tx-Band1

56
C121

7

B1

GND23
GND24
GND25
GND26
GND27
GND28
GND29
GND30
GND31
GND32
GND33
GND34
GND35
GND36
GND37

41
42
43
44
45
46
47
48
49
50
51
53
55
57
59

L116
DNI

B5/GSM850
TP2

C163

33p
L128
DNI

L162
DNI
L137 1n

C151

B8/EGSM

33p

TP2

C153

22p

L138
DNI

L152
47n
L147 1.5n

L148
DNI

L158 1.5n

L159
DNI

L168 1.5n

L169
DNI

Removed (Rev.B)

Schematic of WCDMA Band1,2,4,5,8 Rx Block

LGE Internal Use Only

- 83 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

Set the phone Rx is ON

Check TP1 Signal exist?

No

Check RF Switch (M/S)

Yes
Check TP2
Signal exist?

No

Check Separator

Yes
Check Duplexer, PMB5712

LGE Internal Use Only

- 84 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

4.4 Checking WCDMA Block
START

Check TCXO Block

Check RF Switch (M/S)

Check TX/RX Level

Re-download & Cal

Change the Board

LGE Internal Use Only

- 85 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

4.5.1 Checking RF Tx Block

TP2

TP3

TP1

LGE Internal Use Only

- 86 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

C105

TP1

100p

2

L102

COMMON

ANT

G4

2.2n

G1
ANT

1

G2

G3

4

3

C103

100n

C101

DNI

L104

L105
DNI

SW101
20279-001E-01

SW102
MS-156C

DNI

& lt; L102 & gt;
* Global : 2.2nH
* AT & T, TMUS : 100pF

GSM1800_RX

C116

33p

C117

33p

SDIO

1.2n

C132

33p

18

C133
DNI

FRM

SCL

L131

19

2
4
5
6
8
10

15

13

14

LVDD

16

GND2

VDD

GND5

GND1

4

17

5

GND6

21

GND3

TRX_6

20

C112 10p

GSM_HB_TX

DNI

L113
10n

VBAT

B4

L114
3n

C114
27p

Rev.1.1

2.2n

L141
DNI

U121

ANT-Band8

16

Rx-Band4_1
17
Rx-Band4_2

B40761DY2045L

GND1
GND2
GND3
GND4
GND5
GND6

24

Rx-Band5_1
25
Rx-Band5_2
26

Rx-Band8_1
27
Rx-Band8_2

9

L112

SPI_CLK
SPI_DRW
SPI_SS

TP2

L142

ANT-Band5

RX_GSM1800_M1X
RX_GSM1800_M1
RX_B1_H2X
RX_B1_H2
RX_B2_M2X
RX_B2_M2
RX_B4_H1X
RX_B4_H1
RX_B5_L2X
RX_B5_L2
RX_B8_L1X
RX_B8_L1

37

GND7
GND8
GND9
GND10
GND11
GND12
GND13
GND14
GND15
GND16
GND17
GND18

TRX_5

B2/GSM1900

1

52

Tx-Band8

HB_TX

TRX_4

2

Rx-Band2_1
21
Rx-Band2_2

1

TRX_3

3

20

ANT_Band4

Tx-Band1

ANT
6

GND4

DNI

7

L111

1.8p

PGND

C109

TRX_2

FL111
BGSF18DM20

9

TP2

54
TRX_1

LB_TX

10

GSM_LB_TX

8

12

L110 4.7n

18

ANT-Band2

GND19
38
GND20
39
GND21
40
GND22

12
13
15
28
29
30
31
32
33
34
35
36

11

14

22

Rx-GSM1800_1
23
Rx-GSM1800_2
Rx-Band1_1
19
Rx-Band1_2

Tx-Band5

C123
1p

ANT-Band1

3

58

ANT-GSM1800

Tx-Band2

60

Tx-Band4

L122 2.2n

33p

11

56
C121

7

B1

GND23
GND24
GND25
GND26
GND27
GND28
GND29
GND30
GND31
GND32
GND33
GND34
GND35
GND36
GND37

41
42
43
44
45
46
47
48
49
50
51
53
55
57
59

L116
DNI

L143
DNI

L127 1n
L161 2.2n

C115
10n

C163

VSPI

B5/GSM850

33p
L128
DNI

L162
DNI
L137 1n

C151

33p

C153

B8/EGSM

22p

L138
DNI

L152
47n
L147 1.5n

L148
DNI

L159
DNI

VBAT

L168 1.5n

VSPI

PA_RF

PA_POW_DET

CP_OUT

L158 1.5n

L169
DNI

Removed (Rev.B)

Removed (Rev.E)

GSM_LB_TX

6
3
5
4
7
2
1

GSM_HB_TX

B2_TX
B4_TX

12

SPI_DRW
SPI_CLK

GSM_LB_TX
B1_TX

SPI_GND

VSPI

VBAT

RF_OUT

19

FB_AM

VCMOS

GSM_HB_TX

14

0.1u

18

C173

0.1u

17

C172

220n

20

C171

SPI_SS

U171
RF6260

VCC
HB_RFIN
LB_RFIN

B5_TX

NC

B8_TX

GND

10
11
9

L176 2.7n

SPI_DRW
SPI_CLK
SPI_SS

VBAT_PAM

C175
1p

TP3

TX_H
L177
DNI

16
8
L179 1.8n

15
13
21

C178
DNI

TP3

TX_L
L180
DNI

Schematic of GSM850/EGSM/DCS/PCS Tx Block

LGE Internal Use Only

- 87 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

For testing, Max power output is needed

Chenck Power Level
No
Check TP1
Over 31 dBm(GSM850, EGSM)
Over 28 dBm(DCS, PCS)

Yes
RF TX Level is OK

No
Check TP2
Over 31 dBm(GSM850, EGSM)
Over 28 dBm(DCS, PCS)

Yes
Check Separator

No

Check TP3
Over 12 dBm

Yes
Check PAM

No
Check PMB5712

LGE Internal Use Only

- 88 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

4.5.2 Checking RF Rx Block

TP2

LGE Internal Use Only

- 89 -

TP1

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

C105

TP1

100p

2

L102

COMMON
G4

L105
DNI

SW101
20279-001E-01

SW102
MS-156C
ANT

2.2n

G1
ANT

1

3

C103

100n

C101

DNI

L104

G2

G3

4

DNI

& lt; L102 & gt;
* Global : 2.2nH
* AT & T, TMUS : 100pF

GSM1800_RX

C116

33p

C117

33p

L116
DNI

TRX_5

SDIO

L131

19
18

1.2n

C132

TP2

FRM

SCL

20

33p

C133
DNI

15

13

14

LVDD

16

GND2

VDD

GND5

GND1

4

17

5

GND3

GND6

21

GND4

TRX_6

B2/GSM1900

1

C112 10p

GSM_HB_TX

L142

DNI

VBAT

B4

L114
3n

C114
27p

TP2
L141
DNI

VSPI

U121

ANT-Band8

16

B40761DY2045L

GND1
GND2
GND3
GND4
GND5
GND6

Rx-Band4_1
17
Rx-Band4_2
24

Rx-Band5_1
25
Rx-Band5_2
26

Rx-Band8_1
27
Rx-Band8_2

RX_B1_H2X
RX_B1_H2
RX_B2_M2X
RX_B2_M2
RX_B4_H1X
RX_B4_H1
RX_B5_L2X
RX_B5_L2
RX_B8_L1X
RX_B8_L1

37

GND19
38
GND20
39
GND21
40
GND22

L143
DNI

L127 1n
L161 2.2n

C115
10n

2
4
5
6
8
10

ANT-Band5

9

L113
10n

SPI_CLK
SPI_DRW
SPI_SS

L112

Rev.1.1

2.2n

52

GND7
GND8
GND9
GND10
GND11
GND12
GND13
GND14
GND15
GND16
GND17
GND18

HB_TX

TRX_4

2

Tx-Band8

TRX_3

3

Rx-Band2_1
21
Rx-Band2_2

1

6

7

DNI

PGND

L111

1.8p

TRX_2

FL111
BGSF18DM20

9

C109

LB_TX

10

GSM_LB_TX

TRX_1

20

ANT_Band4

RX_GSM1800_M1X
RX_GSM1800_M1

12
13
15
28
29
30
31
32
33
34
35
36

54

ANT
8

12

L110 4.7n

18

ANT-Band2

Tx-Band5

11

14

22

Rx-GSM1800_1
23
Rx-GSM1800_2
Rx-Band1_1
19
Rx-Band1_2

3

C123
1p

ANT-Band1

Tx-Band2

58

ANT-GSM1800

Tx-Band4

60

11

L122 2.2n

33p

Tx-Band1

56
C121

7

B1

GND23
GND24
GND25
GND26
GND27
GND28
GND29
GND30
GND31
GND32
GND33
GND34
GND35
GND36
GND37

41
42
43
44
45
46
47
48
49
50
51
53
55
57
59

TP2

B5/GSM850
TP2

C163

33p
L128
DNI

L162
DNI
L137 1n

C151

B8/EGSM

33p

TP2

C153

22p

L138
DNI

L152
47n
L147 1.5n

L148
DNI

L158 1.5n

L159
DNI

L168 1.5n

L169
DNI

Removed (Rev.B)

Schematic of GSM850/EGSM/DCS/PCS Rx Block

LGE Internal Use Only

- 90 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

Set the phone Rx is On

Check TP1 Signal exist?

No

Check RF Switch (M/S)

Yes

Check TP2 Signal exist?

No

Check Separator

Yes
Check Duplexer, PMB5712

LGE Internal Use Only

- 91 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

4.6. GPS/WIFI/BT RF components
4.6.1 GPS Module
GPS chip is made by Broadcom and name is BCM4751

U1831
GPS LDO

U1801
GPS LNA

FL1801
Separator

U1811
GPS IC
X1821
GPS TCXO

LGE Internal Use Only

- 92 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

4.6.2 Wifi/BT/FM Module

FL1901
Filter

U1902
RF3482

U1901
WL1271

LGE Internal Use Only

- 93 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

4.7 GPS/WIFI/BT SIGNAL PATH
4.7.1 GPS Signal Path

ANT

LGE Internal Use Only

- 94 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

4.7.2 Wifi/BT/FM Signal Path

ANT

Wifi Signal
BT Signal
FM Signal

LGE Internal Use Only

- 95 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

4.9 Power ON Troubleshooting
4.8
The main power source of LGP920 is provided by 2 chips which are TWL6030 and XMM6260 (Communication
processor). Since XMM6260 only powers up normally when OMAP4430 is properly powered therefore, TWL6030
is the actual one to take look at.
Power ON sequence of LGP920 is,
PWR key press

PM_ON_SW goes low (R1195, TWL6030 PWRON_ pin(L5))

SENSOR_3.0V

VSEL_1.8V (L803)

VPMIC_VCXIO

VSEL_VMEM (L806)

VSEL_VCORE3 (L802)

TWL6030 Power Up

VSEL_2.1V (L804)

VSEL_1.29V (L805)

VCORE1_OMAP_MPU (L800)

VCORE2_OMAP_IVAUD (L801) goes high
(if network connected

VSD1_1.3V

VSD2_1.8V)

External
peripherals

Phoenix Power
Device

OMAP4430

Power On Event: battery plug, power on button, remote power on, RTC wakeup,
battery Voltage & gt; Vbatmin thresold during charge

1
7ms(after debounce) - Phoenix intermal power up sequence
2
External Power IC: Enable

LPDDR2: VDD1
CDC3S04: VDD_DIG
All peripherals: 1.8v lOs and cores

LPDDR2: VDD2

External Power IC: Enable

Phoenix Power IC tum
on time up to
REGEN1/2

V1V8

VBAT

3

500us

VDDS_1P8
VDDS_DV_xxx@ 1.8v
VDDA_BG_VBB,
VDD_LDO_SRAM

4

VMEM @ 1.35V or
1.2V wrt boot mode

1.8V

500us

1.35V if Phoenix BOOT1=0or1.2V if BOOT1=1

5

500us

1.8V

SYSTEM

6

500us

2.1V

2’
Phoenix Audio: TBD

LPPDDR2: VDDCA, VDDQ
All peripherals: 1.2v lOs and cores

CDC3S04: IOs

V2V1

V2V29@ 1.2V

VCXIO

VDDCA_LPDDR2
VDDQ_LPDDR2
VDD_LDO_EMU_WKUP
VDDS_1P2
VDDS_DV_xxx@1.2V
VDDS_DPLL, VDDA_DSI1/2
VDDA_CSI21/2, VDDA_UNI1,
VDDA_USB1OTG_1P8V,
VDDS_1P8_FREF

VCORE3

1.2V

8

500us

9

VDD_MPU

VCORE2

3’

500us

VDD_CORE
VDD_DLL0/1_LPDDR21/2

VCORE1

7

VDD_IVA_AUDIO

TWL6030 Power on sequence

LGE Internal Use Only

- 96 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

XPMU

4. TROUBLE SHOOTING
Confidential

VBAT
LPBG
LPMU

LPMU@1.3V

LPMU@1.1V

LRTC
ON event
detected

ON event

High Precition Bandgap
Step-Down 1
Step-Down 2

LPLL
LIO_12
LUSB_PD
LUSB_ANA
LUSB_IO
REF_CLK_EN

XX

BaseBand reset

XX

20µs

2180µs

2560µs

Battery insertion

1500µs

Start-up

Figure 4

200µs 200µs
20µs
200µs 200µs

20µs
20µs

16ms

Reset

PMU Start-up / Shut-down Timing sequence
XMM6260 PMU Power on

2.1

1520µs

PAD Timing

LPMU
LRTC

VRTC Supplied Pads

VSD2
self enabling
pad

TM_EN

pad active

RESET_PWRDWN

pad active
POR enables
RESET pad

Power on Reset

VRTC Supplied Pads
PMU outputs
PMU inputs

ON1_i

LGE Internal Use Only

pad active

ON2_N_i

pad active

RESET_BB_N_i

pad active

TRIG_B_i

pad active

REF_CLK_EN_o

pad active

BaseBand reset_n

pad active

- 97 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

START

Battery voltage higher than 3.5V?

No

Change or charging the Battery

Yes
Press PWR Key
Check TP1 high to low?

No

Check the Power Key

Yes

Power Key is damaged?

No

Change the Power Key

Yes
Check TP voltage
0.6V & lt; TP2, 3, 4 & lt; 1.3V
TP5 ≈ 1.8V
TP6 ≈ 2.1V
TP7, 8 ≈ 1.2V
Voltage Range is O.K?

No

Change the Main board

Yes
Check TP9 Clock ≈32.768Khz
Clock Range is O.K?

No

Change the TCXO and X-tal

Yes
Change the main board

LGE Internal Use Only

- 98 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

Power Key of LGP920

TP1 (R1195),
PWR_ON_SW

TOP view of LGP920

TP9 (X800), CLOCK

TP6 (L804), VSEL_2.1V
TP4 (L802),
VSEL_VCORE3

TP7 (L805), VSEL1.29V

TP2 (L800),
VCORE1_OMAP_MPU

TP5 (L803), VSEL_1.8V

TP3 (L801), VCORE2_OMAP_IVAUD

LGE Internal Use Only

TP8 (L806), VSEL_VMEM

- 99 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

R1195

PWR_ON_SW

CN1195
1

TP1

2

ZD1195

Added (Rev.E)

ESD9B5_0ST5G

1K

VBAT

V2V1_IN_B1
V2V1_IN_B2
V2V1_FDBK
V2V1_SW_B1
V2V1_SW_B2
V2V1_GND_B1
V2V1_GND_B2
V1V29_IN_B1
V1V29_IN_B2
V1V29_FDBK
V1V29_SW_B1
V1V29_SW_B2
V1V29_GND_B1
V1V29_GND_B2
VMEM_IN_B1
VMEM_IN_B2
VMEM_FDBK
VMEM_SW_B1
VMEM_SW_B2
VMEM_GND_B1
VMEM_GND_B2

LGE Internal Use Only

T13
T14
R14
L15
N16
P16
P15
M16
L16
M15
C16
C15
F16
D16
D15
E16
E15
K16
K15
G16
J16
J15
H16
H15
T10
R10
R13
T11
R11
T12
R12

C808

VCORE1_OMAP_MPU
L800

0.68u

C813

4.7u

10u

TP2
VBAT

FB801

120

VCORE2_OMAP_IVAUD

C815

C814

TP3

L801 0.47u

4.7u

VBAT

10u
FB802

120

VSEL_VCORE3

C818

C817

TP4

L802 0.47u

4.7u

VBAT

10u
FB803

220

FB804

120

C819

VSEL_1.8V
L803

0.68u

C821

4.7u

10u

TP5
VBAT

VSEL_2.1V
L804 0.47u
C825

C824

TP6

4.7u

VBAT

10u
FB805

FB806

VSEL_1.29V
L805 0.47u
C828

VSEL_VMEM

C831

120

TP7

10u

L806 0.47u

120

C826

V1V8_IN_B1
V1V8_IN_B2
V1V8_IN_B3
V1V8_FDBK
V1V8_SW_B1
V1V8_SW_B2
V1V8_SW_B3
V1V8_GND_B1
V1V8_GND_B2
V1V8_GND_B3

K1
K2
G1
J1
J2
H1
H2

220

4.7u

VCORE3_IN_B1
VCORE3_IN_B2
VCORE3_FDBK
VCORE3_SW_B1
VCORE3_SW_B2
VCORE3_GND_B1
VCORE3_GND_B2

T7
R7
R4
T6
R6
T5
R5

FB800

TP8

VBAT

C829

VCORE2_IN_B1
VCORE2_IN_B2
VCORE2_FDBK
VCORE2_SW_B1
VCORE2_SW_B2
VCORE2_GND_B1
VCORE2_GND_B2

T4
T3
R3
L2
N1
P1
P2
M1
L1
M2

4.7u

VCORE1_IN_B1
VCORE1_IN_B2
VCORE1_IN_B3
VCORE1_FDBK
VCORE1_SW_B1
VCORE1_SW_B2
VCORE1_SW_B3
VCORE1_GND_B1
VCORE1_GND_B2
VCORE1_GND_B3

10u

- 100 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

4.10 Charger Troubleshooting
4.9
LGP920 micro USB is located at the side of the terminal set, charging current flows from external micro USB
Connector directly to the battery. The charger IC maximum charging current is set around 945mA
Charging Procedure
- Connect TA or u-USB Cable
- Control the charging current by RT9524 IC
- Charging current flows into the battery
Troubleshooting Check Point
- Connection of TA or USB Cable
- Charging current path (RT9524)
- Battery
During charging operation test point signal goes low and when stop charging goes high.

LGE Internal Use Only

- 101 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

START

Check the Connection
of uUSB and battery

Connection OK?

No

Change I/O connector

Yes
Is the uUSB Cable
voltage 4.8V (or 5.0V)

No

Change TA (or u-USB cable)

Yes
Is it charging properly
After turning on?

Yes

END

No
TP Signal is correct?

Yes

END

No
Change the Main Board

LGE Internal Use Only

- 102 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

During charging operation test point signal goes low and when stop charging goes high.

TP809, CHG_EN_SET/

USB_VBUS

0.15mm

VCHG

USB_VBUS

VCHG

1mm

1mm
U801
RT9524
1
2
3
4

(1%)

PGND
VIN

BATT

ISET

PGB

GND1
LDO
IEOC

CHGSB
GND2
EN_SET

11

R821
10K
(0603)

10
9
8

CHG_STATUS/

7
6

CHG_EN_SET/
C809
1u

R828
2Kohms

C811
1u

R827

560
(1%)

5

C810
1u

VSEL_1.8V

VBAT

TP809

Removed Res.
(Rev.C)

TP809 : Charging Enable Signal

LGE Internal Use Only

- 103 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

4.10
4.11 USB Trouble shooting
The sequence of LGP920USB is,
USB connected to LGP920

USB_VBUS(C816) goes to 5V

USB_D+ go to 3.3V

USB_DATA is triggered

USB work
Block Diagram of USB & UART connection is shown below

START

Start
Cable is inserted?

No

Cable is inserted?
Yes
YES
TP1 is 5V?
C816 is 5V?
Yes
YES
USB_D+is 3.3V?
USB_D+ is 3.3V?
Yes

Insert cable

NO
Insert
No

NO

Check MUIC or Charger IC
Check MUIC or

Charger IC
NO

No

Check

Check U811

YES
Change the mainboard
Change the Main board

LGE Internal Use Only

- 104 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

VCHG

Changed (P925 Rev.A)

1u
D5

8
VBUS1
D- 2

USB_DM
USB_DP
USB_ID

D+3
ID 4

90ohm matching !!

C5
B5
B4

GND5
9
ZD802

10

R848

2.2K B1

ESD9B5_0ST5G

11

D1

GU077-5P-SD-E1500

Added (Rev.B)

C4

1u

C3

C820

VB

BAT

COMN1

DN1

COMP2

DP2

U811

UID

U1

MAX14526EEWP+TCC6

U2

RES

MIC
CAP

AUD1
AUD2

GND
IC

B2

C827

Changed (Rev.E,1.1)

SDA

C823

ISET

100n

D2
A4
A5

USB_DM_OMAP
USB_DP_OMAP

90ohm matching !!

B3

UART_RX
UART_TX

A3
A1

VSEL_1.8V

D4
D3
A2

R850
56K

C2

PSD12-LF

7

TP1 (USB_VBUS)

C822
0.1u

ZD801

6

1mm

INT

OUT

GND1 GND2

SC L

IN

CN801

VBAT

C1

FL800
NFM18PC104R1C3

Changed (Rev.C)

R853
1.5K

R854
1.5K

Added (P925 Rev.A)
I2C3_SCL
I2C3_SDA
MUIC_INT/

B4

USBA0_OTG_DM/UART3_TX_IRTX/UART2_TX/GPIO_180/SAFE_MODE
B5
USBA0_OTG_DP/UART3_RX_IRRX/UART2_RX/GPIO_179/SAFE_MODE
C3
USBA0_OTG_CE

LGE Internal Use Only

- 105 -

USB_DM_OMAP
USB_DP_OMAP

USB
MUIC

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

TP1 (USB_VBUS)

U811 (MUIC – MAXIM14526)

LGE Internal Use Only

- 106 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

4.11 Audio trouble
4.11.1 Speaker troubleshooting
Speaker control signals are generated by OMAP4430 (U500) and Power is supplied byTWL6040(U901).

START
Check the speaker sound and
reconnect the main ANT module

Is speaker sound OK?

Yes

END

No
Change the main ANT module.
Is speaker sound OK?

Yes

END

No
Change the RF key PCB.
Is speaker sound OK?

Yes

END

No
Change the TWL6040(U901)
Is speaker sound OK?

Yes

END

No
Change the mainboard

LGE Internal Use Only

- 107 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

RF Key PCB

TWL6040

TWL6040

LGE Internal Use Only

- 108 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

4.11.2 Receiver troubleshooting
Receiver control signals are generated by OMAP4430 (U500) and Power is supplied byTWL6040(U901).

START

Check the receiver sound
(loop back mode).
And reconnect Top FPCB
connector on main-board.

Is receiver sound OK?

Yes

END

No
Change upper module
(receiver + Top FPCB)

Yes

END

No
Change theTWL6040(U901)
Is speaker sound OK?

Yes

END

No
Change the mainboard

LGE Internal Use Only

- 109 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

Upper module :
Receiver + Top FPCB

Top_FPCB BTB BTB
Top_FPCB
connector
connector

TWL6040
TWL6040

LGE Internal Use Only

- 110 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

4.11.3 Main MIC troubleshooting
Main MIC signal is generate by MEMS MIC on RF-key PCB

START

Check the MIC signal by loop-back test
or voice recorder
Check the MIC hole to
make clear the voice signal path.
Is vioce signal OK?

Yes

END

No
Change the RF-key PCB.
And check the voice siganl.
Is voice signal OK?

Yes

END

No
Change the TWL6040(U901)
Is the voice siganl OK?

Yes

END

No
Change the mainboard

LGE Internal Use Only

- 111 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

RF Key PCB

TWL6040
TWL6040

LGE Internal Use Only

- 112 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

4.11.4 SUB MIC troubleshooting
Sub MIC signal is generate by MEMS MIC on Top FPCB

START

Check the MIC signal by loop-back test
or voice recorder
Check the MIC hole to
make clear the voice signal path.
Is vioce signal OK?

Yes

END

No
Change the Top FPCB.
Is voice signal OK

Yes

END

No
Change the TWL(U901)
Is the voice signal OK?

Yes

END

No
Change the mainboard

LGE Internal Use Only

- 113 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

Top FPCB

TWL6040

LGE Internal Use Only

- 114 -

TWL6040

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

4.11.5 Ear-MIC troubleshooting
Ear MIC control signal is generate by TWL6040 and OMAP4430.
- Disable to recognize headset insert

START

Check the 3.5pi headest FPCB
BtoB connector or change that FPCB
to new one.

Yes

END

No
Check the top FPCB BtoB
Connector or change that FPCB to
new one.

Yes

END

No
Check the left signal and
detectionline became short when
headset inserted

Yes

No
Change the P-channel MOCFET

END

Yes

Detecting headset insert well?
No

END

Yes

Change the TWL6040.
Detecting headset insert well?
No
Change the mainboard

LGE Internal Use Only

- 115 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

Check the left signal and detection line became short when headset inserted
27

8

26

9

25

10

24

11

23

12

22

13

FB1175

1800

21

14

FB1176

1800

20

15

19

16

C1175

C1176

18

17

0.1u

0.1u

AUD_RCV_P
AUD_RCV_N
FB1177

TP2

EAR_R
EAR_L

1800

C1177
33p

R1176
10K

4

5

6

Added (925 Rev.D)
Changed (Rev.1.0)
FB1173
1800

TP1
DNI

ZD1172

3

L1172

DNI

2

C1172

1

C1171 1n
ESD9B5_0ST5G

FM_ANT

D1175
VSMF05LCC

2
1

S
G

D

EAR_SENSE

3

2SJ347

R1174
200K

DNI

Added (Rev.E)

LGE Internal Use Only

Q1173

R1173 1M

R1172

TP2, FB1176

VSEL_1.8V

TP1, FB1173

- 116 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

- Disable to using headset MIC or headset receiver when voice call

START

Check the MIC hole to
make clear the voice signal path.
Is vioce signal OK?

Yes

END

No
Change the Top FPCB.
Is voice signal OK

Yes

END

No
Change the TWL(U901)
Is the voice signal OK?

Yes

END

No
Change the mainboard

LGE Internal Use Only

- 117 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

4.12 Camera trouble(5M/VGA)
4.12.1 Main 5M AF Camera troubleshooting
5M camera control signals are generated by OMAP4430(U500), and Power is supplied by LP8720(U1201)

START

Check the camera conn. and
revonnect thr camera

Camera is OK?

Yes

END

No
No

Check IOVDD(TP1),
DVDD(TP2), AVDD(TP3)
Yes

Change the main board

No

Check the camera signals MCLK(TP4),
MIPI_CLK(TP5), MIPI_DATA(TP6)
Yes
Change the camera

Camera is OK?

LGE Internal Use Only

- 118 -

Yes

END

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

VBAT
1.2V_5M_VDIG

C1209
2.2u

E3
D4

VINB
FB

LDO1

VIN1

E4
D2

VIN2

L1201
2.2u

B3
C4
C3
D3
E2

CAM_SUBPM_EN

GNDB

IRQ_N
SDA
SCL
DVS
EN

LDO3

U1201
LP8720TLX

LDO4
R1202
100K

Changed (P925 Rev.A)

B2
C2

B4

AVDD : TP3
5M_VCM_V2V8_P

SW
LDO2

I2C3_SDA
I2C3_SCL

5M_VANA_V2V7_P

A2

2.2u

VBATT

10u

C1210

2.2u

10u

A4

C1201

C1211

C1212

D1

Close to E4

DVDD : TP2

DEFSEL
IDSEL

LDO5

A3

5M_VANA_V2V7_S

A1

1.8V_5M_VIO

IOVDD : TP1

C1

5M_VCM_V2V8_S

E1

C1204

C1206

C1207

C1208

1u

1u

1u

1u

B1

C1205

1u

GND

Added Res. (Rev.B)

5M_VCM_V2V8_S

CN1221
GB042-40S-H10-E3000

FL1221
ICMEF214P101M
1
P1
2
P2
3
P3
4
P4

5
P5
6
P6
7
P7
8
P8

MIPI_CLK: TP5

8
9
10
11

29

12

28

13

27

14

26

15

25

16

24

17

C1231

23

18

0.1u

19

21

ESD9B5_0ST5G

7

30
ESD9B5_0ST5G
ZD1225

6

34

31

ZD1224

PRIMARY_5M_MIPI_CLK_N
PRIMARY_5M_MIPI_CLK_P

5

35

22

5
P5
6
P6
7
P7
8
P8

4

36

FL1222
1
P1
2
P2
3
P3
4
P4
9
G1
10
G2

MCLK: TP4

3

37

32

5M_MCLK

2

38

SECONDARY_5M_RESET_N
PRIMARY_5M_RESET_N

1

39

9
G1
10
G2

40

33

SECONDARY_5M_MIPI_CLK_N
SECONDARY_5M_MIPI_CLK_P
SECONDARY_5M_MIPI_DATA0_N
SECONDARY_5M_MIPI_DATA0_P

20

5M_MCLK_CAM

I2C4_SCL
I2C4_SDA

C1235

1u

C1237
0.1u

5M_VANA_V2V7_S
1.2V_5M_VDIG

C1234

1.8V_5M_VIO
5M_VANA_V2V7_P

5M_MCLK_CAM

0.1u
C1233
0.1u

C1232
0.1u

I2C3_SCL
I2C3_SDA

5M_VCM_V2V8_P

C1228

ICMEF214P101M

C1236

4.7u

4.7u

C1229
1u

C1230
0.1u

FL1223

MIPI_DATA: TP6

LGE Internal Use Only

1
P1
2
P2
3
P3
4
P4

5
P5
6
P6
7
P7
8
P8
9
G1
10
G2

PRIMARY_5M_MIPI_DATA0_N
PRIMARY_5M_MIPI_DATA0_P
PRIMARY_5M_MIPI_DATA1_N
PRIMARY_5M_MIPI_DATA1_P

ICMEF214P101M

- 119 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

DVDD : TP2(L1201)

IOVDD : TP1(C1207)

AVDD : TP3(C1204)
MIPI_DATA: TP6(FL1223)

MIPI_CLK: TP5(FL1222)
MCLK: TP4(FL1222)

LGE Internal Use Only

- 120 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

4.12.2 Sub Vga Camera troubleshooting
VGA camera control signals are generated by OMAP4430(U500), and Power is supplied by LP8720(U1201)

TWL_LDO_2.8V
TWL_LDO_1.8V
CN103
1

VT_0.3M_MIPI_DATA0_N
VT_0.3M_MIPI_DATA0_P

18

4

17

5

16

6

15
14

8

VT_0.3M_MCLK

19

3

7

VT_0.3M_MIPI_CLK_N
VT_0.3M_MIPI_CLK_P

20

2

13

9

12

10

11

FB101

IOVDD & DVDD : TP1(FB101)

Rev.1.1 (VSEL 1.8V Remove)
Rev.B(Removed Bypass Cap)

AVDD : TP2(C103)
C103

C104

0.1u

I2C3_SDA
I2C3_SCL
VT_CAM_PWDN
VT_CAM_RESET/

0.1u

IOVDD & DVDD :
TP1(FB101)
AVDD : TP2(C103)

LGE Internal Use Only

- 121 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

4.13 Main LCD trouble
4.13.1 2D LCD Display trouble
Main LCD control signals are generated by OMAP4430. Those signal’s path are : OMAP4430 - & gt; LCD Module

START

Press PWR key turn the power On

Is the circuit powered?

No

Follow the Power ON
trouble shooting

Yes
Disconnect and reconnect
LCD connector(CN1141)

LCD display OK?

Yes

No

Change the LCD module

Yes

Yes

Check LCD Power
TP1, TP2, TP3
LCD BL Boost output
TP4
No
Change the Main board

The LCD works

END

LGE Internal Use Only

- 122 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

1.8V_LCD_IOVCC
12V_3D_LCD
2.8V_3D_LCD

TP1

CN1141
24-5804-030-000-829+
30

9
10
11

19

12

18

13
14

16

15

3D_LCD_BANK_SEL_1
I2C2_SDA
I2C2_SCL

2.8V_LCD_VCC
2.8V_LCD_VCI

LED_C1
LED_C2
LED_A

TP3
FB1143

600

C1143
1u

ICVS0318150FR

VA1104

ICVS0318150FR

VA1102

ICMEF214P101M

4

2

TP2

1

5
P5
6
P6
7
P7
8
P8

8

20

G2
10
G1
9

1
P1
2
P2
3
P3
4
P4

DNI

7

21

9
G1
10
G2

DSI2_LCD_MIPI_CLK_N
DSI2_LCD_MIPI_CLK_P

R1191

22

FL1142

DNI

6

23

ICMEF214P101M

R1190

17

DSI2_LCD_MIPI_D0_N
DSI2_LCD_MIPI_D0_P
DSI2_LCD_MIPI_D1_N
DSI2_LCD_MIPI_D1_P

5

24

1
P1
2
P2
3
P3
4
P4

4

26
25

5
P5
6
P6
7
P7
8
P8

3

27

FL1141

2

28

LCD_RESET_N

1

29

1u

3

C1141

Added (Rev.B)
Removeed VA1101, VA1103 (Rev.C)

VSEL_1.8V VBAT
Rev.B

C3
D1
B2

I2C2_SCL
I2C2_SDA

C2

IN
VIO
SCL

U1121
LM3528

SDA
GPIO1

OVP

MAIN
SUB/FB

HWEN/PGEN/GPIO

D3

B1

SW

1u

GND

R1103
1.5K

LED_A

C1122

D2

C1121
R1102
1.5K

TP4

D1122

L1121 10u

SET

1u

A1

A2

LED_C1
LED_C2
LCD_CP_EN

A3
C1
B3
R1125
12K

R1126
100K

Changed (P925 Rev.A)
Added Res. (Rev.B)

TP2,3
TP4

TP1

LGE Internal Use Only

- 123 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

4.13.2 3D LCD Display trouble
3D LCD enables by OMAP4430. Those signal’s path are : OMAP4430 - & gt; LCD Module

START

Press PWR key turn the power On

Is the circuit powered?

No

Follow the Power ON
trouble shooting

Yes
Disconnect and reconnect
LCD connector(CN1141)
Enter the device test
(S3D LCD test)

3D display OK?
(Dedplay another color)

Yes

No

Change the LCD module

Yes

Yes

Check LCD Power
TP1, TP2
Check 3D LCD conttol signal
TP3
No
Change the Main board

The 3D LCD works

END

LGE Internal Use Only

- 124 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

2.8V_3D_LCD

VBAT

U1106
BU28TD2WNVX

3D_LCD_EN

VIN
STBY

VOUT
GND

PGND

4
3

C1107

5

C1106

TP1

1
2

1u

1u

Changed (Rev.B)

VBAT

L1131 4.7u

2
C1132

0.1u

4
3
5

3D_BOOST_EN

6
R1133
51K

R1134

SW

CP1

VO

CP2

OUT

EN

FB
GND

SS

Exposed_GND

9
10

0.1u

TP2

7

R1136

1

510K

11

0.1u

C1137
1u

Changed (P925 Rev.A)

28

3

27

4

26

5

R1190

DNI

25

6

R1191

DNI

24

7

23

8

22

9

21

10

20

11

19

12

18

13

17

14

16

15

3D_LCD_BANK_SEL_1
I2C2_SDA
I2C2_SCL

LED_C1
LED_C2
LED_A

ICVS0318150FR

VA1104

TP3

LGE Internal Use Only

12V_3D_LCD
C1138

8

C1134

200K

VIN

22K

4.7u

R1135

U1131
TPS61093

C1131

- 125 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

TP3
TP1

TP3
TP1

TP2

TP2

Figure. 3D LCD operating trouble

LGE Internal Use Only

- 126 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

4.15
4.14 SIM detect Trouble shooting
The sequence of detecting LG-P920 SIM is,
SIM inserted to LG-P920

2.85V_SIM(C207) goes to 2.85V

Triggers SIM clock, reset and data.

Block Diagram of USB & UART connection is shown below

USIM_CLKK

CLK

USIM

RST
I_O

USIM_RESET
USIM_DATA

CC_CLK
CC_RST
CC_IO

MP-EHM
XMM6260

START

Start
Re-insert the SIM card

Re-insert the SIM card
Work well?

Yes
Work well?

No

Yes

END

End

No

NO
2.9V_SIM (C103) runs?
Change the main
No
2.9V_SIM(C103)runs?
Change the main board
board
YES
Yes
Change SUB
Change SUB
Yes
Work well?
End
Work well?
No
Change SIM card

Yes

No

END

Change SIM card
Work well?

Yes

End

No
Work well?

Change Main
Yes

END

No
Change Main

LGE Internal Use Only

- 127 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

* layout note : CLK and IO must be seperated

J101

VSIM_2.9V : TP1(C103)

1
2

USIM_RESET/
USIM_CLK

3
7
C101
10p

VCC

GND

RST

VPP

CLK
GND1

I_O
GND2

4

4.7K

VSIM_2.9V

R101

VSIM_2.9V

5
6

USIM_DATA

8

C102

C103

C104

DNI

0.1u

10p

Rev 1.0 value change

Rev 1.0 value change

P920 SUB RFPCB

VSIM_2.9V : TP1(C103)

Check if SUB RFPCB is damaged

LGE Internal Use Only

- 128 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

4.15 Vibrator Troubleshooting
Check out the setting menu on the phone. If not, check Test points shown on the pictures.

START

Turn on the phone

Is the circuit powered?

No

Follow the power-on
trouble shooting

Yes
Check haltic feedback
on the setting menu

Vibration OK?

Yes

No
Change the vibrator

Yes

Check TP1, 2, 3
No
Change the main board

Vibrator works

END

LGE Internal Use Only

- 129 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

Added (P925 Rev.A)
TWL_LDO_3.0V
TP905

R982
DNI

GND

MODE

VDD

GAIN

VDN
NC3

4

PWM

11

R981
100K

VDP

NC2

3

ISA1000

EN

L989

8

82n

TP2

7
6

L988

5

82n

TP3

VIB_L_P
VIB_L_N

NC1

2

U981

EUSY0238306

9

1

VIBE_EN
VIBE_PWM

Changed (P925 Rev.A)

TP1

0

10

R987

C986

2.2u

3.9n

R986

C987

470K

Changed (P925 Rev.A)

LGE Internal Use Only

- 130 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

TP1

LGE Internal Use Only

- 131 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

4.16 HDMI Troubleshooting
Check out the setting menu on the phone and then set the proper resolution for the outer display as shown below

START

Turn on the phone

Is the circuit powered?

No

Follow the power-on
trouble shooting

Yes
Connect the HDMI cable

Video ouput OK?

Yes

No
Set the resolution
suitable for the display

Yes

Check the setting on menu
No
Change the main board

HDMI woeks

END

LGE Internal Use Only

- 132 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

LGE Internal Use Only

- 133 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

4.17 Motion Sensor on/off trouble
When the motion sensor does not work, the reason is chip problem. If the motion sensor IC is damaged, it will do not
work even thought power is supplied and OMAP4430 controls normally. Therefore if the motion sensor is damaged,
change the motion sensor IC or main board.

START

Check the gyro & motion sensor function

Function is OK?

Yes

END

No
Change the Gyro Sensor
IC(U961)

Yes

Gyro-NG
No
Motion sensor-OK?

Yes

END

No
Change the motion sensor
IC(U971)
Gyro & motion
function is OK?

Yes

END

No
Change the main board
No
Function is OK?

LGE Internal Use Only

- 134 -

Yes

END

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

SENSOR_3.0V

Added (P925 Rev.A)
C965
0.1u

13
VDD
AD0
VLOGIC
IME_CL

NC9

11
10
9
8
7

C963

C962

0.1u

0.1u

IME_DA

IME_CL

15

16

17

14

NC5

NC6

NC7

NC8

MPU3050A

SDA

1

25

REGOUT

IME_DA

24

SCL

FSYNC

U961

CLKOUT

GYRO_INT

12

6

23

RESV2

NC4

I2C4_SCL
I2C4_SDA

VSEL_1.8V
INT

5

22

CPOUT

NC3

21

RESV1

4

20

NC2

19

3

2.2n

NC1

C961

CLKIN

R902
1.5K

2

R901
1.5K

GND

18

VSEL_1.8V

IME_DA
IME_CL
VSEL_1.8V

SDA

10

VSEL_1.8V

C971

2

0.1u

3
4

C972

DNC2
GND

U971

DNC4

KXTF9

INT
DNC3

9
8
7

R973
DNI

MOTION_INT

6

C973

0.1u

LGE Internal Use Only

DNC1

SCL

5

SENSOR_3.0V

IO_VDD

VDD

1

1u

- 135 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

Gyro Sensor
IC(U961)

Motion sensor
IC(U971)

LGE Internal Use Only

- 136 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

4.18 Gyro/Compass sensor troubleshooting
The compass sensor is calibrated by the gyro sensor data using SW algorithm. Therefore Gyro sensor error makes the
compass sensor malfunction.

START
Check the gyro & compass
sensor function

Function is OK?

Yes

END

No
Change the Gyro Sensor
IC(U961)

Yes

Gyro-NG?
No
Compass-OK?

Yes

END

No
Change the Compass Sensor IC(U975)

Compass Sensor
function is OK?

Yes

END

No
Change the main board
No
Gyro & compass
Function is OK?

LGE Internal Use Only

- 137 -

Yes

END

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

SENSOR_3.0V

Added (P925 Rev.A)
C965
0.1u

13

15

16

17

14

NC5

NC6

NC7

NC8

VDD
AD0

MPU3050A

SDA

VLOGIC
IME_CL

NC9

11
10
9
8
7

C963

C962

0.1u

0.1u

IME_CL

IME_DA

1

25

REGOUT

IME_DA

24

SCL

FSYNC

U961

CLKOUT

GYRO_INT

12

6

23

RESV2

NC4

I2C4_SCL
I2C4_SDA

INT

5

22

VSEL_1.8V

CPOUT

NC3

21

RESV1

4

20

NC2

19

3

2.2n

NC1

C961

CLKIN

R902
1.5K

2

R901
1.5K

GND

18

VSEL_1.8V

SENSOR_3.0V

C978
1u

1

VSEL_1.8V

AVDD

2

U975
AMI306

DVDD

10

SDA

ADDR

9

6

VPP

Added (Rev.1.0)

DRDY

INT

C976
10n

8

5

SC L

4

7

COMPASS_INT

VREG

1u

GND

3

C975

I2C4_SDA
I2C4_SCL

LGE Internal Use Only

- 138 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

Gyro Sensor
IC(U961)

LGE Internal Use Only

- 139 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

4.19 Proximity Sensor on/off trouble
Proximity Sensor is worked as below:
Send Key click - & gt; Phone number click - & gt; Call connected - & gt; Object moved at the sensor - & gt; Control the screen’s on/off
operation automatically

START
Send Key click & Phone number click
& Call connected
Object moved at the
Proximity sensor

Change the vt_cam fpcb

LCD off?

Yes

END

No
Check TP1 & I2C3_SDA & SCL
& TP2 Output

Output work well?

Yes

END

No
Change the main board

No

LGE Internal Use Only

Function is OK?

- 140 -

Yes

END

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

SENSOR_3.0V
PROXI_3.0V
Rev.B(Pull Up Move to Main PCB)
U101

I2C3_SDA
PROX_INT

1
2
3
4

SDA

VDD

INT

SCL

LDR

GND

LEDK

LEDA

TP1

8
7

I2C3_SCL

6

TP2

5

C102
1u

Sensor_3.0V : TP1(C102)

LGE Internal Use Only

C101
1u

PROXI_3.0V : TP2(C101)

- 141 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

4.20 Illumination Sensor on/off trouble
Illumination Sensor is worked as below:
Menu Key click - & gt; Settings click - & gt; Display click - & gt; Brightness click - & gt; Automatic brightness click

START
Menu key click
- & gt; Settings click
- & gt; Display click
- & gt; Brightness click
- & gt; Automatic brightness click
Hide Illumination sensor by hand

Change the vt_cam fpcb

LCD brightness change?

Yes

END

No
Check Sensor_3.0V(TP1)

Output work well?

Yes

END

No
Change the main board

No

LGE Internal Use Only

Function is OK?

- 142 -

Yes

END

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

SENSOR_3.0V
PROXI_3.0V
Rev.B(Pull Up Move to Main PCB)
U101

I2C3_SDA
PROX_INT

1
2
3
4

SDA

VDD

INT

SCL

LDR

GND

LEDK

LEDA

TP1

8
7

I2C3_SCL

6
5

C102
1u

C101
1u

Sensor_3.0V : TP1(C102)

LGE Internal Use Only

- 143 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

4.21 Touch trouble
Touch control signals are generated by OMAP4430. Those signal’s path are : OMAP4430 - & gt; Touch Module

START
Check the touch connector(CN102)
& sub BtB Connector(CN101)
Reconnect the touch connector(CN102)
& sub BtB Connector(CN101)

Change the vt_cam fpcb

Touch is OK?

Yes

END

No
Check Touch_3.3V(TP1)
& Touch_INT_N(TP2)
& I2C2_SDA(TP3) & SCL(TP4) Output

Output work well?

Yes

END

No
Change the Sub Rfpcb

Touch is OK?

Yes

END

No
Change the main board

No

LGE Internal Use Only

Touch is OK?

- 144 -

Yes

END

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

VSEL_1.8V

CN102

I2C2_SCL: TP4(ZD103) 1

10

2

8
7

5

Touch_3.3V : TP1(C119)

3
4

I2C2_SDA: TP3(ZD102)

I2C2_SDA

9

6

TOUCH_RESET

Touch_INT_N: TP2(VA103)

TOUCH_INT_N

C120

VSEL_1.8V

C119

ZD106

ZD104

ZD103

ZD102

ZD101

Rev.F
VA103

2.2u

ZD105

Rev.F

Rev.E

1u

I2C2_SCL

10K

R112

TOUCH_3.3V

Rev.F
Rev.F

2ch - & gt; 1ch (Rev.E)
Remove 0 ohm (Rev.G)
VBAT

TOUCH_3.3V

U102
VDD
CE

1

PGND

4
3

VOUT
2
GND

5

SENSOR_3.0V
C115
1u

LGE Internal Use Only

- 145 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

LGE Internal Use Only

- 146 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

4. TROUBLE SHOOTING

I2C2_SDA: TP3(ZD102) I2C2_SCL: TP4(ZD103)

Touch_3.3V : TP1(C119)

Touch_INT_N: TP2(VA103)

LGE Internal Use Only

- 147 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

5. Block diagram

5. Block diagram
PMU
RF6590

GPS IN
1V2

Filter
B946
9

Diplexer

RD_H
RD_HX
RD HX

1V8

2V852V65

VCTCXO

XO
AFC_DAC
AFC DAC

26MHz
VCONT

PAM DCDC
RF6560
VOUT_FB
VOUT FB

GSM_LB_TX VCC CP_OUT
GSM_HB_TX
TRX4
TRX5
TRX3
TRX2
TRX6
TRX1

Ant_B8
Ant B8
Ant_B5
Ant_B2
Ant_B1
Ant_B4
Ant B4
Ant_B3

B7953
B8 DPX

PM_L
PM L

B8_TX
B8 TX

B7671
B5 DPX
B7955
B2 DPX
B7696
B1 DPX
B7959
B4 DPX

B5_TX

MMMB

B2_TX

RF6260

PM_H

B1_TX
B4_TX
B4 TX

XMM6260

DCS
SAW filter

RX_L1X
RX_L1
RX_L2X
RX_L2
_

ST8T
BGSF18D

RX_M2X
RX_M2
RX_H2X
RX_H2
RX_H1X
RX_H1
RX_M
M1X
RX_M1

LGE Internal Use Only

Transceiver
PMB5712

- 148 -

SYS_CLK

SYS_CLK

SYS_CLK_EN

SYSCLKEN
REF_CLK_EN

REF_CLK_EN
DI3_TX_DAT
DI3_TX_DATX

Di3_TX_DAT
Di3_TX_DATX

DI3_RX_DAT
DI3_RX_DATX

Di3_RX_DAT
Di3_RX_DATX

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

5. Block diagram

FM_ANT

LCD 4.3”
4.3
4.3” TFT 3D
LCD
(480x800)

Touch

LED
Backlight
Driver IC

DSI

I2C2

McBSP1(PCM)
McBSP3(I2S)
UART2
SDIO
5
McPDM

I2C2

Compass
POP

3D CAMERA

5M AF
MIPI(P)
5M AF
MIPI(S)
Keypad

2Gb-2ch
LPDDR2
eMMC (8Gb)
VT
0.3M
MIPI

I2C4
SDRC

OMAP4430

SDMMC2

KB_COL/ROW

GPIO_82

I2C3
UART4 USB

Accelerometer

I2C1

MIC2

MCLK

PMIC_AP
(TWL6030)

VCHG

LGE Internal Use Only

MIC1
MIC2
3.5 pi Ear MIC(Ear_Jack)
3.5 pi Ear_Jack

38.4MHZ
TCXO Driver

Fuel gauge
A-GPS

IPC_SRDY
IPC_MRDY

Key LED

JTAG

PMB5712

LNA

USIF3 DigRF
GPIO_34
NAND
GPIO_35
I2S2 XMM6260 DDR
MIPI_HSI

MCP

1Gb
NAND
512Mb
DDR

USB

JTAG
32.768KHz

FEM

USIM1
JTAG

JTAG
32.768KHz

PWR-ON KEY

Charge
r

Battery

HS_MIC
HSOLR
FM_ANT

USIF1
I2C

SPK

TWL6040
PDM

EAR_PIECE(RCV)

SPK
MIC1

Motor

McSPI4
GPIO_119
GPIO_120
MCSPI2(PCM)
MIPI_HSI
UART1

I2C4

AUXLR

Proximity

UART3

I2C2

FM_L/R

Light Sensor

GPIO

SDMMC1

I2C

HiFi & PCM Voice

GPIO_2
DMTIMER8_PWM_EV
5
T
I2C1

CSI2
HDMI

Gyro

BT/WLAN/FM
(WL1271)

I2C4

CSI1

5M CAM Flash

FM

EARO

MUIC

Coin cell
VBAT

- 149 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

5. Block diagram

OMAP
4430

I2C1_SDA
I2C1 SDA
I2C1_SCL
ABE_PDM_DL_DATA
ABE_PDM_UL_DATA

ABE_PDM_FRAME

SYS_NRESPWRON

ABE_McBSP3_CLKX
ABE McBSP3 CLKX
ABE_McBSP3_DR
ABE_McBSP1_FSX
ABE_McBSP1_DX
ABE_McBSP1_DR
ABE_McBSP1_CLKX
ABE M BSP1 CLKX
UART2_RTS/
UART2_CTS/
UART2_RX
UART2_TX
DPM_EMU10
DPM EMU10

ABE_McBSP2_CLKX
ABE_McBSP2_DR
ABE_McBSP2_DX
ABE M BSP2 DX
ABE_McBSP2_FSX

LGE Internal Use Only

FM_I2S_FSYNC
FM_I2S_DO
FM_I2S_CLK
FM_I2S_DI
BT_PCM_SYNC
BT_PCM_DOUT
BT_PCM_DIN
BT_PCM_CLK
BT_UART_RTS/
BT_UART_CTS/
BT_UART_RXD
BT_UART_TXD

BT / WiFi / FM
FM_I2S_FSYNC
FM_I2S_DI
FM_I2S_CLK
FM I2S CLK
FM_I2S_DO

SPK

AUD_SPK_P

RCV

AUD_RCV_P
AUD RCV P
EARP
EARN AUD_RCV_N

AUDPWRON
NRESPWRON

SYS_nIRQ2

SYS_NIRQ2
SYS NIRQ2

ABE_McBSP3_DX

PDMCLK
PDMCLKLB
PDMFRAME

AUD_PWRON
SYS_nRESPWRON

HDQ_SIO

HFRP1

AUD_SPK_N
AUD SPK N
SDA
HFRN1
SCL (Audio Codec)
HFRP2
PDMDN
HFRN2
PDMUP

ABE_CLKS
PDM_CLK
PDM CLK
PDM_FRAME

ABE_CLKS
ABE_PDM_LB_CLK

ABE_McBSP3_FSX

TWL6040

I2C1_SDA
I2C1 SDA
I2C1_SCL
PDM_DL_DATA
PDM_UL_DATA

NAUDINT
FM_AUDIO_R
FM_AUDIO_L

AFML
AFMR

HBIAS
HS_MIC
HSL
HSR
ACCONN

HS_MICBIAS
HS_MIC
EAR_L
EAR_R

3.5

HOOK_ADC

PCM_AUD_FSYNC
PCM_AUD_IN
PCM_AUD_OUT
PCM_AUD_CLK
PCM AUD CLK

MBIAS
MMICP
MMICN

Analog

SBIAS
SMICP
SMICN

FM_ANT

Analog

MIC1
MIC2
EAR_SENSE

HCI_CTS
HCI_RTS
HCI_TX
HCI_RX

FM_ANT

EAR_SENSE

IPC_I2S_CLK
IPC_I2S_DOUT
IPC_I2S_DIN
_
_
IPC_I2S_SYNC

XMM6260

I2S2_CLK0
I2S2_TX
I2S2_RX
I2S2 RX
I2S2_WA0

- 150 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

5. Block diagram

CAMERA
VT_IO_DVDD_1V8
VT IO DVDD 1V8
CAM_MCLK

`

VT_PCLK
VT_HSYNC

VT_AVDD_2V8

EMI/ESD Filter

VT_VSYNC
VT VSYNC

1.3M Camera

VT_DATA[7:0]
VT_RESET_N
VT_CAM_PWDN
VT CAM PWDN

LP8720
SUB PMIC

CAM_I2C_SC
L
CAM_I2C_SD
A
CAM_SUBPM_EN

AP20
Common mode filter
CAM_VDIG_1V2
CAM_AVDD_2V8
CAM_VIO_1V8
CAM_AF_2V8

8M_MIPI_CLK_N
8M MIPI CLK N
8M_MIPI_CLK_P

8M

8M_MIPI_DATA0_N

Camera

8M_MIPI_DATA0_P
8M_MIPI_DATA1_N
8M MIPI DATA1 N

(LGIT)

8M_MIPI_DATA1_P
8M_RESET_N
CAM_MCLK
8M_CAM_VCM_EN
8M CAM VCM EN
CAM_VIO_1V8

LGE Internal Use Only

- 151 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

6. CIRCUIT DIAGRAM

6. CIRCUIT DIAGRAM
B4 RX Diversity
Changed (P925 Rev.B)
2.7n

L212

M7
M2
L12
L11
L8
L3
K10
K6
K5
J10
J9
J7
J6
J3
H10
H6
H5
H4
H3
G10
G9

2

L213

O1 G1
1
IN
O2 G2

1.5p
2.7n

4

RD_B4_HX

1n

DPX_IN
TX_L
TX_H
PA_POW_DET
PA_RF
VSPI
SPI_CLK

5

FL211
B9469
2140MHz

L214

L215

DNI

4.7n

SPI_SS
SPI_DRW

PA_RAMP
RESET_N

C105

100p

2

SW102
MS-156C

L102

COMMON
G4

L105
DNI

ANT

2.2n
ANT

C103

G2

DNI

& lt; L102 & gt;
* Global : 2.2nH
* AT & T, TMUS : 100pF

3
2

X1841XXA26000FBA
OUT

VCC

GND

VCONT

C117

DNI

1
C184

VDD_1V8

C185

22n

33p

C182

DNI

4

26MHz

C116

C181

DNI

RD_B4_H
RD_B4_HX
RX_B8_L1X
RX_B8_L1
RX_B5_L2X
RX_B5_L2
RX_GSM1800_M1X
RX_GSM1800_M1
RX_B2_M2X
RX_B2_M2
RX_B1_H2X
RX_B1_H2
RX_B4_H1X
RX_B4_H1

C101

DNI

GSM1800_RX

C254

DNI

G1

1

3

100n

C253

DNI

G3

4

L104

C252

SW101
20279-001E-01

10n

CLK_ON
GPS_PWR_ON
26MHz_GPS_REF

33p

VBAT

C112 10p

VSPI

10n

B5/GSM850

C163

33p

L128
DNI

B8/EGSM

22p

C207

C208

C209

0.1u

0.1u

0.1u

2.2u

C197

C198

C199

C200

C201

C202

C203

C204

47n

47n

47n

0.1u

0.1u

0.1u

0.1u

0.1u

VDD_1V8

VDD_2V85
VDD_2V65
VDD_1V2
VSD2_1.8V
VBAT

6.8n
1n

C191

C192

C193

C194

C195

0.1u

4.7u

1u

0.1u

100n

6.8n
4.7n

DI3_SYS_CLK
DI3_SYS_CLK_EN
DI3_REF_CLK_EN

DI3_RX_DAT
R187
100

R114 must be close to Baseband
DI3_RX_DATX
DI3_TX_DAT

R186
100

Added (Rev.D)
Moved to CP (Rev1.0)

R113 must be close to PMB5712
DI3_TX_DATX

A3
A7
C3
C7
C8
C10
C11
D9
E1
E5
E6
F4
F5
F6
F8
F10
G3
G4
G6
G7
G8

L127 1n

6

GSM_HB_TX

3
5

C153

C206

47n

VSPI
0.1u

L137 1n

4
7

L152
47n

L138
DNI

2
1

GSM_HB_TX

SPI_SS

U171
RF6260

B2_TX

SPI_DRW
SPI_CLK

GSM_LB_TX
B1_TX

12

C173

0.1u

14

C172

220n

L162
DNI

33p

PA_RF

C171

GSM_LB_TX
C151

VBAT

VSPI

L161 2.2n

C115

C205

Removed (Rev.E)

L143
DNI

FB_AM

27p

L141
DNI

20

C114

Rev.1.1

2.2n

U181
PMB5712

J5
J4
C5
C6
J8
L10
D10
B9
F3
L2
F7
G5
L9
A6
D5
D2
E8
C9
B13
L13
K9
A9
C2
B2
F9
E12
B1
D8
C190
C4
C189
H9
C188
A10
C187
F13
F12
E13
C13
D13
C12
D12
E7
B5
A5
M8
M9
M10
K11 TP102
J11

37

GND19
38
GND20
39
GND21
40
GND22

SPI_GND

B4

L114
3n

RX_B5_L2X
RX_B5_L2
RX_B8_L1X
RX_B8_L1

VCMOS

VBAT

9

L113
10n

SPI_CLK
SPI_DRW
SPI_SS

DNI

26

Rx-Band8_1
27
Rx-Band8_2

RX_B4_H1X
RX_B4_H1

18

L142
L112

24

Rx-Band5_1
25
Rx-Band5_2

VBAT

GSM_HB_TX

B40761DY2045L

GND1
GND2
GND3
GND4
GND5
GND6

PA_POW_DET

33p

U121

ANT-Band8

17

C132
C133
DNI

2
4
5
6
8
10

RF_OUT

1.2n

18

FRM

SDIO

SCL

L131

19

15

13

14

VDD

GND1

GND2

GND3

GND4

GND5

LVDD

16

17

4

5

7

21

GND6

TRX_6

52

VDD2V5_RCRF
VD2V5_RCBB
VDD2V5_TXBIAS
VDD2V5_TXDCO
VDD2V5_RXDCO
VDD2V5_RFC
VDD2V5_FSYS
D2B_OUT
VDD1V8_RCBB
VDD1V8_RCRF
VDD1V8_RCMS
VDD1V8_RCLO
VDD1V8_RXDCO
VDD1V8_TXDCO
VDD1V8_TXLO
VDD1V8_FBR
VDD1V8_TXMS
VDD1V8_DIG
VDD1V8_SCU
VDD1V8_RFC
VDD1V8_RXPLL
VDDBAT
D2B_OUT_TXRF
VDD_TXRF
VDD1V2_DIG
VDD_IO
VDDBAT_TXRF
CEXT_TXPLL
CEXT_TXMS
CEXT_RXPLL
CEXT_DCXO
SYS_CLK
SYS_CLK_EN
REF_CLK_EN
DI3_RX_DAT
DI3_RX_DATX
DI3_TX_DAT
DI3_TX_DATX
GPO1
GPO2
GPO3
GPO4
GPO5
GPO6
GPO7
GPO8

RX_B2_M2X
RX_B2_M2

CP_OUT

TRX_5

20

RX_B1_H2X
RX_B1_H2

19

TRX_4

1

16

Rx-Band4_1
17
Rx-Band4_2

GND7
GND8
GND9
GND10
GND11
GND12
GND13
GND14
GND15
GND16
GND17
GND18

HB_TX

B2/GSM1900

2

Tx-Band8

TRX_3

ANT-Band5

1

6

PGND

DNI

9

L111

1.8p

TRX_2

FL111
BGSF18DM20

10

C109

TRX_1

LB_TX

20

Rx-Band2_1
21
Rx-Band2_2

RX_GSM1800_M1X
RX_GSM1800_M1

PM_L
PM_H
PA_POW_DET
PA_RF
VSPI
SPI_CLK
SPI_SS
SPI_DRW
PA_RAMP
PA_BIAS
RESET_N
RD_L2
RDL2x
RD_L1
RD_L1x
RD_M
RD_Mx
RD_H
RD_Hx
RX_L1X
RX_L1
RX_L2X
RX_L2
RX_M1X
RX_M1
RX_M2X
RX_M2
RX_H2X
RX_H2
RX_H1X
RX_H1
XO_SUP
XOX
XO
AFC_DAC
XO_EXT
CLK_ON
FSYS1_EN
FSYS1
FSYS2_EN
FSYS2
FSYS3_EN
FSYS3
NC1
NC2
NC3
NC4
VDD_TEST
MI1
MI2

12
13
15
28
29
30
31
32
33
34
35
36

8

12

L110 4.7n

GSM_LB_TX

18

ANT_Band4

Tx-Band5

ANT

54
3

22

Rx-GSM1800_1
23
Rx-GSM1800_2
Rx-Band1_1
19
Rx-Band1_2

ANT-Band2

Tx-Band4

11

14

ANT-Band1

Tx-Band2

60
58

C123
1p

3

33p

Tx-Band1

C121

ANT-GSM1800

7

56
L122 2.2n

11

B1

GND23
GND24
GND25
GND26
GND27
GND28
GND29
GND30
GND31
GND32
GND33
GND34
GND35
GND36
GND37

41
42
43
44
45
46
47
48
49
50
51
53
55
57
59

L116
DNI

A4
A2
D1
C1
E3
D3
E4
D4
M12
M11
K12
M3
M4
C183
L4
DNI
L5
M5
M6
L6
L7
F2
E2
G1
F1
H2
G2
J1
H1
L1
K1
K2
J2
B11
A12
A11
B10
B12
K13
G13
G12
H12
H13
J13
J12
A1
A13
M1
M13
E9
A8
B8

B4_TX

VCC
HB_RFIN
LB_RFIN

B5_TX

NC

B8_TX

GND

L176 2.7n

10

SPI_DRW

11

TX_H

SPI_CLK

9

C175
1p

VBAT_PAM

SPI_SS

L177
DNI

Tranceiver PMU

16
8
L179 1.8n

15

TX_L

13

C178
DNI

21

VSD2_1.8V

L180
DNI

CLK_ON
SPI_CLK
SPI_SS
SPI_DRW

C211

GND42
GND41
GND40
GND39
GND38
GND37
GND36
GND35
GND34
GND33
GND32
GND31
GND30
GND29
GND28
GND27
GND26
GND25
GND24
GND23
GND22

3

GND1
GND2
GND3
GND4
GND5
GND6
GND7
GND8
GND9
GND10
GND11
GND12
GND13
GND14
GND15
GND16
GND17
GND18
GND19
GND20
GND21

L211

RD_B4_H

L147 1.5n

VDD_1V2

C251

L148
DNI

0.1u

U220
RF6560

CP_OUT

D5
A6

PA_RAMP
C233

C5
B4
B5
B6

CC_N

VSDI

CA_P
CA_N

CP_OUT
CB_P
VRAMP

CB_N

SDI_EN

VOUT_FB

SDI_CLK

LOUTB

SDI_DATA

LOUTA

NC

B2

DNI

SPI_SS
SPI_CLK
SPI_DRW

CC_P

VBATT1B

LGE Internal Use Only

- 152 -

B3
D4

C232

220n

C231

C230

2.2u

D1

A1
A3

Changed
(Rev.1.1)

A5

B4

D4

C4
SPI_DRW

SPI_SS

VSNS_1V2
LX2
VSNS_1V8

VANA
LX3A

C241
1u

VSNS_2V85

C249
D3

L249

C250

2.2u

4.7u

1u

VDD_1V8

C3
D1

L247

4.7u

L244

4.7u

Removed(Rev.1.0)
VDD_2V85

L248 15n

C2
B1

L245 15n

A1

VBAT_PAM

OUT3B

A2

VDD_2V65

C247

C244

C248

C245

4.7u

4.7u

4.7u

1u

C243
4.7u

L227 20n

B1
C1

LX1

2.2u

C4
D3

Removed
(Rev.1.0)

CLK_ON

VDD_IO
4.7u

VPWR

SPI_CLK

B2

Changed
(Rev.1.1)

L226

1u
C226

GND2

1u

CWELL

VBATT1A

GND1A2

C225

VBATT2

GND1A1

A4

GND1B

A2

10n

A4

C242

U241
RF6590

C227

C228

C255

2.2u

2.2u

2.2n

DNI

C6

D2

10u

C3

D6

10u

C224

C2

100n

C223

VSPI

C221

D2

Removed (Rev.E)
C222

Removed (Rev.B)

220
C1

L168 1.5n

L169
DNI

FB201

PGND

L159
DNI

Rev.E

A3

VBAT

AGND

PAM DCDC

L158 1.5n

B3

VBAT

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

6. CIRCUIT DIAGRAM

BASE BAND PROCESSOR

C330

C329

C328

C327

0.1u

0.1u

0.1u

0.1u

0.1u

0.1u

0.1u

C341

10p

L17

C337
0.1u

M17

X300
FC-135
32.768KHz
C342

M16
N17

10p

R2

M14
L13
P13
N12
L11
M15
M13
A13
A11
A10
A9
A8
C12
B9
C9
A16
B17
C17
D17
E17
F17
G17
H17
J16

MIPI_HSI_AC_DATA
MIPI_HSI_AC_FLAG|McSPI4_SOMI
MIPI_HSI_AC_FLAG

VSD2_1.8V

McSPI4_SIMO
McSPI4_SOMI
McSPI4_CLK

A5
M5

MIPI_HSI_AC_WAKE
MIPI_HSI_CA_READY|McSPI4_CLK
MIPI_HSI_CA_DATA
MIPI_HSI_CA_FLAG
MIPI_HSI_CA_READY
MIPI_HSI_AC_READY
MIPI_HSI_CA_WAKE Rev.C
MEM_A[0]
MEM_A[1]
MEM_A[2]
MEM_A[3]
MEM_A[4]
MEM_A[5]
MEM_A[6]
MEM_A[7]
MEM_A[8]
MEM_A[9]
MEM_A[10]
MEM_A[11]
MEM_A[12]
MEM_A[13]
MEM_A[14]
MEM_A[15]

C356
0.1u

C357
0.1u

VCC1
VCC2

IO0
IO1
IO2
IO3
IO4
IO5
IO6
IO7
IO8
IO9
IO10
IO11
IO12
IO13
IO14
IO15

C358
2.2u
A9
B1
B5
B10
C9
D10
E9
F10
G9
H1
H9
J10
K10
L2
L9
M10
N6
N9

H16
J15
G15

VSS1
VSS4
VSS8
VSSQ5
VSSQ4
VSSQ9
VSSQ8
VSSQ3
VSS2
VSS3
VSSQ10
VSSQ1
VSSQ2
VSS5
VSSQ6
VSSQ7
VSS6
VSS7

/CE
/RE
/WE
CLE
ALE
/WP
R/B

M1
M2
M3
L5
N7
L6
M6
L8
N2
N3
M4
N4
N5
M7
L7
M8

MEM_AD[0]
MEM_AD[1]
MEM_AD[2]
MEM_AD[3]
MEM_AD[4]
MEM_AD[5]
MEM_AD[6]
MEM_AD[7]

A6
A3
A7
A4
B4
B3
B6

MEM_CS0_N
MEM_RD_N
MEM_WR_N
MEM_WAIT_N
MEM_ADV_N
MEM_WP
MEM_BUSY/

MEM_AD[8]
MEM_AD[9]
MEM_AD[10]
MEM_AD[11]
MEM_AD[12]
MEM_AD[13]
MEM_AD[14]
MEM_AD[15]

A1
A10
N1
N10

R1

P2

P1

N2

T9

N1

U9

K3

P12

U10

T8

T7

U8

U7

D4

F6

K4

J1

H3

E4

B4

F2

C4

H1

C3

A5

C314

220n

PT301

G1

F4

G2

F3

DN I

10K

N13

MIPI_HSI_AC_DATA|McSPI4_SIMO

NC1
NC26
NC28
NC29

220n

0.1u

220n

220n
C311

C308

0.1u
C301

C309

0.1u

C310

220n
H8

E3

K2

J3

J2

C2

A3

A2

H2

D3

E1

A4

VDD_VBAT_SD1
VDD_VBAT_SD2
VSS_SD1
VSS_SD2
SD1_SW1
SD1_SW2
SD1_FB
SD2_SW1
SD2_SW2
SD2_FB
ON1
ON2_N
RESET_PWRDWN_N
RESET_BB_N
FSS
RESET_ALL_N
M1
M2
M3
M4
VDD_VBAT_PMU
VPMU
VRTC
VSIM
VPLL
VDD_VSD2
VIO_12
VUSB_IO
VUSB_PD
VUSB_ANA
VSS_PMU
AGND
VREF
TM_EN
ANAMON
TRIG_B
Di3_RX_DAT
Di3_RX_DATX
Di3_TX_DAT
Di3_TX_DATX
SYS_CLK
SYSCLKEN
XRESET_N
ALERT_N
REF_CLK_EN
I2S2_CLK0
I2S2_CLK1
I2S2_RX
I2S2_TX
I2S2_WA0
I2S2_WA1
F14

Changed (Rev.E)
VRTC_1.8V

R5

MODEM_SEND
GSM_TXON_IND
Rev.1.0

E16

R384

D16

DNI

C16

VSD2_1.8V

B16
H11
G11
G9
D8
F9
E8
E9
D10
E11
A7
H10
D11
D12
D13
J12
F13

MEM_AD[0]
MEM_AD[1]
MEM_AD[2]
MEM_AD[3]
MEM_AD[4]
MEM_AD[5]
MEM_AD[6]
MEM_AD[7]
MEM_AD[8]
MEM_AD[9]
MEM_AD[10]
MEM_AD[11]
MEM_AD[12]
MEM_AD[13]
MEM_AD[14]
MEM_AD[15]

Added (P925 Rev.A)

Analog switch for USIF1
Changeed (Rev.C)
UART_TX_SW
UART_TX_IFX

C333

2

C334

1

C335

P3

USB_VBUS

10u

100K

R340

C344

S2 4

1
2

UART_RX_SW
C336

2B0

1B1

GND

UART_RX_IFX

100n

LGE Internal Use Only

- 153 -

U303
FSA2259UMX

VCC

1A

NTJD4105CT1G

3

4.7K

R342

10

G2 5

3 D2

(Active high)

2B1

D1 6

2 G1

IFX_USB_VBUS_EN

IFX_USB_VBUS

USB_D+_IFX
USB_D-_IFX

Removed
(Rev.1.0)

1 S1

USIF1_SW

VBAT

Q301

IFX_TRIG_IN
MON1
MON2
UART_TX_IFX
UART_RX_IFX

220n

USIM_CLK
USIM_RESET/
USIM_DATA

C343

4020

R336

IFX_USB_VBUS

8

T10

N4

9

P14

DSP_AUDIO_IN1

P10

MEM_BFCLKO
MEM_SDCLKO
DDR_CKE
MEM_CS1_N
DDR_RAS_N
DDR_CAS_N
MEM_WR_N
MEM_BC1_N
MEM_BC0_N
DDR_DQS[1]
DDR_DQS[0]

S2

N9
T15

N8

G8
F8
D3
H2
F2
G2
J1
D7
H8
D5
H7

2A

U15

VUSB_ANA_1.8V

B6

MEM_A[0]
MEM_A[1]
MEM_A[2]
MEM_A[3]
MEM_A[4]
MEM_A[5]
MEM_A[6]
MEM_A[7]
MEM_A[8]
MEM_A[9]
MEM_A[10]
MEM_A[11]
MEM_A[12]
MEM_A[13]
MEM_A[14]
MEM_A[15]

7
6

UART1_RX_IPC

1B 0

R12

P9

/CK
CK
CKE
/CS
/RAS
/CAS
/WED
UDQM
LDQM
UDQS
LDQS

K4
K5
K6
K7
J8
K8
J7
J5
E6
C5
D8
C6
C8
C7
B8
B7

S1

R16
4.7

N10

Removed (Rev 1.0)

DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15

NC27
NC20
NC21
NC9
NC19
NC8
NC11
NC12
NC17
NC18
NC7
NC16
NC25
NC6
NC10
NC5
NC13
NC14
NC4
NC2
NC24
NC22
NC23
NC15
NC3

MEM_AD[0]
MEM_AD[1]
MEM_AD[2]
MEM_AD[3]
MEM_AD[4]
MEM_AD[5]
MEM_AD[6]
MEM_AD[7]
MEM_AD[8]
MEM_AD[9]
MEM_AD[10]
MEM_AD[11]
MEM_AD[12]
MEM_AD[14]
MEM_AD[15]

5

R337

K10

IPC_SRDY
IPC_MRDY
OMAP_SEND

VDDQ1
VDDQ6
VDDQ5
VDDQ4
VDDQ10
VDDQ9
VDDQ2
VDDQ8
VDDQ7
VDDQ3

J4
K1
K2
K3
B2
C2
D1
C3
D2
C4
J3
E2
E1
H3
J2

4

T12

K16

VUSB_PD_1.1V

M8

A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
BA0
BA1

UART1_TX_IPC

L8

Rev.B
M9

A2
D4
D6
E3
E4
E5
E7
E8
F1
F3
F4
F5
F6
F7
G3
G4
G5
G6
G7
H4
H5
H6
J6
L3
L4

VDD1
VDD2
VDD3
VDD5
VDD4
VDD6

R4

J17

Rev.B

U17

K11

U1

0.22u

A1

0.1u

A17

0.1u

T11

N11

U11

C325

P16

C324

N16

VSIM_2.9V
VUSB_IO_3.1V
VSD2_1.8V
VPLL_1.2V
VIO_1.2V

C323

T16

F15

R17

B11

T17

K8

Changed (Rev.E)

P17

R8

T1

K9

E12

U2

E13

U12

0.22u

U13

0.1u

VSD2_1.8V Changed (Rev.E)

U3

0.22u

T2

E10

T3

C318

P7

C317

0.1u

* C316, C318, C324 : L-W swapped Cap

C316

R6

C315

T5

H9

T4

K14

T6

N5

Removed (Rev.1.0)

U6

M6

U301
XMM6260

U5

M4

U4

M2

T13

M5

K1

M3

L5

Added (Rev.B)
Removed (925 Rev.D)
VSD1_1.3V

T14

L7

U14

B14

L9

B15

K5

A14

L2

G16

L4

A15

B10

L1

MEM_BFCLKO
DDR_CKE

F16

M1

A12

K7

MEM_BC0_N
MEM_BC1_N
DDR_DQS[0]
DDR_DQS[1]
MEM_SDCLKO

R9

G13

U16

B7
G14

D9

E14

L14

K17

L10

B12

L16

B13

J11

G10

MEM_ADV_N
MEM_RD_N
MEM_WR_N
MEM_WAIT_N
DDR_RAS_N
DDR_CAS_N

D1

C1

H13

P8

H14

J8

J13

IPC_I2S_CLK
IPC_I2S_DIN
IPC_I2S_DOUT
IPC_I2S_SYNC
CP_CRASH_INT

EINT1
EINT2
EINT3
I2C1_SCL
I2C1_SDA
DSP_AUDIO_IN1
CLKOUT0
CLKOUT2
T_OUT0
T_OUT1
RESET2_N
MIPI_HSI_RX_DATA
MIPI_HSI_RX_FLG
MIPI_HSI_RX_RDY
MIPI_HSI_RX_WAKE
MIPI_HSI_TX_DATA
MIPI_HSI_TX_FLG
MIPI_HSI_TX_RDY
MIPI_HSI_TX_WAKE
MEM_A_0
MEM_A_1
MEM_A_2
MEM_A_3
MEM_A_4
MEM_A_5
MEM_A_6
MEM_A_7
MEM_A_8
MEM_A_9
MEM_A_10
MEM_A_11
MEM_A_12
MEM_A_13
MEM_A_14
MEM_A_15
MEM_A_16
MEM_A_17
MEM_A_18
MEM_A_19
MEM_A_20
MEM_A_21
MEM_A_22
MEM_A_23
MEM_AD_0
MEM_AD_1
MEM_AD_2
MEM_AD_3
MEM_AD_4
MEM_AD_5
MEM_AD_6
MEM_AD_7
MEM_AD_8
MEM_AD_9
MEM_AD_10
MEM_AD_11
MEM_AD_12
MEM_AD_13
MEM_AD_14
MEM_AD_15

A8
C1
G1
G10
L1
N8
B9
C10
D9
E10
F9
H10
J9
K9
L10
M9

DI3_TX_DAT
DI3_TX_DATX

VSS_1
VSS_2
VSS_3
VSS_4
VSS_5
VSS_6
VSS_7
VSS_8
VSS_9
VSS_10
VSS_11
VSS_12
VSS_DIGRF
VSS_PLL
VSS_USB
ETM11_TRACECLK
ETM11_TRACEPKT0
ETM11_TRACEPKT1
ETM11_TRACEPKT2
ETM11_TRACEPKT3
ETM11_TRACEPKT4
ETM11_TRACEPKT5
ETM11_TRACEPKT6
ETM11_TRACEPKT7
CC_CLK
CC_RST
CC_IO
TDO
TDI
TMS
TCK
TRST_N
TRIG_IN
HW_MON1
HW_MON2
USIF1_TXD_MTSR
USIF1_RXD_MRST
USIF1_RTS_N
USIF1_CTS_N
USIF1_SCLK
HSIC_USB_DATA
HSIC_USB_STRB
USB_TEST
USB_DPLUS
USB_DMINUS
USB_TUNE
USB_ID
VBUS
DPLUS
DMINUS
NC1
NC2
NC3
NC4
NC5

A6
J14

C355
0.1u

TP311
TP313
TP310
TP312

FWP
FCDP_RBn
MEM_CS0_N
MEM_CS1_N
MEM_CS2_N
MEM_CS3_N
MEM_ADV_N
MEM_RD_N
MEM_WR_N
MEM_WAIT_N
MEM_RAS_N
MEM_CAS_N
MEM_BE0_N
MEM_BE1_N
MEM_BC0_N
MEM_BC1_N
MEM_BC2_N
MEM_BC3_N
MEM_SDCLKO
MEM_BFCLKO_0
MEM_BFCLKO_1
MEM_CKE
MMCI1_CMD
MMCI1_CLK
MMCI_DAT_0
MMCI1_DAT_1
MMCI1_DAT_2
MMCI1_DAT_3
MMCI1_CD
VDD_CORE_1
VDD_CORE_2
VDD_CORE_3
VDD_CORE_4
VDD_CORE_3G_1
VDD_CORE_3G_2
VDD_CORE_EBU
VDD_IO18_1
VDD_IO18_2
VDD_IO18_3
VDD_IO18_4
VDD_IO18_5
VDD_IO18_6
VDD_MMC
VDD_SIM
VDD_USBIO
VDD_MIPI
VDD_PLL
VDD_IO12
VPP
VDD_USB_PD
VDD_USB_ANA
VDD_DIGRF
F32K
OSC32K
VSS_RTC
VDD_RTC

G8

B8

MEM_WP
MEM_BUSY/
MEM_CS0_N
MEM_CS1_N

K13

DNI

R383
4.7K

D14

R382

B1

22u

F1

C306

VSD2_1.8V

C354
0.1u

DI3_SYS_CLK
DI3_SYS_CLK_EN
RESET_N
DI3_REF_CLK_EN

R306

TP301

PT200 close to TCXO

3.3u
TP300

22u

C353
0.1u

Rev.B

J5

L303
C307

J6

3.3u

C352
0.1u

DI3_RX_DAT
DI3_RX_DATX

10u

J4

L304

10u

RESET_PMU_N

C313

10u

Removed (Rev.1.0)

C312

2.2u

C305

H6

4.7K

VSD2_1.8V
VSD1_1.3V

U350
H8BCS0QG0MMR-46M

VBAT

FB302
60

N14

4.7K

FB301
60

R319

VSD1_1.3V

R316

VSD2_1.8V
IFX_PWR_ON_SW/

DSP_AUDIO_IN1
MON1
MON2
IFX_TRIG_IN

C302

4.7K

1u

C304

VBAT

R314

4.7K

P11

R313

VSD2_1.8V

C351

C303

VSD2_1.8V

VPMU_1.3V
VRTC_1.8V
VSIM_2.9V
VPLL_1.2V
VSD2_1.8V
VIO_1.2V
VUSB_IO_3.1V
VUSB_PD_1.1V
VUSB_ANA_1.8V

C301 close to BB

Boot Configuration

NAND MCP

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

6. CIRCUIT DIAGRAM

McSPI port usage
NO ASSIGN

VSEL_1.8V

3.3K

TCXO_BUFFER, TI PMIC, TI CODEC

R588

I2C1

DNI

IPC

DNI

SPI4

DNI

SPI3

I2C port usage

Port

R581

FM, SD/MMC5(WLAN)
DMB

R586

SPI2

R584

SPI1

PDM_UL_DATA
PDM_DL_DATA
PDM_FRAME
PDM_CLK
ABE_CLKS

PDM

AG25
AF25
AE25
AF26
AH26
TP512 TP513

AE24
AF24
AG24
AH24

IPC_SRDY
IPC_MRDY

IFX control
MODEM_SEND
OMAP_SEND

AE18
AG19
AF19
AE19
AF18
AG18
AE17
AF17
AH17
AE16
AF16
AG16
AF14
AE14

MIPI_HSI_CA_WAKE
MIPI_HSI_CA_DATA
MIPI_HSI_CA_FLAG
MIPI_HSI_AC_READY
MIPI_HSI_AC_WAKE
MIPI_HSI_AC_DATA
MIPI_HSI_AC_FLAG
MIPI_HSI_CA_READY
FM_I2S_DI
FM_I2S_DO
FM_I2S_CLK
FM_I2S_FSYNC

MIPI HSI
Rev.C

FM I2S

USB HSIC
SD/MMC1
MICROSD

D2
E3
E4
E2
E1
F4
F3
F1
G4
G3

MICROSD_CLK
MICROSD_CMD
MICROSD_DAT0
MICROSD_DAT1
MICROSD_DAT2
MICROSD_DAT3

GPIOs
1.8V & 3.0V_VIO

UART2
BT

AB26
AB27
AA25
AA26

BT_UART_CTS/
BT_UART_RTS/
BT_UART_RXD
BT_UART_TXD

AF22
AE22
AG22
AE23
AF23
AG23
AH23
F27
F28
G27
G28

UART1_RX_IPC

UART1

GPS_LNA_SD
UART1_TX_IPC
Rev.B

VIBE_PWM
3D_LCD_EN

TP525 TP524 TP523

McSPI4_CLK

McSPI4McSPI4_SIMO
McSPI4_SOMI
UART4

UART4_RX_OMAP
UART4_TX_OMAP

IFX_PWR_ON_SW/
LCD_CP_EN
CAM_SUBPM_EN

HDMI

HDMI_HPD
HDMI_CEC
HDMI_SCL
HDMI_SDA
HDMI_D0HDMI_D0+
HDMI_D1HDMI_D1+
HDMI_D2HDMI_D2+
HDMI_CLKHDMI_CLK+

Rev.B

AE21
AF20
AF21
AE20
AG20
AH19
H4
J2
G2
J1
K1
H2
H3
B9
B10
A8
B8
C10
D10
C9
D9
C8
D8
C11
D11

ABE_PDM_UL_DATA/ABE_McBSP3_DR/SAFE_MODE
ABE_PDM_DL_DATA/ABE_McBSP3_DX/SAFE_MODE
ABE_PDM_FRAME/ABE_McBSP3_CLKX/SAFE_MODE
ABE_PDM_LB_CLK/ABE_McBSP3_FSX/SAFE_MODE
ABE_CLKS/GPIO_118/SAFE_MODE
ABE_DMIC_CLK1/GPIO_119/USBB2_MM_TXSE0/SAFE_MODE
ABE_DMIC_DIN1/GPIO_120/USBB2_MM_TXDAT/SAFE_MODE
ABE_DMIC_DIN2/SLIMBUS2_CLOCK/GPIO_121/SAFE_MODE
ABE_DMIC_DIN3/SLIMBUS2_DATA/ABE_DMIC_CLK2/GPIO_122/SAFE_MODE

CSI22_DX0/GPI_77/SAFE_MODE
CSI22_DY0/GPI_78/SAFE_MODE
CSI22_DX1/GPI_79/SAFE_MODE
USBB1_ULPITLL_CLK/HSI1_CAWAKE/GPIO_84/USBB1_ULPIPHY_CLK/ATTILA_HW_DBG20/SAFE_MODE
CSI22_DY1/GPI_80/SAFE_MODE
USBB1_ULPITLL_STP/HSI1_CADATA/McBSP4_CLKR/GPIO_85/USBB1_ULPIPHY_STP/USBB1_MM_RXDP/ATTILA_HW_DBG21/SAFE_MODE CAM_SHUTTER/GPIO_81/SAFE_MODE
USBB1_ULPITLL_DIR/HSI1_CAFLAG/McBSP4_FSR/GPIO_86/USBB1_ULPIPHY_DIR/ATTILA_HW_DBG22/SAFE_MODE
CAM_STROBE/GPIO_82/SAFE_MODE
USBB1_ULPITLL_NXT/HSI1_ACREADY/McBSP4_FSX/GPIO_87/USBB1_ULPIPHY_NXT/USBB1_MM_RXDM/ATTILA_HW_DBG23/SAFE_MODE
CAM_GLOBALRESET/GPIO_83/SAFE_MODE
USBB1_ULPITLL_DAT0/HSI1_ACWAKE/McBSP4_CLKX/GPIO_88/USBB1_ULPIPHY_DAT0/USBB1_MM_RXRCV/ATTILA_HW_DBG24/SAFE_MODE
USBB1_ULPITLL_DAT1/HSI1_ACDATA/McBSP4_DX/GPIO_89/USBB1_ULPIPHY_DAT1/USBB1_MM_TXSE0/ATTILA_HW_DBG25/SAFE_MODE
CVIDEO_TVOUT
USBB1_ULPITLL_DAT2/HSI1_ACFLAG/McBSP4_DR/GPIO_90/USBB1_ULPIPHY_DAT2/USBB1_MM_TXDAT/ATTILA_HW_DBG26/SAFE_MODE
CVIDEO_VFB
USBB1_ULPITLL_DAT3/HSI1_CAREADY/GPIO_91/USBB1_ULPIPHY_DAT3/USBB1_MM_TXEN/ATTILA_HW_DBG27/SAFE_MODE
CVIDEO_RSET
USBB1_ULPITLL_DAT4/DMTIMER8_PWM_EVT/ABE_McBSP3_DR/GPIO_92/USBB1_ULPIPHY_DAT4/ATTILA_HW_DBG28/SAFE_MODE
USBB1_ULPITLL_DAT5/DMTIMER9_PWM_EVT/ABE_McBSP3_DX/GPIO_93/USBB1_ULPIPHY_DAT5/ATTILA_HW_DBG29/SAFE_MODE
DSI1_DX0
USBB1_ULPITLL_DAT6/DMTIMER10_PWM_EVT/ABE_McBSP3_CLKX/GPIO_94/USBB1_ULPIPHY_DAT6/ABE_DMIC_DIN3/ATTILA_HW_DBG30/SAFE_MODE
DSI1_DY0
USBB1_ULPITLL_DAT7/DMTIMER11_PWM_EVT/ABE_McBSP3_FSX/GPIO_95/USBB1_ULPIPHY_DAT7/ABE_DMIC_CLK3/ATTILA_HW_DBG31/SAFE_MODE
DSI1_DX1
DSI1_DY1
USBB1_HSIC_DATA/GPIO_96/SAFE_MODE
USBB1_HSIC_STROBE/GPIO_97/SAFE_MODE
DSI1_DX2
DSI1_DY2
SDMMC1_CLK/DPM_EMU19/GPIO_100/SAFE_MODE
DSI1_DX3
SDMMC1_CMD/UART1_RX/GPIO_101/SAFE_MODE
DSI1_DY3
SDMMC1_DAT0/DPM_EMU18/GPIO_102/SAFE_MODE
DSI1_DX4
SDMMC1_DAT1/DPM_EMU17/GPIO_103/SAFE_MODE
DSI1_DY4
SDMMC1_DAT2/DPM_EMU16/GPIO_104/JTAG_TMS_TMSC/SAFE_MODE
SDMMC1_DAT3/DPM_EMU15/GPIO_105/JTAG_TCK/SAFE_MODE
DSI2_DX0
SDMMC1_DAT4/GPIO_106/SAFE_MODE
DSI2_DY0
SDMMC1_DAT5/GPIO_107/SAFE_MODE
DSI2_DX1
DSI2_DY1
SDMMC1_DAT6/GPIO_108/SAFE_MODE
SDMMC1_DAT7/GPIO_109/SAFE_MODE
DSI2_DX2
DSI2_DY2
UART2_CTS/SDMMC3_CLK/GPIO_123/SAFE_MODE
UART2_RTS/SDMMC3_CMD/GPIO_124/SAFE_MODE
GPMC_AD0/SDMMC2_DAT0
UART2_RX/SDMMC3_DAT0/GPIO_125/SAFE_MODE
GPMC_AD1/SDMMC2_DAT1
UART2_TX/SDMMC3_DAT1/GPIO_126/SAFE_MODE
GPMC_AD2/SDMMC2_DAT2
GPMC_AD3/SDMMC2_DAT3
McSPI1_CLK/GPIO_134/SAFE_MODE
GPMC_AD4/SDMMC2_DAT4/SDMMC2_DIR_DAT0
McSPI1_SOMI/GPIO_135/SAFE_MODE
GPMC_AD5/SDMMC2_DAT5/SDMMC2_DIR_DAT1
McSPI1_SIMO/GPIO_136/SAFE_MODE
GPMC_AD6/SDMMC2_DAT6/SDMMC2_DIR_CMD
McSPI1_CS0/GPIO_137/SAFE_MODE
GPMC_AD7/SDMMC2_DAT7/SDMMC2_CLK_FDBK
McSPI1_CS1/UART1_RX/GPIO_138/SAFE_MODE
GPMC_AD8/KPD_ROW0/C2C_DATA15/GPIO_32
McSPI1_CS2/UART1_CTS/SLIMBUS2_CLOCK/GPIO_139/SAFE_MODE
GPMC_AD9/KPD_ROW1/C2C_DATA14/GPIO_33
McSPI1_CS3/UART1_RTS/SLIMBUS2_DATA/GPIO_140/SAFE_MODE
GPMC_AD10/KPD_ROW2/C2C_DATA13/GPIO_34
UART3_CTS_RCTX/UART1_TX/GPIO_141/SAFE_MODE
GPMC_AD11/KPD_ROW3/C2C_DATA12/GPIO_35
UART3_RTS_SD/GPIO_142/SAFE_MODE
GPMC_AD12/KPD_COL0/C2C_DATA11/GPIO_36
UART3_RX_IRRX/DMTIMER8_PWM_EVT/GPIO_143/SAFE_MODE
GPMC_AD13/KPD_COL1/C2C_DATA10/GPIO_37
UART3_TX_IRTX/DMTIMER9_PWM_EVT/GPIO_144/SAFE_MODE
GPMC_AD14/KPD_COL2/C2C_DATA9/GPIO38
GPMC_AD15/KPD_COL3/C2C_DATA8/GPIO39
McSPI4_CLK/SDMMC4_CLK/GPIO_151/SAFE_MODE
McSPI4_SIMO/SDMMC4_CMD/GPIO_152/SAFE_MODE
GPMC_A16/KPD_ROW4/C2C_DATAIN0/GPIO40/VENC_656_DATA0
McSPI4_SOMI/SDMMC4_DAT0/GPIO_153/SAFE_MODE
GPMC_A17/KPD_ROW5/C2C_DATAIN1/GPIO_41/VENC_656_DATA1/SAFE_MODE
McSPI4_CS0/SDMMC4_DAT3/GPIO_154/SAFE_MODE
GPMC_A18/KPD_ROW6/C2C_DATAIN2/GPIO_42/VENC_656_DATA2/SAFE_MODE
UART4_RX/SDMMC4_DAT2/GPIO_155/SAFE_MODE
GPMC_A19/KPD_ROW7/C2C_DATAIN3/GPIO_43/VENC_656_DATA3/SAFE_MODE
UART4_TX/SDMMC4_DAT1/GPIO_156/SAFE_MODE
GPMC_A20/KPD_COL4/C2C_DATAIN4/GPIO_44/VENC_656_DATA4/SAFE_MODE
GPMC_A21/KPD_COL5/C2C_DATAIN5/GPIO_45/VENC_656_DATA5/SAFE_MODE
SIM_IO/GPIO_WK0/SAFE_MODE
GPMC_A22/KPD_COL6/C2C_DATAIN6/GPIO_46/VENC_656_DATA6/SAFE_MODE
SIM_CLK/GPIO_WK1/SAFE_MODE
GPMC_A23/KPD_COL7/C2C_DATAIN7/GPIO_47/VENC_656_DATA7/SAFE_MODE
SIM_RESET/GPIO_WK2/SAFE_MODE
GPMC_A24/C2C_CLKOUT0/GPIO_48/SAFE_MODE
SIM_CD/GPIO_WK3/SAFE_MODE
GPMC_A25/C2C_CLKOUT1/GPIO_49/SAFE_MODE
SIM_PWR_CTRL/GPIO_WK4/SAFE_MODE
USBC1_ICUSB_DP/GPIO_98/SAFE_MODE
GPMC_nCS0/GPIO_50/SYS_NDMAREQ0
USBC1_ICUSB_DM/GPIO_99/SAFE_MODE
GPMC_nCS1/C2C_DATAOUT6/GPIO_51/SAFE_MODE
GPMC_nCS2/C2C_DATAOUT7/GPIO_52/SAFE_MODE
HDMI_HPD/GPIO_63/SAFE_MODE
GPMC_nCS3/GPMC_DIR/C2C_DATAOUT4/GPIO_53/SAFE_MODE
HDMI_CEC/GPIO_64/SAFE_MODE
GPMC_nWP/DSI1_TE0/GPIO_54/SYS_NDMAREQ1
HDMI_DDC_SCL/GPIO_65/SAFE_MODE
GPMC_CLK/GPIO_55/SYS_nDMAREQ2
HDMI_DDC_SDA/GPIO_66/SAFE_MODE
GPMC_nADV_ALE//DSI1_TE1/GPIO_56/SYS_NDMAREQ3
HDMI_DATA0X
GPMC_nOE/SDMMC2_CLK
HDMI_DATA0Y
GPMC_nWE/SDMMC2_CMD
HDMI_DATA1X
GPMC_NBE0_CLE/DSI2_TE0/GPIO_59
HDMI_DATA1Y
GPMC_nBE1/C2C_DATAOUT5/GPIO_60/SAFE_MODE
HDMI_DATA2X
GPMC_WAIT0/DSI2_TE1/GPIO_61
HDMI_DATA2Y
GPMC_WAIT1/C2C_DATAOUT2/GPIO_62/SAFE_MODE
HDMI_CLOCKX
HDMI_CLOCKY

U500
OMAP4430

PRIMARY_5M_MIPI_CLK_P
PRIMARY_5M_MIPI_CLK_N
PRIMARY_5M_MIPI_DATA0_P
PRIMARY_5M_MIPI_DATA0_N
PRIMARY_5M_MIPI_DATA1_P
PRIMARY_5M_MIPI_DATA1_N
VT_0.3M_MIPI_CLK_P
VT_0.3M_MIPI_CLK_N
VT_0.3M_MIPI_DATA0_P
VT_0.3M_MIPI_DATA0_N

M26
M25
N26
N25
T27
U27
V27

SECONDARY_5M_MIPI_CLK_P
SECONDARY_5M_MIPI_CLK_N
SECONDARY_5M_MIPI_DATA0_P
SECONDARY_5M_MIPI_DATA0_N

R510
1.5K

AA27

I2C1_SCL
I2C1_SDA

AE28
AE26
C26
D26

I2C2_SCL
I2C2_SDA

W27
Y27

I2C4_SCL
I2C4_SDA
SRI2C_SCL
SRI2C_SDA

AG21
AH22
AG9
AF9

SYS_nIRQ2
SYS_nIRQ1
SYS_PWRREQ

AF6
AE6
AH7

Composite
Video

DSI1

AG5
AH6
AH5
AG8
AD1

SYSTEM
OMAP_CLK_IN
OMAP_CLK_REQ
DSI2_LCD_MIPI_CLK_P
DSI2_LCD_MIPI_CLK_N
DSI2_LCD_MIPI_D1_P
DSI2_LCD_MIPI_D1_N
DSI2_LCD_MIPI_D0_P
DSI2_LCD_MIPI_D0_N

470K

SDMMC2_DAT[0]
SDMMC2_DAT[1]
SDMMC2_DAT[2]
SDMMC2_DAT[3]
SDMMC2_DAT[4]
SDMMC2_DAT[5]
SDMMC2_DAT[6]
SDMMC2_DAT[7]

R512
DNI

AUD_PWRON

CSI2_2

VSEL_1.8V
SYS_nRESWARM
SYS_nRESPWRON
MOTION_INT
CLK32K_MAIN

DSI2

eMMC4.4

UART_SW1
UART_SW2
Rev.1.0
COMPASS_INT
Rev.D TOUCH_RESET
SECONDARY_5M_RESET_N
PROX_INT
GPS_UART_TXD
GPS_UART_RXD
GPS_UART_RTS_N
GPS_UART_CTS_N
Rev.E, 1.0
FUEL_INT/
VT_CAM_PWDN
VT_CAM_RESET/
PRIMARY_5M_RESET_N
VIBE_EN
Rev.B CP_CRASH_INT
LCD_EN
GYRO_INT
Rev.C 3D_LCD_BANK_SEL
FLASH_EN

Added(Rev.D)

470K

MICROSD_DET/
HDMI_LS_OE
MICROSD_COVER_DET/
3D_BOOST_EN

HDQ_SIO/I2C3_SCCB/I2C2_SCCB/GPIO_127/SAFE_MODE

USBB2_HSIC_STROBE/GPIO_170/SAFE_MODE
USBB2_HSIC_DATA/GPIO_169/SAFE_MODE
USBB2_ULPITLL_DAT7/USBB2_ULPIPHY_DAT7/SDMMC3_CLK/GPIO_168/McSPI3_CLK/DISPC2_DATA11/RSVD
USBB2_ULPITLL_DAT6/USBB2_ULPIPHY_DAT6/SDMMC3_CMD/GPIO_167/McSPI3_SIMO/DISPC2_DATA12/RSVD
USBB2_ULPITLL_DAT5/USBB2_ULPIPHY_DAT5/SDMMC3_DAT3/GPIO_166/McSPI3_CS0/DISPC2_DATA13/RSVD
USBB2_ULPITLL_DAT4/USBB2_ULPIPHY_DAT4/SDMMC3_DAT0/GPIO_165/McSPI3_SOMI/DISPC2_DATA14/RSVD
USBB2_ULPITLL_DAT3/USBB2_ULPIPHY_DAT3/SDMMC3_DAT1/GPIO_164/HSI2_CAREADY/DISPC2_DATA15/RSVD
USBB2_ULPITLL_DAT2/USBB2_ULPIPHY_DAT2/SDMMC3_DAT2/GPIO_163/HSI2_ACFLAG/DISPC2_DATA18/RSVD
USBB2_ULPITLL_DAT1/USBB2_ULPIPHY_DAT1/SDMMC4_DAT3/GPIO_162/HSI2_ACDATA/DISPC2_DATA19/RSVD
USBB2_ULPITLL_DAT0/USBB2_ULPIPHY_DAT0/SDMMC4_DAT2/GPIO_161/HSI2_ACWAKE/DISPC2_DATA20/RSVD
USBB2_ULPITLL_NXT/USBB2_ULPIPHY_NXT/SDMMC4_DAT1/GPIO_160/HSI2_ACREADY/DISPC2_DATA21/RSVD
USBB2_ULPITLL_DIR/USBB2_ULPIPHY_DIR/SDMMC4_DAT0/GPIO_159/HSI2_CAFLAG/DISPC2_DATA22/RSVD
USBB2_ULPITLL_STP/USBB2_ULPIPHY_STP/SDMMC4_CLK/GPIO_158/HSI2_CADATA/DISPC2_DATA23/RSVD
USBB2_ULPITLL_CLK/USBB2_ULPIPHY_CLK/SDMMC4_CMD/GPIO_157/HSI2_CAWAKE/SAFE_MODE

I2C1_SCL
I2C1_SDA
I2C2_SCL/UART1_RX/GPIO_128/SAFE_MODE
I2C2_SDA/UART1_TX/GPIO_129/SAFE_MODE
I2C3_SCL/GPIO_130/SAFE_MODE
I2C3_SDA/GPIO_131/SAFE_MODE
I2C4_SCL/GPIO_132/SAFE_MODE
I2C4_SDA/GPIO_133/SAFE_MODE
SR_SCL
SR_SDA

10K

AF7
AE7
AG6
AG7

M2
N2
P2
V1
V2
W1
W2
W3
W4
Y2
Y3
Y4
AA1
AA2
AA3
AA4
AB2
AB3
AB4
AC4
A27

AE13
AF13
AE9
AG10
AF10
AE10
AH11
AG11
AF11
AE11
AG13
AE12
AF12
AG12

GPIOs1.2V_VIO
WLAN_EN
WLAN_HOST_WAKEUP
BT_EN
USIF1_SW
RESET_PMU_N
FUEL_SDA
R515 2.7K
R514 2.7K

FREF_XTAL_VSSOSC
FREF_XTAL_IN/C2C_WAKEREQIN
FREF_XTAL_OUT
FREF_SLICER_IN/GPI_WK5/C2C_WAKEREQIN/SAFE_MODE
FREF_CLK_IOREQ

UNIPRO_RY2/KPD_ROW5/GPI_3/SAFE_MODE
UNIPRO_RX2/KPD_ROW4/GPI_2/SAFE_MODE
UNIPRO_RY1/KPD_ROW3/GPI_178/SAFE_MODE
UNIPRO_RX1/KPD_ROW2/GPI_177/SAFE_MODE
UNIPRO_RY0/KPD_ROW1/GPI_176/SAFE_MODE
UNIPRO_RX0/KPD_ROW0/GPI_175/SAFE_MODE

U500
OMAP4430

SYS_NRESWARM
SYS_NRESPWRON
SYS_PWRON_RESET_OUT/GPIO_WK29
SYS_32K

UNIPRO_TY2/KPD_COL5/GPIO_1/SAFE_MODE
UNIPRO_TX2/KPD_COL4/GPIO_0/SAFE_MODE
UNIPRO_TY1/KPD_COL3/GPIO_174/SAFE_MODE
UNIPRO_TX1/KPD_COL2/GPIO_173/SAFE_MODE
UNIPRO_TY0/KPD_COL1/GPIO_172/SAFE_MODE
UNIPRO_TX0/KPD_COL0/GPIO_171/SAFE_MODE

USB_DM_OMAP
USB_DP_OMAP

K27
L27
K25
K26
J25
J26

KEY_R[1]
KEY_R[0]

H27
J27
H25
H26
G25
G26

GPS_RESET_N
GPS_PWR_ON

DPM_EMU0/GPIO_11/ATTILA_HW_DBG0/SAFE_MODE
DPM_EMU1/GPIO_12/ATTILA_HW_DBG1/SAFE_MODE
DPM_EMU2/USBA0_ULPIPHY_CLK/GPIO_13/DISPC2_FID/ATTILA_HW_DBG2/RSVD
DPM_EMU3/USBA0_ULPIPHY_STP/GPIO_14/DISPC2_DATA10/ATTILA_HW_DBG3/RSVD
DPM_EMU4/USBA0_ULPIPHY_DIR/GPIO_15/DISPC2_DATA9/ATTILA_HW_DBG4/RSVD
DPM_EMU5/USBA0_ULPIPHY_NXT/GPIO_16/RFBI_TE_VSYNC0/DISPC2_DATA16/ATTILA_HW_DBG5/RSVD
SYS_BOOT0/GPIO_184/SAFE_MODE
DPM_EMU6/USBA0_ULPIPHY_DAT0/UART3_TX_IRTX/GPIO_17/RFBI_HSYNC0/DISPC2_DATA17/ATTILA_HW_DBG6/RSVD
SYS_BOOT1/GPIO_185/SAFE_MODE
DPM_EMU7/USBA0_ULPIPHY_DAT1/UART3_RX_IRRX/GPIO_18/RFBI_CS0/DISPC2_HSYNC/ATTILA_HW_DBG7/RSVD
SYS_BOOT2/GPIO_186/SAFE_MODE
DPM_EMU8/USBA0_ULPIPHY_DAT2/UART3_RTS_SD/GPIO_19/RFBI_RE/DISPC2_PCLK/ATTILA_HW_DBG8/RSVD
SYS_BOOT3/GPIO_187/SAFE_MODE
DPM_EMU9/USBA0_ULPIPHY_DAT3/UART3_CTS_RCTX/GPIO_20/RFBI_WE/DISPC2_VSYNC/ATTILA_HW_DBG9/RSVD
SYS_BOOT4/GPIO_188/SAFE_MODE
DPM_EMU10/USBA0_ULPIPHY_DAT4/GPIO_21/RFBI_A0/DISPC2_DE/ATTILA_HW_DBG10/RSVD
SYS_BOOT5/GPIO_189/SAFE_MODE
DPM_EMU11/USBA0_ULPIPHY_DAT5/GPIO_22/RFBI_DATA8/DISPC2_DATA8/ATTILA_HW_DBG11/RSVD
SYSBOOT6/DPM_EMU18/GPIO_WK9/C2C_WAKEREQOUT/SAFE_MODE
DPM_EMU12/USBA0_ULPIPHY_DAT6/GPIO_23/RFBI_DATA7/DISPC2_DATA7/ATTILA_HW_DBG12/RSVD
SYSBOOT7/DPM_EMU19/GPIO_WK10/SAFE_MODE
DPM_EMU13/USBA0_ULPIPHY_DAT7/GPIO_24/RFBI_DATA6/DISPC2_DATA6/ATTILA_HW_DBG13/RSVD
DPM_EMU14/SYS_DRM_MSECURE/UART1_RX/GPIO_25/RFBI_DATA5/DISPC2_DATA5/ATTILA_HW_DBG14/RSVD
DPM_EMU15/SYS_SECURE_INDICATOR/GPIO_26/RFBI_DATA4/DISPC2_DATA4/ATTILA_HW_DBG15/RSVD
C2C_DATA15/DSI2_TE1/C2C_DATAOUT1/GPIO_104/SAFE_MODE
DPM_EMU16/DMTIMER8_PWM_EVT/DSI1_TE0/GPIO_27/RFBI_DATA3/DISPC2_DATA3/ATTILA_HW_DBG16/RSVD
C2C_DATA11/USBC1_ICUSB_TXEN/C2C_DATAOUT3/GPIO_100/SYS_NDMAREQ0/SAFE_MODE
DPM_EMU17/DMTIMER9_PWM_EVT/DSI1_TE1/GPIO_28/RFBI_DATA2/DISPC2_DATA2/ATTILA_HW_DBG17/RSVD
C2C_DATA12/DSI1_TE0/C2C_CLKIN0/GPIO_101/SYS_NDMAREQ1/SAFE_MODE
DPM_EMU18/DMTIMER10_PWM_EVT/DSI2_TE0/GPIO_190/RFBI_DATA1/DISPC2_DATA1/ATTILA_HW_DBG18/RSVD
C2C_DATA13/DSI1_TE1/C2C_CLKIN1/GPIO_102/SYS_NDMAREQ2/SAFE_MODE
DPM_EMU19/DMTIMER11_PWM_EVT/DSI2_TE1/GPIO_191/RFBI_DATA0/DISPC2_DATA0/ATTILA_HW_DBG19/RSVD C2C_DATA14/DSI2_TE0/C2C_DATAOUT0/GPIO_103/SYS_NDMAREQ3/SAFE_MODE

51K

R593

FREF_CLK1_OUT/GPIO_181/SAFE_MODE
FREF_CLK2_OUT/GPIO_182/SAFE_MODE
FREF_CLK3_REQ/FREF_CLK1_REQ/SYS_DRM_MSECURE/GPIO_WK30/C2C_WAKEREQIN/SAFE_MODE
FREF_CLK4_REQ/FREF_CLK5_OUT/GPIO_WK7
FREF_CLK4_OUT/GPIO_WK8
FREF_CLK0_OUT/FREF_CLK1_REQ/SYS_DRM_MSECURE/GPIO_WK6/SAFE_MODE
FREF_CLK3_OUT/FREF_CLK2_REQ/SYS_SECURE_INDICATOR/GPIO_WK31/C2C_WAKEREQOUT/SAFE_MODE

51K

AA28
Y28
AD3
AC2
AC3
AD2
AD4

MUIC

Key Pad

VSEL_1.8V

Added (Rev.E)
5M_MCLK

LCD_RESET_N
Rev.B
MUIC_INT/
SYS_DRM_MSEC
VT_0.3M_MCLK

F26
E27
E26
E25
D28
D27
AF8
AE8

D24
D23
A24
B24
C24

USB

KEY_C[1]
KEY_C[0]
R592

JTAG_TDO
JTAG_nTRST
JTAG_TMS_TMSC/SAFE_MODE
JTAG_TDI
JTAG_TCK/SAFE_MODE
JTAG_RTCK

VSEL_1.8V
Added (Rev.1.1)
FUEL_SCL

B4

USBA0_OTG_DM/UART3_TX_IRTX/UART2_TX/GPIO_180/SAFE_MODE
B5
USBA0_OTG_DP/UART3_RX_IRRX/UART2_RX/GPIO_179/SAFE_MODE
C3
USBA0_OTG_CE

SYS_NIRQ2/GPIO_183/SAFE_MODE
SYS_NIRQ1/SAFE_MODE
SYS_PWR_REQ

R516

AE2
AH2
AH1
AE1
AG1
AE3

Removed
(Rev.1.0)

JTAG

SD/MMC2

DN I

Changed(Rev.1.0)

R511
1.5K

I2C3_SCL
I2C3_SDA

2.7K

C12
D12
C13
D13
C15
D15
A16
B16
C16
D16
VSEL_1.8V
C17
D17
C18
D18
C19
R522
D19 R521

B25
C21
D21
C22
C25
B22
D25
B11
B12
C23
D22
B26
B23

CSI2_1

I2C

Rev.E

T3
T4
U3
U4
V3
V4

B17
A18
B18
A19
B19
B20
A21
B21
C20
D20

VSEL_1.8V

Added(Rev.C)

FRONT_KEY_LED_EN
CHG_EN_SET/

P3
P4
N3
N4
M3
M4
L3
L4
K3
K4

SYS_BOOT6
SYS_BOOT7

WLAN

R26
R25
T26
T25
U26
U25
V26
V25
W26
W25

B7
C7 R513
D7

TI PMIC

SRI2C

SD/MMC5

3.3K

CSI21_DX0/GPI_67/SAFE_MODE
CSI21_DY0/GPI_68/SAFE_MODE
CSI21_DX1/GPI_69/SAFE_MODE
CSI21_DY1/GPI_70/SAFE_MODE
CSI21_DX2/GPI_71/SAFE_MODE
CSI21_DY2/GPI_72/SAFE_MODE
CSI21_DX3/GPI_73/SAFE_MODE
CSI21_DY3/GPI_74/SAFE_MODE
CSI21_DX4/GPI_75/SAFE_MODE
CSI21_DY4/GPI_76/SAFE_MODE

SYS_BOOT1
SYS_BOOT2
SYS_BOOT4

R598

ABE_McBSP1_CLKX/ABE_SLIMBUS1_CLOCK/GPIO_114/SAFE_MODE
ABE_McBSP1_DR/ABE_SLIMBUS1_DATA/GPIO_115/SAFE_MODE
ABE_McBSP1_DX/SDMMC3_DAT2/ABE_MCASP_ACLKX/GPIO_116/SAFE_MODE
ABE_McBSP1_FSX/SDMMC3_DAT3/ABE_MCASP_AMUTEIN/GPIO_117/SAFE_MODE

2st 5M CAM, Gyro sensor, PROXI/ALC sensor

R597

AC26
AC25
AB25
AC27

I2C4

3.3K

R501 10

WLAN_CLK
WLAN_CMD
WLAN_SDIO[0]
WLAN_SDIO[1]
WLAN_SDIO[2]
WLAN_SDIO[3]

3.3K

BT PCM

AE5
AF5
AE4
AF4
AG3
AF3

3.3K

BT_PCM_CLK
BT_PCM_DIN
BT_PCM_DOUT
BT_PCM_SYNC

McBSP1

SDMMC5_CLK/MCSPI2_CLK/USBC1_ICUSB_DP/GPIO_145/SAFE_MODE
SDMMC5_CMD/MCSPI2_SIMO/USBC1_ICUSB_DM/GPIO_146/SAFE_MODE
SDMMC5_DAT0/MCSPI2_SOMI/USBC1_ICUSB_RCV/GPIO_147/SAFE_MODE
SDMMC5_DAT1/USBC1_ICUSB_TXEN/GPIO_148/SAFE_MODE
SDMMC5_DAT2/MCSPI2_CS1/GPIO_149/SAFE_MODE
SDMMC5_DAT3/MCSPI2_CS0/GPIO_150/SAFE_MODE

R591

IPC_PCM

ABE_McBSP2_CLKX/McSPI2_CLK/ABE_MCASP_AHCLKX/GPIO_110/USBB2_MM_RXDM/SAFE_MODE
ABE_McBSP2_DR/McSPI2_SOMI/ABE_MCASP_AXR/GPIO_111/USBB2_MM_RXDP/SAFE_MODE
ABE_McBSP2_DX/McSPI2_SIMO/ABE_MCASP_AMUTE/GPIO_112/USBB2_MM_RXRCV/SAFE_MODE
ABE_McBSP2_FSX/McSPI2_CS0/ABE_MCASP_AFSX/GPIO_113/USBB2_MM_TXEN/SAFE_MODE

1st 5M CAM, VT CAM, CAM PMU, MUIC

R596

AD27
AD26
AD25
AC28

IPC_I2S_CLK
IPC_I2S_DOUT
IPC_I2S_DIN
IPC_I2S_SYNC

McBSP2

TOUCH, LCD backlight booster, Flash LED driver, Compass sensor

I2C3
R500
10

R594

I2C2

SYS_BOOT1
SYS_BOOT2
SYS_BOOT4

SYSTEM
BOTTING

SYS_BOOT6
SYS_BOOT7

TP511

PROXI_LDO_EN

For Touch S/W control

ATESTV

Added (P925 Rev.A)
Removed (Rev.E)

CHG_STATUS/
TOUCH_INT_N
IFX_USB_VBUS_EN
SDMMC2_CLK
SDMMC2_CMD
HDMI_CT_CP_HPD

Reference Clock
JATG & UART INTERFACE
Removed (Rev.1.0)

VBAT
VCLKB_TCXO_VCC

ARRAY TP
VBAT

E2
C500

I2C1_SCL
I2C1_SDA

1u

VCHG
UAT500

ESD9B5_0ST5G

ESD9B5_0ST5G

ESD9B5_0ST5G

ZD593

ZD592

ZD591

PWR_ON_SW

E3
B2

SYS_nRESWARM
2.5G

UART_RX_IFX
UART_TX_IFX

E4

1
2
3
4
5
6
7
8
9
10
11
12

GND
RX
TX
NC1
ON_SW
VBAT
NC2
NC3
NC4

3G
GND
RX
TX
VCHAR
ON_SW
VBAT
PWR
URXD
UTXD

VCLKB_TCXO_VCC

4
1
C505
0.1u

A3

OMAP_CLK_REQ
WL_CLK_REQ

OUT

GND1

C3
C1

X500
VCC

A1

GND2

3

C504

0.1u

B1
D4

2

VBAT

VLDO

SCLH

VDD_ANA

SDAH
RESET
REQ1
REQ2

VDD_DIG

U502
CDC3S04

CLK1
CLK2
CLK3
CLK4

REQ3
REQ4

MCLK_REQ

MCLK_IN

GND_ANA

ADR_A0

GND_DIG

VPMIC_VDAC
VSEL_1.8V

E1
B3
D1
A4

C509

68p

A2

C508

68p

C4

C507

68p

C2

OMAP_CLK_IN
WL_CLK_IN
AUD_CLK_IN

C501

C502

C503

2.2u

1u

1u

D3
B4
D2

1XXB38400FAA
38.4MHz

DSR
RTS
CTS

UART_TP

LGE Internal Use Only

- 154 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

6. CIRCUIT DIAGRAM

OMAP POWER

C687

C688

4.7u

C619

1u

C620

1u

1u

0.47u

IN

OUT

GND

VCORE2_OMAP_IVAUD

Changed (Rev.E)

C626

C627

0.1u

Added (Rev.1.0)

V9
U9
V8
W8
W9
Y8
Y9
Y10
AA10

FL621
NFM18PS105R0J3D_

C621

1u

V21
W20
W21
Y18
Y19
Y20
Y21
AA17
AA19
AA18

FL627
NFM18PS105R0J3D_
IN

OUT

GND

Changed (Rev.E)

VSEL_1.8V

C640

C641

C642

0.1u

0.1u

H22
J22
U7
V7
AB7
W22
K7

0.1u

VPMIC_VCXIO

Y7
L1
L2

C685
220n

C686

C647

220n

220n

C649

W28
V28

VPMIC_VDAC

220n

Added (P925 Rev.A)

A11
G12

Added (P925 Rev.A)
C684

C652

C653

C658

0.1u

0.1u

0.1u

G13
C650

0.1u

P9
Y16

0.47u
C657 220n

T22
P7
N22
AB14

VSEL_1.8V
VSEL_1.29V
VSEL_1.8V
VSEL_1.8V

C663

220n

C667

220n

M28

VSEL_1.8V

C668

0.1u

A7
A5

VPMIC_VCXIO
VPMIC_VUSB
C669
220n

VSEL_1.8V

A13
C27
AH14
N1
P1
R28
C1
AG2
AG27

C670
220n

C673

C674

C675

C681

0.1u

0.1u

0.1u

0.47u

VSEL_VMEM

C677

C678

C679

C680

0.1u

0.1u

0.1u

A15
B15
AG14
N28
T1
T2
A3
C28
AF27
AH3

0.47u

VSEL_1.29V

C682

C683

0.1u

0.1u

Y14
R27
G15
T8
1%
R631
240 AH16
R632
240 AF28
A26
B2

VDDCA_LPDDR2_0
VDDCA_LPDDR2_1
VDDCA_LPDDR2_2
VDDCA_LPDDR2_3
VDDCA_LPDDR2_4
VDDCA_LPDDR2_5
VDDCA_LPDDR2_6
VDDCA_LPDDR2_7
VDDCA_LPDDR2_8
VDDCA_LPDDR2_9

VDD_IVA_AUDIO_0
VDD_IVA_AUDIO_1
VDD_IVA_AUDIO_2
VDD_IVA_AUDIO_3
VDD_IVA_AUDIO_4
VDD_IVA_AUDIO_5
VDD_IVA_AUDIO_6
VDD_IVA_AUDIO_7
VDD_IVA_AUDIO_8
VDD_IVA_AUDIO_9

VDDS_DV_BANK0
VDDS_DV_BANK1
VDDS_DV_BANK2_0
VDDS_DV_BANK2_1
VDDS_DV_BANK3
VDDS_DV_BANK4
VDDS_DV_BANK5
VDDS_DV_BANK6

U500

VDDS_1P8_0
VDDS_1P8_1
VDDS_1P8_2
VDDS_1P8_3
VDDS_1P8_4
VDDS_1P8_5
VDDS_1P8_6

47 K

47K

47 K

47K

47K

47K

47 K

47 K

47 K

R735

R736

R737

R738

R739

10

R722

10

R723

10

R724

10

R725

10

R726

10

R727

10

R728

10

H3
H4
H5
J2
J3
J4
J5
J6

SDMMC2_CLK

R729

10

W6

SDMMC2_CMD

R730

10

W5
C739

1u

C740

VSEL_1.29V

FB741

M6
N5
T10
U9
M7
P5
R10
U8
K4
Y2
Y5
AA4
AA6
K6
W4
Y4
AA3
AA5

600

C742

2.2u

0.1u

C744

2.2u

Voltage Level Check!!!

C618

0.47u

C741

C743

C617

0.1u

0.1u

VSEL_1.8V
FB743 600

VSEL_1.8V

C635

C636

C637

C639

0.1u

220n

0.1u

VDDS_DV_GPMC
VDDS_DV_FREF

0.1u

A4
A6
A9
A11
B2
B13
D1
D14
H1
H2
H6
H7
H8
H9
H10
H11
H12
H13
H14
J1
J7
J8
J9
J10
J11
J12
J13
J14
K1
K3

Added (Rev.E)

VDDS_SDMMC1_0
VDDS_SDMMC1_1

G20
C644

0.1u

C646

0.1u

C648

0.1u

C651

0.1u

W7

VSEL_1.8V

H7
G7

VPMIC_VMMC

G16

VDDA_DSI1
VDDA_DSI2

VDDS_DV_SDMMC2_0
H16
VDDS_DV_SDMMC2_1

VDDA_CSI21
VDDA_CSI22

VDDS_1P2
VDDS_DV_CAM

VDDA_HDMI_VDAC_0
VDDA_HDMI_VDAC_1

VDDS_SIM

AA16

VSEL_1.29V

V22
J7

VSEL_1.8V

G22

VDDA_DPLL_CORE_AUDIO

VSEL_VCORE3

VDDA_DLL0_LPDDR21
G9
VDDA_DLL1_LPDDR21
M7
VDDA_DLL0_LPDDR22
AB10
VDDA_DLL1_LPDDR22

VDDA_DPLL_MPU
VDDA_DPLL_IVA_PER
VDDA_LDO_SRAM_CORE
VDDA_LDO_EMU_WKUP
VDDA_LDO_SRAM_IVA_AUDIO
VDDA_LDO_SRAM_MPU

CAP_VBB_LDO_IVA_AUDIO
CAP_VDD_LDO_SRAM_IVA_AUDIO
CAP_VBB_LDO_MPU
CAP_VDD_LDO_SRAM_MPU
CAP_VDD_LDO_SRAM_CORE
CAP_VDD_LDO_EMU_WKUP

VDDA_UNI
VDDA_USBA0OTG_1P8V
VDDA_USBA0OTG_3P3V

PBIAS_SDMMC1
PBIAS_SIM

POP_VDD1_LPDDR21_A15
POP_VDD1_LPDDR21_C28
POP_VDD1_LPDDR21_AJ15
POP_VDD1_LPDDR22_N2
POP_VDD1_LPDDR22_R1
POP_VDD1_LPDDR22_P29
POP_VDD1_LPDDR2_SHARED_C1
POP_VDD1_LPDDR2_SHARED_AH2
POP_VDD1_LPDDR2_SHARED_AH28

VDDA_BDGP_VBB

A1
A2
AB12

C654
C659

1u

C660

C645

0.1u

0.1u

1u

C665

C656

0.1u

1u

C662

C655

0.1u

1u

C661

1u

AG28

RSVD1
RSVD2
RSVD3
RSVD4
RSVD5
RSVD6
RSVD7
RSVD8
RSVD9
LPDDR21_NCS0
NC1
NC2
NC3
NC4
NC5
NC6
NC7
NC8
NC9

NC74
NC75
NC76
NC77
NC78
NC79
NC144
NC81
NC82
NC83
NC84
NC85
NC86
RESET
NC153
NC150
NC148
NC91
NC92
NC93
NC94
NC95
NC96
NC97
NC98
NC99
NC100
NC101
NC102
NC103
NC104
NC105
NC106
NC107
NC108
NC109
NC110
NC111
NC112
NC113
NC114
NC115
NC116
NC117
NC118
NC119
NC120
NC121
NC122
NC123
NC142
NC125
NC126
NC127
NC128
NC129
NC130
NC131
NC132
NC133
NC134
NC135
NC136
NC137
NC138
NC139

DAT0
DAT1
DAT2
DAT3
DAT4
DAT5
DAT6
DAT7
CLK
CMD
VDDI
VCC1
VCC2
VCC3
VCC4
VSS1
VSS2
VSS3
VSS4
VSSQ1
VSSQ2
VSSQ3
VSSQ4
VSSQ5
VCCQ1
VCCQ2
VCCQ3
VCCQ4
VCCQ5

U721
SDIN5C2-8G-974D

NC1
NC2
NC3
NC4
NC5
NC6
NC7
NC8
NC9
NC10
NC146
NC147
NC13
NC14
NC15
NC16
NC17
NC18
NC19
NC20
NC21
NC22
NC23
NC24
NC25
NC26
NC27
NC28
NC29
NC30

R12
R13
R14
T1
T2
T3
T5
T12
T13
T14
U1
U2
U3
U5
U6
U7
U10
U12
U13
U14
V1
V2
V3
V12
V13
V14
W1
W2
W3
W7
W8
W9
W10
W11
W12
W13
W14
Y1
Y3
Y6
Y7
Y8
Y9
Y10
Y11
Y12
Y13
Y14
AA1
AA2
AA7
AA8
AA9
AA10
AA11
AA12
AA13
AA14
AE1
AE14
AG2
AG13
AH4
AH6
AH9
AH11

SYS_nRESWARM

VPMIC_OMAP_VPP_CUST

PoP LPDDR2

J8

VSENSE
AH27
IFORCE

NC140

VSEL_1.8V

VPP_CUST
Y22
VPP_STD

POP_VDD2_LPDDR21_A16
POP_VDD2_LPDDR21_B16
POP_VDD2_LPDDR21_AH15
POP_VDD2_LPDDR22_P28
POP_VDD2_LPDDR22_T1
POP_VDD2_LPDDR22_T2
POP_VDD2_LPDDR2_SHARED_A3
POP_VDD2_LPDDR2_SHARED_C29
POP_VDD2_LPDDR2_SHARED_AG28
POP_VDD2_LPDDR2_SHARED_AH3
VDDCA_VREF_LPDDR21
VDDCA_VREF_LPDDR22
VDDQ_VREF_LPDDR21
VDDQ_VREF_LPDDR22
POP_LPDDR21_ZQ_AJ17
POP_LPDDR22_ZQ_AG29

R21
N21
AB13
AB11
U22
T7

K2

0.1u

VPMIC_VAUX1

C671
0.1u

4Gb

C4
C5
C6
D3
D4
D5
D6
L22
N7

U701
1

Fiducial1

AH28
A28
B1
B28
T21
K21
K22
M27
N27
H15

Screw

Shield Can Clip (Top) Shield Can
SC791
1

SC793
1

SC795
1

LGE Internal Use Only

L4

R721

SDMMC2_DAT[0]
SDMMC2_DAT[1]
SDMMC2_DAT[2]
SDMMC2_DAT[3]
SDMMC2_DAT[4]
SDMMC2_DAT[5]
SDMMC2_DAT[6]
SDMMC2_DAT[7]

T28
AA22
AA21
AB22
AB28
AD28
AH18
AH20
AH25
AB21
AB16
AB20
AB8
AB19
AB18
AA7
AB17
AA14

R734

Changed (P925 Rev.A)

G17

VDDS_1P8_FREF

POP_VACC_LPDDR2_B28
POP_VACC_LPDDR2_B2

1u

VDDS_DV_C2C_0
G18
VDDS_DV_C2C_1
G19
VDDS_DV_C2C_2

OMAP4430

R15
R16
R17
T12
T13
T14
T15
T16
T17
U2
U8
U12
U13
U14
U15
U16
U17
U21
U28
Y25
Y26
AA11
AA12
AA20
K8
AB1
AE27
AF2
AG4
AG17
AG26
AH8
AH10
AH13
AH21

1%

VDD_MPU_0
VDD_MPU_1
VDD_MPU_2
VDD_MPU_3
VDD_MPU_4
VDD_MPU_5
VDD_MPU_6
VDD_MPU_7
VDD_MPU_8

eMMC 8GB

VSEL_1.8V

C605

0.1u

NC149
NC32
NC33
NC34
NC35
NC36
NC37
NC38
NC39
NC40
NC41
NC42
NC43
NC44
NC45
NC46
NC47
NC48
NC151
NC152
NC154
NC145
NC53
NC54
NC55
NC56
NC57
NC58
NC141
NC60
NC61
NC62
NC63
NC64
NC155
NC143
NC67
NC68
NC69
NC70
NC71
NC72
NC156

Added (P925 Rev.A)

C603

0.1u

K5
K7
K8
K9
K10
K11
K12
K13
K14
L1
L2
L3
L12
L13
L14
M1
M2
M3
M5
M8
M9
M10
M12
M13
M14
N1
N2
N3
N10
N12
N13
N14
P1
P2
P3
P10
P12
P13
P14
R1
R2
R3
R5

VCORE1_OMAP_MPU

C602

0.1u

R733

0.1u

C601

0.1u

R732

0.1u

C600

R731

0.1u

VSSA_CSI2

0.1u

VSSA_DSI_0
VSSA_DSI_1

0.1u

A4
A6
A9
A12
A17
A22
A25
D1
E28
G1
G8
G21
H8
H9
H20
H21
J28
M8
L7
L28
L8
U1
Y1
AA8
AA9
AB9
AC1
AF1
AH4
AH9
AH12

R22

0.1u

VDD_CORE_0
VDD_CORE_1
VDD_CORE_2
VDD_CORE_3
VDD_CORE_4
VDD_CORE_5
VDD_CORE_6
VDD_CORE_7
VDD_CORE_8
VDD_CORE_9
VDD_CORE_10
VDD_CORE_11
VDD_CORE_12
VDD_CORE_13
VDD_CORE_14
VDD_CORE_15
VDD_CORE_16
VDD_CORE_17
VDD_CORE_18
VDD_CORE_19
VDD_CORE_20
VDD_CORE_21
VDD_CORE_22
VDD_CORE_23
VDD_CORE_24
VDD_CORE_25
VDD_CORE_26
VDD_CORE_27
VDD_CORE_28

VSSA_HDMI_VDAC

1u

H12
H18
J9
J10
J11
J12
J13
J15
J16
J17
J18
J19
J20
K9
K20
L9
L20
M9
M20
N20
R20
T20
U20
Y11
Y12
Y13
AA13
T9
V20

VSSA_UNI

C614

VDDQ_LPDDR2_0
VDDQ_LPDDR2_1
VDDQ_LPDDR2_2
VDDQ_LPDDR2_3
VDDQ_LPDDR2_4
VDDQ_LPDDR2_5
VDDQ_LPDDR2_6
VDDQ_LPDDR2_7
VDDQ_LPDDR2_8
VDDQ_LPDDR2_9
VDDQ_LPDDR2_10
VDDQ_LPDDR2_11
VDDQ_LPDDR2_12
VDDQ_LPDDR2_13
VDDQ_LPDDR2_14
VDDQ_LPDDR2_15
VDDQ_LPDDR2_16
VDDQ_LPDDR2_17
VDDQ_LPDDR2_18
VDDQ_LPDDR2_19
VDDQ_LPDDR2_20
VDDQ_LPDDR2_21
VDDQ_LPDDR2_22
VDDQ_LPDDR2_23
VDDQ_LPDDR2_24
VDDQ_LPDDR2_25
VDDQ_LPDDR2_26
VDDQ_LPDDR2_27
VDDQ_LPDDR2_28
VDDQ_LPDDR2_29
VDDQ_LPDDR2_30

P8
N8

C613

G11

C612

VSSA_USBA0OTG
VSSA_USBA0OTG_3P3V

C611

H10
G10

C610

M22

C609

VSS_48
VSS_49
VSS_50
VSS_51
VSS_52
VSS_53
VSS_54
VSS_55
VSS_56
VSS_57
VSS_58
VSS_59
VSS_60
VSS_61
VSS_62
VSS_63
VSS_64
VSS_65
VSS_66
VSS_67
VSS_68
VSS_69
VSS_70
VSS_71
VSS_72
VSS_73
VSS_74
VSS_75
VSS_76
VSS_77
VSS_78
VSS_79
VSS_80
VSS_81
VSS_82

C607

VSS_0
VSS_1
VSS_2
VSS_3
VSS_4
VSS_5
VSS_6
VSS_7
VSS_8
VSS_9
VSS_10
VSS_11
VSS_12
VSS_13
VSS_14
VSS_15
VSS_16
VSS_17
VSS_18
VSS_19
VSS_20
VSS_21
VSS_22
VSS_23
VSS_24
VSS_25
VSS_26
VSS_27
VSS_28
VSS_29
VSS_30
VSS_31
VSS_32
VSS_33
VSS_34
VSS_35
VSS_36
VSS_37
VSS_38
VSS_39
VSS_40
VSS_41
VSS_42
VSS_43
VSS_44
VSS_45
VSS_46
VSS_47

A10
A20
A23
B3
B6
B13
B27
C2
F2
F25
H1
H11
H17
H19
H28
J3
J4
J21
K2
K28
N9
L21
L25
L26
M1
Y17
M13
M14
M15
M16
M17
M21
H13
N12
N13
N14
N15
N16
N17
P12
P13
P14
P15
P16
P17
R12
R13
R14

VSEL_1.29V
VSEL_VCORE3

- 155 -

SC792

Top

OJ701

OJ702

OJ703

OJ704

Bottom

1

SC794
1

SC797
1

SC798
1

SC799
1

SC796
1

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

6. CIRCUIT DIAGRAM

PCB VERSION CHECK

VPMIC_VRTC

SMPL DETECTION

0.113V
0.429V

B

1.8V
1.8V

0.720V

150K

130K

1.8V

Rev.B

0.561V

100K

D

R2
1%

68K

150K

0.836V

E

150K

180K

1.8V

0.982V

Rev.1.0

150K

240K

1.8V

1.108V

Rev.1.1

150K

330K

1.8V

# VBAT LINE WIDTH (STAR Connection)
GSM PA : 2mm - & gt; WCDMA PA 1mm
TWL6030 : 1.5mm

BOOT3
BOOT2
BOOT1
BOOT0

1.238V

10K

R809
330k

150K

C

PCB_VER_ADC

Changed ( Rev 1.0)

Added (P925 Rev.B)
VSEL_1.8V

Q801
NTUD3169CZ
4

R801
10K

5
6

S2

D2

G2

G1

PMB9801 : 1mm
CHARGER : 1mm

VBAT

VBAT

Deleted (Rev.B)

VBAT

VSEL_1.8V

CN800

3

C800

C801

C802

C803

C804

C805

100p
(0603)

10n
(0603)

10p
(0603)

6p
(0603)

3p
(0603)

100u

ZD803

D1
2
D2

2

BATT_THM_ADC

CELL

VDD
ALRT

D1

S1

Changed
(P925 Rev.A, Rev.E)

6

EAG62832401

1

QSTRT

4

C892
1u

SDA

GND

SCL

VBAT

K16
K15
G16
J16
J15
H16
H15
T10
R10
R13
T11
R11
T12
R12

C838

C839

C840

C834

C835

C836

2.2u

2.2u

2.2u

2.2u

2.2u

2.2u

2.2u

2

VIN
GND1

4

VBAT

FB801

C810
1u

120

C811
1u

IEOC

(1%)

560
(1%)

10u

PGB
CHGSB

LDO

5

C813

BATT

ISET

3

GND2

DNI
DNI

FUEL_SDA
FUEL_SCL
I2C1_SDA
I2C1_SCL

EN_SET

10
9
8

CHG_STATUS/

7
6

CHG_EN_SET/
C809

C814

L801 0.47u

4.7u

560 ohm- & gt; (910mA) 2K(10%)- & gt; 91mA
780 ohm- & gt; (680mA)
820 ohm- & gt; (646mA)

VBAT
C815

10u
FB802

FB803

220

FB804

GND pad on the bottom of chip has to be connected to main GND trace
through many vias for heat emission.

120

120

VSEL_VCORE3
C817

L802 0.47u

4.7u

VBAT
C818

10u

C819

VSEL_1.8V
L803
C821

4.7u

10u

MICRO USB CONN. + MUIC

0.68u

VBAT

VSEL_2.1V

C825

VCHG
C824

L804 0.47u

VBAT

10u
FB805

10u

GND1 GND2

C822

C823

0.1u

PSD12-LF

VBAT

1mm
Changed (P925 Rev.A)

1u
D5

8
VBUS1
D- 2

USB_DM
USB_DP
USB_ID

D+3
ID 4

VBAT

90ohm matching !!

C5
B5
B4

GND5
FB806

120

9
10

VSEL_VMEM
L806 0.47u
C831

OUT

ZD801

6

L805 0.47u
C828

IN

CN801

120

7

VSEL_1.29V

FL800
NFM18PC104R1C3

Changed (Rev.C)

4.7u

11

ZD802

R848

2.2K B1

ESD9B5_0ST5G
D1

GU077-5P-SD-E1500

Added (Rev.B)

C827

C4

1u

10u

C3

Changed (Rev.E,1.1)

0.05mm

BAT

COMN1

DN1

COMP2
UID

DP2

U811

U1

MAX14526EEWP+TCC6

U2

RES

MIC
CAP

AUD1
AUD2

GND
IC

ISET

D2

100n

A4
A5

USB_DM_OMAP
USB_DP_OMAP

90ohm matching !!

B3

UART_RX
UART_TX

A3
A1

VSEL_1.8V

D4
D3
A2

R850
56K

R853
1.5K

R854
1.5K

Added (P925 Rev.A)

MUIC_INT/

C890
2.2u

DP3T SWITCH

BAT800
311HR-VG1

U851
FSUSB63

VPMIC_VMMC
VPMIC_VDAC
VPMIC_VCXIO

UART_TX

1

HSD1+
D+

HSD2+

C841

C842

TWL_LDO_1.8V

HSD3+

1u

2.2u

TWL_LDO_2.8V

HSD1-

VBAT

VPMIC_VAUX1

UART_RX

2
12

TWL_LDO_3.0V

3

C844

C845

C848

C849

C850

C851

C852

C853

C854

C855

1u

2.2u

1u

1u

1u

2.2u

1u

2.2u

1u

1u

4

C820

VB

I2C3_SCL
I2C3_SDA

Added (Rev.E)

VPMIC_OMAP_VPP_CUST

2

Removed Res.
(Rev.C)

VCORE2_OMAP_IVAUD

VPMIC_VRTC

VSEL_2.1V
VSEL_1.8V

TP809

1u

SCL

C16
C15
F16
D16
D15
E16
E15

1

4.7u

0.68u

VPMIC_VUSB
C837

0

R821
10K
(0603)

11

SDA

T13
T14
R14
L15
N16
P16
P15
M16
L16
M15

C808

VCORE1_OMAP_MPU
L800

PGND

INT

K1
K2
G1
J1
J2
H1
H2

U801
RT9524

C2

T7
R7
R4
T6
R6
T5
R5

1mm

B2

VRTC
D7

K4

VPP

VMMC
J13

VDAC

VCXIO

G15

F15

VAUX2

VAUX1

VAUX3
R9

T9

T8

2.2u

N9
G13
B9
L4

Changed (Rev.E)

C832

VRTC_IN
VANA_IN
VPP_IN

C833
10p

OSC32KOUT
OSC32KCAP

D11
D10
J4

C830
10p

OSC32KIN

VDD_B1
VDD_B2
VDD_B3
VDD_B4

1

2

A8
E8

VMEM_IN_B1
VMEM_IN_B2
VMEM_FDBK
VMEM_SW_B1
VMEM_SW_B2
VMEM_GND_B1
VMEM_GND_B2

CLK32KG

VANA

A10

X800
FC-135
32.768KHz

CLK32KAO

VUSIM

J10

CLK32KAUDIO

B8

CLK32K_GATE

V1V29_IN_B1
V1V29_IN_B2
V1V29_FDBK
V1V29_SW_B1
V1V29_SW_B2
V1V29_GND_B1
V1V29_GND_B2

B10

E9
H10

CHRG_PMID_B1
CHRG_PMID_B2
CHRG_PMID_B3
CHRG_PMID_B4
CHRG_VREF

CHRG_PGND_B1
CHRG_PGND_B2
CHRG_PGND_B3
CHRG_PGND_B4

CLK32K_AUD
CLK32K_MAIN

V2V1_IN_B1
V2V1_IN_B2
V2V1_FDBK
V2V1_SW_B1
V2V1_SW_B2
V2V1_GND_B1
V2V1_GND_B2

CHRG_CSOUT
CHRG_AUXPWR

A5
A6
B6
B5

E1
F1
E2
F2
F5

CHRG_BOOT
CHRG_CSIN

GND_DIG_VIO
GND_DIG_VRTC

D4
E6

V1V8_IN_B1
V1V8_IN_B2
V1V8_IN_B3
V1V8_FDBK
V1V8_SW_B1
V1V8_SW_B2
V1V8_SW_B3
V1V8_GND_B1
V1V8_GND_B2
V1V8_GND_B3

CHRG_SW_B1
CHRG_SW_B2
CHRG_SW_B3
CHRG_SW_B4

M8
G4

G2
E4

VCORE3_IN_B1
VCORE3_IN_B2
VCORE3_FDBK
VCORE3_SW_B1
VCORE3_SW_B2
VCORE3_GND_B1
VCORE3_GND_B2

U800
TWL6030

GND_ANA_B1
GND_ANA_B2
GND_ANA_B3
GND_ANA_B4
GND_ANA_B5
GND_ANA_B6
GND_ANA_B7

A3
A4
B4
B3

CHRG_EXTCHRG_ENZ
VAC
CHRG_DET_N
CHRG_EXTCHRG_STATZ
CHRG_LED_TEST
CHRG_LED_IN

N8
M10
E11
L13
D9
H4
G7

J7
F4
E5
H7
D5
D6

ID
VBUS_B1
VBUS_B2
VBUS_B3
VBUS_B4

VAUX1_IN
VAUX2_IN
VAUX3_IN
VMMC_IN1
VMMC_IN2
VUSIM_IN1
VUSIM_IN2
VCXIO_IN
VDAC_IN
VIO
VBAT

4.7u

R895

VSEL_1.8V

VBAT

1mm

C1

VCORE2_IN_B1
VCORE2_IN_B2
VCORE2_FDBK
VCORE2_SW_B1
VCORE2_SW_B2
VCORE2_GND_B1
VCORE2_GND_B2

REFGND_B1
REFGND_B2

VCHG

R827

IREF

VCHG

USB_VBUS

R828
2Kohms

VBG

N7
N10
R8
J12
K13
D8
B7
F13
H13
M9
B13

C816

7

Changed (Rev.E, 1.1)

220

C 826

PBKG_B51
PBKG_B53

FB800

4.7u

VPROG

T4
T3
R3
L2
N1
P1
P2
M1
L1
M2

0.15mm

C829

K12

D12
B11
B14
A13
B12
A14
B15
A11
A12

GPADC_IN0
GPADC_IN1
GPADC_IN2
GPADC_IN3
GPADC_IN4
GPADC_IN5
GPADC_IN6
GPADC_VREF1
GPADC_VREF4

GPADC_START

D13

GGAUGE_RESN
E13
GGAUGE_RESP

PREQ3
PREQ2C
PREQ2B
PREQ2A
PREQ1

N6
M7
K8
K9
J9

N5
M5
K7
J5
L5
K5
M11
M12
N15
M6
H9
G9
G8
H8
L12

NRESPWRON
NRESWARM
REGEN1
REGEN2
PWRON
RPWRON
PWM1
PWM2
PWMFORCE
SYSEN
BOOT3
BOOT2
BOOT1
BOOT0
BATREMOVAL

N13

K10

INT

SRI2C_SDA
M13
SRI2C_SCL

N4

CTLI2C_SDA
M4
CTLI2C_SCL

VCORE1_IN_B1
VCORE1_IN_B2
VCORE1_IN_B3
VCORE1_FDBK
VCORE1_SW_B1
VCORE1_SW_B2
VCORE1_SW_B3
VCORE1_GND_B1
VCORE1_GND_B2
VCORE1_GND_B3

USB_VBUS
E12
C1
D1
C2
D2

USB_VBUS
VBAT

4.7u

A9
F12

CHARGER IC

Rev.B

VBACKUP

H12

C858

0

Removed HOOK_ADC (Rev.C)

VUSB

G12

1M

BATT_THM_ADC
PCB_VER_ADC

E10

R830

R894

R896

CTG

8

Added (Rev.1.1)

A7

C812 0.1u

FUEL_INT/

10n

1u

SYS_PWRREQ

Removed BAT_REMOVAL (Rev.C)

BOOT3
BOOT2
BOOT1
BOOT0

PWR_ON_SW

SYS_nIRQ1

SYS_nRESWARM
SENSOR_LDO_EN

SRI2C_SDA
SRI2C_SCL

SYS_DRM_MSEC

I2C1_SDA
I2C1_SCL

MICROSD_DET/

D NI
R818

A16
B16

SIM
M MC
TESTEN
TESTV
MSECURE

N12
N11
J8
A15
N2

B1
A2
A1
R16
T15
T16
H5
R1
T2
T1

PBKG_B43
PBKG_B42
PBKG_B41
PBKG_B33
PBKG_B32
PBKG_B31
PBKG_B2
PBKG_B13
PBKG_B12
PBKG_B11

Rev.C

5

C891
C807
0.47u

VSEL_1.8V

G10

3

R897

SYS_nRESPWRON

1

VA800

R893
150

U891 MAX17043G

Sensing node

1

PSD05-LF

Rev.B

Changed (P925 Rev.A)

R892
100K

R891
150

R811
80.6K
(1%)

3

R802
10K

2

Close to batt. connector

PGND

1.8V

FUEL GAUGE

9

1.8V

47K

10K

10K

150K

10 K

150K

A

BATTERY CONNECTOR

(Sudden Momentary Power Loss)

R800

ADC

10K

VDD

EVB

R1
1%

R2

R808

R804
150K

R1

R803

REV

R805

# PCB Revision Check ADC

ICVL0505101V150FR

VSEL_1.8V

HSD2D-

HSD3-

VCC

SEL1

GND

SEL0

6
8
10
5
7
9
11
4

UART4_TX_OMAP
UART_TX_SW
USB_D+_IFX
UART4_RX_OMAP
UART_RX_SW
USB_D-_IFX
UART_SW2
UART_SW1

Changed (Rev.C)

3

1

C846
1u

Changed (Rev.E)

LGE Internal Use Only

- 156 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

6. CIRCUIT DIAGRAM

GYRO SENSOR

AUDIO CODEC (TWL6040)

MOTION SENSOR

SENSOR_3.0V
VBAT

VSEL_1.8V

Added (P925 Rev.A)

VSEL_2.1V

IME_DA

C965
C934

C933 C932

0.1u

0.1u

2.2u

220n

2.2u

2.2u

100n

0.1u

C904

Removed (Rev.C)
Open/ground switch input

EAR_SENSE
HOOK_ADC

4.7u

C905

4.7u

L6
K6
L5
G5
E1

Microphone input
K2
A1
L1
A11
L11

AUD_CLK_IN

K7

CLK32K_AUD

H7

AUDPWRON
NRESPWRON
NAUDINT
GPO1
GPO2
GPO3
REFN
REFP
REF
PLUGDET
ACCONN

U901
TWL6040

HSL

SD A

15

16

13
VDD

17

14

NC5

NC8

N C6

NC7

GND

18

IME_DA

N C4

IME_DA

EAR_L
EAR_R

HFRN1
HFLP2
HFLN2
HFRP2
HFRN2

B4
B5
A9
A8

MCLK
CLK32K

PBKG1
PBKG2
PBKG3
PBKG4
PBKG5

DNC3

8

R973
DNI

7

MOTION_INT

6

C973
1u

SENSOR_3.0V
FB914

120

FB913

120

AUD_SPK_P
AUD_SPK_N
C913

SENSOR LDO

C978

C914

1n

1n

1u

C1

VIBLP
D3
VIBLN
A2
VIBRP
B1
VIBRN

GND

INT

Digital Compass Movee to MAIN (P925 Rev.B)

A4

HFLP1
A5
HFLN1

B9
stereo speaker
HFRP1
filterless class-D outputs with B8
1.5W

KXTF9

9

Digital Compass Sensor

G3

AUXLP
F3
AUXLN
G4
AUXRP
stereo line outputs F4
AUXRN

ATEST
DTEST1
DTEST2
DTEST3
PROG

NC1
NC2
NC3
NC4

AUD_RCV_P
AUD_RCV_N

J11

stereo headphoneHSR K11

DNC2

DNC4

0.1u

0.1u

FM_AUDIO_R
FM_AUDIO_L

SCL

U971

DNC1

IME_CL

0.1u

B10
C11

earpiece
EARN
a differential class-AB driver
with 2 Vrms capability to a typical 32Ohm

0.1u

IO_VDD

SENSOR_3.0V

C962

C972

HS_MICBIAS
HS_MIC

VSEL_1.8V

6

0.1u

C915

5

C916

EARP

E6
E7
F8
G7
G8

D5
D6
D7
E5

F2

AFMR
AFML

a stereo line-input F1

C963

MMIC_N
SMIC_P
SMIC_N

1u

Removed (Rev.C)

4

COMPASS_INT

F5
F6
F7
E4
K10

5

VSEL_1.8V

U975
AMI306

C975
1

D4
B6
B7

0.1u

0

7

SENSOR_3.0V

VBAT

AVDD

D8
J9
E8

SDA
SCL

C917

R919

HBIAS
2.1V
H1

25

4

8

INT

DVDD

10

SDA

ADDR

9

Added (Rev.1.0)

1

C976

DRDY

AUD_PWRON
SYS_nRESPWRON
SYS_nIRQ2

HMICP
H2
HMICN

0.1u

J3

PDMDN DOWNLINK
PDMUP UPLINK
PDMCLK
PDMCLKLB
PDMFRAME

ICVS0318150FR
VA903

9

10n

2

SENSOR_LDO_EN

3

8

H6
G6

0.1u

C918

0

2

TP904

C919

R921

3

10

VLOGIC
IME_CL

NC9

2

0.1u

11

AD0

MPU3050A

SDA

GND

TP903

0.1u

SCL

C971

GYRO_INT

12

REGOUT

SCL

TP902

0.1u

C920

24

U961

CLKOUT

7

TP901

I2C1_SDA
I2C1_SCL

0.1u

C921

23

Added (P925 Rev.A)

FSYNC

3

K9
L8
L10
K8
H8

C922

22

I2C4_SCL
I2C4_SDA
MMIC_P

INT

RESV2

VREG

PDM_DL_DATA
PDM_UL_DATA
ABE_CLKS
PDM_CLK
PDM_FRAME

4.7u

ICVS0318150FR
VA902

1

VSEL_1.8V

CPOUT

VPP

4.7u

C903

Added (P925 Rev.A)
X
X

21

RESV1

6

C902

GNDREF
GNDHS
GNDAMIC
GNDDMIC
GNDLDO1
GNDLDO2
GNDVCM
GNDNCP1
GNDNCP2
GNDHFL1
GNDHFL2
GNDHFL3
GNDHFR1
GNDHFR2
GNDHFR3
GNDDIG
GNDVIBR
GNDVIBL
GNDIO

4.7u

J5
L4
K3
K1
J2
J4
H4

19

VA901

1u

DBIAS1
DBIAS2
MBIAS
2.1V
MMICP
MMICN
SMICP
SMICN

2.2n

20

4

I2C4_SDA
I2C4_SCL

K5
H9
H3
L3
E3
D9
J1
F10
G10
C5
C4
C6
C7
C8
C9
J6
B3
D2
J8

C901

VDDREGNCP
NCPOUT1
NCPOUT2
NCPFB
CFLYP
CFLYN

VDDVREF
VDDEAR
VDDHS
VDDUL
VDDDL
VDDPLL
VDDHFL1
VDDHFL2
VDDHFR1
VDDHFR2
VDDVIBL
VDDVIBR
VDDAMBIAS
VDDDMBIAS
VDDVIO
VSSEAR
VSSHS
VSSUL
VSSDL
VSSPLL
VDDV2V1
VDDLDO
VSSLDOIN
VSSLDO

H11
E10
E11
G9
G11
F11

N C5
N C6
N C7
N C8
N C9

FB901 120

C961

NC1

C923

R902
1.5K

CLKIN

2.2u

R901
1.5K

MICBIAS

NC 3

C924

Added (P925 Rev.A)

NC2

0.1u

4

0.47u

H5
B11
J10
G2
E9
J7
A3
A6
A7
A10
C2
B2
L2
K4
L9
C10
H10
G1
F9
L7
E2
D1
D11
D10

100n

2.2u

C925

C941

3

C927

120

0.1u

C926

FB941

470n

C928

VSEL_1.8V

2

C940

VBAT

VSEL_2.1V

IME_CL

0.1u

1

0.1u

ICVS0318150FR

0.1u

0.1u

VSEL_1.8V

C931 C930 C929

10

C935

VDD

C936

5

C937

C991

U991
RT9032AGQW
VIN

VOUT1

EN1

VOUT2

P2
P1

PGND

C938

9

C939

GND
EN2

PROXI_3.0V

8
7
6
5

PROXI_LDO_EN

C992

C993

1u

1u

1u

MOTOR DRIVER
Added (Rev.B)

Added (P925 Rev.A)
TWL_LDO_3.0V
TP905

R982
DNI

U981

ISA1000

EN

VDP

PWM

GND

MODE

VDD

GAIN

VDN
NC3

R981
100K

4

L989

82n

L988

8

82n

VIB_L_P

7
6
5

VIB_L_N

NC1

3

NC2

2

EUSY0238306

9

1

11

Changed (P925 Rev.A)

0

10

R987

VIBE_EN
VIBE_PWM

C986

2.2u

3.9n

R986

C987

470K

Changed (P925 Rev.A)

LGE Internal Use Only

- 157 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

6. CIRCUIT DIAGRAM

LCD Power
EN1

VOUT2

2
3

P2

4

P1

VSEL_1.8V VBAT

3D LCD CONNECTOR

7
6

GND

5

C1102

Rev.B

C1103

1u

EN2

9

1u

PGND

C1101

8

VOUT1

1u

D1122

L1121 10u

LED_A
1u

R1103
1.5K

C3

IN

D1

R1101
100K

Changed (P925 Rev.A)

VIO

B2

I2C2_SCL
I2C2_SDA

SCL

C2

Added Res. (Rev.B)

SW

R1102
1.5K

LCD_EN

C1122

D2

C1121

SDA

B1

MAIN
SUB/FB

HWEN/PGEN/GPIO
SET

1u

A1

A2

LED_C1
LED_C2
LCD_CP_EN

A3
C1
B3
R1125
12K

D3

GPIO1

OVP

U1121
LM3528

1.8V_LCD_IOVCC
12V_3D_LCD
2.8V_3D_LCD

R1126
100K

Changed (P925 Rev.A)

CN1141
24-5804-030-000-829+

C1141

30

C1107

22

VBAT

1u

OE_

FB
GND

SS

Exposed_GND

5

510K

0.1u

1u

Changed (P925 Rev.A)

3D_LCD_BANK_SEL_1

TOP FPCB Connector

KEY FPCB Connector
(0.9T, 20 Pin)

Changed Pin map (Rev.B)

KEY_C[1] - KEY_R[1] : Hot Key

Changed Pin map (Rev.D)

VSEL_1.8V

MICBIAS
SMIC_N

29

24
23

20
18

12

22

Rev.D
P925 Rev.B
Rev.E

FB1177

P4

13

FB1175

1800

21

14

FB1176

1800

20

15

4

19

16
17

P6

P2

C1175

1
2

C1176
0.1u

R1178

33p

12

C1171 1n
P3

P2

C1178

AUD_SPK_P

P4

3
4

C1172

L1172

DNI

DNI

470p

10u

Changed Pin map (Rev.B)
Changed (P925 Rev.B)

VSEL_1.8V

Volumm Key
Added (Rev.B)

Q1173

R1173 1M

D1175
VSMF05LCC

2
1
R1172

Changed (P925 Rev.A)

AUD_SPK_N

C1179

FM_ANT

ICMEF112P900M

10

VIB_L_N

Changed (Rev.1.0)
1800

P5 5

P1

9

MMIC_N

HS_MICBIAS

2.2K

10K

8

VIB_L_P

Added (925 Rev.D)

ZD1172

S
G

D

2SJ347

R1174
200K

DNI

Added (Rev.E)

CN1191
SIDEKEY_4P

EAR_SENSE

3

PWR On Key

1

KEY_C[0]
KEY_R[0]
KEY_R[1]

2
3
4

CN1195
1

R1195

2

1K

ZD1195

Added (Rev.E)

- 158 -

ESD9B5_0ST5G

PWR_ON_SW

ZD1191

Added (Rev.D)

LGE Internal Use Only

13

MMIC_P

HOOK_ADC
HS_MIC

1800

C1177

R1176

0.1u

ICMEF112P900M
6

VT_0.3M_MIPI_DATA0_N
VT_0.3M_MIPI_DATA0_P

EAR_R
EAR_L

7

KEY_R[1]

FB1173

FL1172

TOUCH_RESET

19

17

23

3

18

P3

P6

16

2

P1

6

21

15

VBAT

22

14

1

6

13

FLASH_EN

FL1171

VT_0.3M_MIPI_CLK_N
VT_0.3M_MIPI_CLK_P

4

25

GSM_TXON_IND Rev.B, Rev.D
PWR_ON_SW
UART_RX_IFX
UART_TX_IFX
TOUCH_INT_N
I2C2_SDA
I2C2_SCL

6

14

MICBIAS

HS_MIC|HOOK_ADC

AUD_RCV_P
AUD_RCV_N

3

26

12

11

5

27

11

10

24

2

28

10

25

5

KEY_C[1]

R1187
100K

1

29

USIM_RESET/
USIM_CLK
USIM_DATA

1

ESD9B5_0ST5G

30

9

9

FRONT_KEY_LED_EN

4

11

8

26

Q1186
UMT2222A

3

17
16

3
2

7

27

R1186 4.7K

6

28

I2C3_SCL
I2C3_SDA
VT_CAM_PWDN
VT_CAM_RESET/
VT_0.3M_MCLK

P5 5

31

8

MICROSD_DAT0
MICROSD_DAT1
MICROSD_DAT2
MICROSD_DAT3
MICROSD_CMD
MICROSD_DET/
MICROSD_COVER_DET/

32

7

5

PROX_INT

33

6

4

SMIC_P

34

5

3

31

1u

2

32

FB1174 120
R1171
4.7K

SENSOR_3.0V

4

33

27p

30

VSIM_2.9V

C1173

1

2

18

PROXI_3.0V

1

19

15

34

20

TWL_LDO_2.8V

CN1171
24-5804-034-000-829+
C1174

MICROSD_CLK

CN1181
24-5804-020-000-829+

TWL_LDO_1.8V

CN1161
24-5804-034-000-829+

VBAT

SENSOR_3.0V
VSEL_1.8V

(0.9T, 34 Pin)

3

2
1

C1137

4

SUB FPCB Connector

2

1u

Added (Rev.B)
Removeed VA1101, VA1103 (Rev.C)
R1136

1

(0.9T, 40 Pin)

1

FB1143 600

C1143

6

Rmoved (Rev.E)

VSEL_1.8V VPMIC_VMMC

VA1104

ICMEF214P101M

7
11

LED_C1
LED_C2
LED_A

ICVS0318150FR

0.1u

VA1102

12V_3D_LCD
C1138

8

ESD9B5_0ST5G

B

GND

EN

10

ZD1182

A

OUT

C1134

200K

CP2

9

15

ESD9B5_0ST5G

VCCB

VO

ZD1181

VCCA

R1134

SW

CP1

14

2.8V_LCD_VCC
2.8V_LCD_VCI

ESD9B5_0ST5G

3

6
R1133
51K

U1108
NLSV1T244MUTBG

VIN

ESD9B5_0ST5G

3D_LCD_BANK_SEL

5

3D_BOOST_EN

2.8V_LCD_VCC

2

4
3

Added (Rev.C)

1

0.1u

9
G1
10
G2

LCD Level Shifter
VSEL_1.8V

2
C1132

13

16

I2C2_SDA
I2C2_SCL

22K

4.7u

R1135

U1131
TPS61093

C1131

12

18

5
P5
6
P6
7
P7
8
P8

11

19

FL1142
1
P1
2
P2
3
P3
4
P4

DSI2_LCD_MIPI_CLK_N
DSI2_LCD_MIPI_CLK_P

L1131 4.7u

10

20

ZD1193

1u

9

21

ICMEF214P101M

Changed (Rev.B)

DNI

8

3D_LCD_BANK_SEL_1

ICVS0318150FR

3D LCD 12V Boost

1
2

5

C1106

VOUT
GND

DNI

R1191

7

23

ESD9B5_0ST5G

VIN
STBY

DSI2_LCD_MIPI_D0_N
DSI2_LCD_MIPI_D0_P
DSI2_LCD_MIPI_D1_N
DSI2_LCD_MIPI_D1_P

ZD1192

4
3

3D_LCD_EN

PGND

U1106
BU28TD2WNVX

G2
10
G1
9

VBAT

R1190

6

24

1
P1
2
P2
3
P3
4
P4

5

25

5
P5
6
P6
7
P7
8
P8

4

26

17

2.8V_3D_LCD

3

27

FL1141

2

28

LCD_RESET_N

1

29

1u

Added Res. (Rev.B)

Added (Rev.C)

4

VIN

GND

1

LCD BACKLIGHT LED Boost

1.8V_LCD_IOVCC
2.8V_LCD_VCC

U1101
RT9032AGQW

3

VBAT

KEY_C[0] - KEY_R[0] : Volume UP
KEY_C[0] - KEY_R[1] : Volume Down

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

6. CIRCUIT DIAGRAM

3D CAMERA MODULE

CAM POWER

Changed Pin Map (P & lt; -- & gt; S)(Rev.C)

Changed IC (Rev.C, 1.1)

5M_VCM_V2V8_S

VBAT
1.2V_5M_VDIG

2.2u

GNDB
LDO2

B3
C4

I2C3_SDA
I2C3_SCL

C3
D3
E2

CAM_SUBPM_EN

IRQ_N
SDA

LDO3

U1201
LP8720TLX

SCL
DVS
EN

LDO4
R1202
100K

A3

5M_VANA_V2V7_S

A1

C1

DEFSEL
IDSEL

LDO5

5M_MCLK

E1

C1204

C1206

C1207

C1208

1u

1u

1u

1u

B1

C1205

1u

GND

Added Res. (Rev.B)

PRIMARY_5M_MIPI_CLK_N
PRIMARY_5M_MIPI_CLK_P

1
P1
2
P2
3
P3
4
P4

8
9
10

30

11

29

12

28

13

27

14

26

15

25

16

24

17

C1231

23

18

0.1u

19

21

5
P5
6
P6
7
P7
8
P8

7

31

FL1222
B2
C2

6

34

5M_VCM_V2V8_S

5

35

1.8V_5M_VIO

4

36

SECONDARY_5M_RESET_N
PRIMARY_5M_RESET_N

9
G1
10
G2

Changed (P925 Rev.A)

5M_VCM_V2V8_P

B4

3

37

22

A2

LDO1

2

38

SW

1

39

9
G1
10
G2

FB

40

ESD9B5_0ST5G

D4

VINB

ESD9B5_0ST5G
ZD1225

E3

SECONDARY_5M_MIPI_CLK_N
SECONDARY_5M_MIPI_CLK_P
SECONDARY_5M_MIPI_DATA0_N
SECONDARY_5M_MIPI_DATA0_P

5M_VANA_V2V7_P

ZD1224

E4
D2

VIN2

A4

D1

C1209

2.2u

VBATT

L1201
2.2u

5
P5
6
P6
7
P7
8
P8

32

C1210

2.2u

10u

1
P1
2
P2
3
P3
4
P4

33

C1211

C1212

VIN1

Close to E4

FL1221
ICMEF214P101M

C1201
10u

CN1221
GB042-40S-H10-E3000

20

I2C4_SCL
I2C4_SDA

C1235

C1236

4.7u

1u

C1237
0.1u

5M_VANA_V2V7_S
1.2V_5M_VDIG

C1234

1.8V_5M_VIO
5M_VANA_V2V7_P

5M_MCLK_CAM

0.1u
C1233
0.1u

C1232
0.1u

I2C3_SCL
I2C3_SDA

5M_MCLK_CAM

5M_VCM_V2V8_P

C1228

ICMEF214P101M

4.7u

C1229
1u

C1230
0.1u

FL1223
1
P1
2
P2
3
P3
4
P4

5
P5
6
P6
7
P7
8
P8
9
G1
10
G2

PRIMARY_5M_MIPI_DATA0_N
PRIMARY_5M_MIPI_DATA0_P
PRIMARY_5M_MIPI_DATA1_N
PRIMARY_5M_MIPI_DATA1_P

ICMEF214P101M

HDMI Connector
Must Check Pin Map!!!

HDMI BackEnd IC

5V_HDMI

CN1271
78618-0001
20

Changed Con. (Rev.B)

21

5V_HDMI

22
1

C_HDMI_HPD
VBAT
4.7u
G2
L1251

4.7u

HDMI_SCL
HDMI_SDA
HDMI_CEC
HDMI_HPD

1u

F2
B1
C1
B2
C2
A3
A4
B4
C4
D4
E4
F4
G4

Removed (Rev.1.1)

LGE Internal Use Only

VBAT

5VOUT

SW

FB

SCL_A

CT_CP_HPD

SDA_A

LS_OE

CEC_A
HPD_A
D2+
D2-

U1251
TPD12S015

SCL_B
SDA_B
CEC_B
HPD_B

D1+
D1-

VCCA

D0+
D0-

GND0
GND1

CLK+

GND2

CLK-

GND3
PGND

F1
E1
D1
A1
E3
F3
D3
G3

E2
C3

4
5
6
7
8

HDMI_D1HDMI_D0+
HDMI_CT_CP_HPD
HDMI_LS_OE
C_HDMI_SCL
C_HDMI_SDA
C_HDMI_CEC
C_HDMI_HPD

9
10
11

HDMI_D0HDMI_CLK+
Removed (Rev.1.0)
HDMI_CLKC_HDMI_CEC

VSEL_1.8V

12
13
14
15
16
17

C_HDMI_SCL
C_HDMI_SDA

A2
D2

3

HDMI_D2+
HDMI_D2HDMI_D1+

C1252

C1241

2
R1271
100K

18
19
23

C1253

24

0.1u

C1271

25

100n

B3
G1

- 159 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

6. CIRCUIT DIAGRAM

GPS

LDO for GPS
VBAT

C1831
1u

PGND

VIN
STBY

VOUT
GND

VCC_GPS_2V8

1
2
C1832

5

4
3

GPS_PWR_ON

VCC_GPS_2V8

U1831
BU28TD2WNVX

1u
R1803

R1802
10

GPS_LNA_SD

1.5K

C1803
330p
C1801
47p

Changed (P925 Rev.A)

9

L1803 9.1n
FB1818
60

C1818
2.2u

C4
B5
B3

E4

D4
D3

SYNC/PPS_OUT
IFVALID
RST_N
REGPU
TM2

AVSS
VSSC1
VSSC2
VSSC3

2

240MHz
MURATA

ALM-2712
U1801

SFAC0002701

Changed (Rev.1.0,1.1)
L1810

Removed Mobile Switch
(Rev.B)

CN1803

1n

1

L1806

L1811

DNI

SDA1
SCL1

G1

L1807

6.8n

1n

L1810

A5

1nH

6.8nH

* TMUS

VDD_GPS_TCXO_1V8

G2

L1811

* Global, AT & T

F1

8.2nH

1.8pF

Changed (Rev.D)

26MHz_GPS_REF

D1
D5

CLK32K_GATE

D2
C1

C1822

E1

2.2u

C1821
22p

X1821
KT2520F26000ACW18TAK
6

VCC

GND1

NC2

NC1

OUT

GND2

1

A3
5

A2
B6

GPS_RESET_N
GPS_PWR_ON

G6
E6

A4

TP1803

GPS_26MHz

4

2
3

26MHz

TP1804

TCXO for GPS

C5

VSEL_1.8V

VSEL_1.8V
FB1815 60

FB1817 60

C1815
2.2u

LGE Internal Use Only

FL1801
LFD211G57DPMD153
1
6
P2
GND3
2
5
GND1
P3
3
4
P1
GND2

F2

E2

F3

VDDLNA

VDDIF

VDDPL

SCL2/UART_TX
SDA2/UART_RX
UART_nRTS
UART_nCTS

A6

C3

BCM4751

VDD_BAT

GPS_UART_RXD
GPS_UART_TXD
GPS_UART_CTS_N
GPS_UART_RTS_N

RFIP

G5

C6

VDD1P2_CORE

TP1801

REF_CAP

VDDIO

G4
TP1802

U1811

10n

1

(P925 Rev.A)
(Rev.1.1)

GPS_CAL
TCXO/TSXO
LPO_IN
ADCP
VDDADC
ADCN

F6

B2

C1812

VDD1P2_GRF

F4
B1

VDD_AUX_O
VDD_AUX_IN
HOST_REQ
LNA_EN

GND

Changed (P925 Rev.A)

L1802 100p

DPX_IN

VSSIF
VSSLNA

VDD_PRE

E5

CAL_REQ/ANT_SEL
VSSADC

VDDC2
VDDC1

E3

AUXOP

D6

C2

60

B4

A1
FB1812

F5

G3

RF_IN

RF_OUT

1.8p

VCC_GPS_2V8

C1814

VDD

C1808

VDD_GPS_TCXO_1V8

2.2u

8

VSD

11

C1802
0.1u

C1816
2.2u

C1817
2.2u

- 160 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

6. CIRCUIT DIAGRAM

BT/WIFI/FM
VBAT_FEM

Changed (P925 Rev.A)

+1.8V_BT

SWB_VIO_1.8V

1u

1u
C1901

1u

0.1u
C1912

1u

0.1u

C1910

C1911

1u

C1909

1u
0.1u

C1906

C1908

C1907

C1902

1u

1u

0.1u
C1914

C1905

0.1u
C1913

C1904

+1.8V_BT

0.1u

VBAT_FEM

C1903

+1.8V_BT

C1915

0.1u

C1916

220n

CN1904

J10

E4

O UT

GND1 GND2

IN

DNI

FL1901
LFB212G45SG8A166

2450MHz

A7

K11

FREFBGCAP

FMBGAPCAP

E3

C9

A6

M1

PMS_TEST_1P8V

LDO_IN_DCOW

VDD_LDO_INBT

C8

LDO_INW

A8

VDD_PPA_IFBT

VDD_CLASS1P5

B8

C5

C3

VCC_TXAW

VCC_TXBW

C 11

B2

VCC_RXW

VCC_ANAW

VDD_DCOBT

D2

B10

C4

VCC_DCOW

VDD1P8VFM

M6

K3

L8

VDD_RFBT

VDDS4

VDDS3

F9

G2

VDDS1

VDDS2

L6

M4
VDD7

VDD6

VDD5

J1

G9

G1

VDD4

VDD3

VDD2

M2

K1

F11

E10

VDD1

G6
PMS_VBAT

VDD_LDO_IN_CLASS1P5

J2

L1924

DNI

100n

WL_BTH_SW
WL_TX_SW
WL_RX_SW

D5
F1

L1926
1n

Changed (Rev.D)

F3
F2

L1925
DNI

C1932

100p

DNI

A4

BT

VBAT_FEM

M7

5

VB1

13

14

VB3

6

M8

TX_SW

PAEN

PGND

4

RX_SW

AUD_OUT
AUD_IN

BT_PCM_CLK
BT_PCM_SYNC
BT_PCM_DIN
BT_PCM_DOUT

H11
F7
F6

11
10
9

Added
(Rev.D)
WL_BTH_SW
WL_RX_SW
WL_TX_SW L1923

VBAT_FEM

3.3n

C1922

C1923

DNI

1u

Added
(Rev.C)

J7

F8

12

17

BT_RF

U1902
RF3482

GND1

PDET

BT_RF

K7

Removed
(Rev.D)

BTH_SW

PABC

A9

3

TXB

VB2

2

8

1

7

A5

ANT

16

A3

RXBP

RXBN

A2

GND2

B1

15

C1

C1920
1.5n

TESTPBT
FM_I2S_FSYNC

WLAN_IRQ

FM_I2S_CLK

WL_UART_DBG

FM_I2S_DI
FM_I2S_DO

VPP

FM_SCL

IFORCE

FM_IRQ

VSENSE

FM_SDA

DC_REQ

FMRFINP

DRPWPABC

FMRFINM

DRPWPDET

FMRFOUTP

DRPWTEST1

FMAUDLIN

DRPWTEST2

FMAUDRIN

DRPWTEST3

FMAUDLOUT

DRPWTEST4

FMAUDROUT

A1

NC6

Removed Cap.
(Rev.B)

TESTMODE

G4

TP1905 TP1906

WLAN_HOST_WAKEUP

F4

TP1901

H9
H7
H10
L1

DC_EN

D3
D4
B7
C6
C7
D6
M11

VSS_ANAW

J8
K8
J11

FM_AUDIO_L
FM_AUDIO_R

AUD_FSYNC

TESTMBT

VSS_BTDPLL

L10

BT_EN
WLAN_EN

C1917

B6

L9

BT_FUNC7

D 11

FM_ANT

AUD_CLK

VSS_RFW2

L11

BT_FUNC4

C2

L5

G5

TP1907

Changed Library
(Rev.B)

BT_FUNC5

VSS_RFW1

K5

JTAG_TMS

VSSAPASYNTHFM

M5

L1901 180n

BT_FUNC6

JTAG_TDI
JTAG_TCK

B4

L7

BT_FUNC2

JTAG_TDO

M9

J6
H6

BT_FUNC1

VSS_XTAL

H5

FM_I2S_FSYNC
FM_I2S_CLK
FM_I2S_DO
FM_I2S_DI

CLK_REQ_OUT_N

VSSAADCAPLLFM

A11
C10

CLK_REQ_OUT

VSSARFFM

E8

RFIOBT

U1901
WL1271

SLOWCLK

J9

E6
H8

XTALM

D9

E7
TP1902

TP1903 TP1904

XTALP

K10

E9

DRPWTXB

VSS_DCOW

F10

DRPWRXBM

VSS_DCOBT

20K

DRPWRXBP

HCI_RX

E2

R1902

DC_MODE

HCI_TX

B 11

F5
E5

NC4

VSS_DIG7

K9

CLK32K_GATE
WL_CLK_REQ

HCI_RTS

VSS_DIG6

D8

NC3

VSS_DIG5

WL_CLK_IN

NC2
HCI_CTS

G3

D7

1

C1918

C1933

WL_RS232_RX

D10

G7

WL_TX_SW
WL_RX_SW

H4

WL_RS232_TX

G10

G8

SDIO_D2

VSS_DIG4

G11

WL_BTH_SW

VSS_DIG3

E11

BT_UART_RTS/
BT_UART_CTS/
BT_UART_RXD
BT_UART_TXD

SDIO_D1

K6

H2

NC1

H3

SWB_VIO_1.8V

H1
TP1911 TP1912TP1913TP1914

WL_EN
WL_PAEN_B

VSS_DIG2

Changed (P925 Rev.A)

J3

FM_EN
BT_EN

SPI_CSX

A 10

WLAN_SDIO[1]
WLAN_SDIO[2]
Removed TP
(Rev.B)

SPI_DOUT

VSS_DIG1

J4

VSS_RFBT

J5

L4

K4

SPI_DIN

K2

L3

SPI_CLK

VDD_DIG_LDO

M3

VIN_DIG_LDO

Removed TP (P925 Rev.A)
WLAN_CLK
WLAN_CMD
WLAN_SDIO[0]
WLAN_SDIO[3]

VDD_MEM_LDO

L2

C1936 100p

Added (P925 Rev.A)
Removed (Rev.E)

Added (P925 Rev.A)
Removed (Rev.E)

VBAT_FEM

SWB_VIO_1.8V
VSEL_1.8V

FB1914 600

VBAT

R1905

Removed TP
(Rev.B)

Added(Rev.C)
Removed(Rev.1.0)

0

+1.8V_BT

U1904
TPS62611YFDR
A2
B2

DC_EN
C1930
2.2u

LGE Internal Use Only

C2

VIN

MODE

EN

SW

GND

FB

A1
B1
C1

DC_MODE
L1903

1.5u

C1931
4.7u

- 161 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

6. CIRCUIT DIAGRAM

USIM for XMM6260

Main2Sub B2B Con.

* layout note : CLK and IO must be seperated
VSIM_2.9V

VSIM_2.9V

12

23

13

22

14

21

15

20

16

19

17

DNI

DNI

DN I

R101

DNI

24

DNI

11

R109

25

R110

10

18

10p

Rev 1.0 value change

MICROSD_CLK
Rev 1.0 value change

S101
GND

Rev.B
Remove Series R

CMD

27
R118

VDD
CLK

27

VSS

MICROSD_DET/
MICROSD_DAT0
MICROSD_DAT1
MICROSD_COVER_DET/

VSIM_2.9V

I2C4 - & gt; GND(Rev.G)

CARD_DETECT
DAT0
DAT1
COVER_DETECT1

TOUCH_RESET Rev.E

3

USIM_DATA

C105

5

1

D101

D102

C106

0.1u

USIM_CLK

4

2

DAT2
CD_DAT3

R117

6

26

Rev.B

Rev.C

5

9

0.1u

MICROSD_DAT2
MICROSD_DAT3
MICROSD_CMD

4.7u

1

27

C104

4

8

USIM_DATA

8

2

28

GND2

3

7

I_O

GND1

C103

DNI

10p

GSM_TXON_INDRev.E
PWR_ON_SW
UART_RX_IFX
Rev.B
UART_TX_IFX
TOUCH_INT_N
I2C2_SDA
I2C2_SCL

CLK

C102

R106

29

7
C101

6

30

6

(Rev.E)

6

1

5

MICROSD_CLK

USIM_RESET/
USIM_CLK
USIM_DATA

3

R105

31

VPP

5
R104

32

4

RST

4

5

33

3

GND

4

2

USIM_RESET/
USIM_CLK

VCC

2

34

2

3

1

VBAT

VPMIC_VMMC

PU Resistor Moved to Main PCB

J101
1

CN101

4.7K

SENSOR_3.0V
Rev.E

FLASH_EN

VPMIC_VMMC

VSIM_2.9V

VSEL_1.8V VPMIC_VMMC

MICROSD_DAT0
MICROSD_DAT1
MICROSD_DAT2
MICROSD_DAT3
MICROSD_CMD
MICROSD_DET/
MICROSD_COVER_DET/

MicroSD Socket(Hinge Type)

USIM_RESET/

6
D103

Touch Connector

CAMERA FLASH LED

Zif - & gt; BtB (Rev.E)

NEST JIG

Must Check Schematic
Rev.C

VSEL_1.8V

TP gap(center to center) 2mm
(Rev.E)

Routing line must be thick enough to support 1A!!

VSEL_1.8V
10

L101

9

7

5

TOUCH_INT_N

C 120
1u

ZD104

ZD 106

ZD103

ZD102

VA103

ZD101

Rev.F

ZD105

2.2u

Rev.F
Rev.F

B3

C107

D4

FLASH_EN
I2C2_SCL
I2C2_SDA
Rev.E & 1.0
DNI R Added

GSM_TXON_IND

D3
D2
C3
R122

C2

DNI

D1

TP102
TP103
TP104

HWEN

U101

SCL
SDA

VBAT

10u
OUT1
OUT2

VSEL_1.8V

C119

Rev.F

IN

SW2

A3

6

C4

Rev.E

SW1

R121

TOUCH_RESET

LED1
LED2

A2
B2

A1

Routing line must be thick enough to support 1A!!

B1

STROBE
TX1/TORCH/GPIO1
TX2/INT/GPIO2
GND1

4

I2C2_SDA

TP101

TP105

8

A4

3

DNI

2

UART_RX_IFX
UART_TX_IFX
PWR_ON_SW

1u

LEDI/NTC

1

C1

GND2

CN102

I2C2_SCL

B4

1

Rev.B

VBAT

LD101

10K

R112

TOUCH_3.3V

2

C109
10u

Routing line must be thick enough to support 1A!!

VA102

Touch LDO

2ch - & gt; 1ch (Rev.E)
Remove 0 ohm (Rev.G)

VBAT

TOUCH_3.3V

VDD
CE

5

SENSOR_3.0V

PGND

U102
4
3

VOUT
GND

1
2

Camera Deco contact C-clip
CN110
1

C115
1u

LGE Internal Use Only

HJ-BCT-04Y

- 162 -

Rev.D

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

6. CIRCUIT DIAGRAM

Main2FPCB B2B
Must Check!!! Pin MAP

Proxi. Ambiant Sensor

SENSOR_3.0V
TWL_LDO_1.8V

34

MICBIAS

32

5

29

6

28

7

27

8

26

9

25

10

24

11

23

12

22

13

21

14

20

15

19

16

18

17

Rev.1.1 (VSEL 1.8V Remove)

1

I2C3_SDA

2

PROX_INT

3

HS_MIC
EAR_R
EAR_L
EAR_SENSE

4

SDA

VDD

INT

SCL

LDR

GND

LEDK

LEDA

7

5

8

6

EAR_R

7

I2C3_SCL

FM_ANT

6
5

L102
100n
C102
1u

C105
22p

C101
1u

VGA(MIPI)

(FPCB, Aptina 1/11 " , Hansung)
TWL_LDO_2.8V

1

TWL_LDO_1.8V

2

CN103
1

D102

VT_0.3M_MIPI_DATA0_N
VT_0.3M_MIPI_DATA0_P

2

19

3

18

4

17

5

16

6

15
14

8

VT_0.3M_MCLK

20

7

VT_0.3M_MIPI_CLK_N
VT_0.3M_MIPI_CLK_P
D101

8

4

EAR_SENSE

CN102

AUD_RCV_N

9

3

FM_ANT

Receiver
AUD_RCV_P

10

EAR_L

Rev.B(Pull Up Move to Main PCB)
U101

AUD_RCV_P
AUD_RCV_N

CN104

HS_MIC
2

4

30

VT_0.3M_MIPI_CLK_N
VT_0.3M_MIPI_CLK_P
VT_0.3M_MIPI_DATA0_N
VT_0.3M_MIPI_DATA0_P

3

31

PROX_INT
I2C3_SCL
I2C3_SDA
VT_CAM_PWDN
VT_CAM_RESET/
VT_0.3M_MCLK

2

1

PROXI_3.0V

1

33

SMIC_N
SMIC_P

SENSOR_3.0V

TWL_LDO_2.8V
PROXI_3.0V

CN101

13

9

12

10

11

FB101

Rev.1.1 (VSEL 1.8V Remove)
Rev.B(Removed Bypass Cap)
I2C3_SDA
I2C3_SCL
VT_CAM_PWDN
VT_CAM_RESET/
C103

SUB MIC

C104

0.1u

0.1u

Must Check Schematic
TOP
MIC101
1

MICBIAS

2
3
4

SMIC_P

P
G1
G2
O

D104

D103

SMIC_N

Rev.B(Bead Move to Main PCB)

LGE Internal Use Only

- 163 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

6. CIRCUIT DIAGRAM

3.5pi Ear Jack Connector
EAG62831701

1

CN101

10

HS_MIC
2

HS_MIC
EAR_L

4

M5-MIC

3

8
7

5

6

EAR_L

J101

EAR_SENSE

M4-L

4D
M4-DETECT
1
M1-R
6
M6-GND
EAG62831701

EAR_SENSE
EAR_R
FM_ANT

9

4

5

EAR_R
FM_ANT

Remove HS_GND

LGE Internal Use Only

- 164 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

6. CIRCUIT DIAGRAM

Main2Key B2B
VBAT

SPEAKER

MAIN KEY LED

L103

AUD_SPK_P

VBAT

L104

AUD_SPK_N
20
19

CN102

Rev.B

100n

SP101
1
2

100n

1

HIR-02A57-0000AA

2

LED_SINK

D101
C103

MICBIAS

33p

LD104

5

LD103

4

16

LD102

3

17

LD101

18

D102

KEY_C[1]
KEY_R[1]

MMIC_P
15

6

14

7

13

8

12

9

11

10

MMIC_N

R101

R102

R103

R104

130

VIB_L_P

130

130

130

MOTOR

AUD_SPK_P
VIB_L_N

Q-Motor(Not Fixed)

AUD_SPK_N

LED_SINK
L102

VIB_L_N
L101

VIB_L_P

3D HOT_KEY
KB101

KEY_R[1]
KEY_C[1]

VB101
82n

1

82n

2

MAIN MIC
Must Check Schematic!!!
TOP
MIC101
1

MICBIAS

2
FB103

MMIC_P

3
120

Rev.B

LGE Internal Use Only

- 165 -

C110

C113
33p

P
G1
G2
O

C114

27p

0.1u

DNI

MMIC_N
R 105

Volume Key

4

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

6. CIRCUIT DIAGRAM

MAIN ANT
SW101

ANT

CN103

1

G2

HJ-ICT-06Y

C106

CN104

1

L105 1.5n

G1

HJ-ICT-06Y

0.5p

LGE Internal Use Only

- 166 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

6. CIRCUIT DIAGRAM

POWER Key

ON/OFF/LOCK
KB101

PWR_ON_SW

CN101
1
2

LGE Internal Use Only

- 167 -

PWR_ON_SW

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

6. CIRCUIT DIAGRAM

UPDOWN

Volumm Key
KEY_C[0]
KEY_R[0]
KEY_R[1]

KB101

KB102

KEY_C[0]
KEY_R[0]
KEY_R[1]

4
3
2
1

SIDEKEY_4P
CN101

KEY_C[0] - KEY_R[0] : Volume UP
KEY_C[0] - KEY_R[1] : Volume Down

LGE Internal Use Only

- 168 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

7. BGA PIN MAP

U181 PMB5712 (Transceiver)

7. BGA PIN MAP
U181 PMB5712 (Transceiver)

Not Used
Used

LGE Internal Use Only

- 169 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

7. BGA PIN MAP

U301 PMB 9811 (Digital Baseband Processor,3G)
U301 PMB 9811 (Digital Baseband Processor,3G)

Not Used
Used

LGE Internal Use Only

- 170 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

7. BGA PIN MAP

U350 H8BCS0QG0MMR-46M
H8BCS0QG0MMR 46M
U350 H8BCS0QG0MMR-46M

LGE Internal Use Only

- 171 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

7. BGA PIN MAP

U701 K3PE4E400M-XGC1 4Gb LPDDR2 PoP

Not Used
Used

LGE Internal Use Only

- 172 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

7. BGA PIN MAP

U500 OMAP4430 IC, Application Processor

Not Used
Not Used
Used

LGE Internal Use Only

- 173 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

7. BGA PIN MAP

U800 PMIC

Not Used

LGE Internal Use Only

- 174 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

7. BGA PIN MAP

U721 SanDisk 8G NAND Flash

U721 SanDisk 8G NAND Flash

Used
Not Used
LGE Internal Use Only

- 175 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

7. BGA PIN MAP

U901 (TWL6040 Audio codec)

Not Used

LGE Internal Use Only

- 176 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

7. BGA PIN MAP

U811 MUCI

Not Used
Used

LGE Internal Use Only

- 177 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

8. PCB LAYOUT

8. PCB LAYOUT

X500 : 38.4Mhz X-tal
- no Booting

CN1195
ZD593

ZD591
TP1911

U721

R733

R736

R725

R735

R724

R734

U811
5

TP904

C1931

TP523

1

2

C190

28

C605

TP525

C614

C352

SC795

TP524

L1903

C1930

C682

U1904 : DCDC
- no Bluetooth/WiFI/FM

R382

C353

1

C658

C652

C642

C356

C662

C357

ZD1193

ZD1192

C354

10

R597

C679

C328

C335

17

C330

R337

R187

C971

U

T

R

N

P

M

L

H

K

G

J

F

E

D

C

1

TP310

TP312

C973

U971 : Motion sensor
- no Motion sensor

TP311

L988

L989

C987

R986
C986

U981

Q1186

R1186

R982

TP905

U981 : Motor D-IC
- no Vibration

R987

R981

SC793

R1187

R313

R319

R314

C306

C305

C309

C303

L303

C831

C314

L304

FB803
TP300

C834

FB806

L806

C819

C848

FB301

C846

C829

FB801

L801

C815

C814

C808

FB800

C312

C972

R973

U971

C315

C965

C318

C963

C962

C313

U301

C304

C307

U301 : CP modem
- no Service
U961 : Gyro sensor
- no Gyro sensor
- no Motion sensor

R593

TP313

L803

C961

U961

C337

SC794

C327

R592

T

L800

R853

R854

R901

R902

C334

R336

C323

C809

FB302

C851

C325

C317

C826

FB805

C821

P
R

C302

C344

C333

C828

U800

C342

C316

C850

L805

C341

C336

C825

C849

U303

C324

C824
C841

C343
C329

R809

R804

C812

L804

U303 : SPDT S/W
- no CP UART port
- no AP-CP UART port

R383

X300

B

C675

C639

FB804

16

L
M
N

C813

R830

1

C837

R818

C840
C844

C641

C830

C602

C833

C644

C603

C854

C663

C640

C619

G
H
J
K

C817

SC792

C811

U801

FB802

C653

C647

A

C845

X800

B
C
D
E
F

L802
C832

C838

C839

R340

R342

C816

C649

C687

C852

C621

FL621

C601

C651

C681

C612

C656

C611

Y
AA
AB
AC
AD
AE
AF
AG
AH

A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W

1

C600

C636

A

C670 C680 C607

R516

C355

R513

C358
C667

ZD1191

U500

C669

C684

U350 : CP memory
- no Service

R384

C661

U350

C650

R588

U701

C637

CN1191

A

B

C

F

E

D

H

G

J

L

K

N

M

C613

SC791

R598

R827

C853

C810

R828

R803

U1904

FB1914

R631

C671

R808

R805

C991

TP513

C351

C627

C818

R800

C992

C648

Q301

R821

U991

C993

TP902

C645

TP809

TP901

A

TP512

B

TP301

C

R632

C677

C617

R512

C685

C686

C683

R501

C635

C620

U801 : Charger IC
- no Charging
- no AP/CP USB

C657

C660

C674

C678

ZD801

Q301 : FET
- no CP USB

C668

R594

R584

C673

R586

R596

FL800

CN1271

CN1271 : HDMI Conn.
- no HDMI diplay

AF

TP1906 TP1905

SC796

C822

U500 + U701: AP + POP memory
- no Booting

AH

AE

FB743

C502

C509

C618

TP511

U991 : Dual LDO
- no Gyro sensor
- no Motion sensor
- no Compass sonsor
- no Proximity sensor

C744

4

1

C507

ZD802

C823

AG

AC

AD

Y

AB

W

AA

T

V

U

P

R

N

M

J

L

K

F

H

E

D

G

C

B

U502

C500

A

1

1
R581

C743

R731

R726

C505

C508

A

B

R739

R721

A

B

C

D

E

R848

C

D

CN801

R732

R730

R591

C827

R722

U721 : EMMC memory
- no Booting
- no Service

C742

FB741

C503

C501

U851
C820

R737

R723

X500

C504

R850

C855

R738

R727

C741

C739
C740
R728

U811 : MUIC
- no USB/UART

U800 : PMIC
- no Booting
- no Power On
- no Service

TP1912

14

R729

U851 : DP3T S/W
- no CP USB/UART port
- no AP UART port

CN801 : uUSB Conn.
- no USB/UART
- no Charging

TP1914

R1195

TP1913

U502 : Clock Buffer IC
- no Booting
- no BT/WiFi/FM
- no Audio

ZD1195

ZD592

LG-P920_MAIN_1.1_TOP
LGE Internal Use Only

- 178 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

8. PCB LAYOUT

CN1171 : Top FPCB Con.
- no Ear-jack
- no Sub MIC
- no Receiver
- no VT Camera
- no Illumination sensor
- no Proximity sensor

C1920
18

U1831

C1832

L1810
L1806
L1803

L1802

L215
L213

L214

L212

C 93 3

C1812

FB1818

C1822

C1815

C1818

VA902 C922

C938
TP903

C930

C917

C928

U901

U1831 : LDO (for GPS)
- no GPS
FL1801 : Diplexer (GPS/B4 Diversity)
- no GPS
U1801 : GPS RF Module
- no GPS
X1821 : 26Mhz X-tal
- no GPS
U1811 : GPS chip
- no GPS
U901 : Audio codec
- no Sound

C934

C913

C914

C1253
4

C117

1
F

E

G

L116

C1916

L1901

C609

C187

C205

C191
C200
C189
C204

C626

C248

L102

R511

SW101

L143
L141
L131
C151

C183

C1206
C1209

U241

C1231
C1232

C251
C1233
C1234
C1237

C1131

L169

C1236

1
A

C233

C231

U171

L152
C228

L176
C175

C835

U1108

C255

L179

C1143

FB1143
15

R514

R894
R895

C892

CN1141

B
C
D

C1141 VA1102
30

C221
C976

C225

C230
ZD1181
ZD1182

16

U891
R892

C978
C975

C227

L180
C310

R316

FL1221

R1134 C1134 R1133

C222

C112

C842

U1131

C232

C109

U1121

L159

FL1223

C1229

C243

L244
C1138

L138

C1204

C1230

L245

L112

L110
3

L128

U1201

C1207

TP1904
TP1903

R1136

D1122

C1122

FL1141

L1121

C1210

C1913

L1201

R1202

C1208

C244

U121

C123
C1121

U 11 0 6

C1106

C1107

R 11 2 5

R 1 10 2

R 1 10 3

FL1142

R1126

Q801

C1910

FL1222

L1131

L114
R510

M
L
K
J
H
G
F
E
D
C
B
A

C250

C242

C688

L111

C1909

C1914 R1902

C206

C192

C198

C133

C105

R500

CN1904

C1906

C1205
L248

C197

C114

L105

SW102

R8 0 2

R8 0 1

C836

R1191

R1190

C308

V A 1104

C3 0 1

C3 11

R891

U1101

C891
R893

C890

R811

VA800

R1101

BAT800

C805

C1103

R89 7

R8 9 6

C1101

C 807

C8 0 0

C 801

C8 0 4

C 802

C 8 03

C1102

ZD803

C8 5 8

R 515

11

C101

U1901

TP1907

C915
C916

R1172

C199

C659

FB901

L177

C1 72

C171

C 173

C178

U1121 : LCD LED boost
- no LCD backlight
SW102 : RF S/W
- no Service

C103

C610

L162

C1 15

L113

L227

C226

L226

FL111

C223

A

D

1

C224

C153

C1241

U 220

L1251

U1251 : HDMI IC
- no HDMI Display
FL111 : FEM
- no Service
- RF Sensitivity & TX Power

L104

C665

A

B

D

C

C116

L161

C121

C132

L142

R 12 7 1

U1251

L122

L148

C163

L147

L127

L137

L158

L168

C1137

R1135

6

C1252

C1902

C939
C654

C1908
1

C926

C935

FB913

FB914

C646

C 6 55

C924

U181 : Transceiver
- no Service
- RF Sensitivity & TX Power
U121 : Bank Duplexer
- no Service
- RF Sensitivity & TX Power

C1271

C1915

11

C1907

FB1176

C925
1

C918

C1912

C1911

C188

C1816
FB1815

11

C927

A

C9 4 0

B

R921

R1905

FB1175

M
L
K
J
H
G
F
E
D
C
B
A

C

C9 20 V A 9 0 3

E
D

R9 19

C902

F

C91 9

J
H
G

C921

C1179
PT301

R306

C1936

L1924

C1171

FB1812

R1802

K

C901

1

C19 5

FL627

C1 8 2

C903

U181

VA901 C923

ZD1172

FL1901

R522

R521

C1904 C1903

C1801
C93 6

C937

C211

C9 41

C905

C9 31

C 92 9

C 93 2

C2 07

C904

L211

FL1172

U1811

C1802

C1803
C1821

FL211

X1821

R1803

C 2 54

C2 03

C1 93

FB941

C1814

TP1801

TP1802

T P1 8 0 3

TP102

C2 02

C1 9 4

R1 8 6

20

C1808

FL1801

T P1 8 0 4

L1172

C1 17 2

U1801

C1932

C1923

CN1161

R1178

FL1171
FB1817

C1817

18

R 11 7 3

17

FB1173

13

C209

L

L1811

D1175

C2 01

C1 85

C 20 8

C 18 4

21

C1831

R1171

L1807

C117 4

CN1171

C1177

FB1177

Q1173

X184

C245

40

CN1803 : GPS Ant.
- no GPS

34

C1173
C 11 75 C 1 17 6

C25 2

C2 53

C18 1

L247

C1132

20

CN1181

CN800

10

U891 : Fuel gauge
- Battery-bar accuracy declined

FB201

U975

U220 : DCDC (for PAM)
- no Service
- RF Sensitivity & TX Power

BAT800 : Backup Cap.
- RTC Reset

C247

C241

C1235

X184 : 26Mhz X-tal
- no Service

CN1181 : Key FPCB Con.
- no 4 key LED
- no 3D key
- no Main MIC
- no Speaker
- no Vibrator

C249

L249

C1228

C N1 22 1

U975 : Compass sensor
- no compass sensor

R1174

C1901

C1211

U1131 : 3D LCD boost
- no 3D LCD

ZD1224 ZD1225

CN1221 : 3D Cam con.
- no 5M Camera
- no 3D Camera

R 11 7 6

C1905

4

C11 78

L1926

C1212

U241 : PMU(for Transceiver)
- no Service
- RF Sensitivity & TX Power

E

C1201

U1201 : Camera PMIC.
- no 5M Camera
- no VT Camera

L1925

U1901 : WiFi/BT/FM Module
- no WiFi connection
- no BT Connection
- no FM Radio

TP1902 TP1901

CN1904 : WiFi/BT Ant
- no WiFi/Bluetooth

17

FB1174

U1902

34

CN1803

C1922

C1933

C1918

C1917

U1902 : BT/WiFi RF Module
- no BT Connection
- no WiFi connection

L1923

CN1161 : Sub PCB Con.
-no SIM
-no T-flash memory
-no Flash LED
-no Touch

U1106 : LDO
- no 3D LCD
SW101 : Coaxial Conn.
- no Service
FL1141/FL1142 : EMI filter
- no Display

U1101 : Dual LDO
- no Display

CN1141 : LCD Conn.
- no Display

U171:MMMB (Multi PAM)
- no Service
- RF Sensitivity & TX Power

LG-P920_MAIN_1.1_BOT
LGE Internal Use Only

- 179 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

8. PCB LAYOUT

18

34

CN101
17

LG-P920_F_SUB_1.0_TOP
LGE Internal Use Only

- 180 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

8. PCB LAYOUT

S101

LD101
ZD105
ZD101
5

R1 0 9

C106

R1 1 0

CN102

D1 0 2

10

VA102

R118

D1 0 1

ZD103

CN110

6

ZD102

ZD104

R117

C120

ZD106

R1 0 6

R1 0 5

C119

VA103

C104

R1 0 4

R101

C105

R112

C101

R122

C115

C1 0 2

J 101

D1 0 3

C103

U102
R121

C107

U101

L101
TP105

TP104

TP103

TP101

C109

TP102

LG-P920_F_SUB_1.0_BOT
LGE Internal Use Only

- 181 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

8. PCB LAYOUT

10

MIC101

CN103
FB101
C104
D104

D103

C103
C102

11

20

C101

U101

CN102

D101

D102

LG-P920_F_VTCAM_1.1_TOP
LGE Internal Use Only

- 182 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

43

101NC

81

71

8. PCB LAYOUT

10

6

CN104

L102
C105

5

LG-P920_F_VTCAM_1.1_BOT
LGE Internal Use Only

- 183 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

8. PCB LAYOUT

LG-P920_F_EAR_1.0_TOP
LGE Internal Use Only

- 184 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

8. PCB LAYOUT

LG-P920_F_EAR_1.0_BOT
LGE Internal Use Only

- 185 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

8. PCB LAYOUT

KB101

SP101

LD104

LD103

LD102

L104
D102

LD101
FB103

R102

R101

C103

L102

L101

R 105

C 110

MIC101

C 114

R104

C 113

R103

L103

1
VB10

D101

LG-P920_RF_KEY_1.1_TOP
LGE Internal Use Only

- 186 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

8. PCB LAYOUT

20

CN102
10

11

LG-P920_RF_KEY_1.1_BOT
LGE Internal Use Only

- 187 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

8. PCB LAYOUT

L105

CN104

CN103

C106

S W10 1

LG-P920_E_PCB_1.0
LGE Internal Use Only

- 188 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

8. PCB LAYOUT

KB101

LG-P920_F_SK_PWR_1.0
LGE Internal Use Only

- 189 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

8. PCB LAYOUT

KB101
KB102

LG-P920_F_SK_VOL_1.0
LGE Internal Use Only

- 190 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

9. CALIBRATION

9. CALIBRATION
9.1 Configuration of Tachyon
9.1.1 Configuration of directory

P920/

LGP920
LGP920
LGP920
LGP920

LGE Internal Use Only

- 191 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

9. CALIBRATION

9.1.2 Description of basic folders
Folder

Description

Tachyon

Exe file and MFC dll, UI dll is present.

Common

Common dll files.
(XML Data I/O , Auto Test Logic, Tachyon Logic Control, Communication)

Config

Envirement files.
(Port configuration, Loss adjust)

Instrument

Tester control dll.

Model

Model files is present.
(Model - & gt; Solution (Qualcomm, EMP, ADI, INFINEON) - & gt; MODEL
NAME(LGGW620, LGSH470, ..) - & gt; BUYER NAME(SKT, TEL, VIVO, …)

OCX

Conponent files.

PhoneCmd

Phone communication file

Report

Report Files is present.
(Cal data, test data)

9.1.3 Description of configuration files
File

Description

‘MODEL NAME’_Calibration.XML

There are imformations to calibrate.
It consist of calibration items.

‘MODEL NAME’_CallSetup.XML

There are imformations to call.

‘MODEL NAME’_NV.INI

It consists of default values.
It is written when ‘cal & auto’ is begun.

‘MODEL NAME’_Sequence.XML

It is described a testing procedures.

LGE Internal Use Only

- 192 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

9. CALIBRATION

9.2 How to use Tachyon
9.2.1 Model selection
Follow the procedure before start calibration & auto test
a. Click the icon,

in tool bar. Then, you can see the below screen.

b. Select Model “LGP920”

B

LGE Internal Use Only

- 193 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

9. CALIBRATION

c. Select the model : You should select “LGP920”
d. Select the buyer (must be double clicked) Then, you can see “PASS” in Config File Check.
e. Click select button

C
D

E

LGE Internal Use Only

- 194 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

9. CALIBRATION

9.2.2 Start cal & auto
a. Click calibration & autotest button,

in Tool bar.

LGP920

b. Calibration & autotest will be executed in order.
1) Precede Action.
- NV write
- Test command send.
2) Calibration
3) Auto test
4) After action
- Phone reset
- Change UE to AMSS

LGE Internal Use Only

- 195 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

10. HIDDEN MENU

10. HIDDEN MENU
Hidden Menu Start
Start shortcut keys:3845#*920#
Hidden Menu List
Start the desired menu: Menu, click

Device Test
List:
Auto all Test: evice functionality testing at the factory to use
D
Accelerometer Test
ALC/Proximity Test
AutoDetecting Test
Bluetooth Scan Test
Camera Test
Compass Test
Gyroscope Test
External Memory Test
Font Test
Key/Compass Test
LCD Test
S3D LCD Test
3D LCD Test
RTC Test
Sound Test
Touch Test
Vibrator Test
Wifi Scan Test
Gyro Cal Test
EMI Test
HDMI Output Test
HDMI Test
Touch LED Brightness
Gesture Manager Test
Gmtest_app2
Gesture Test
LGE Internal Use Only

- 196 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

10. HIDDEN MENU

Device Test List
Auto All Test :
- & gt; Auto All Test menu click
- & gt; ontinuous information on the menu, giving you ability test
C

Accelerometer Test

Proximity Test
: Proximity Sensor
Phone contact with your fingers in the top of the sensor
determine the sensor response
- Far 1.0
- Near 0.0
Check the “Auto brightness mode”
- ALC level changed due to the brightness

LGE Internal Use Only

- 197 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

10. HIDDEN MENU

AutoDetecting Test
: USIM, SD card, Ear jack
Check the SIM card
Check the SD card
Check Ear phone(jack)
- Ejected ear jack is normal

Bluetooth Scan Test

Camera Test
Menu features disabled
This feature is part of Auto All Test replaced by
- & gt; Auto All Test
- & gt; Camera Preview
- & gt; VTCamera Preview
- & gt; 3DCamera Preview

LGE Internal Use Only

- 198 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

10. HIDDEN MENU

Camera Test 1
Camera Preview

Camera Test 2
VTCamera Preview

Camera Test 3
3DCamera Preview

LGE Internal Use Only

- 199 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

10. HIDDEN MENU

Compass Test

Compass Test

External Memory Test
SD Card
SD Card test
- & gt; Write a test check of the SD Card memory

LGE Internal Use Only

- 200 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

10. HIDDEN MENU

Font Test
Change native font

Key/Compass Test
Up/Down key : Check Recognition
Menu key : Check Recognition
Home key : Check Recognition
Back key : Check Recognition
Search key : Check Recognition
3D key : Check recognition
End key : Check recognition
Phone contact with your fingers in the top of the sensor
determine the sensor response
Far 1.0
Near 0.0
- ALC Change
Compass test
LCD Test List
Manual Test : Click on the following screen
Automatic Test : Automatically, without clicking
Manual Test
Automatic Test
2D pattern Test
3D pattern Test
Red Display
Green Display
Blue Display
White Display
Red, Green, Blue, White Display
Gradation brightness Display

LGE Internal Use Only

- 201 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

10. HIDDEN MENU

S3D LCD Test

3D LCD Test

RTC test

LGE Internal Use Only

- 202 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

10. HIDDEN MENU

Ring test

Touch window test
Write with finger

Vibrator test
A case-by-state vibration tests

LGE Internal Use Only

- 203 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

10. HIDDEN MENU

Wifi Scan test

Gyro Cal Test
Gyroscope calibration

EMI Test
Display EMI

LGE Internal Use Only

- 204 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

10. HIDDEN MENU

HDMI output Test
Using HDMI output

HDMI Test
Display HDMI

Touch LED Brightness

LGE Internal Use Only

- 205 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

10. HIDDEN MENU

Gesture Test

Audio Loop Back Test
Mic & Speak Phone loop Back test

ELT Test
Automatic Mode: Test Automatically
Manual Mode : Test selectivity

LGE Internal Use Only

- 206 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

10. HIDDEN MENU

ELT Test
Automatic Mode : LCD Automatic on/off test
- & gt; time setting

ELT Manual Test
LCD Backlight
Ringtone
Vibrator
Camera
Audio Loopback
- & gt; test on the device is working
(The ability to use plant)

SW Sanity Test
FPRI Test
CRC Test: BIN CRC
CAL CRC
EFS CRC
EFS CRC Detail

LGE Internal Use Only

- 207 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

10. HIDDEN MENU

Factory Reset
Format External SD card : External SD Card Data reset
Format Internal SD card : Internal SD Card Data reset
Factory Rest :Changing the Factory

Version Info
Classified Information representation

Module Test list
- BT DUT setting
- SMS Prefer set
- LCD Always ON
- Hidden Reset
- USB mode selection
- Reboot CP/AP
- Stability Test
- Charging Test
- FOTA Test
- Crash Handling
- SMPL Setting
- SMPL count
- Wakelock Monitoring Setting

LGE Internal Use Only

- 208 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

10. HIDDEN MENU

WLAN Test
WLAN performance on SW

ERS Menu

Contacts Test

LGE Internal Use Only

- 209 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

10. HIDDEN MENU

Contacts Test
Aging Test

Port Setting
Select - & gt; OK

KR Setting
- & gt; Select OK

LGE Internal Use Only

- 210 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

10. HIDDEN MENU

Log service

Browser Utility

AT Test

LGE Internal Use Only

- 211 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

10. HIDDEN MENU

Modem Setting
Menu:
Engineering Mode
Band Selection
Auto Call Answering
RRC Version Setting
QCRIL/Android Log On/Off
PDP Setting
HSDPA Category
GSM A5 Algorithm
Protocol Test
GCF Flag
Arm9 Log ON/Off

GPS Test

GPS HW Test

LGE Internal Use Only

- 212 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

10. HIDDEN MENU

SMS Test
- & gt; Automatic Memfull Test

DRM Test

Call Test
VC Auto answer
- & gt; Select Disable or Enable

LGE Internal Use Only

- 213 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

10. HIDDEN MENU

MMS Test

WPS test

Network Mode

LGE Internal Use Only

- 214 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

10. HIDDEN MENU

Network Mode

Preferred networks

FM radio Test
Input the Freq. & Volume

LGE Internal Use Only

- 215 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

10. HIDDEN MENU

Development Menu Setting
For monkey cage test

VT memu

Connectivity Test

LGE Internal Use Only

- 216 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

10. HIDDEN MENU

TouchArea Setting

Fake Language

LGE Internal Use Only

- 217 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

ACQ00

MCQ00

MJN00

SVLM00

EBR01

SVCY00

MBG01

ADV00

EBR02

SUMY00
EBP00
SWCC00

MEG00
SURY00

EBR04

MBG02
MBG00

MCQ02
MCQ01

EBR03
SUMY00

ACQ02

ACQ01
MBL01

EBR00
EAX01
MBK02

MBL00

EAX00
MBK03

GMEY01
MBK00
MBK04

MBK01

EBR05

GMZZ00
EAA00
EAC00

LGE Internal Use Only

GMEY00

- 218 -

Location
EBR00
MBK00
MBK01
MBK02
EAX00
MBK03
EAX01
MBK04
EBR01
SUMY00
EBR02
EBR03
EBR04
SUMY00
SVCY00
SVLM00
SWCC00
ADV00
GMEY00
MBG00
MBG01
MBG02
MCQ00
MCQ01
MCQ02
MEG00
MJN00
SURY00
EBP00
ACQ00
ACQ01
EAA00
MBL00
MBL01
EBR05
GMEY01
GMZZ00
EAC00
ACQ02

Description
PCB Assembly,Main
Can,Shield
Can,Shield
Can,Shield
PCB,Sidekey
Can,Shield
PCB,Sidekey
Can,Shield
PCB Assembly,Flexible
Microphone,Condenser
PCB Assembly,Flexible
PCB Assembly,Flexible
PCB Assembly,Flexible
Microphone,Condenser
Camera Module
LCD,Module-TFT
Cable,Assembly
Frame Assembly
Screw,Machine
Button
Button
Button
Damper,LCD
Damper
Damper
Holder
Tape
Receiver
Camera Module
Cover Assembly,Front
Cover Assembly,Rear
Antenna Assembly
Cap,Receptacle
Cap,Receptacle
PCB Assembly,Flexible
Screw,Machine
Screw,Machine
Rechargeable Battery,Lithium Ion
Cover Assembly,Battery

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

11
12.2 Replacement Parts
& lt; Mechanic component & gt;
Level

Location No.

Description

Note: This Chapter is used for reference, Part order is
ordered by SBOM standard on GCSC

PartNumber

Spec

1

AGQ000000 Phone Assembly

AGQ86509311

LGP920.ANEUML ML:Metal Black UADS : refer to
AGQ86509301

2

MEZ002100 Label, Approval

MLAA0062316

COMPLEX GU280 OREBK ZZ:Without Color
COMPLEX, (empty), , , , ,

2

ACQ100400

Cover Assembly,
EMS

ACQ85692012

LGP920.ANEUML ML:Metal Black -

3

EBR00

PCB Assembly,
Main

EBR73661711

LGP920.ANEUML 1.0 Main

4

EBR071800

PCB Assembly,
Main, SMT

EBR73661811

LGP920.ANEUML 1.0 Main

5

EBR071600

PCB Assembly,
Main,
SMT Bottom

EBR72793001

LGP920.ASFRZY 1.1 MAIN

6

MBK00

Can, Shield

MBK62874201 PRESS CU 0.2 LGP920.ASFRZY ZZ:Without Color -

6

BAT800

Capacitor Assembly

SMZY0023501

6

MBK01

Can, Shield

MBK63032501 PRESS STS 304 0.2mm LGP920.ASFRZY SV:Silver -

5

EBR071700

PCB Assembly,
Main,
SMT Top

EBR72793201

LGP920.ASFRZY 1.1 MAIN

6

EAX010000

PCB, Main

EAX63973701

LGP920.ASFRZY 1.1 FR-4 Any Layer 10 0.75 MAIN

6

MBK02

Can, Shield

Remark

MBK62874001 PRESS CU 0.2 LGP920.ASFRZY ZZ:Without Color MLAZ0038301

COMPLEX LG-VX6000 ZZ:Without Color PID Label 4
Array PRINTING,

PCB Assembly,
Main, Insert

EBR74043701

LGP920.AGBRML 1.1 Main

PCB, Sidekey

EAX64050301

LGP920.ASFRZY E POLYI Multi 2 0.18 SIDEKEY

5

MEZ000000 Label

4

EBR071500

5

EAX00

LGE Internal Use Only

PAS311HR-VG1 3.8 Backup Capacitor 0.03F, Module
Assembly, KOREA TAIYO YUDEN.CO., LTD.

- 219 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

5

MBK03

5

EAX01

Description

PartNumber

Spec

Can, Shield

MBK62874101

PRESS STS 0.15 LGP920.ASFRZY ZZ:Without Color
-

PCB, Sidekey

EAX64144001

LGP920.AGBWBK 1.0 POLYI Double 2 0.18 Sidekey

5

MEV000000 Insulator

MEV63895901 COMPLEX LGP920.ASFRZY ZZ:Without Color -

5

MEV000001 Insulator

Remark

MEV63896101 COMPLEX LGP920.ASFRZY ZZ:Without Color -

Can, Shield

MBK63052601

PRESS STS 304 0.2 LGP920.ASFRZY ZZ:Without
Color -

6

MBK070300 Can, Shield

MBK62873901

PRESS STS 0.15 LGP920.ASFRZY ZZ:Without Color
-

6

MJN000001

Tape

MJN67868301

COMPLEX LGP920.ASFRZY ZZ:Without Color -

6

MJN000000

Tape

MJN67832201

COMPLEX LGP920.ASFRZY ZZ:Without Color -

5

RAA050100

Resin, PC

BRAH0001301 UF-1060

3

ACQ003400

Cover Assembly,
Bar

ACQ85692101

LGP920.AGBRML ML:Metal Black -

4

EBR01

PCB Assembly,
Flexible

EBR74043801

LGP920.AGBRML 1.0 Flexible

5

EBR070400

PCB Assembly,
Flexible, SMT

EBR74043901

LGP920.AGBRML 1.0 Flexible

6

EBR070300

PCB Assembly,
Flexible,
SMT Top

EBR74044101

LGP920.AGBRML 1.0 Flexible

7

EAX010700

PCB, Flexible

EAX63975101

LGP920.ASFRZY 1.1 POLYI Multi 5 - FLEXIBLE

7

SUMY00

Microphone,
Condenser

SPU0410HR5H -PB SPU0410HR5H -PB, UNIT, 42
SUMY0010609 dB, 3.76*2.95*1.1, mems smd mic KNOWLES
ACOUSTICS

6

EBR070200

PCB Assembly,
Flexible,
SMT Bottom

EBR74044001

LGP920.AGBRML 1.0 Flexible

4

EBR02

PCB Assembly,
Flexible

EBR74044201

LGP920.AGBRML 1.0 Flexible

5

EBR070400

PCB Assembly,
Flexible, SMT

EBR74044301

LGP920.AGBRML 1.0 Flexible

6

EBR070300

PCB Assembly,
Flexible,
SMT Top

EBR74044501

LGP920.AGBRML 1.0 Flexible

5

MBK04

LGE Internal Use Only

- 220 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

7

EAX010700

PCB, Flexible

EAX64142901

LGP920.ASFRZY C POLYI Multi 3 - Flexible

6

EBR070200

PCB Assembly,
Flexible,
SMT Bottom

EBR74044401

LGP920.AGBRML 1.0 Flexible

4

EBR03

PCB Assembly,
Flexible

EBR74044601

LGP920.AGBRML 1.0 Flexible

5

EBR070400

PCB Assembly,
Flexible, SMT

EBR74044701

LGP920.AGBRML 1.0 Flexible

6

EBR070200

PCB Assembly,
Flexible,
SMT Bottom

EBR74044801

LGP920.AGBRML 1.0 Flexible

6

EBR070300

PCB Assembly,
Flexible,
SMT Top

EBR74044901

LGP920.AGBRML 1.0 Flexible

7

EAX010700

PCB, Flexible

EAX64132001

LGP920.ASFRZY 1.1 POLYI Double 2 0.18 Flexible

4

EBR04

PCB Assembly,
Flexible

EBR74045001

LGP920.AGBRML 1.0 Flexible

5

EBR070400

PCB Assembly,
Flexible, SMT

EBR74045101

LGP920.AGBRML 1.0 Flexible

6

EBR070300

PCB Assembly,
Flexible,
SMT Top

EBR74045301

LGP920.AGBRML 1.0 Flexible

7

EAX010700

PCB, Flexible

EAX63975001

LGP920.ASFRZY 1.0 POLYI Multi 4 0.4 Flexible

7

SUMY00

Microphone,
Condenser

SPU0410HR5H -PB SPU0410HR5H -PB, UNIT, 42
SUMY0010609 dB, 3.76*2.95*1.1, mems smd mic KNOWLES
ACOUSTICS

6

EBR070200

PCB Assembly,
Flexible,
SMT Bottom

EBR74045201

LGP920.AGBRML 1.0 Flexible

4

SVCY00

Camera Module

SVCY0027901

LM08MIFF LM08MI VGA Aptina 1/11 " , MIPI I/F,
FPCB type, 90deg HANSUNG ELCOMTEC CO.,
LTD.

4

SVLM00

LCD, Module-TFT

LH430WV2-SD01 WVGA 4.3INCH 480X800 170CD
SVLM0043201 COLOR 70% 15/9 1000:1 60Hz Inverter N 3D LCD LG
Display Co. Ltd.

4

SWCC00

Cable, Assembly

SWCC0010601

80186-202B-80L 80 mm, LINE, 20311-011R_20311011R, H=2.0, I-PEX CO., LTD

4

ADV00

Frame Assembly

ADV73885501

LGP920.ASFRZY BK:Black -

LGE Internal Use Only

Description

PartNumber

Spec

- 221 -

Remark

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

Description

PartNumber

Spec

5

MCQ009400 Damper, Camera

MCQ66476601 COMPLEX LGP920.ASFRZY ZZ:Without Color -

5

MCQ000000 Damper

MCQ66476501 COMPLEX LGP920.ASFRZY ZZ:Without Color -

5

MJN009401

Tape, Camera

MJN67697901

COMPLEX LGP920.ASFRZY ZZ:Without Color -

5

MJN000000

Tape

MJN67710501

COMPLEX LGP920.ASFRZY ZZ:Without Color -

5

MJN000001

Tape

MJN67889001

COMPLEX LGP920.ASFRZY ZZ:Without Color -

5

MJN000002

Tape

MJN67889101

COMPLEX LGP920.ASFRZY ZZ:Without Color -

5

MCQ000001 Damper

MCQ66671001 COMPLEX LGP920.ASFRZY ZZ:Without Color -

5

MDQ000000 Frame

MDQ62840301 COMPLEX LGP920.ASFRZY SV:Silver -

5

MJN009400

Tape, Camera

MJN67710401

COMPLEX LGP920.ASFRZY ZZ:Without Color -

4

GMEY00

Screw, Machine

GMEY0018101

GMEY0018101 FH + 1.4mM 1.5mM SWCH FZB N KUMGANG SCREW CO., LTD

4

MBG00

Button

MBG64110501

MOLD PC LUPOY SC-1004A LGP920.ASFRZY
BK:Black -

4

MBG01

Button

MBG64110601

MOLD PC LUPOY SC-1004A LGP920.ASFRZY
BK:Black -

4

MBG02

Button

MBG64110701

MOLD PC LUPOY SC-1004A LGP920.ASFRZY
BK:Black -

4

MCQ00

Damper, LCD

MCQ66476801 COMPLEX LGP920.ASFRZY BK:Black -

4

MCQ01

Damper

MCQ66720201

4

MCQ02

Damper

MCQ66726801 COMPLEX LGP920.ASFRZY BK:Black -

4

MEG00

Holder

MEG62719101 MOLD NBR LGP920.ASFRZY BK:Black -

4

MJN000000

Tape

MJN67808901

COMPLEX LGP920.ASFRZY ZZ:Without Color -

4

MJN00
MJN000005

Tape

MJN67880801

COMPLEX LGP920.ASFRZY ZZ:Without Color -

4

MJN000001

Tape

MJN67889201

COMPLEX LGP920.ASFRZY ZZ:Without Color -

4

SURY00

Receiver

BWBR1207L-04B-P 30mW 32OHM 105DB
SURY0010114 0HZTO0HZ WIRE - BUJEON ELECTRONICS CO.,
LTD

4

EBP00

Camera Module

EBP61302201

HSIS-LM58SNAFVS HSIS-LM58SNAFVS 5M AF
Dual Sony 1/4 CIS, MIPI, RFPCB 0degree HANSUNG
ELCOMTEC CO., LTD.

4

MJN000002

Tape

MJN67889301

Remark

COMPLEX LGP920.ASFRZY ZZ:Without Color -

LGE Internal Use Only

MOLD URETHANE LGP920.ASFRZY ZZ:Without
Color P920 Pad LCD Rubber

- 222 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

4

ACQ00

Description
Cover Assembly,
Front

PartNumber
ACQ85371101

Spec

Remark

LGP920.ASFRZY BK:Black -

5

MCQ000001 Damper

MCQ66723401 COMPLEX LGP920.ASFRZY ZY:Color Unfixed -

5

MJN000001

Tape

MJN67901801

COMPLEX LGP920.ASFRZY ZZ:Without Color -

5

MJN000000

Tape

MJN67787901

COMPLEX LGP920.ASFRZY ZZ:Without Color -

5

MJN020801

Tape, Decor

MJN67787801

COMPLEX LGP920.ASFRZY ZZ:Without Color -

5

MJN020800

Tape, Decor

MJN67787701

COMPLEX LGP920.ASFRZY ZZ:Without Color -

5

MEG000001 Holder

MEG62719001 MOLD NBR LGP920.ASFRZY BK:Black -

5

MEG000000 Holder

MEG62706101 MOLD NBR LGP920.ASFRZY BK:Black -

5

MEA000000 Guide

MEA62590801

MOLD PC LGP920.ASFRZY ZZ:Without Color light
plate

5

MDJ000000

MDJ63124501

COMPLEX LGP920.ASFRZY ZZ:Without Color -

5

MCR000002 Decor

MCR64356501 PRESS STS 304 0.3 LGP920.ASFRZY BK:Black -

5

MCQ000000 Damper

MCQ66687601 COMPLEX LGP920.ASFRZY ZZ:Without Color -

5

MCQ009400 Damper, Camera

MCQ66627301 COMPLEX LGP920.ASFRZY ZZ:Without Color -

5

MCQ074200 Damper, Speaker

MCQ66627201 COMPLEX LGP920.ASFRZY ZZ:Without Color -

5

MCK032700 Cover, Front

MCK66589601 MOLD PC LGP920.ASFRZY BK:Black -

6

MET099500 INSERT, NUT

MICE0016909

5

MCR000000 Decor

MCR64367501 MOLD PC+ABS LGP920.ASFRZY BK:Black -

5

MCR000001 Decor

MCR64367401 MOLD PC+ABS LGP920.ASFRZY BK:Black -

5

EBD030100

Touch Window
Assembly

EBD61005201

S09CL04301B CAPACITIVE TOUCH G/G Synaptics
Gen3 4.3 BB - Kyoshin Technosonic(Korea)Co., LTD.

5

MDJ000001

Filter

MDJ63124401

COMPLEX LGP920.ASFRZY ZZ:Without Color -

4

MEZ000000 Label

MLAZ0038303

COMPLEX LG-LC3200 WA:White PRINTING, PPRI
PRINTING

4

MJN000006

Tape

MJN67928901

COMPLEX LGP920.ASFRZY ZZ:Without Color -

4

MJN000004

Tape

MJN67905401

COMPLEX LGP920.ASFRZY ZZ:Without Color -

4

MJN000003

Tape

MJN67902001

COMPLEX LGP920.ASFRZY ZZ:Without Color P920
USP Film, Europe

LGE Internal Use Only

Filter

MECH_COMMON ZY, ZZ, PRESS, STS, , , , ,

- 223 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

Description

PartNumber

Spec

3

ACQ01

Cover Assembly,
Rear

ACQ85531901

LGP920.ASFRZY BK:Black -

4

EAA00

Antenna Assembly

EAA62609302

P920-MODULE-LAIRD LGP925.AATTDB Black Black
Black LAIRD TECHNOLOGIES KOREA

4

ACW000000 Decor Assembly

ACW73637101 LGP920.ASFRZY ZZ:Without Color -

5

MCQ000000 Damper

MCQ66627401 COMPLEX LGP920.ASFRZY ZZ:Without Color -

5

MJN000001

Tape

MJN67853301

COMPLEX LGP920.ASFRZY ZZ:Without Color -

5

MJN000000

Tape

MJN67788101

COMPLEX LGP920.ASFRZY ZZ:Without Color -

5

MCR000000 Decor

MCR64367601 CASTING AL LGP920.ASFRZY SV:Silver -

5

MJN009400

Tape, Camera

MJN67788001

COMPLEX LGP920.ASFRZY ZZ:Without Color -

4

MBL00

Cap, Receptacle

MBL64823201

MOLD PC LUPOY SC-1004A LGP920.ASFRZY
BK:Black -

4

MBL01

Cap, Receptacle

MBL64837601

Remark

MOLD PC LUPOY SC-1004A LGP920.ASFRZY
BK:Black MOLD PC LUPOY SC-1004A LGP920.ASFRZY
BK:Black GF 10%

4

MCK063300 Cover, Rear

MCK66589801

4

MCQ000000 Damper

MCQ66627501 COMPLEX LGP920.ASFRZY ZZ:Without Color -

4

MCQ000001 Damper

MCQ66627601 COMPLEX LGP920.ASFRZY ZZ:Without Color -

4

MCQ000003 Damper

MCQ66627701 COMPLEX LGP920.ASFRZY ZZ:Without Color -

4

MCQ000002 Damper

MCQ66627801 COMPLEX LGP920.ASFRZY ZZ:Without Color -

4

MCQ000004 Damper

MCQ66627901 COMPLEX LGP920.ASFRZY ZZ:Without Color -

4

MCQ000005 Damper

MCQ66628001 COMPLEX LGP920.ASFRZY ZZ:Without Color -

4

MCQ000006 Damper

MCQ66650901 COMPLEX LGP920.ASFRZY ZZ:Without Color -

4

EAA030100

PIFA Antenna,
Multiple

EAA62546001

ACB-00103 DUAL -2DB 3:1 Planar Inverted F Type MOBITECH CORPORATION

4

MEZ000900

Label,
After Service

MLAB0001102

COMPLEX C2000 CGRSV WA:White C2000 USASV
DIA 4.0 PRINTING,

4

MKC009400 Window, Camera

MKC63903301

CUTTING SODA LIME GLASS LGP920.ASFRZY
ZZ:Without Color -

4

MGJ000000 Plate

MGJ63003001

COMPLEX LGP920.ASFRZY BK:Black -

4

MFB029600 Lens, Flash

MFB62473601

MOLD PMMA LGP920.ASFRZY ZZ:Without Color -

LGE Internal Use Only

- 224 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

Description

PartNumber

Spec

3

EBR05

PCB Assembly,
Flexible

EBR74045401

LGP920.AGBRML 1.0 Flexible

4

EBR070400

PCB Assembly,
Flexible, SMT

EBR74045501

LGP920.AGBRML 1.0 Flexible

5

EBR070300

PCB Assembly,
Flexible,
SMT Top

EBR74045701

LGP920.AGBRML 1.0 Flexible

6

EAX010700

PCB, Flexible

EAX63974901

LGP920.ASFRZY G POLYI Multi 4 0.4 FLEXIBLE

5

EBR070200

PCB Assembly,
Flexible,
SMT Bottom

EBR74045601

LGP920.AGBRML 1.0 Flexible

3

GMEY01

Screw, Machine

GMEY0007902

GMEY0007902 CS + 2.7M 4.5M SWRH BLACK N A
KUMGANG SCREW CO., LTD

3

GMZZ00

Screw, Machine

GMZZ0017701

GMZZ0017701 BH + 1.4mM 3mM MSWR NI PLT N ASIA BOLT

1

AAD000000

Addition Assembly

AAD85849712

LGP920.ANEUML ML:Metal Black -

2

ACQ02

Cover Assembly,
Battery

ACQ85513201

LGP920.ASFRZY BK:Black LG-P920 ASFRZY, Cover
Assy Battery

3

MCR000000 Decor

MCR64356401 PRESS AL 0.3 LGP920.ASFRZY BK:Black -

3

MCK004100 Cover, Battery

MCK66590101

MOLD PC LUPOY SC-1004A LGP920.AGBRML
ML:Metal Black GF10%

3

MGJ000000 Plate

MGJ63107801

COMPLEX LGP920.ASFRZY ZZ:Without Color -

3

MJN000000

Tape

MJN67907401

COMPLEX LGP920.ASFRZY ZZ:Without Color -

2

EAD010000

Cable, Assembly

EAD61875101

LG0050 USB USB 1.2M 5pin BLACK halogen free N
ningbo broad telecommunication co., ltd

1

AGF000000

Package Assembly

AGF76258517

LGP920.ANEUML ZZ:Without Color
LGP920_COSMO1 NEU Palletizing_700ea

2

MAY084000 Box, Unit

MAY65193101

COMPLEX LGP920.ACISML ZZ:Without Color
COSMO 1_H/Case Upper_LG-P920_Small ENG_EU
STD / CIS

2

MAY084001 Box, Unit

MAY65193102

COMPLEX LGP920.ACISML ZZ:Without Color
COSMO 1_H/Case Lower_LG-P920_Small ENG_EU
STD / CIS

2

MAY047100 Box, Master

MAY65217301

Remark

COMPLEX LGP920.AFRAML ZZ:Without Color
COSMO 1 M/Box_LGP920_None_EU STD / CIS

LGE Internal Use Only

- 225 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

Description

PartNumber

Spec

2

MEZ084100 Label, Unit Box

MEZ64160701

COMPLEX LGP920.ADEUML ZZ:Without Color
COSMO_USP Label_LGP920_ENG_ENG STD

2

MEZ003500 Label, Barcode

MEZ64187101

COMPLEX LGP920.ADEUML ZZ:Without Color -

2

MEZ047200 Label, Master Box

MLAJ0004402

PRINTING CG300 CGR DG ZZ:Without Color LABEL
MASTER BOX(for CGR TDR 2VER. mbox_label) GSM
standard_master box label

2

MEZ000000 Label

MLAZ0050901

COMPLEX KU990.AGBRBK ZZ:Without Color Battery
Warning Label (Lithium ion Battery Label)

2

AGJ000000

Pallet Assembly

AGJ73398303

LGP920.ADEUML ZZ:Without Color COSMO1
NEU_Body 1200*800(9501)_700ea

3

MBL007000

Cap, Box

MCCL0001710 COMPLEX LGP920.ANLDML ZZ:Without Color 2/700

3

MAY010800 Box, Carton

MBEC0003012 COMPLEX LGP920.ANLDML ZZ:Without Color 1/700

3

MGA000000 Pallet

MPCY0009501

Remark

LGE Internal Use Only

COMPLEX G7100 ORUBK BK:Black PALLET(G7100
for Orange UK_EUR) COMPLEX,

- 226 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

12.2 Replacement Parts
11
& lt; Main component & gt;

Note: This Chapter is used for reference, Part order is
ordered by SBOM standard on GCSC

Level

Location No.

Description

PartNumber

6

L113

Inductor, Multilayer,
Chip

ELCH0001048

1005GC2T10NJLF 10NH 5% - 250mA 0.42OHM
2.5GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
PILKOR ELECTRONICS LTD.

6

C211

Capacitor, Ceramic,
Chip

ECZH0000822

C1005C0G1H1R5CT000F 1.5pF 0.25PF 50V NP0 55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

6

C244,
C247

Capacitor, Ceramic,
Chip

ECCH0006201

C1608X5R0J475KT000N 4.7uF 10% 6.3V X5R 55TO+85C 1608 R/TP - TDK CORPORATION

6

C1209,
C1210,
C1211,
C227,
C835,
C836,
C842,
C890,
C934,
C935

Capacitor, Ceramic,
Chip

CL05A225MP5NSNC 2.2uF 20% 10V X5R ECCH0007804 55TO+85C 1005 R/TP 0.5MM SAMSUNG
ELECTRO-MECHANICS CO., LTD.

6

C1107,
C1173,
C1204,
C1205,
C1206,
C1207,
C1208,
C1832,
C1901,
C1902,
C1905,
C193,
C241,
C245,
C250,
C659,
C665

Capacitor, Ceramic,
Chip

ECCH0004904

6

C1201

Capacitor, Ceramic,
Chip

GRM188R60J106M 10000000 pF, 6.3V, M, X5R, TC,
ECCH0005604 1608, R/TP, 0.8 mm MURATA MANUFACTURING
CO., LTD.

LGE Internal Use Only

Spec

Remark

GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C
1005 R/TP - MURATA MANUFACTURING CO., LTD.

- 227 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

Description

PartNumber

6

C1101,
C1102,
C1103,
C1106,
C1121,
C1831,
C1923,
C891,
C975,
C978

Capacitor, Ceramic,
Chip

ECZH0001215

C1005X5R1A105KT000F 1uF 10% 10V X5R 55TO+85C 1005 R/TP - TDK KOREA
COOPERATION

6

R811

Resistor, Chip

ERHZ0000318

MCR01MZP5F8062 80.6KOHM 1% 1/16W 1005 R/TP
- ROHM.

6

C1122,
C1137

Capacitor, Ceramic,
Chip

ECZH0003503

GRM188R61E105K 1uF 10% 25V X5R -55TO+85C
1608 R/TP - MURATA MANUFACTURING CO., LTD.

6

C1812,
C1815,
C1816,
C1817,
C1818,
C1822,
C209,
C230,
C231,
C249,
C924,
C927,
C937

Capacitor, Ceramic,
Chip

CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R ECCH0000198 55TO+85C 1005 R/TP . SAMSUNG ELECTROMECHANICS CO., LTD.

6

R1803

Resistor, Chip

ERHZ0000220

MCR01MZP5F1501 1.5KOHM 1% 1/16W 1005 R/TP ROHM.

6

C115,
C1814,
C185,
C801,
C858

Capacitor, Ceramic,
Chip

ECCH0009106

C0603X7R1C103KT 10nF 10% 10V X7R 55TO+125C 0603 R/TP - TDK CORPORATION

6

R1176,
R801,
R802

Resistor, Chip

ERHY0009505

MCR006YZPJ103 10KOHM 5% 1/20W 0603 R/TP ROHM.

6

C105,
C1932,
C1936,
L1802

Capacitor, Ceramic,
Chip

ECZH0000813

C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C
1005 R/TP - TDK KOREA COOPERATION

6

R1125

Resistor, Chip

ERHY0009555

MCR006YZPF1202 12KOHM 1% 1/20W 0603 R/TP ROHM.

LGE Internal Use Only

Spec

- 228 -

Remark

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

6

ZD1172,
ZD1181,
ZD1182,
ZD1224,
ZD1225

6

Description

PartNumber

Spec

Diode, TVS

EDTY0010101

ESD9B5.0ST5G ESD9B5.0ST5G, SOD-923, 5 V, 300
mW, R/TP, 15pF SCG HONG KONG SAR LTD.

L131

Inductor, Multilayer,
Chip

ELCH0001411

LL1005-FHL1N2S 1.2NH 0.3NH - 400mA 0.1OHM
16GHZ 7 SHIELD NONE 1.0X0.5X0.5MM R/TP
TOKO, INC.

6

C1228,
C1235,
C1241,
C1252,
C192,
C243,
C248,
C901,
C902,
C903,
C904,
C905

Capacitor, Ceramic,
Chip

CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R ECCH0017601 55TO+85C 1005 R/TP 0.5MM SAMSUNG
ELECTRO-MECHANICS CO., LTD.

6

U1121

IC, DC, DC
Converter

EUSY0430301

LM3528TMX 2.5 to 5.5V adj 0W CSP R/TP 12P NATIONAL SEMICONDUCTOR ASIA PACIFIC PTE.
LTD.

6

C114,
C1174

Capacitor, Ceramic,
Chip

ECCH0009506

MCH032A270JK 27pF 5% 25V NP0 -55TO+125C
0603 R/TP - ROHM.

6

R1190,
R1191,
R896,
R897

PCB ASSY,
MAIN,
PAD OPEN

SAFO0000401

AX3100 ATL SV_SHIPBACK, MAIN, A, 0OHM DNI

6

R1102,
R1103,
R510,
R511

Resistor, Chip

ERHY0009511

MCR006YZPJ152 1.5KOHM 5% 1/20W 0603 R/TP ROHM.

6

L179

Inductor, Multilayer,
Chip

ELCH0003847

LQG15HS1N8S02D 1.8NH 0.3NH - 300mA 0.1OHM
6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
MURATA MANUFACTURING CO., LTD.

ALM-2712 0DBM 14.2DB 0% 0A 200mA 0DB 80DBM
1.26DBM 0P 3.0x2.5x1.0MM - AVAGO
SMZY0027801
TECHNOLOGIES INTERNATIONAL SALES PTE.
LIMITED

6

U1801

Module, RF
Amplifier

6

U975

IC, Magnetic Sensor

EBD60985501

6

C187

Capacitor, Ceramic,
Chip

Remark

GRM033R61A472K 4700pF 10% 10V X5R ECCH0009228 55TO+85C 0603 R/TP - MURATA
MANUFACTURING CO., LTD.

LGE Internal Use Only

AMI306 1.7 to 3.6V - QFN R/TP 8P - AICHI STEEL
CORPORATION

- 229 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

Description

6

C1141,
C1229,
C1236,
C1904,
C1906,
C1908,
C1909,
C1910,
C225,
C688,
C892,
C923

Capacitor, Ceramic,
Chip

CL03A105MQ3CSNH 0.000001F 20% 6.3V X5R ECCH0017301 45TO+85C 0603 R/TP - SAMSUNG ELECTROMECHANICS CO., LTD.

6

FB1812,
FB1815,
FB1817,
FB1818

Filter, Bead

EAM62150301

6

C221,
C976

Capacitor, Ceramic,
Chip

MCH153CN103KK 10nF 10% 16V X7R -55TO+125C
ECCH0000155 1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

6

C1143

Capacitor, Array

EAE62463801

GNM0M2R60J105ME18D 1uF2 20% 6.3V 2R SMD
R/TP 4P MURATA MANUFACTURING CO., LTD.

6

C1171,
C189,
C913,
C914

Capacitor, Ceramic,
Chip

ECZH0025920

GRM033R71C102K 1nF 10% 16V X7R -55TO+125C
0603 R/TP - MURATA MANUFACTURING CO., LTD.

6

R1905,
R894,
R895,
R919,
R921

PCB ASSY, MAIN,
PAD SHORT

SAFP0000401

LG-LU3000 LGTBK, MAIN, A,

6

X1821

Oscillator, TCXO

EXST0002501

KT2520F26000ACW18TAK 26 MHz, 2 PPM, 10 pF,
SMD, 2.5*2.0*0.8, 2ppm, 26, 1.8V, 2.5, 2.0, 0.8, SMD,
R/TP KYOCERA CORP.

6

CN800

Connector, Terminal
Block

EAG62832401

04-9254-003-037-037-829+ 3P 2.50MM ANGLE SMD
T/REEL - KYOCERA ELCO KOREA SALES CO.,
LTD.

LGE Internal Use Only

PartNumber

Spec

Remark

CIM05J600NC 60 ohm 1.0X0.5X0.5 25% 0.2 ohm
0.65A SMD R/TP 2P 0 SAMSUNG ELECTROMECHANICS CO., LTD.

- 230 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

Description

PartNumber

6

C1134,
C1175,
C1176,
C1230,
C1231,
C1232,
C1233,
C1234,
C1237,
C1253,
C173,
C1802,
C1903,
C1907,
C191,
C1911,
C1912,
C1913,
C1914,
C1915,
C194,
C200,
C201,
C202,
C203,
C204,
C206,
C207,
C208,
C251,
C301,
C609,
C610,
C626

Capacitor, Ceramic,
Chip

ECCH0009101

C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R 55TO+85C 0603 R/TP - TDK CORPORATION

6

C646,
C654,
C655,
C915,
C916,
C917,
C918,
C919,
C920,
C921,
C922,
C925,
C928,
C929,
C930,
C931,
C932,
C938,
C939

Capacitor, Ceramic,
Chip

ECCH0009101

C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R 55TO+85C 0603 R/TP - TDK CORPORATION

LGE Internal Use Only

Spec

- 231 -

Remark

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

6

FB201

Filter, Bead

EAM62070801

BLM15EG221SN1D 220 ohm 1.0X0.5X0.5 25% 0.28
ohm 0.7A SMD R/TP 2P 0 MURATA
MANUFACTURING CO., LTD.

6

D1122

Diode, Switching

EDSY0011901

SDB310Q 340mV 30V 200mA 1A 0SEC 150mW
EMD2 R/TP 2P 1 AUK CORP

6

FL111

Filter Separator

SFAY0015301

BGSF18DM20 800, 1900, 1.0 dB, 1.0 dB, 25 dB, 25
dB, 3226, 3228Size INFINEON TECHNOLOGIES
(ASIA PACIFIC) PTE LTD.

6

R1134,
R1174

Resistor, Chip

ERHY0009547

MCR006YZPF2003 200KOHM 1% 1/20W 0603 R/TP ROHM.

6

C1131,
C242

Capacitor, Ceramic,
Chip

CL10A475KP8NNNC 4.7uF 10% 10V X5R ECCH0007802 55TO+85C 1608 R/TP - SAMSUNG ELECTROMECHANICS CO., LTD.

6

C1178

Capacitor, Ceramic,
Chip

GRM033R71C471K 470pF 10% 16V X7R ECCH0009231 55TO+125C 0603 R/TP - MURATA
MANUFACTURING CO., LTD.

6

L1807,
L1810,
L1926

Inductor, Multilayer,
Chip

ELCH0003831

LQG15HS1N0S02D 1NH 0.3NH - 300mA 0.07OHM
10GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
MURATA MANUFACTURING CO., LTD.

6

C1138

Capacitor, Ceramic,
Chip

ECZH0003504

GRM188R71E104K 100nF 10% 25V X7R 55TO+125C 1608 R/TP - MURATA
MANUFACTURING CO., LTD.

6

C800

Capacitor, Ceramic,
Chip

ECCH0009103

C0603C0G1H101JT00NN 100pF 5% 50V X7R 55TO+125C 0603 R/TP - TDK CORPORATION

6

C1821

Capacitor, Ceramic,
Chip

ECCH0009216

GRM0335C1E220J 22pF 5% 25V X7R -55TO+125C
0603 R/TP - MURATA MANUFACTURING CO., LTD.

6

R521,
R522

Resistor, Chip

ERHY0009528

MCR006YZPJ474 470KOHM 5% 1/20W 0603 R/TP ROHM Semiconductor KOREA CORPORATION

6

L102,
L122,
L142,
L161

Inductor, Multilayer,
Chip

ELCH0003832

LQG15HS2N2S02D 2.2NH 0.3NH - 300mA - 0.12OHM 6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM
R/TP MURATA MANUFACTURING CO., LTD.

6

L127,
L137,
L213

Inductor, Multilayer,
Chip

ELCH0001403

LL1005-FHL1N0S 1NH 0.3NH - 400mA 0.1OHM
20GHZ 7 SHIELD NONE 1.0X0.5X0.5MM R/TP
TOKO, INC.

6

U181

IC, RF Transceiver,
3G

EUSY0432901

PMB5712 XMM6260 RFIC , ; , IC, Tx/Rx WFWLB
R/TP 138P INFINEON TECHNOLOGIES (ASIA
PACIFIC) PTE LTD.

LGE Internal Use Only

Description

PartNumber

Spec

- 232 -

Remark

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

Description

PartNumber

Spec

6

U1901

IC, WiFi

EUSY0378501

6

C1916,
C308,
C310,
C311,
C936

Capacitor, Ceramic,
Chip

GRM033R60J224M 0.00000022F 20% 6.3V X5R ECCH0032801 55TO+85C 0603 R/TP 0.3MM MURATA
MANUFACTURING CO., LTD.

6

U891

IC, Fuel Gauge

EAN61958601

MAX17043G 2.5 to 4.5V Vbat 0W DFN R/TP 8P MAXIM INTEGRATED PRODUCTS INC.

6

L1131

Inductor, Wire
Wound, Chip

ELCP0008019

VLS252010ET- 4R7M 4.7UH 20% - 800mA
0.332OHM - - NON SHIELD 2.5X2X1MM NONE TDK CORPORATION

Filter, Saw

SFSY0035004

B9469 2140 MHz, 1.4*1.1*0.45, SMD, 2110M~2170M,
IL 2.5, 5pin, U-B, 50-100, BAND I DIVERSITY,
2140MHz, 1.4*1.1*0.45, SMD, R/TP EPCOS PTE
LTD.

Connector, BtoB

ENBY0057501

Remark

24-5804-034-000-829+ 34, 0.4 mm, STRAIGHT, gold,
34, 0.40MM, STRAIGHT, FEMALE, SMD, 0.9T,
KYOCERA ELCO KOREA SALES CO., LTD.
1005GC2T2N7SLF 2.7NH 0.3NH - 300mA 0.17OHM
5.5GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
PILKOR ELECTRONICS LTD.

WL1271BYFFR 0VTO0V 0W 137P - WLCSP R/TP
137P TEXAS INSTRUMENTS KOREA LTD,
HONGKONG BRANCH.

6

FL211

6

CN1161,
CN1171

6

L176,
L211,
L212

Inductor, Multilayer,
Chip

ELCH0001056

6

C803

Capacitor, Ceramic,
Chip

GRM0335C1E6R0D 6pF 0.5PF 25V X7R ECCH0009213 55TO+125C 0603 R/TP - MURATA
MANUFACTURING CO., LTD.

6

VA1102,
VA1104,
VA901,
VA902,
VA903

Varistor

SEVY0008901

ICVS0318150FR 18V 0% 15pF 0.6*0.3*0.33 NONE
SMD R/TP INNOCHIPS TECHNOLOGY

6

L244,
L247,
L249

Inductor, Wire
Wound, chip

ELCP0008014

MIPSZ2012D4R7 MIPSZ2012D4R7, 4.7 uH, N,
2.0X1.2X1.0, R/TP FDK CORPORATION.

6

FL1141,
FL1142,
FL1221,
FL1222,
FL1223

Filter, EMI/Power

SFEY0015901

ICMEF214P101MFR ICMEF214P101MFR, SMD,
ESD Common mode Filter INNOCHIPS
TECHNOLOGY

6

PT301

Thermistor, NTC

SETY0006301

NCP15XH103J03RC 10KOHM 5% 0V 0A 3.35KK
SMD P/TP 1005size MURATA MANUFACTURING
CO., LTD.

LGE Internal Use Only

- 233 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

6

FB1173,
FB1175,
FB1176,
FB1177

Filter, Bead

SFBH0008102

BLM15HD182SN1D 1800 ohm 1.0X0.5X0.5 25% 2.2
ohm 0.2A SMD R/TP 2P 0 MURATA
MANUFACTURING CO., LTD.

6

U1131

IC, DC, DC
Converter

EAN61841601

TPS61093 1.6 to 6V adj 1.6W DFN R/TP 10P TEXAS INSTRUMENTS KOREA LTD, HONGKONG
BRANCH.

6

C116,
C117,
C121,
C132,
C151,
C163

Capacitor, Ceramic,
Chip

ECZH0000830

C1005C0G1H330JT000F 33pF 5% 50V NP0 55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

6

Q1173

FET

EQFP0000101

2SJ347 P-CHANNEL MOSFET -20V -7 -0.05A
40OHM 100mW SSM R/TP 3P TOSHIBA

6

R514,
R515

Resistor, Chip

ERHY0009593

MCR006YZPJ272 2.7KOHM 5% 1/20W 0603 R/TP ROHM.

6

VA800

Varistor

SEVY0003601

ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55
NONE SMD R/TP INNOCHIPS TECHNOLOGY

6

U1108

IC, Level Translator

EUSY0391601

NLSV1T244-D 0.9~4.5V - LEVEL SHIFTER - R/TP 6P
- SCG HONG KONG SAR LTD.

6

R1136

Resistor, Chip

ERHZ0000296

MCR01MZP5F5103 510KOHM 1% 1/16W 1005 R/TP
- ROHM.

6

R892

Resistor, Chip

ERHZ0000204

MCR01MZP5F1003 100KOHM 1% 1/16W 1005 R/TP
- ROHM.

6

R186

Resistor, Chip

ERHY0009503

MCR006YZPJ101 100OHM 5% 1/20W 0603 R/TP ROHM.

6

CN1803,
CN1904

Contact

MCE62252901

COMPLEX LGP999BN ZZ:Without Color LG-P999
CLIP_SUB

6

C197,
C198,
C199,
C205

Capacitor, Ceramic,
Chip

GRM033R60J473KE19D 47nF 10% 6.3V X5R ECCH0009201 55TO+85C 0603 R/TP - MURATA
MANUFACTURING CO., LTD.

6

C153

Capacitor, Ceramic,
Chip

MCH155A220JK 22pF 5% 50V NP0 -55TO+125C
ECCH0000115 1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

6

FB1174,
FB901,
FB913,
FB914,
FB941

Filter, Bead

SFBH0007101

LGE Internal Use Only

Description

PartNumber

Spec

Remark

BLM15AG121SN1D 120 ohm 1.0X0.5X0.5 25% 0.25
ohm 0.5A SMD R/TP 2P 0 MURATA
MANUFACTURING CO., LTD.

- 234 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

Description

PartNumber

6

C1271,
C195,
C222,
C933,
C941

Capacitor, Ceramic,
Chip

EAE62286801

6

C1920

Capacitor, Ceramic,
Chip

MCH155CN152KK 1.5nF 10% 50V X7R -55TO+125C
ECCH0000145 1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

6

L1923

Inductor, Multilayer,
Chip

ELCH0001034

HK1005 3N3S-T 3.3NH 0.3NH - 300mA 0.16OHM
6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP TAIYO
YUDEN CO., LTD

6

U1106,
U1831

IC, LDO Voltage
Regulator

EUSY0407101

BU28TD4WNVX SSON004, 4, R/TP, 2.8V 150mA
Single LDO, IC, LDO Voltage RegulatorIC, LDO Voltage
Regulator ROHM.

6

R1171,
R316

Resistor, Chip

ERHY0009526

MCR006YZPJ472 4.7KOHM 5% 1/20W 0603 R/TP ROHM.

6

SW102

Connector, RF

ENWY0008701

MS-156C NONE STRAIGHT SOCKET SMD T/REEL
AU 50OHM 400mDB HIROSE KOREA CO., LTD

6

L226

Inductor, Wire
Wound, chip

ELCP0009408

LQM2HPN1R0MG0 LQM2HPN1R0MG0, 1 uH, N,
2X2.5X1.0, R/TP, Chip power MURATA
MANUFACTURING CO., LTD.

6

C228

Capacitor, Ceramic,
Chip

ECCH0009230

GRM033R61A222K 2.2nF 10% 25V X5R -55TO+85C
0603 R/TP - MURATA MANUFACTURING CO., LTD.

6

L1803

Inductor, Multilayer,
Chip

ELCH0003818

LQG15HS9N1J02D 9.1NH 5% - 300mA 0.26OHM
3.4GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
MURATA MANUFACTURING CO., LTD.

6

C807,
C926

Capacitor, Ceramic,
Chip

CL03A474MQ3NNNH 0.47 uF, 6.3V, M, X5R, HD,
0603, R/TP, 0.0000047, 20%, 6.3V, X5R, -55TO+85C,
ECCH0034801
0603, R/TP, .3 mm SAMSUNG ELECTROMECHANICS CO., LTD.

6

R1802,
R500

Resistor, Chip

ERHY0009502

MCR006YZPJ100 10OHM 5% 1/20W 0603 R/TP ROHM.

6

FL627

Filter, EMI/Power

EAM62230801

NFM18PS105R0J3D_ EMI 0HZ 1uF 0H SMD R/TP
6.3V, 2A, 0.03ohm MURATA MANUFACTURING
CO., LTD.

6

C805

Capacitor, TA,
Conformal

ECTH0002703

TCTAL1A107M8R 0.0001F 20% 10V 50UA 55TO+125C 0OHM 3.2x1.6x1.1 NONE SMD R/TP
ROHM CO., LTD.

6

R1902

Resistor, Chip

ERHY0009554

MCR006YZPF2002 20KOHM 1% 1/20W 0603 R/TP ROHM.

LGE Internal Use Only

Spec

Remark

CL03A104KP3NNNC 0.0000001F 10% 10V X5R 55TO+85C 0603 R/TP 0.3 SAMSUNG ELECTROMECHANICS CO., LTD.

- 235 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

6

U901

IC, Audio Codec

EUSY0424501

TWL6040 BGA, 120, R/TP, 6X6, OMAP4XXX, IC,
Audio Codec TEXAS INSTRUMENTS KOREA LTD,
HONGKONG BRANCH.

6

C1803

Capacitor, Ceramic,
Chip

ECCH0009109

C0603X7R1H331KT00NN 330pF 10% 50V X7R 55TO+125C 0603 R/TP - TDK CORPORATION

6

C226

Capacitor, Ceramic,
Chip

ECCH0005603

GRM188R61A225K 2.2uF 10% 10V X5R -55TO+85C
1608 R/TP - MURATA MANUFACTURING CO., LTD.

6

C172

Capacitor, Ceramic,
Chip

ECCH0000182

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C
1005 R/TP - MURATA MANUFACTURING CO., LTD.

6

R1178

Resistor, Chip

ERHZ0000243

MCR01MZP5F2201 2.2KOHM 1% 1/16W 1005 R/TP ROHM.

6

L147,
L158,
L168

Inductor, Multilayer,
Chip

ELCH0001404

LL1005-FHL1N5S 1.5NH 0.3NH - 400mA 0.13OHM
15GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
TOKO, INC.

6

FB1143

Filter, Bead

SFBH0008101

BLM15AG601SN1D 600 ohm 1.0X0.5X0.5 25% 0.6
ohm 0.3A SMD R/TP 2P 0 MURATA
MANUFACTURING CO., LTD.

6

FL1171,
FL1172

Filter, EMI/Power

SFEY0016301

ICMEF112P900M COMMON MODE NOISE FILTER
0HZ 0F 0H SMD R/TP INNOCHIPS TECHNOLOGY

6

C188

Capacitor, Ceramic,
Chip

ECZH0001108

C1005X7R1E682KT000F 6.8nF 10% 25V X7R 55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

6

D1175

Diode, TVS

EDTY0009801

VSMF05LCC 5V 6V 12V 2A 25W SOT-963 R/TP 6P 5
PROTEK DEVICES INC.

6

C1179,
C1212,
C223,
C224

Capacitor, Ceramic,
Chip

CL10A106MP8NNNC 10uF 20% 10V X5R ECCH0007803 55TO+85C 1608 R/TP 0.8MM SAMSUNG
ELECTRO-MECHANICS CO., LTD.

6

C1801

Capacitor, Ceramic,
Chip

ECZH0025917

6

C112

Capacitor, Ceramic,
Chip

MCH155A100D 10pF 0.5PF 50V NP0 -55TO+125C
ECCH0000110 1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

6

C802

Capacitor, Ceramic,
Chip

ECCH0009514

MCH032A(AN)100DK 10pF 0.5PF 25V X7R 55TO+125C 0603 R/TP - ROHM.

6

CN1181

Connector, BtoB

ENBY0053601

24-5804-020-000-829+ 20P 0.40MM STRAIGHT
FEMALE SMD R/TP 900mM - KYOCERA ELCO
KOREA SALES CO., LTD.

LGE Internal Use Only

Description

PartNumber

Spec

Remark

GRM0335C1E470J 47pF 5% 25V NP0 -55TO+125C
0603 R/TP - MURATA MANUFACTURING CO., LTD.

- 236 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

6

L1251

Inductor, Wire
Wound, chip

ELCP0008015

MIPSTZ2012D1R0 MIPSTZ2012D1R0, 1.0 uH, N,
2*1.25*0.8, R/TP FDK CORPORATION.

6

U220

IC, DC, DC
Converter

EUSY0264510

RF6560 2.9 to 5.1V adj 0W CSP R/TP 24P - RF
MICRO DEVICES INC

6

R1101,
R1126,
R1202,
R1271

Resistor, Chip

ERHY0009506

MCR006YZPJ104 100KOHM 5% 1/20W 0603 R/TP ROHM.

6

L110,
L215

Inductor, Multilayer,
Chip

ELCH0001035

HK1005 4N7S-T 4.7NH 0.3NH - 300mA 0.21OHM
4GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP TAIYO
YUDEN CO., LTD

6

U241

IC, MM PMIC

EUSY0264511

RF6590 CSP , 16 , R/TP , 3B, 2LDO, CSP,
1.732X1.722 , ; , IC, DC, DC Converter MICRO
DEVICES, INC.

6

C1132

Capacitor, Ceramic,
Chip

ECZH0003103

GRM36X7R104K10PT 100nF 10% 10V X7R 55TO+125C 1005 R/TP - MURATA
MANUFACTURING CO., LTD.

6

FL1901

Filter, Ceramic

SFCY0000901

LFB212G45SG8A166 BPF 2.45KHZ 100Hz SMD
R/TP 4P MURATA MANUFACTURING CO., LTD.

6

U1902

Module, WLAN

RF3482 TI WLAN WL1271 COB 3x3 SP3T + PAM +
SMZY0027002 DET + Balun + Tx Filter, RF Module RF MICRO
DEVICES INC

6

C109,
C1808

Capacitor, Ceramic,
Chip

GRM1555C1H1R8C 1.8pF 0.25PF 50V NP0 ECCH0000183 55TO+125C 1005 R/TP - MURATA
MANUFACTURING CO., LTD.

6

U121

Filter, Multiplexer

EAM62070401

B40761DY2045L Duplexer Bank for UE2j,
Band1/2/4/5/8+DCS1800, 10.4*3.6*1.0 KOREA
TAIYO YUDEN.CO., LTD.

6

L1201

Inductor, Wire
Wound, chip

ELCP0008013

MIPSZ2012D2R2 MIPSZ2012D2R2, 2.2 uH, N,
2.0X1.2X1.0, R/TP FDK CORPORATION.

6

U1811

IC, GPS

EUSY0415301

BCM4751IUB2G , 42, BCM4750 Shrink version 65nm,
IC, GPS WLBGA R/TP 42P BROADCOM CORP

6

U1251

IC, I/O Support Chip

EUSY0426301

TPD12S015 ESD protection HDMI companion chip , ; ,
IC, CMOS WCSP R/TP 28P TEXAS INSTRUMENTS
KOREA LTD, HONGKONG BRANCH.

6

CN1221

Connector, BtoB

ENBY0036001

GB042-40S-H10-E3000 40P 0.4MM STRAIGHT
SOCKET SMD R/TP 1M ENGINEERING PLASTIC
UL94V-0 AU OVER NI LS Mtron Ltd.

LGE Internal Use Only

Description

PartNumber

Spec

- 237 -

Remark

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

Description

PartNumber

Spec

6

C171,
C232

Capacitor, Ceramic,
Chip

ECZH0001216

C1005X5R1A224KT000E 220nF 10% 10V X5R 55TO+85C 1005 R/TP - TDK KOREA
COOPERATION

6

U1101

IC, LDO Voltage
Regulator

EUSY0407401

RT9032 WDFN8L, 8, R/TP, Programmable Dual LDO,
IC, LDO Voltage RegulatorIC, LDO Voltage Regulator
RICHTEK TECHNOLOGY CORP.

6

L1811

Inductor, Multilayer,
Chip

ELCH0009109

0402CS-6N8XJEW 6.8NH 5% - 680mA 0.083OHM
4.8GHZ 20 NON SHIELD NONE 1.19X0.64X0.66MM
R/TP COILCRAFT SINGAPORE PTE LTD.

6

L114

Inductor, Multilayer,
Chip

ELCH0003820

LQG15HS3N0S02D 3NH 0.3NH - 300mA 0.17OHM
6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
MURATA MANUFACTURING CO., LTD.

6

C804

Capacitor, Ceramic,
Chip

GRM0335C1E3R0BD01D 3 pF, 25V, B, C0G, TC,
0603, R/TP, 0.000000000003, 0.1PF, 25V, C0G, ECCH0042009
55TO+125C, 0603, R/TP, 0.3 mm MURATA
MANUFACTURING CO., LTD.

6

U1201

IC, MM PMIC

EUSY0227205

LP8720TLX 2.7 To 5.5V Adj 1.2W CSP R/TP 20P NATIONAL SEMICONDUCTOR ASIA PACIFIC PTE.
LTD.

6

U171

Module, Tx Module

SMRH0006901

RF6260 0DBM 0DB 0% 0A 0A 0DB 0DBM 0DBM 0P
0.0x0.0x0.0MM - RF MICRO DEVICES INC

6

R1173

Resistor, Chip

ERHY0009527

MCR006YZPJ473 47KOHM 5% 1/20W 0603 R/TP ROHM.

6

R891,
R893

Resistor, Chip

ERHY0024601

RC0603J151CS 150OHM 5% 1/20W 0603 R/TP SAMSUNG ELECTRO-MECHANICS CO., LTD.

SFAC0002701

LFD211G57DPMD153 0.67 13.5 - 2050, 240 MHz,
0.67 dB, 13.5 dB, 1575, 6 MHz, 0.88 dB, 18.3 dB,
SMD, ETC, diplexer, GPS/PCS, 2.0*1.25, MURATA
MANUFACTURING CO., LTD.

6

FL1801

Filter, Separator,
Spdt

6

L1901

Inductor, Multilayer,
Chip

ELCH0003830

LQG15HSR18J02D 180NH 5% - 130mA 3.38OHM
500MHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
MURATA MANUFACTURING CO., LTD.

6

Q801

FET, Array

EBK61611301

NTUD3169CZ N/P-CHANNEL 20 8 0.22(0.2) 2(6)
0.125 SOT-963 R/TP 6P 2 ON SEMICONDUCTOR

6

C1177,
C184

Capacitor, Ceramic,
Chip

ECCH0009110

C0603X7R0J223KT 22nF 10% 6.3V X7R 55TO+125C 0603 R/TP - TDK CORPORATION

6

R1133

Resistor, Chip

ERHY0042406

Remark

RC0201JR-0751KL 51KOHM 5% 1/20W 0603 R/TP YAGEO CORPORATION

LGE Internal Use Only

- 238 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

6

L1121

6

CN1141

6

X184

6

PartNumber

Spec

Inductor, Wire
Wound, Chip

EAP61747901

VLS3010ET-100M 10UH 20% - 630mA 0.39OHM
1.8MHZ 19 SHIELD 3.03x3.03x1.0 NONE R/TP TDK
KOREA COOPERATION

Connector, BtoB

ENBY0053801

24-5804-030-000-829+ 30P 0.40MM STRAIGHT
FEMALE SMD R/TP 900mM - KYOCERA ELCO
KOREA SALES CO., LTD.

Oscillator, VCTCXO

EAW61443801

1XXA26000FBA 26MHZ 1PPM 1.8V 2.5x2.0x0.8MM ;
SMD R/TP DAISHINKU CORPORATION.

R1135

Resistor, Chip

ERHZ0000244

MCR01MZP5F2202 22KOHM 1% 1/16W 1005 R/TP ROHM.

6

C940

Capacitor, Ceramic,
Chip

ECZH0001217

GRM155R60J474K 470nF 10% 6.3V X5R -25TO+70C
1005 BK-DUP - MURATA MANUFACTURING CO.,
LTD.

6

L227

Inductor, Wire
Wound, Chip

EAP61785901

LQW15CN18NJ00D 18NH 5% - 1.4A - - 0.046OHM
3GHZ - SHIELD 1.0X0.5X0.5MM NONE R/TP
MURATA MANUFACTURING CO., LTD.

6

C123,
C175

Capacitor, Ceramic,
Chip

ECZH0000802

C1005C0G1H010CT 1pF 0.25PF 50V NP0 55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

6

L104,
L1924

Inductor, Multilayer,
Chip

ELCH0001430

LL1005-FHLR10J 100NH 5% - 150mA 2.2OHM
1.03GHZ 10 SHIELD NONE 1.0X0.5X0.5MM R/TP
TOKO, INC.

6

L152

Inductor, Multilayer,
Chip

ELCH0003813

LQG15HN47NJ02D 47NH 5% - 200mA 1.15OHM
1GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
MURATA MANUFACTURING CO., LTD.

6

ZD803

Diode, TVS

EDTY0008601

PSD05-LF 5V 6 13.5V 42A 500W SOD323 R/TP 2P 1
PROTEK DEVICES INC.

6

L245,
L248

Inductor, Multilayer,
Chip

ELCH0012510

LQW15AN15NG00D 15NH 2% - 460mA 0.16OHM
5GHZ 30 NON SHIELD NONE 1.0X0.5X0.5MM R/TP
MURATA MANUFACTURING CO., LTD.

6

SW101

Connector, RF

ENWY0005501

20279-001E-01 NONE STRAIGHT SOCKET SMD
R/TP AU 50OHM 400mDB I-PEX CO., LTD

6

C1271,
C195,
C222,
C933,
C941

Capacitor, Ceramic,
Chip

EAE62286801

CL03A104KP3NNNC 0.0000001F 10% 10V X5R 55TO+85C 0603 R/TP 0.3 SAMSUNG ELECTROMECHANICS CO., LTD.

LGE Internal Use Only

Description

- 239 -

Remark

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

Description

PartNumber

Spec

6

C1107,
C1173,
C1204,
C1205,
C1206,
C1207,
C1208,
C1832,
C1901,
C1902,
C1905,
C193,
C241,
C245,
C250,
C659,
C665

Capacitor, Ceramic,
Chip

ECCH0004904

GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C
1005 R/TP - MURATA MANUFACTURING CO., LTD.

6

C1134,
C1175,
C1176,
C1230,
C1231,
C1232,
C1233,
C1234,
C1237,
C1253,
C173,
C1802,
C1903,
C1907,
C191,
C1911,
C1912,
C1913,
C1914,
C1915,
C194,
C200,
C201,
C202,
C203,
C204,
C206,
C207,
C208,
C251,
C301,
C609,
C610,
C626

Capacitor, Ceramic,
Chip

ECCH0009101

C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R 55TO+85C 0603 R/TP - TDK CORPORATION

LGE Internal Use Only

- 240 -

Remark

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

Description

PartNumber

6

C646,
C654,
C655,
C915,
C916,
C917,
C918,
C919,
C920,
C921,
C922,
C925,
C928,
C929,
C930,
C931,
C932,
C938,
C939

Capacitor, Ceramic,
Chip

ECCH0009101

6

C1179,
C1212,
C223,
C224

Capacitor, Ceramic,
Chip

CL10A106MP8NNNC 10uF 20% 10V X5R ECCH0007803 55TO+85C 1608 R/TP 0.8MM SAMSUNG
ELECTRO-MECHANICS CO., LTD.

6

FL627

Filter, EMI/Power

EAM62230801

6

C1228,
C1235,
C1241,
C1252,
C192,
C243,
C248,
C901,
C902,
C903,
C904,
C905

Capacitor, Ceramic,
Chip

CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R ECCH0017601 55TO+85C 1005 R/TP 0.5MM SAMSUNG
ELECTRO-MECHANICS CO., LTD.

6

C1201

Capacitor, Ceramic,
Chip

GRM188R60J106M 10000000 pF, 6.3V, M, X5R, TC,
ECCH0005604 1608, R/TP, 0.8 mm MURATA MANUFACTURING
CO., LTD.

6

ZD801

Diode, TVS

EDTY0008602

PSD12-LF 12V 13.3 25.9V 21A 500W SOD323 R/TP
2P 1 PROTEK DEVICES INC.

6

U500

IC, Application
Processor

EUSY0425001

OMAP4430 , 54, 547pin, IC, Digital Signal Processors
BGA R/TP 547P TEXAS INSTRUMENTS KOREA
LTD, HONGKONG BRANCH.

6

U303

IC, Analog Switch

EUSY0186504

FSA2259UMX QFN , 8 , R/TP , Dual SPDT , ; , IC,
Analog Switch FAIRCHILD SEMICONDUCTOR

LGE Internal Use Only

Spec

Remark

C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R 55TO+85C 0603 R/TP - TDK CORPORATION

NFM18PS105R0J3D_ EMI 0HZ 1uF 0H SMD R/TP
6.3V, 2A, 0.03ohm MURATA MANUFACTURING
CO., LTD.

- 241 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

6

R588,
R591,
R594,
R596,
R597

Resistor, Chip

ERHY0009522

MCR006YZPJ332 3.3KOHM 5% 1/20W 0603 R/TP ROHM.

6

C1143

Capacitor, Array

EAE62463801

GNM0M2R60J105ME18D 1uF2 20% 6.3V 2R SMD
R/TP 4P MURATA MANUFACTURING CO., LTD.

6

C807,
C926

Capacitor, Ceramic,
Chip

CL03A474MQ3NNNH 0.47 uF, 6.3V, M, X5R, HD,
0603, R/TP, 0.0000047, 20%, 6.3V, X5R, -55TO+85C,
ECCH0034801
0603, R/TP, .3 mm SAMSUNG ELECTROMECHANICS CO., LTD.

6

R1802,
R500

Resistor, Chip

ERHY0009502

6

C1916,
C308,
C310,
C311,
C936

Capacitor, Ceramic,
Chip

GRM033R60J224M 0.00000022F 20% 6.3V X5R ECCH0032801 55TO+85C 0603 R/TP 0.3MM MURATA
MANUFACTURING CO., LTD.

6

C1141,
C1229,
C1236,
C1904,
C1906,
C1908,
C1909,
C1910,
C225,
C688,
C892,
C923

Capacitor, Ceramic,
Chip

CL03A105MQ3CSNH 0.000001F 20% 6.3V X5R ECCH0017301 45TO+85C 0603 R/TP - SAMSUNG ELECTROMECHANICS CO., LTD.

6

R1176,
R801,
R802

Resistor, Chip

ERHY0009505

MCR006YZPJ103 10KOHM 5% 1/20W 0603 R/TP ROHM.

6

U1904

IC, DC, DC
Converter

EUSY0416301

TPS62611YFDR CSP, 6, R/TP, DCDC Converter for
WiFi BT Module Power, IC, DC, DC Converter TEXAS
INSTRUMENTS KOREA LTD, HONGKONG
BRANCH.

6

CN1271

Connector, I/O

EAG62832201

78618-0001 19P 0.40MM ANGLE RECEPTACLE DIP
R/TP - HANKOOK MOLEX

6

C316,
C318,
C325

Capacitor, Low ESL

EAE62487001

LLL153C80J224ME14E 0.22uF 20% 6.3V X6S 55TO+105C 1005 R/TP 0.35T max. MURATA
MANUFACTURING CO., LTD.

6

FB1812,
FB1815,
FB1817,
FB1818

Filter, Bead

EAM62150301

CIM05J600NC 60 ohm 1.0X0.5X0.5 25% 0.2 ohm
0.65A SMD R/TP 2P 0 SAMSUNG ELECTROMECHANICS CO., LTD.

LGE Internal Use Only

Description

PartNumber

Spec

Remark

MCR006YZPJ100 10OHM 5% 1/20W 0603 R/TP ROHM.

- 242 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

6

R514,
R515

Resistor, Chip

ERHY0009593

MCR006YZPJ272 2.7KOHM 5% 1/20W 0603 R/TP ROHM.

6

C507,
C508,
C509

Capacitor, Ceramic,
Chip

ECCH0009206

GRM0335C1E680J 68pF 5% 25V X7R -55TO+125C
0603 R/TP - MURATA MANUFACTURING CO., LTD.

6

R1171,
R316

Resistor, Chip

ERHY0009526

MCR006YZPJ472 4.7KOHM 5% 1/20W 0603 R/TP ROHM.

6

ZD1172,
ZD1181,
ZD1182,
ZD1224,
ZD1225

Diode, TVS

EDTY0010101

ESD9B5.0ST5G ESD9B5.0ST5G, SOD-923, 5 V, 300
mW, R/TP, 15pF SCG HONG KONG SAR LTD.

6

U981

IC, Motor Driver

EUSY0238306

ISA1000 2.4~3.6V 150mV~300mV 0W DFN R/TP 8P -

6

U1101

IC, LDO Voltage
Regulator

EUSY0407401

RT9032 WDFN8L, 8, R/TP, Programmable Dual LDO,
IC, LDO Voltage RegulatorIC, LDO Voltage Regulator
RICHTEK TECHNOLOGY CORP.

6

SC791,
SC792,
SC793,
SC794,
SC795,
SC796

Clip

MCGY0003801 COMPLEX LG-KH3900 KTF ZZ:Without Color -

6

R804

Resistor, Chip

ERHZ0000222

MCR01MZP5F1503 150KOHM 1% 1/16W 1005 R/TP
- ROHM.

6

R827

Resistor, Chip

ERHZ0000298

MCR01MZP5F5600 560OHM 1% 1/16W 1005 R/TP ROHM.

6

FB1143

Filter, Bead

SFBH0008101

BLM15AG601SN1D 600 ohm 1.0X0.5X0.5 25% 0.6
ohm 0.3A SMD R/TP 2P 0 MURATA
MANUFACTURING CO., LTD.

6

C823

Capacitor, Ceramic,
Chip

ECZH0001420

C1608X5R1A105KT000E 1uF 10% 10V X5R 55TO+85C 1608 R/TP - TDK KOREA
COOPERATION

6

U301

IC, Digital Baseband
EUSY0432001
Processor, 3G

6

Q1186

TR, Bipolar

LGE Internal Use Only

Description

PartNumber

Spec

Remark

PMB9811 1.7VTO2V, 1.7VTO2V, 1.7VTO2V 100mW
300P - BGA P/TP 300P INFINEON TECHNOLOGIES
(ASIA PACIFIC) PTE LTD.

UMT2222A NPN 6V 75V 40V 600mA 100mA 100~300
EQBN0005301 200mW UMT3 R/TP 3P ROHM Semiconductor
KOREA CORPORATION

- 243 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

6

L801,
L802,
L804,
L805,
L806

6

PartNumber

Spec

Inductor, Wire
Wound, chip

ELCP0014001

CIG21LR47MNE 0.47 uH, M, 2.0*1.25*1.0, R/TP,
0.0000047, 20%, 1.3A, 0.08 ohm, SHIELD,
2X1.25X1MM, NONE, R/TP, Inductor, Wire Wound,
Chip SAMSUNG ELECTRO-MECHANICS CO., LTD.

R1133

Resistor, Chip

ERHY0042406

RC0201JR-0751KL 51KOHM 5% 1/20W 0603 R/TP YAGEO CORPORATION

6

X300,
X800

Crystal

EXXY0018701

FC-135(12.5PF, +-20PPM) 32.768KHZ 20PPM
12.5PF 32*15 SMD R/TP SEIKO EPSON CORP

6

R1102,
R1103,
R510,
R511

Resistor, Chip

ERHY0009511

MCR006YZPJ152 1.5KOHM 5% 1/20W 0603 R/TP ROHM.

6

R830

Resistor, Chip

ERHY0009553

MCR006YZPF1004 1MOHM 1% 1/20W 0603 R/TP ROHM Semiconductor KOREA CORPORATION

6

U801

IC, Charger

EUSY0410801

RT9524 DFN, 10, R/TP, DFN Cal Test Mode Single
Charger IC for Micro USB, IC, ChargerIC, Charger
RICHTEK TECHNOLOGY CORP.

6

R631,
R632

Resistor, Chip

EBC61856201

RC0201FR-07240RL 240OHM 1% 1/20W 0603 R/TP
- YAGEO CORPORATION

6

U350

IC, MCP, NAND

EUSY0425901

H8BCS0QG0MMR-46M NAND/1G SDRAM/512M
0VTO0V 8.0x9.0x1.0 TR 130P NAND+DRAM BGA HYNIX SEMICONDUCTOR INC.

6

R336

Resistor, Chip

ERHY0035301

RC1005F4021CS 4.02KOHM 1% 1/16W 1005 R/TP SAMSUNG ELECTRO-MECHANICS CO., LTD.

6

C1209,
C1210,
C1211,
C227,
C835,
C836,
C842,
C890,
C934,
C935

Capacitor, Ceramic,
Chip

CL05A225MP5NSNC 2.2uF 20% 10V X5R ECCH0007804 55TO+85C 1005 R/TP 0.5MM SAMSUNG
ELECTRO-MECHANICS CO., LTD.

6

C802

Capacitor, Ceramic,
Chip

ECCH0009514

MCH032A(AN)100DK 10pF 0.5PF 25V X7R 55TO+125C 0603 R/TP - ROHM.

6

L800,
L803

Inductor, Wire
Wound, Chip

ELCP0013901

XPL2010-681MEC 680NH 20% - 2.1A 2.19 2.1
0.057OHM 152MHZ - SHIELD 2X2X1.2MM NONE
R/TP COILCRAFT INC.

6

R850

Resistor, Chip

ERHY0009561

MCR006YZPF5602 56KOHM 1% 1/20W 0603 R/TP ROHM.

LGE Internal Use Only

Description

- 244 -

Remark

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

6

L303,
L304

Inductor, Wire
Wound, Chip

ELCP0008007

6

C306,
C307

Capacitor, Ceramic,
Chip

CL10A226MQ8NRNE 22uF 20% 6.3V X5R ECCH0017501 55TO+85C 1608 R/TP 0.8MM SAMSUNG
ELECTRO-MECHANICS CO., LTD.

6

R1195

Resistor, Chip

ERHY0009504

MCR006YZPJ102 1KOHM 5% 1/20W 0603 R/TP ROHM.

6

Q301

FET

EQFP0003601

NTJD4105CT1G P-CHANNEL MOSFET 20V +-12
660mA 0.63OHM 270mW SC70 R/TP 6P ON
SEMICONDUCTOR

6

C1101,
C1102,
C1103,
C1106,
C1121,
C1831,
C1923,
C891,
C975,
C978

Capacitor, Ceramic,
Chip

ECZH0001215

C1005X5R1A105KT000F 1uF 10% 10V X5R 55TO+85C 1005 R/TP - TDK KOREA
COOPERATION

6

C1132

Capacitor, Ceramic,
Chip

ECZH0003103

GRM36X7R104K10PT 100nF 10% 10V X7R 55TO+125C 1005 R/TP - MURATA
MANUFACTURING CO., LTD.

6

U811

IC, MUIC

EUSY0371201

MAX14526EEWP+TCC6 MAX14526EEWP+TCC6,
WLP, MUIC for 5Pin Micro USB WLP R/TP 20P
MAXIM INTEGRATED PRODUCTS INC.

6

R1173

Resistor, Chip

ERHY0009527

MCR006YZPJ473 47KOHM 5% 1/20W 0603 R/TP ROHM.

6

FL800

Filter, EMI/Power

SFEY0015301

NFM18PC104R1C3 ESD/EMI 0HZ 0.1uF 0H SMD
R/TP MURATA MANUFACTURING CO., LTD.

6

U721

IC, MCP, eMMC

EUSY0431102

SDIN5C2-8G-974D FBGA, 166, ETC, 8GB eMMC
v4.41 / 12.0x16.0x1.2 / 169ball, ;, IC, MCP SANDISK
CORPORATION

6

L988,
L989

Inductor, Multilayer,
Chip

ELCH0001444

0402AF-101XJEW 100NH 5% - 900mA 0.16OHM
1.4GHZ 8 NON SHIELD NONE 1.12X0.66X0.66MM
R/TP COILCRAFT SINGAPORE PTE LTD.

6

R1190,
R1191,
R896,
R897

PCB ASSY,
MAIN,
PAD OPEN

SAFO0000401

AX3100 ATL SV_SHIPBACK, MAIN, A, 0OHM DNI

6

R828

Resistor, Chip

ERHZ0000236

MCR01MZP5F2001 2KOHM 1% 1/16W 1005 R/TP ROHM.

LGE Internal Use Only

Description

PartNumber

Spec

Remark

MIPS2520D3R3M 3.3UH 30% - 1A 0.12OHM - SHIELD 2.5X2X1MM NONE R/TP FDK
CORPORATION.

- 245 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

6

R986

6

C1812,
C1815,
C1816,
C1817,
C1818,
C1822,
C209,
C230,
C231,
C249,
C924,
C927,
C937

6

R848

6

6

Description

PartNumber

Spec

Resistor, Chip

ERHZ0000487

MCR01MZP5J474 470KOHM 5% 1/16W 1005 R/TP ROHM.

Capacitor, Ceramic,
Chip

CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R ECCH0000198 55TO+85C 1005 R/TP . SAMSUNG ELECTROMECHANICS CO., LTD.

Resistor, Chip

ERHY0009516

MCR006YZPJ222 2.2KOHM 5% 1/20W 0603 R/TP ROHM.

FB741,
FB743

Filter, Bead

SFBH0006806

CIM05J601NC 600 ohm 1.0X0.5X0.5 25% 0.6 ohm
0.3A SMD R/TP 2P 0 SAMSUNG ELECTROMECHANICS CO., LTD.

CN801

Connector, I/O

GU077-5P-SD-E1500 5, 0.65 mm, ETC, 0.64MM,
ENRY0011501 RECEPTACLE, DIP, R/TP, Reverse, Offset (1.50mm),
SUS plate LS Mtron Ltd.

6

U502

IC, Buffer

EUSY0428301

CDC3S04 1.65~1.95 999 999 999W 999W 33~68 4
WCSP R/TP 20P Quad Sine-wave Clock Buffer
TEXAS INSTRUMENTS KOREA LTD, HONGKONG
BRANCH.

6

R809

Resistor, Chip

ERHZ0000538

MCR01MZP5F3303 330KOHM 1% 1/16W 1005 R/TP
- ROHM.

6

R186

Resistor, Chip

ERHY0009503

MCR006YZPJ101 100OHM 5% 1/20W 0603 R/TP ROHM.

6

U800

IC, PMIC

EAN62093401

TWL6030B107CMR 2.5 to 4.8V adj 1.7W BGA R/TP
187P - TEXAS INSTRUMENTS KOREA LTD,
HONGKONG BRANCH.

6

R337

Resistor, Chip

ERHY0040202

Remark

RC0201FR-074R7L 4.7OHM 1% 1/20W 0603 R/TP YAGEO CORPORATION

6

U701

IC, MCP, NAND

EUSY0429001

K3PE4E400M-XGC1 4096MBIT 1.14VTO1.3V,
1.7VTO1.95V 12.0x12.0x0.71 TR 216P DRAM FBGA
4Gb LPDDR2 PoP 216ball for OMAP4 Series Chipset
(44nm) SAMSUNG ELECTRONIC CO., LTD

6

C986

Capacitor, Ceramic,
Chip

ECZH0001120

CC1005X7R1H392KT000F 3.9nF 10% 50V X7R 55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

LGE Internal Use Only

- 246 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

6

X500

6

R1101,
R1126,
R1202,
R1271

6

Description

PartNumber

Spec

Oscillator, TCXO

EXST0002601

1XXB38400FAA 38.4 MHz, 1.5 PPM, 10 pF, SMD,
2.5*2.0*0.8, 38.4, 1.5PPM, 1.8V, 2.5, 2.0, 0.8, SMD,
R/TP DAISHINKU CORPORATION.

Resistor, Chip

ERHY0009506

MCR006YZPJ104 100KOHM 5% 1/20W 0603 R/TP ROHM.

U971

IC, Acceleration
Sensor

EUSY0410101

KXTF9 1.8V to 3.6V 400KHZ 12BIT 1SPS 1W LGA
R/TP 10P Accelerometer Sensor - LGA R/TP 10P KIONIX, INC.

6

U961

IC, Gyro Sensor

EUSY0434601

MPU3050 1.8~3.6 Gyro Sensor - QFN R/TP 24P INVENSENSE

6

U851

IC, Analog Switch

EAN61871401

FSUSB63 2.7~4.3V 400NSEC 45NSEC 0W MLP
R/TP 12P 1 FAIRCHILD SEMICONDUCTOR HONG
KONG LTD.

6

R1905,
R894,
R895,
R919,
R921

PCB ASSY,
MAIN,
PAD SHORT

SAFP0000401

LG-LU3000 LGTBK, MAIN, A,

6

C188

Capacitor, Ceramic,
Chip

ECZH0001108

C1005X7R1E682KT000F 6.8nF 10% 25V X7R 55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

6

C961

Capacitor, Ceramic,
Chip

ECCH0000147

MCH155CN222KK 2.2nF 10% 50V X7R -55TO+125C
1005 R/TP - ROHM.

6

FB800,
FB803

Filter, Bead

EAM62071001

BLM18KG221SN1D 220 ohm 1.6X0.8X0.8 25% 0.05
ohm 2.2A SMD R/TP 2P 0 MURATA
MANUFACTURING CO., LTD.

6

FB801,
FB802,
FB804,
FB805,
FB806

Filter, Bead

EAM62071101

BLM15PD121SN1D 120 ohm 1.0X0.5X0.5 25% 0.09
ohm 1.3A SMD R/TP 2P 0 MURATA
MANUFACTURING CO., LTD.

6

L1903

Inductor, Wire
Wound, chip

ELCP0012801

MIPS2520D1R5 1.6 uH, N, 2.5*2.0*1.0, R/TP,
0.0000015, 30%, 1.2A, 0.1 OHM, 2.5X2X1MM, NONE,
R/TP, Inductor, Wire Wound, Chip FDK
CORPORATION.

7

D101,
D102,
D103,
D104

Diode, TVS

EDTY0008606

PRSB6.8C 4.7V 5.7 - - 10W - R/TP 2P 1 PROTEK
DEVICES INC.

7

CN103

Connector, BtoB

ENBY0039601

Remark

GB042-20S-H10-E3000 20P 0.4MM STRAIGHT
SOCKET SMD R/TP 1M - LS Mtron Ltd.

LGE Internal Use Only

- 247 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

Description

PartNumber

7

C1101,
C1102,
C1103,
C1106,
C1121,
C1831,
C1923,
C891,
C975,
C978

Capacitor, Ceramic,
Chip

ECZH0001215

C1005X5R1A105KT000F 1uF 10% 10V X5R 55TO+85C 1005 R/TP - TDK KOREA
COOPERATION

7

C1132

Capacitor, Ceramic,
Chip

ECZH0003103

GRM36X7R104K10PT 100nF 10% 10V X7R 55TO+125C 1005 R/TP - MURATA
MANUFACTURING CO., LTD.

7

U101

IC, Ambient Light
Sensor

EUSY0431901

APDS-9900 - - - - - - AVAGO TECHNOLOGIES
INTERNATIONAL SALES PTE. LIMITED

7

FB741,
FB743

Filter, Bead

SFBH0006806

CIM05J601NC 600 ohm 1.0X0.5X0.5 25% 0.6 ohm
0.3A SMD R/TP 2P 0 SAMSUNG ELECTROMECHANICS CO., LTD.

7

L988,
L989

Inductor, Multilayer,
Chip

ELCH0001444

0402AF-101XJEW 100NH 5% - 900mA 0.16OHM
1.4GHZ 8 NON SHIELD NONE 1.12X0.66X0.66MM
R/TP COILCRAFT SINGAPORE PTE LTD.

7

CN104

Connector, BtoB

ENBY0052001

24-5804-010-000-829+ 10P 0.40MM STRAIGHT
FEMALE SMD R/TP 900mM - KYOCERA ELCO
KOREA SALES CO., LTD.

7

CN101

Connector, BtoB

ENBY0057401

14-5804-034-000-829+ 34, 0.4 mm, STRAIGHT, gold,
34, 0.40MM, STRAIGHT, MALE, SMD, 0.9T,
KYOCERA ELCO KOREA SALES CO., LTD.

7

C153

Capacitor, Ceramic,
Chip

MCH155A220JK 22pF 5% 50V NP0 -55TO+125C
ECCH0000115 1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

7

CN101

Connector, BtoB

ENBY0051901

14-5804-010-000-829+ 10P 0.40MM STRAIGHT
MALE SMD R/TP 900mM - KYOCERA ELCO KOREA
SALES CO., LTD.

7

J101

Jack, Phone

EAG62831701

KJA-PH-3-0176 4P 4P ANGLE R/TP 3.5M BLACK 5P
6.5x12.6x4.0t, Short Detect, All DIP type KSD CO.,
LTD

7

CN103,
CN104

Contact

MCIZ0008401

COMPLEX LG-C900 ATTDW ZZ:Without Color
PRESS, BeCu, , 3.0, 1.2, 1.5,

7

C106

Capacitor, Ceramic,
Chip

ECZH0001002

C1005CH1H0R5BT000F 0.5pF 0.1PF 50V NP0 55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

7

L147,
L158,
L168

Inductor, Multilayer,
Chip

ELCH0001404

LL1005-FHL1N5S 1.5NH 0.3NH - 400mA 0.13OHM
15GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
TOKO, INC.

LGE Internal Use Only

Spec

- 248 -

Remark

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

7

SW101

Connector, RF

ENWY0005501

20279-001E-01 NONE STRAIGHT SOCKET SMD
R/TP AU 50OHM 400mDB I-PEX CO., LTD

7

LD101,
LD102,
LD103,
LD104

LED, Chip

EDLH0015109

19-219UTD-S592/TR8 WHITE 2.7~3.1 25mA
112~285mcd x, y 95mW 1608 R/TP 2P EVERLIGHT ELECTRONICS CO., LTD.

7

L988,
L989

Inductor, Multilayer,
Chip

ELCH0001444

0402AF-101XJEW 100NH 5% - 900mA 0.16OHM
1.4GHZ 8 NON SHIELD NONE 1.12X0.66X0.66MM
R/TP COILCRAFT SINGAPORE PTE LTD.

7

L101,
L102

Inductor, Multilayer,
Chip

ELCH0004717

1005GC2T82NJLF 82NH 5% - 150mA 2.1OHM
700MHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
PILKOR ELECTRONICS LTD.

7

R101,
R102,
R103,
R104

Resistor, Chip

ERHZ0000415

MCR01MZP5J131 130OHM 5% 1/16W 1005 R/TP ROHM.

7

C116,
C117,
C121,
C132,
C151,
C163

Capacitor, Ceramic,
Chip

ECZH0000830

C1005C0G1H330JT000F 33pF 5% 50V NP0 55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

7

ZD1172,
ZD1181,
ZD1182,
ZD1224,
ZD1225

Diode, TVS

EDTY0010101

ESD9B5.0ST5G ESD9B5.0ST5G, SOD-923, 5 V, 300
mW, R/TP, 15pF SCG HONG KONG SAR LTD.

7

C172

Capacitor, Ceramic,
Chip

ECCH0000182

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C
1005 R/TP - MURATA MANUFACTURING CO., LTD.

7

FB1174,
FB901,
FB913,
FB914,
FB941

Filter, Bead

SFBH0007101

BLM15AG121SN1D 120 ohm 1.0X0.5X0.5 25% 0.25
ohm 0.5A SMD R/TP 2P 0 MURATA
MANUFACTURING CO., LTD.

7

C110

Capacitor, Ceramic,
Chip

CL05C270JB5NNNC 27pF 5% 50V NP0 -55TO+125C
ECCH0000117 1005 R/TP 0.5 SAMSUNG ELECTRO-MECHANICS
CO., LTD.

7

CN102

Connector, BtoB

ENBY0053501

14-5804-020-000-829+ 20P 0.40MM STRAIGHT
MALE SMD R/TP 900mM - KYOCERA ELCO KOREA
SALES CO., LTD.

6

CN101

Connector, BtoB

ENBY0057401

14-5804-034-000-829+ 34, 0.4 mm, STRAIGHT, gold,
34, 0.40MM, STRAIGHT, MALE, SMD, 0.9T,
KYOCERA ELCO KOREA SALES CO., LTD.

LGE Internal Use Only

Description

PartNumber

Spec

- 249 -

Remark

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

Description

PartNumber

6

C103,
C105

Capacitor, Ceramic,
Chip

ECCH0002001

C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P 30TO+85C 1005 R/TP - TDK CORPORATION

6

CN102

Connector, BtoB

ENBY0051001

GB042-10S-H10-E3000 10P 0.4MM STRAIGHT
FEMALE SMD R/TP 1M - LS Mtron Ltd.

6

R117,
R118

Resistor, Chip

ERHY0000193

RC1005F270CS 27OHM 1% 1/16W 1005 R/TP SAMSUNG ELECTRO-MECHANICS CO., LTD.

6

ZD1172,
ZD1181,
ZD1182,
ZD1224,
ZD1225

Diode, TVS

EDTY0010101

ESD9B5.0ST5G ESD9B5.0ST5G, SOD-923, 5 V, 300
mW, R/TP, 15pF SCG HONG KONG SAR LTD.

6

VA103

Varistor

SEVY0003901

EVL5M02200 5.5V 0% 480F 1.0*0.5*0.6 NONE SMD
R/TP AMOTECH CO., LTD.

6

R112

Resistor, Chip

ERHZ0000405

MCR01MZP5J103 10KOHM 5% 1/16W 1005 R/TP ROHM.

6

R101

Resistor, Chip

ERHY0000254

MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP ROHM.

6

S101

Socket, Card

ENSY0023802

SCHB1B0201 Micro-SD 8P ANGLE SMD R/TP ALPS ELECTRIC KOREA CO., LTD.

6

C1201

Capacitor, Ceramic,
Chip

GRM188R60J106M 10000000 pF, 6.3V, M, X5R, TC,
ECCH0005604 1608, R/TP, 0.8 mm MURATA MANUFACTURING
CO., LTD.

6

C1228,
C1235,
C1241,
C1252,
C192,
C243,
C248,
C901,
C902,
C903,
C904,
C905

Capacitor, Ceramic,
Chip

CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R ECCH0017601 55TO+85C 1005 R/TP 0.5MM SAMSUNG
ELECTRO-MECHANICS CO., LTD.

6

U101

IC, DC, DC
Converter

EAN61850201

6

C112

Capacitor, Ceramic,
Chip

MCH155A100D 10pF 0.5PF 50V NP0 -55TO+125C
ECCH0000110 1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

LGE Internal Use Only

Spec

Remark

LM3559TLX 2.5 to 5.5V adj 0W MICRO SMD R/TP
16P - NATIONAL SEMICONDUCTOR ASIA PACIFIC
PTE. LTD.

- 250 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location No.

Description

6

C1812,
C1815,
C1816,
C1817,
C1818,
C1822,
C209,
C230,
C231,
C249,
C924,
C927,
C937

Capacitor, Ceramic,
Chip

CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R ECCH0000198 55TO+85C 1005 R/TP . SAMSUNG ELECTROMECHANICS CO., LTD.

6

CN110

Contact

MCIZ0008701

COMPLEX L-04C, ANTTWV ZZ:Without Color
PRESS, YCUT-FX, 4.2, 2.5, 1.5,

6

U102

IC, LDO Voltage
Regulator

EUSY0353801

RP103K331D 1.7V TO 5.25V 3.3V 400mW DFN R/TP
4P - RICOH COMPANY, LTD.

6

LD101

LED, Chip

EDLM0009501

LXCL-PWF4 WHITE 2.8~4.6 150mA 28~59cd NA 1W
2016 R/TP 2P - LUMILEDS LIGHTING U.S., LLC

6

L101

Inductor, Wire
Wound, chip

ELCP0008008

MIPS2520D1R0M MIPS2520D1R0M, 1 uH, M,
2.0x2.5x1.0, R/TP, MLCI FDK CORPORATION.

6

D1175

Diode, TVS

EDTY0009801

VSMF05LCC 5V 6V 12V 2A 25W SOT-963 R/TP 6P 5
PROTEK DEVICES INC.

6

C1101,
C1102,
C1103,
C1106,
C1121,
C1831,
C1923,
C891,
C975,
C978

Capacitor, Ceramic,
Chip

ECZH0001215

C1005X5R1A105KT000F 1uF 10% 10V X5R 55TO+85C 1005 R/TP - TDK KOREA
COOPERATION

6

J101

Card Socket

ENSY0022101

GCA26C-6S-H15-E1500 GCA26C-6S-H15-E1500, 6,
ETC2.54 mm, H=1.5 LS Mtron Ltd.

6

VA102

Varistor

SEVY0001001

EVLC14S02050 14V 0% 50F 1.0*0.5*0.6 NONE SMD
R/TP AMOTECH CO., LTD.

LGE Internal Use Only

PartNumber

Spec

- 251 -

Remark

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

11
12.3 Accessory

Level

Location No.

2

EAB010200

Note: This Chapter is used for reference, Part order is
ordered by SBOM standard on GCSC

Description

PartNumber

Spec

EAB62410801

COSMO 3mW 16OHM 5DB 20HZTO20KHZ 1M
BLACK 4 POLE PLUG - CRESYN CO., LTD

Rechargeable
Battery,
Lithium Ion

EAC61679801

Remark

FL-53HN_WWU_TOCAD PRISMATIC 3.7V 1.5AH
300mAH 45x53x5.3 54.5x47.8x5.7 BLACK Frame Type
534553, 1500mAh, Frame, WW, Up TOCAD
DONG-HWA CO., LTD

Earphone, Stereo

2

EAC00

2

EAY060000

Adapters

EAY62531701

SC0600LGA 100-240V 5.0V 1A 50-60Hz CB, CE
WALL 2P USB - SALCOMP OY

2

AFN053800

Manual Assembly,
Operation

AFN75494322

LGP920.ANEUMN ZZ:Without Color LGP920 manual
assy for NEU

3

MBM062602

Card, Quick
Reference

MBM63496413

COMPLEX LGP920.ADEUML ZZ:Without Color
NORWEGIAN_Simple Manual

3

MBM062601

Card, Quick
Reference

MBM63496412

COMPLEX LGP920.ADEUML ZZ:Without Color
FINNISH_Simple Manual

3

MBM062600

Card, Quick
Reference

MBM63496411

COMPLEX LGP920.ADEUML ZZ:Without Color
DANISH_Simple Manual

3

MBM062603

Card, Quick
Reference

MBM63496414

COMPLEX LGP920.ADEUML ZZ:Without Color
SWEDISH_Simple Manual

3

MFL053800

Manual,
Operation

MFL67303501

COMPLEX LGP920.ANEUML ZZ:Without Color Safety
Guide for P920 NEU

3

MBM087200

CARD,
WARRANTY

MCDF0001123 KP202 TNR BK, ZZ, PRINTING

LGE Internal Use Only

- 252 -

Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes