Witaj KGS. Jeszcze raz ja. Jeszcze jedna paczka z danymi o preskalerach. Danych nigdy za wiele. Może się przydadzą. Mam poza tym jedno pytanie. Widzę że zgłębiasz podobne tematy jak ja. Mam prawie na ukończeniu pewien fajny miernik. Brakuje mi tylko jednej niedrogiej części. Jest na Ebaju około 1$ szt. a u nas nie osiągalna. Tak się pytam czy przypadkiem jej nie posiadasz. Jest to MSA2111. W paczce o preskalerach dorzuciłem PDF-a o tym małym "robaczku". Pozdrawiam
www.DataSheetLIST.com
Preskaler do miernika
częstotliwości AVT−2235
Do czego to służy?
Proponowany układ jest z pewnością
jednym z najprostszych, jakie kiedykol−
wiek pozwoliłem sobie zaprezentować
moim Czytelnikom. Pomimo tej prostoty
jest to układ w pełni funkcjonalny, znacz−
nie rozszerzający możliwości miernika
częstotliwości AVT .
Z miernika częstotliwości AVT–2235
w zasadzie byłem bardzo zadowolony.
Konstrukcja „wyszła” mi całkiem zgrabna,
malutki przyrząd nie wymagał ani wielkich
nakładów pracy, ani też zdobywania trudno
dostępnych i drogich części. Niestety, przy−
rząd ten posiada jedną, w przypadku mier−
nika częstotliwości dość istotną wadę: nie−
jednokrotnie zbyt mały zakres pomiarowy:
tylko do 1MHz. To prawda, że w przypadku
dokonywania pomiarów większości pros−
tych układów cyfrowych jest to wartość
wystarczająca. W wielu przypadkach, kie−
dy badana częstotliwość jest nam mniej
więcej znana możemy poradzić sobie bez
rozszerzania zakresu pomiarowego. Jeżeli
np. wiemy, że mierzona częstotliwość za−
wiera się w zakresie 1 2MHz, a nasz mier−
nik pokaże wynik wynoszący np. 123456,
to z dużym prawdopodobieństwem może−
my przyjąć, że wartość zmierzona wynosi
1,123456MHz. Zgodzimy się jednak
wszyscy, że taka „metoda” dokonywania
pomiarów nie przystoi, obiecującym adep−
tom pięknej sztuki konstruowania układów
elektronicznych. Co zatem wypada uczy−
nić? Budować nowy miernik z powiększo−
nym zakresem? Nie, nie sądzę aby miało
to sens. Budowa miernika częstotliwości
a wyświetlaniem 8–o cyfrowym jest całko−
wicie możliwa, ale możliwości takiego
przyrządu pozostałyby najczęściej nie wy−
korzystane. W większości przypadków,
przy pomiarach częstotliwości rzędu kilku−
dziesięciu MHz odczyt dziesiątek i jednos−
tek nie ma najmniejszego znaczenia i dwie
„najmłodsze”, najczęściej stale migające
cyfry tylko denerwowałyby Użytkownika
takiego przyrządu pomiarowego.
A zatem nie musimy budować nowe−
go układu miernika częstotliwości i pozo−
Rys. 1.
60
2278
staniemy przy już wykonanym. Pomyśl− ciach. Oczywiście, budowane są dzielniki
my tylko, jak rozszerzyć jego możliwości. częstotliwości sprawnie działające nawet
Najprostszą i ogólnie znaną metodą roz− przy częstotliwościach rzędu gigaherców,
szerzenia zakresu pomiarowego miernika ale są to elementy bardzo drogie i trudno
częstotliwości jest zastosowania tzw. pre− osiągalne. Nam potrzebny jest licznik mo−
skalera. Dla wyjaśnienia tego pojęcia posłu− dulo 10, który będziemy mogli zakupić
żymy się prostym porównaniem. Z pewnoś− w każdym sklepie z częściami elektronicz−
cią każdy z Was wie, jak można zmienić za− nymi, najlepiej kostka z którejś z znanych
kres pomiarowy woltomierza, normalnie pra− rodzin TTL lub CMOS. Zabrałem się za
cującego na zakresie np. 200V. Wystarczy na wertowanie katalogu układów TTL firmy
jego wejściu dodać wstępny dzielnik napię− Texas Instruments i prawie natychmiast
cia z rezystorami o wartościach w stosunku znalazłem potrzebny układ. Jest nim licznik
1:10 i już mamy woltomierz o zakresie dziesiętny typu 74S196! Kostka ta wystę−
2000V! Taki dzielnik napięcia jest też swoje− puje w trzech odmianach: standard, S i LS,
go rodzaju preskalerem, zmieniającym uży− a jej wyprowadzenia zostały pokazane na
teczny zakres przyrządu pomiarowego. rysunku 1. Najbardziej interesuje nas gwa−
W przypadku miernika częstotliwości spra− rantowana przez producenta maksymalna
wa ma się podobnie: aby uzyskać zakres po− częstotliwość, z jaką te układy mogą praco−
miarowy do 10MHz wystarczy wstępnie po− wać (patrz tabela 1).
A zatem mamy już to, o co nam chodzi−
dzielić badaną częstotliwość przez 10. Za−
kres do 100MHz otrzymamy przy podziale ło. Kostka 74196 zawiera w swojej struk−
badanej częstotliwości przez 100, a częstot− turze, podobnie jak popularna 7490, dwa
liwości rzędu gigaherców możemy mierzyć liczniki: modulo 2 i modulo 5, które po kas−
kadowym połączeniu dadzą nam licznik
po zastosowaniu preskalera 1:1000.
Tak problem konstrukcyjny z pozoru wy− mogący przyjąć na swoje wejście częstot−
gląda na bardzo prosty. Zostawmy w spo− liwości do 100MHz. Grzać to się będzie
koju gigaherce i zadowolimy się możliwoś− jak jasna cholera, prawie 400mW mocy
cią dokonywania pomiarów częstotliwości traconej w kostce w obudowie DIL to nie
w zakresie do 100MHz. Wystarczy zatem bagatelka, ale działać będzie. Niestety, tak
dobudować do naszego układu dwa liczni− pięknie wyglądało to tylko w katalogu. Wy−
ki dekadowe, prosty przełącznik służący daje mi się, że układ 74196 w wersji „S”
wybieraniu stopnia podziału i po kłopocie. istniał tylko na papierze, ponieważ mimo
To prawda, ale tylko w połowie. Nie ma usilnych starań nie mogłem go nigdzie ku−
najmniejszego problemu z znalezieniem pić. Chyba coś tu komuś nie wyszło.
licznika
dziesiętnego, Tabela 1
który pracowałby bez
Typ
CLOCK 1
CLOCK 2
Moc tracona
problemów z częstotli−
74196
0...50MHz
0...25MHz 240mW
wością do 10MHz. Spra−
74S196
0...100MHz 0...50MHz 375mW
wa komplikuje się przy
74LS196
0...30MHz
0...15MHz 80mW
wyższych częstotliwoś−
ELEKTRONIKA DLA WSZYSTKICH 7/98
Montaż
i uruchomienie
Na rysunku 3 została poka−
zana mozaika ścieżek płytki
drukowanej preskalera, wyko−
nanej na laminacie jednostron−
nym oraz rozmieszczenie na
niej elementów. Nie ma sensu
rozwodzić się nad sposobem
zmontowania typowego ukła−
du składającego się z dwóch
układów scalonych. Warto je−
dynie wspomnieć, że na płyt−
Nie martwmy się jednak. Częstotli−
wość, którą możemy mierzyć przy zasto−
sowaniu kostek 74196 serii Standard lub
LS są też bardzo wysokie i miernik o ta−
kim zakresie zaspokoi z pewnością po−
trzeby wszystkich konstruktorów ukła−
dów cyfrowych. Ponadto, praktyka wyka−
zuje, że podane wyżej parametry są gwa −
rantowane przez producenta, a rzeczy−
wistości układy 74196 pracują poprawnie
jeszcze przy nieco wyższych częstotli−
wościach. Układ modelowy, wykorzystu−
jący „najgorszą” wersję 74196 – LS dzia−
łał jeszcze przy częstotliwości wejścio−
wej ok. 40MHz! A może wytrwałym czy−
telnikom EdW uda się zdobyć kostki
74S196?
Wykaz elementów
Rezystory
R1: 510Ω
R2, R3: 10kΩ
Kondensatory
C1: 1µF
C2: 100pF
Półprzewodniki
IC1: 74S196 (74196, 74LS196)
IC2: 74LS90
T1: BC337
Pozostałe
CON1: 2 x goldpin kątowy 3 piny
CON2: gniazdo BNC
REL1: przekaźnik OMRON 5V
S1: przełącznik dźwigienkowy
Jak to działa?
Schemat elekt−
ryczny
modułu
preskalera został
przedstawiony na
rysunku 2. Sygnał
wejściowy poda−
wany jest za po− Rys. 3. Schemat montażowy
średnictwem re−
zystora R2 na bazę tranzystora T1, który ce drukowanej umieszczono dwa złącza:
bezpośrednio steruje wejściem zegaro− CON1 i złącze oznaczone jedynie prosto−
wym pierwszego z liczników zawartych kątem na stronie opisowej płytki, które
w strukturze układu 74196. Jest to służą do połączenia modułu preskalera
„szybszy” licznik, pracujący modulo 2, z miernikiem częstotliwości. Połączenie
z którego wyjścia sygnał podawany jest to wykonamy za pomocą dwóch szere−
na wejście drugiego licznika, dokonujące− gów goldpinów kątowych, każdy po trzy
go dalszego podziału częstotliwości we− piny. Złącze CON1 przekazuje do modułu
jściowej, tym razem przez 5. Z wyjścia te− preskalera napięcie zasilające i przenosi
go licznika częstotliwość podzielona sygnał wejściowy, natomiast drugie złą−
przez 10 podawana jest na wejście deka− cze nie ma żadnej funkcji, poza mecha−
dy 74LS90, której zasady działania nie nicznym ustabilizowaniem połączenia
płytek.
musimy chyba sobie przypominać.
Jako S1 zastosujemy przełącznik
Przekaźnik REL1 umożliwia wybranie
potrzebnego stopnia podziału. W pozycji dźwigniowy dwupozycyjny, a jako we−
styków przekaźnika takiej, jak na rysunku jście CON2 typowe gniazdko BNC.
Zbigniew Raabe
na wyjście CON1 podawana jest częstotli−
wość podzielona przez 100. Po włączeniu
przekaźnika za pomocą przełącznika S1 na
wyjście modułu przekazany zostanie syg−
nał wejściowy podzielony przez 10.
To chyba wszystko, co można powie−
dzieć o działaniu tak niezwykle prostego
układu!
Preskalery
Part Description Package Pins product
11C90DCQR 650 MHz prescalers J16A 16 National Sem.
11C91DCQR 650 MHz prescalers J16A 16 National Sem.
ADF4110 Single, Integer-N, 550 MHz PLL With Programmable Prescaler And
Charge Pump - Analog Devices
ADF4111 Single, Integer-N, 1.2 GHz PLL With Programmable Prescaler And
Charge Pump - Analog Devices
ADF4112 Single, Integer-N 3.0 GHz PPL With Programmable Prescaler And
Charge Pump - Analog Devices
ADF4113 Single, Integer-N 4.0 GHz PLL With Programmable Prescaler And
Charge Pump - Analog Devices
CA3179 1.25 GHz x64/x256 prescaler
RCA
CND2047 10GHz frequency divider by 4 fixed modulus prescaler. Chip,
SOIC8, FTP8 8 Toshiba
CND2050-DAF/20 0.5-11.5 GHz divide by 4 static prescaler. SOIC8 8
Toshiba
COP87L88RD 8-Bit CMOS OTP Microcontrollers with 16k or 32k Memory and
8-Channel A/D with Prescaler MDIP, PLCC 40, 44 National Sem.
D602 3V, 6GHz divide-by-2 static prescaler final. SOIC 8 SANYO
DN8506S Prescaler IC for TV and VCR tuners - Panasonic
DN8522S-A Prescaler IC for CATV - Panasonic
DS8673N Low Power VHF/UHF Prescalers - National Sem.
HD10551 Prescaler for digital tuning system SP-8 8 Hitachi Sem.
HMC251MS8 SMT prescaler 3.0 -6.5 GHz MSOP 8 Hitachi Sem.
IFD50010 Avantek 5 GHz prescaler /4
Hitachi Sem.
IFD53010 Silicon bipolar MMIC 3.5 GHz divide-by-4 static prescalers -- 4
Hitachi Sem.
IFD53110 Silicon bipolar MMIC 5.5 GHz divide-by-4 static prescalers -- 4
Hitachi Sem.
KGF2701 2.0 GHz two-modulus prescaler PSOP 8 National Sem.
KGL2115 UNF-band digital device. 2-modulus prescaler. SOP 8 National
Sem.
KGL2132 2.0 GHz two-modulus prescaler PSOP 8 National Sem.
KGL2135 1.7 GHz two-modulus prescaler PSOP 8 National Sem.
LB3500 1/8 prescaler for PLL electronic tuning SEP9 9 SANYO
LMX5080M PLLatinum 2.7 GHz Low Power Dual Modulus Prescaler for RF
Personal Communications - National Sem.
MB15E03SLP Single serial input PLL freguency synthesizer on-chip 1.2 GHz
prescaler SSOP, BCC 16 Fujitsu
MB15E05SLPV Single serial input PLL frequency synthesizer On-chip 2.0
Ghz prescaler BCC 16 Fujitsu
MB15E07LP Single serial input PLL frequency synthesizer On-chip 2.5 Ghz
prescaler BCC 16 Fujitsu
MB501L Two modulus prescaler DIP 8 Fujitsu
MB501LP =NE701=MC12022 divider/64/65/128/129 1.2 GHz DIP8 8 Fujitsu
MB501LPF =NE701D same in SMD SO-8 8 Fujitsu
MB504L Two modulus prescaler DIP 8 Fujitsu
MB506P Prescaler /64/128/256 max. 2.5 GHz DIP8 8 Fujitsu
MB506PF Prescaler /64/128/256 max. 3 GHz see UPB1505 SO8 8 Fujitsu
MB510 Prescaler /128/144/256/272 max. 2,7 GHz SO8 8 Fujitsu
MB511 Prescaler /1/2/8 max.1.2GHz sensitive: -26 dBm DIP8 8 Fujitsu
MC12009P Dual modulus prescaler PDIP 16 Motorola
MC12011 8/9 divider max. 600 MHz.
Motorola
MC12011P Dual modulus prescaler PDIP 16 Motorola
MC12015P Dual modulus prescaler PDIP 8 Motorola
MC12016 40/41 divider max. 250 MHz =135C05 8 Motorola
MC12016P Dual modulus prescaler PDIP 8 Motorola
MC12017 divider
Motorola
MC12018 divider 128/129 550MHz low power DIP8 8 Motorola
MC12019 Dual modulus prescaler SO-8, PDIP 8 Motorola
MC12022D See also MB501LPF, 64/65/128/129 divider 1.2 GHz SO-8, PDIP 8
Motorola
MC12022SL V(cc): -0.5 to +7.0V; 1.1GHz low power dual modulus prescaler
PDIP, SO8 8 Motorola
MC12023P 225 MHz prescaler PDIP 8 Motorola
MC12025P 520 MHz dual modulus prescaler PDIP 8 Motorola
MC12026A 1.1 GHz dual modulus prescaler 8/9/16/17 divider SO8, PDIP 8
Motorola
MC12028A 1.1 GHz dual modulus prescaler SO-8, PDIP 8 Motorola
MC12032AD 64/65/128/129 divider 2 GHz SO8 8 Motorola
MC12033AD 2.0 GHz low voltage dual modulus prescaler SO-8, PDIP 8
Motorola
MC12034AD 2.0 GHz dual modulus prescaler SO-8, PDIP 8 Motorola
MC12036 1.1 GHz dual modulus prescaler with stand-by mode SO-8, PDIP 8
Motorola
MC12052ASD 1.1 GHz super low power dual modulus prescaler SSOP 8
Motorola
MC12053A 1.1 GHz super low power dual modulus prescaler with stand-by
mode SO-8, SSOP 8 Motorola
MC12054A 2.0 GHz super low power dual modulus prescaler SO-8, SSOP 8
Motorola
MC12058 1.1 GHz super low power dual modulus prescaler SO-8, SSOP 8
Motorola
MC12066D 1.3 GHz prescaler SO-8 8 Motorola
MC12074 1.1 GHz prescaler SO-8, PDIP 8 Motorola
MC12075 1.3 GHz prescaler SOIC, PDIP 8 Motorola
MC12076 1.3 Hz prescaler SOIC, PDIP 8 Motorola
MC12078 1.3 GHz prescaler SOIC, PDIP 8 Motorola
MC12078 1.3 GHz prescaler PDIP 8 Motorola
MC12089 2.9 GHz prescaler SO-8, PDIP 8 Motorola
MC12090 UHF prescaler DIP, PDIP 16 Motorola
MC12093 2,4,8.1 GHz low power prescaler with stand-by mode SO-8, SSOP 8
Motorola
MC12095 Prescaler max. 2.7 GHz, /2 of /4 low power prescaler with
stand-by mode SO-8, SSOP 8 Motorola
MC12098D 2.5 GHz prescaler SO-8 8 Motorola
MC3393 divider 15/16 150 MHz lowpower DIP8 8 Motorola
MN6152U PLL LSI with Built-In Prescaler - Panasonic
MN6155 PLL LSI with Built-In Prescaler - Panasonic
MSL2318 Divider /10 (40 MHz) /100 (250 MHz) switchable DIL DIL8 8
HYPERLINK " http://www.xs4all.nl/~barendh/Indexeng.htm "
NTE851 Integrated circuit. VHF/UHF prescaler DIP 14 National Sem.
PE3501 3.5 GHz low power CMOS divide-by-2 prescaler TSSOP 8 Panasonic
PE3502 3.5 GHz low power CMOS divide-by-4 prescaler SOP 8 Panasonic
PE3503 3.5 GHz low power CMOS divide-by-8 prescaler SOP 8 Panasonic
PE9301 3.5 GHz low power CMOS divide-by-2 prescaler for RAD-hard
applications SOIC 8 Panasonic
PE9302 3.5 GHz low power CMOS divide-by-4 prescaler for RAD-hard
applications Flat pack 8 Panasonic
PE9303 3.5 GHz low power CMOS divide-by-8 prescaler for RAD-hard
applications Flat pack 8 Panasonic
PMB2313T Prescaler Circuit 1.1 GHz - Infineon
PMB2314T Prescaler Circuit 2.1 GHz - Infineon
RDD104 Selectable 4 Decade CMOS* Divider
HYPERLINK " http://www.scheme.ru/lib/chipdir/c/u.htm " \l " us_digital "
US Digital
RED3600 Complementary MOS* (CMOS*) Divider
HYPERLINK " http://www.scheme.ru/lib/chipdir/c/u.htm " \l " us_digital "
US Digital
SA701 Divide by 128/129 - 64/65 ECL* prescaler dual modulus low power
ECL prescaler DIL8, DLF, SOT96, SO, DIP 8 HYPERLINK
" http://www.scheme.ru/lib/chipdir/c/p.htm " \l " philips " Philips
SA702 Divide by 64/65/72 triple modulus low power ECL* prescaler DIL8,
SOT96, NE, DIP 8 HYPERLINK " http://www.scheme.ru/lib/chipdir/c/p.htm "
\l " philips " Philips
SA703 Divide by 128/129/144 ECL* prescaler DIL8 8 HYPERLINK
" http://www.scheme.ru/lib/chipdir/c/p.htm " \l " philips " Philips
SAA1058 32/33 Divider to 125 MHz DIL8 8 HYPERLINK
" http://www.xs4all.nl/~barendh/Indexeng.htm "
SAB6456 Sensitive 1 GHz prescaler=SDA4212 divider ECL* o/p select 64/256
see U891BS(pincomp.) DIP, SO, SOT96 8 Philips
SAB6457A Divide-by-64/256 prescaler DIL8 8 Philips
SP4653 256 divider Plessey 1 GHz DIP8 8 Plessey
SP4740 1-3Ghz /256 prescaler with low current and low radiation TTL-out
DIP8, MDIP 8 HYPERLINK " http://www.xs4all.nl/~barendh/Indexeng.htm "
Plessey
SP4902 Prescaler /2 max. 2.5 GHz alt. zie U862 DIP8 8 HYPERLINK
" http://www.xs4all.nl/~barendh/Indexeng.htm " Plessey
SP8629 100 divider 150 MHz DIP8 8 HYPERLINK
" http://www.xs4all.nl/~barendh/Indexeng.htm "
SP8668 10 divider 1.6 GHz !!! (normally nearly NLG 200)
HYPERLINK " http://www.xs4all.nl/~barendh/Indexeng.htm "
SP8690 =95H90 10/11 prescaler 225 MHz
HYPERLINK " http://www.xs4all.nl/~barendh/Indexeng.htm "
SP8704 divider /128/129/64/65 1GHz lowpower only 10 mA DIP8 8
HYPERLINK " http://www.xs4all.nl/~barendh/Indexeng.htm "
SP8718 64/65 divider 550 MHz smd SO8 8 HYPERLINK
" http://www.xs4all.nl/~barendh/Indexeng.htm "
SP8719M =SP8792 but 550 MHz; 80/81 divider PLCC 8 HYPERLINK
" http://www.xs4all.nl/~barendh/Indexeng.htm "
SP8782 Prescaler /16/17/32/33 max. & gt; 1 GHz DIP8 DIP8 8 HYPERLINK
" http://www.xs4all.nl/~barendh/Indexeng.htm "
SP8789 Prescaler /20/22 500 MHz lowpower DIP8 DIP8 8 HYPERLINK
" http://www.xs4all.nl/~barendh/Indexeng.htm "
SP8793 Prescaler /40/41 225 MHz see also MC12016
HYPERLINK " http://www.xs4all.nl/~barendh/Indexeng.htm "
SP8830 6.5V; 1.5GHz+10 prescaler DIP 8 Mitel
SP8908 Prescaler /8 5,5 GHz SO8 8 HYPERLINK
" http://www.xs4all.nl/~barendh/Indexeng.htm "
TC9127P High speed PLL with built-in prescaler DIP28-P 22 Toshiba
TC9128P High speed PLL with built-in prescaler DIP28-P 22 Toshiba
TC9172AP High speed PLL with built-in prescaler DIP, DIP28-P 16 Toshiba
TC9227P High speed PLL with built-in prescaler DIP 22 Toshiba
TC9228P High speed PLL with built-in prescaler DIP 22 Toshiba
TC9307AF Single chip DTS controller with built-in prescaler-PLL-LCD
driver (DTS-12) QFP44-P 44 Toshiba
TD6116P 1.2GHz prescaler SIP7-P 7 Toshiba
TD6118P 1.2GHz prescaler SIP7-P 7 Toshiba
TD6120P 1.2GHz prescaler SIP7-P 7 Toshiba
TD6122P 1.2GHz prescaler SIP7-P 7 Toshiba
TD6124P 1.2GHz prescaler SIP7-P 7 Toshiba
TD6126P 1.2GHz prescaler SIP7-P 7 Toshiba
TD7101F ELC prescaler for digital synthsized tuner - Toshiba
TD7103F ECL prescaler for digital synthesized tuner - Toshiba
TD7104F ECL prescaler for digital synthesized tuner - Toshiba
TD7104P ECL prescaler for digital synthesized tuner - Toshiba
U666B 256-divider 1.2 GHz DIP8 not self oscillating
Toshiba
U813BSE 1.1-GHz prescaler for PLLs in TV, CATV and SAT TV tuners,
emitter-follower output stage DIP 8 SANYO
U813BS-FP 1.1-GHz prescaler for PLLs in TV, CATV and SAT TV tuners, ECL
output stage SO 8 SANYO
U824 4-divider 2.3 GHz in TO50 (X-case) very scarce
SANYO
U833BSE divider /64/128/256 max. 1.3 GHz (typ.1.6GHz) emitt.foll. o/p
SANYO
U847BST (pincomp.SP4740) Dlr./256 max. 1.3GHz (typ.1.6GHz) TTL output
SANYO
U862BS divider /2 2.5GHz TO50
SANYO
U865BS divider /960/1024 1.2 GHz DIP8 8 SANYO
U891BS divider /64/128/256 on chip filt.(clean output) 1.2Gz balanced
output DIP8 8 SANYO
U893BSE divider /64/128/256 on chip filt.(clean output) 1.2GHz balanced
output DIP 8 SANYO
U893BSE-FP 1.3 GHz prescaler for PLL's in TV, CATV and SAT TV tuners SO
8 SANYO
U893BSE-SP 1.3 GHz prescaler for PLL's in TV, CATV and SAT TV tuners SIP
6 SANYO
UPB1502GR 2 GHz prescaler divided by 64/65, 128/129 8-P-SOP - NEC
UPB1505GR 64/128/256 divider 4 GHz (pincomp. MB506PF but faster)
NEC
UPB1506GV 3GHz,64/128/256 dividing prescaler 8-P-SSOP - NEC
UPB1507GV 3GHz 64/128/256 dividing prescaler 8-P-SSOP - NEC
UPB1508GV 3GHz,2 dividing prescaler 8-P-SSOP - NEC
UPB1509GV 1GHz,low voltage 2/4/8 dividing prescaler 8-P-SSOP - NEC
UPB1510GV 3GHz, 4 dividing prescaler 8-P-SSOP - NEC
UPB1510GV 3.0 GHz Divide by 4 prescaler
NEC
UPB1511TB 800MHz, low current 2/4 dividing prescaler 6-P - NEC
UPB571C 500MHz dual-modulus prescaler DIP 8 NEC
UPB582 /4 divider 3 GHz DIP8 8 NEC
UPB584G 2.5 GHz divide by 2 prescaler
HYPERLINK " http://www.scheme.ru/lib/chipdir/c/n.htm " \l " nec " NEC
UPD1719G Integral prescaler, PLL synthesizer LCD driver microcontroller
- 64 NEC
ZL40800/DC 6 GHz fixed modulus prescaler of 8 or 16. SOIC 8 Toshiba
ZL40802/DC 6 GHz fixed modulus prescaler of 8 or 16. SOIC 8 Toshiba
Part Description product
CA3179 1.25 GHz x64/x256 RCA
LB3500 1/8 SANYO
MB501LP /64/65/128/129 1.2 GHz Fujitsu
MB504L Two modulus prescaler Fujitsu
MB506P /64/128/256 max. 2.5 GHz Fujitsu
MB510 /128/144/256/272. 2,7 GHz Fujitsu
MC12018 128/129 550MHz Motorola
MC12022D 64/65/128/129 1.2 GHz Motorola
MC12026A 1.1 GHz 8/9/16/17 Motorola
MC12032AD 64/65/128/129 2 GHz Motorola
SA701 128/129 - 64/65 HYPERLINK
" http://www.scheme.ru/lib/chipdir/c/p.htm " \l " philips " Philips
SA702 64/65/72 HYPERLINK " http://www.scheme.ru/lib/chipdir/c/p.htm "
\l " philips " Philips
SA703 128/129/144 HYPERLINK
" http://www.scheme.ru/lib/chipdir/c/p.htm " \l " philips " Philips
SAB6456 1 GHz 64/256 Philips
SAB6457A 64/256 Philips
SP4653 256 1 GHz Plessey
SP4740 1-3Ghz /256 TTL-out Plessey
SP8704 /128/129/64/65 1GHz Plessey
SP8782 /16/17/32/33 1 GHz Plessey
U666B 256 1.2 GHz Toshiba
U813BSE 1.1-GHz SANYO
U833BSE /64/128/256 max. 1.3 GHz SANYO
U847BST /256 1.3GHz TTL output SANYO
U891BS /64/128/256 1.2Gz SANYO
U893BSE /64/128/256 1.2GHz SANYO
UPB1502GR 2 GHz 64/65, 128/129 NEC
UPB1505GR 64/128/256 4 GHz NEC
UPB1506GV 3GHz,64/128/256 NEC
UPB1507GV 3GHz 64/128/256 NEC
Order this document by MC12080/D
MC12080
1.1 GHz Prescaler
The MC12080 is a single modulus divide by 10, 20, 40, 80 prescaler for
low power frequency division of a 1.1 GHz high frequency input signal.
Divide ratio control inputs SW1, SW2 and SW3 select the required divide
ratio of ÷10, ÷20, ÷40, or ÷80.
An external load resistor is required to terminate the output. A 820 Ω
resistor is recommended to achieve a 1.2 Vpp output swing, when dividing a
1.1 GHz input signal by the minimum divide by ratio of 10, assuming a 8.0 pF
load. Output current can be minimized dependent on conditions such as
output frequency, capacitive load being driven, and output voltage swing
required. Typical values for load resistors are included in the Vout
specification for various divide ratios at 1.1 GHz input frequency.
• 1.1 GHz Toggle Frequency
•
•
•
MECL PLL COMPONENTS
÷10/20/40/80 PRESCALER
SEMICONDUCTOR
TECHNICAL DATA
Supply Voltage 4.5 to 5.5 V
Low Power 3.7mA Typical at VCC = 5.0 V
8
Operating Temperature Range of –40 to 85°C
1
D SUFFIX
PLASTIC PACKAGE
CASE 751
(SO–8)
FUNCTIONAL TABLE
SW1
SW2
L
L
Divide Ratio
L
L
80
L
H
40
L
H
L
40
L
H
H
20
H
L
L
40
H
L
H
20
H
H
L
20
H
NOTE:
SW3
H
H
10
8
1
P SUFFIX
PLASTIC PACKAGE
CASE 626
SW1, SW2 and SW3: H = VCC, L = Open.
MAXIMUM RATINGS
Characteristic
Power Supply Voltage, Pin 2
Operating Temperature Range
Storage Temperature Range
Maximum Output Current, Pin 4
NOTE:
Symbol
Range
VCC
–0.5 to 7.0
Vdc
TA
–40 to 85
PIN CONNECTIONS
Unit
°C
Tstg
–65 to 150
°C
IO
10
IN
VCC
SW1
OUT
mA
ESD data available upon request.
1
8
2
7
3
6
4
5
IN
SW3
SW2
Gnd
(Top View)
ORDERING INFORMATION
Device
MC12080D
MC12080P
Operating
Temperature Range
TA = – 40° to +85°C
© Motorola, Inc. 1997
Package
SO–8
Plastic
Rev 2
MC12080
ELECTRICAL CHARACTERISTICS (VCC = 4.5 to 5.5 V; TA = –40 to 85°C, unless otherwise noted.)
Parameter
Symbol
Min
Typ
Max
Unit
Toggle Frequency (Sine Wave)
ft
0.1
1.4
1.1
GHz
Supply Current Output (Pin 2)
ICC
–
3.7
5.0
mA
Vin
400
100
–
–
1000
1000
mVpp
Divide Ratio Control Input High (SW1, SW2, SW3)
VIH
VCC – 0.5 V
VCC
VCC + 0.5 V
V
Divide Ratio Control Input Low (SW1, SW2, SW3)
VIL
Open
Open
Open
–
Vout
0.8
1.2
–
Vpp
Input Voltage Sensitivity
100–250 MHz
250–1100 MHz
RL = 820 Ω, IO = 4.0 mA for ÷10
RL = 1.6 kΩ, IO = 2.1 mA for ÷20
RL = 3.3 kΩ, IO = 1.1 mA for ÷40
RL = 6.2 kΩ, IO = 0.57 mA for ÷80
Output Voltage Swing1
NOTE:
1. Assumes 8.0 pF load and 1.1 GHz input frequency (typical), IO at VCC = 5.0 V and TA = 25°C
Figure 1. Logic Diagram (MC12080)
D
D
Q
D
C
In
In
Q
QB
C
QB
Q
C
QB
1
D
QB
D
QB
D
QB
D
QB
C
Q
C
Q
C
Q
C
Q
0
SW1
Out
SW3
SW2
Figure 2. AC Test Circuit
VCC = 4.5 to 5.5 V
C3
SINE WAVE GENERATOR
C1
VCC
IN
SW2
50 Ω
SW3
C2
IN
OUT
GND
2
SW1
CL
RL
EXTERNAL COMPONENTS
C1 = C2 = 1000 pF
C3 = 0.1 µF
CL = 8.0 pF (Including Scope and Jig Capacitance)
RL = 820 Ω for ÷10 at 1.1 GHz
MOTOROLA RF/IF DEVICE DATA
MC12080
Figure 3. Input Signal Amplitude versus Input Frequency
+15.0
+1257.40
+10.0
+707.11
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
0
+223.61
OPERATING
WINDOW
–5.0
AMPLITUDE (dBm)
+397.64
–10.0
–15.0
–20.0
–25.0
+125.74
+70.71
+39.76
+22.36
mVrms
+5.0
+12.57
–30.0
+7.07
–35.0
+3.98
–40.0
+2.24
–45.0
+1.26
–50.0
0
200
400
600
800
1000
1200
1400
1600
+0.71
1800
FREQUENCY (MHz)
Divide Ratio = 10; VCC = 5.0 V; TA = 25°C
Figure 4. Output Amplitude versus Input Frequency
2000
1200
800
mVpp
1600
400
0
200
400
600
800
1000
1200
1400
1600
0
1800
FREQUENCY (MHz)
MOTOROLA RF/IF DEVICE DATA
3
MC12080
OUTLINE DIMENSIONS
8
P SUFFIX
PLASTIC PACKAGE
CASE 626–05
ISSUE K
5
–B–
1
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
4
F
–A–
NOTE 2
L
DIM
A
B
C
D
F
G
H
J
K
L
M
N
C
J
–T–
N
SEATING
PLANE
D
M
K
G
H
0.13 (0.005)
T A
M
B
M
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS ARE IN MILLIMETER.
3. DIMENSION D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
C
5
0.25
H
E
M
B
M
1
4
h
B
X 45 _
e
q
A
C
SEATING
PLANE
L
0.10
A1
B
0.25
C B
M
S
A
INCHES
MIN
MAX
0.370
0.400
0.240
0.260
0.155
0.175
0.015
0.020
0.040
0.070
0.100 BSC
0.030
0.050
0.008
0.012
0.115
0.135
0.300 BSC
–––
10_
0.030
0.040
M
D SUFFIX
PLASTIC PACKAGE
CASE 751–06
(SO–8)
ISSUE T
D
A
MILLIMETERS
MIN
MAX
9.40
10.16
6.10
6.60
3.94
4.45
0.38
0.51
1.02
1.78
2.54 BSC
0.76
1.27
0.20
0.30
2.92
3.43
7.62 BSC
–––
10_
0.76
1.01
S
DIM
A
A1
B
C
D
E
e
H
h
L
q
MILLIMETERS
MIN
MAX
1.35
1.75
0.10
0.25
0.35
0.49
0.19
0.25
4.80
5.00
3.80
4.00
1.27 BSC
5.80
6.20
0.25
0.50
0.40
1.25
0_
7_
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part. Motorola and
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.
Mfax is a trademark of Motorola, Inc.
How to reach us:
USA / EUROPE / Locations Not Listed: Motorola Literature Distribution;
P.O. Box 5405, Denver, Colorado 80217. 1–303–675–2140 or 1–800–441–2447
JAPAN: Nippon Motorola Ltd.: SPD, Strategic Planning Office, 141,
4–32–1 Nishi–Gotanda, Shagawa–ku, Tokyo, Japan. 03–5487–8488
Customer Focus Center: 1–800–521–6274
Mfax™: RMFAX0@email.sps.mot.com – TOUCHTONE 1–602–244–6609
ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park,
Motorola Fax Back System
– US & Canada ONLY 1–800–774–1848 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298
– http://sps.motorola.com/mfax/
HOME PAGE: http://motorola.com/sps/
4
◊
MC12080/D
MOTOROLA RF/IF DEVICE DATA
MSA-2111
Cascadable Silicon Bipolar MMIC Amplifier
Data Sheet
Description
Features
The MSA-2111 is a low cost silicon bipolar Monolithic Microwave Integrated Circuit (MMIC) housed in a surface
mount plastic SOT‑143 package. This MMIC is designed
for use as a general purpose 50 Ω gain block. Typical applications include narrow and broad band IF and RF amplifiers in commercial and industrial applications.
• Cascadable 50 Ω Gain Block
The MSA-series is fabricated using Avago’s 10 GHz fT,
25 GHz fMAX, silicon bipolar MMIC process which uses nitride self-alignment, ion implantation, and gold metallization to achieve excellent performance, uniformity and
reliability. The use of an external bias resistor for temperature and current stability also allows bias flexibility.
SOT-143 Package
• Medium Power: 10 dBm at 900 MHz
• High Gain: 16.5 dB Typical at 900 MHz
• Low Noise Figure:
3.3 dB Typical at 900 MHz
• Low Cost Surface Mount Plastic Package
• Tape-and-Reel Packaging Option Available
• Lead-free Option Available
Typical Biasing Configuration
R bias
VCC & gt; 5 V
RFC (Optional)
C block
Pin Connections and Package Marking
A06x
Notes:
Top View. Package Marking provides orientation and identification.
" x " is the date code.
IN
C block
OUT
MSA
Vd = 3.6 V
MSA-2111 Absolute Maximum Ratings
Thermal Resistance[2]:
θjc = 505°C/W
Absolute Maximum[1]
40 mA
125 mW
+13 dBm
150°C
–65°C to 150°C
Parameter
Device Current
Power Dissipation[2,3]
RF Input Power
Junction Temperature
Storage Temperature
Notes:
1. Permanent damage may occur if any of these limits are exceeded.
2. TCASE = 25°C.
3. Derate at 2.0 mW/°C for TC & gt; 85°C.
Electrical Specifications[1], TA = 25°C
Symbol
Parameters and Test Conditions: Id = 29 mA, ZO = 50 Ω
GP
Power Gain (|S21| 2)
∆GP
Gain Flatness
f = 0.1 to 0.3 GHz
f3 dB
3 dB Bandwidth
VSWR
f = 900 MHz
Units
Min.
Typ.
dB
16.0
17.5
dB
±0.5
GHz
0.5
Input VSWR
f = 0.1 to 2.5 GHz
1.8:1
Output VSWR
f = 0.1 to 2.5 GHz
Max.
1.8:1
NF
50 Ω Noise Figure
f = 900 MHz
dB
3.3
P1 dB
Output Power at 1 dB Gain Compression
f = 900 MHz
dBm
10
IP3
Third Order Intercept Point
f = 900 MHz
dBm
20
tD
Group Delay
f = 900 MHz
psec
158
Vd
Device Voltage
V
2.9
3.6
dV/dT
Device Voltage Temperature Coefficient
mV/°C
–8.0
4.3
Notes:
1. The recommended operating current range for this device is 12 to 35 mA. Typical gain performance as a function of current is on the following page.
Ordering Information
Part Numbers
MSA-2111-BLK
MSA-2111-BLKG
MSA-2111-TR1
MSA-2111-TR1G
MSA-2111-TR2
MSA-2111-TR2G
Note:
No. of Devices
100
100
3000
3000
10000
10000
Comments
Bulk
Bulk
7 " Reel
7 " Reel
13 " Reel
13 " Reel
Order part number with a “G” suffix if lead-free option
is desired.
MSA-2111 Typical Scattering Parameters (ZO = 50 Ω, TA = 25°C, Id = 29 mA)
Freq.
GHz
S11
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.5
2.0
2.5
3.0
3.5
4.0
S21
S12
S22
Mag
Ang
dB
Mag
Ang
dB
Mag
Ang
Mag
Ang
k
.28
.26
.24
.21
.18
.15
.13
.11
.09
.07
.08
.11
.15
.27
.38
.46
171
163
156
152
149
148
148
152
158
169
–123
–124
–167
158
145
135
23.0
22.5
21.9
21.2
20.5
19.7
19.0
18.3
17.6
16.9
14.0
11.8
10.1
8.3
6.8
5.6
14.1
13.4
12.5
11.5
10.6
9.7
8.9
8.2
7.6
7.0
5.0
3.9
3.2
2.6
2.2
1.9
167
156
145
136
128
120
114
108
102
98
79
63
56
43
32
21
–26.0
–25.5
–24.9
–24.0
–23.4
–22.6
–21.8
–21.1
–20.4
–19.9
–17.3
–15.5
–14.3
–13.5
–13.1
–12.6
.050
.053
.057
.063
.068
.074
.081
.088
.095
.101
.136
.167
.193
.211
.222
.234
9
18
25
30
35
38
40
42
43
44
45
42
43
38
34
30
.27
.27
.26
.26
.24
.24
.22
.21
.20
.19
.10
.06
.06
.12
.16
.17
177
175
173
171
170
169
169
169
168
169
179
–147
–177
149
145
144
1.03
1.03
1.03
1.03
1.03
1.03
1.04
1.04
1.04
1.05
1.06
1.08
1.10
1.13
1.14
1.14
Typical Performance, TA = 25°C
(unless otherwise noted)
25
14
25
22
0.1 GHz
0.5 GHz
20
13
15
2.0 GHz
10
10
0.1
0.3 0.5
1.0
3.0
6.0
FREQUENCY (GHz)
Figure 1. Power Gain vs. Frequency, Id = 29
mA.
4.0
NF (dB)
3.5
3.0
2.5
0.1
0.2
0.3
0.5
1.0
FREQUENCY (GHz)
Figure 4. Noise Figure vs. Frequency,
Id = 29 mA.
2.0
10
8
5
7
P1 dB (dBm)
16
4
12
0.9 GHz
GP (dB)
GP (dB)
19 Gain Flat to DC
0
10
15
20
25
I d (mA)
30
Figure 2. Power Gain vs. Current.
6
0.1
0.2
0.3
0.5
1.0
FREQUENCY (GHz)
Figure 3. Output Power at 1 dB Gain
Compression vs. Frequency, Id = 29 mA.
2.0
SOT-143 Package Dimensions
e2
e1
RF OUTPUT AND BIAS
GROUND
B1
XXX
E
E1
L
GROUND
B
RF INPUT
e
C
DIMENSIONS (mm)
D
A
A1
Notes:
XXX-package marking
Drawings are not to scale
SYMBOL
A
A1
B
B1
C
D
E1
e
e1
e2
E
L
MIN.
0.79
0.013
0.36
0.76
0.086
2.80
1.20
0.89
1.78
0.45
2.10
0.45
For product information and a complete list of distributors, please go to our web site:
MAX.
1.097
0.10
0.54
0.92
0.152
3.06
1.40
1.02
2.04
0.60
2.65
0.69
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies, Limited. All rights reserved. Obsoletes 5989-4455EN
AV02-0792EN - October 30, 2007
INTEGRATED CIRCUITS
DATA SHEET
SAB6456
SAB6456T
Sensitive 1 GHz
divide-by-64/divide-by-256
switchable prescaler
Product specification
File under Integrated Circuits, IC02
June 1986
Philips Semiconductors
Product specification
Sensitive 1 GHz divide-by-64/divide-by-256
switchable prescaler
SAB6456
SAB6456T
GENERAL DESCRIPTION
The SAB6456/SAB6456T is a prescaler for UHF/VHF tuners. It can be switched to divide-by-64 or divide-by-256 by the
mode-control (MC) pin. The circuit has an input frequency range of 70 MHz to 1 GHz, has high input sensitivity and good
harmonic suppression.
Fig.1 Block diagram.
QUICK REFERENCE DATA
PARAMETER
Supply voltage
CONDITIONS
pin 8 to pin 4
SYMBOL
MIN.
TYP.
MAX.
UNIT
VCC
4,5
5,0
5,5
V
Supply current
pin 8
ICC
−
21
−
mA
Input frequency range
pins 2 and 3
fi
70
−
1000
MHz
Vi(rms)
−
−
10
mV
Vo(p-p)
−
1
−
V
Tamb
0
−
80
°C
Sensitivity to input voltage
(r.m.s. value)
Output voltage
(peak-to-peak value)
pins 6 and 7
Operating ambient
temperature range
PACKAGE OUTLINES
SAB6456 : 8-lead DIL; plastic (SOT97); SOT97-1; 1996 November 18.
SAB6456T: 8-lead mini-pack (SO8; SOT96A); SOT96-1; 1996 November 18.
June 1986
2
Philips Semiconductors
Product specification
Sensitive 1 GHz divide-by-64/divide-by-256
switchable prescaler
SAB6456
SAB6456T
PINNING
1.
n.c.
not connected
2.
C1
3.
C2
4.
VEE
ground (0 V)
5.
MC
mode control
6.
QH
7.
QL
8.
VCC
differential inputs
complementary outputs
positive supply voltage
Fig.2 Pinning diagram.
FUNCTIONAL DESCRIPTION
The circuit comprises an input amplifier, a divider stage with selectable division ratio and an output stage.
The input amplifier is driven by a sinusoidal signal from the local oscillator of a television tuner. The inputs (C1, C2) are
differential and are biased internally to permit capacitive coupling. When driven asymmetrically the unused input should
be connected to ground via a capacitor.
The mode-control (MC) input to the divider stage is intended for static control of the division ratio, selection is made as
follows:
divide-by-64: MC pin open-circuit
divide-by-256: MC pin connected to ground
The divider stage may oscillate during no-signal conditions but this oscillation is suppressed when input signals are
received.
Two complementary signals (QH, QL) are provided by the output differential amplifier stage. The voltage-edges of the
output signals are slowed internally to reduce harmonics in the television intermediate frequency band.
June 1986
3
Philips Semiconductors
Product specification
Sensitive 1 GHz divide-by-64/divide-by-256
switchable prescaler
SAB6456
SAB6456T
ELECTROSTATIC DISCHARGE PROTECTION
Inputs and outputs have electrostatic discharge protection according to specification MIL-883C, class B.
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC-134)
PARAMETER
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
VCC
−
−
7,0
V
Input voltage
Vi
−
−
VCC
V
Storage temperature range
Tstg
−55
−
+ 150
°C
Junction temperature
Tj
−
−
+ 150
°C
Supply voltage
pin 8 to pin 4
THERMAL RESISTANCE
From junction to ambient
8-lead DIL; plastic (SOT-97A)
Rth j-a
120 K/W
on printed circuit board
Rth j-a
260 K/W
on ceramic substrate
Rth j-a
170 K/W
8-lead mini-pack (SO-8; SOT-96A)
D.C. CHARACTERISTICS
VCC = 5 V; VEE = 0 V; Tamb = 25 °C; test IC mounted in a test socket or on a printed circuit board; measurements taken
after thermal equilibrium is established
PARAMETER
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
Output voltage HIGH
VOH
−
−
VCC
V
Output voltage LOW
VOL
−
−
VCC − 0.8
V
Supply current
ICC
−
21
28
mA
(divide-by-256)
VIL
0
−
0,2
V
Input current LOW
−IL
−
25
60
µA
VIH
1,4
−
3,0
V
Mode-control (MC)
Input voltage LOW
Input voltage HIGH
(divide-by-64)
June 1986
pin 5 open-circuit
4
Philips Semiconductors
Product specification
Sensitive 1 GHz divide-by-64/divide-by-256
switchable prescaler
SAB6456
SAB6456T
A.C. CHARACTERISTICS
VCC = 4,5 to 5,5 V; VEE = 0 V; Tamb = 0 to +80 °C
PARAMETER
Sensitivity to input
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
50 Ω system
−
−
10
mV
−
−
10
mV
Vi(rms)
−
−
10
mV
fi = 500 MHz
Vi(rms)
−
−
10
mV
fi = 900 MHz
Vi(rms)
−
−
10
mV
fi = 1000 MHz
Vi(rms)
−
−
10
mV
1000 MHz
(r.m.s. value)
Vi(rms)
Vi(rms)
fi = 300 MHz
Input overload voltage
70 MHz
fi = 150 MHz
voltage (r.m.s. value)
Vi
300
−
−
mV
fi =
50 Ω system
fi = 70 MHz to
Ri
−
560
−
Ω
Ri
−
30
−
Ω
fi =
70 MHz
Ci
−
5
−
pF
fi = 1000 MHz
Input capacitance
70 MHz
fi = 1000 MHz
Input parallel resistance
Ci
−
1,5
−
pF
VOH
−
−
VCC
V
−
−
VCC − 0,8
V
Vo(p-p)
0,8
1,0
1,2
V
Vo(p-p)
0,17
−
−
V
−15
−23
−
dB
∆Vo
−
−
0,1
V
Ro
−
500
−
Ω
fi =
Output voltage HIGH
Output voltage LOW
VOL
Output voltage swing
(peak-to-peak value)
fi =
70 MHz
fi = 1000 MHz;
RL = 820 Ω;
CL = 60 pF
Attenuation of third
harmonic at output
fi = 800 MHz;
RL = 820 Ω;
CL = 60 pF
Output unbalance
see Fig.3
Output resistance
June 1986
5
Philips Semiconductors
Product specification
Sensitive 1 GHz divide-by-64/divide-by-256
switchable prescaler
Fig.4
Fig.3 Test circuit for output unbalance measurement.
SAB6456
SAB6456T
Typical input sensitivity curve: VCC = 5 V;
Tamb = 25 °C.
Fig.5 Smith chart of typical input impedance: Vi(rms) = 25 mV; VCC = 5 V; reference value = 50 Ω.
June 1986
6
Philips Semiconductors
Product specification
Sensitive 1 GHz divide-by-64/divide-by-256
switchable prescaler
SAB6456
SAB6456T
PACKAGE OUTLINES
DIP8: plastic dual in-line package; 8 leads (300 mil)
SOT97-1
ME
seating plane
D
A2
A
A1
L
c
Z
w M
b1
e
(e 1)
b
MH
b2
5
8
pin 1 index
E
1
4
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
b2
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.2
0.51
3.2
1.73
1.14
0.53
0.38
1.07
0.89
0.36
0.23
9.8
9.2
6.48
6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
1.15
inches
0.17
0.020
0.13
0.068
0.045
0.021
0.015
0.042
0.035
0.014
0.009
0.39
0.36
0.26
0.24
0.10
0.30
0.14
0.12
0.32
0.31
0.39
0.33
0.01
0.045
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT97-1
050G01
MO-001AN
June 1986
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
92-11-17
95-02-04
7
Philips Semiconductors
Product specification
Sensitive 1 GHz divide-by-64/divide-by-256
switchable prescaler
SAB6456
SAB6456T
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A
X
c
y
HE
v M A
Z
5
8
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
4
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.01
0.019 0.0100
0.014 0.0075
0.20
0.19
0.16
0.15
0.244
0.039 0.028
0.050
0.041
0.228
0.016 0.024
inches
0.010 0.057
0.069
0.004 0.049
0.01
0.01
0.028
0.004
0.012
θ
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT96-1
076E03S
MS-012AA
June 1986
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
95-02-04
97-05-22
8
o
8
0o
Philips Semiconductors
Product specification
Sensitive 1 GHz divide-by-64/divide-by-256
switchable prescaler
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
WAVE SOLDERING
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
DIP
SOLDERING BY DIPPING OR BY WAVE
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
REPAIRING SOLDERED JOINTS
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
REPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
June 1986
SAB6456
SAB6456T
9
Philips Semiconductors
Product specification
Sensitive 1 GHz divide-by-64/divide-by-256
switchable prescaler
SAB6456
SAB6456T
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
June 1986
10
This datasheet has been download from:
www.datasheetcatalog.com
Datasheets for electronics components.
Sept. 1995
Edition 3.0a
DATA SHEET
MB501SL
SUPER LOW POWER TWO MODULUS PRESCALER
SUPER LOW POWER TWO MODULUS PRESCALER
The Fujitsu MB501SL is a super low power version of the MB501 two modulus
prescaler used with a frequency synthesizer to make a Phase Locked Loop
(PLL). It divides the input frequency by the modulus of 64/65 or 128/129,
respectively. The MB501SL achieves extremely small stray capacitance by the
use of Fujitsu’s Advanced Process Technology. High speed operation is
achieved with low power supply current of 5mA which is about half of the current
value of the MB501L.
S High Frequency Operation:
fmax = 1.1GHZ max.(PIN = –14bBm)
S Pulse Swallow Function:
64/65, 128/129
S Low Power Supply Current:
5.0mA typ.
S Stable Output Amplitude:
VO = 1.6Vp-p typ.
PLASTIC PACKAGE
DIP-08P-M01
PLASTIC PACKAGE
FPT-08P-M01
S Complete PLL synthesizer circuit with the Fujitsu MB87001A, PLL
synthesizer IC
S Plastic 8-pin Dual-In-Line Package
S Plastic 8-pin Mini Flat Package
PLASTIC PACKAGE
FPT-08P-M02
S Built-in Termination Resistor
S Stable output amplitude is obtained up to output load capacitance of 8pF.
IN
Rating
Value
Unit
Power Supply Voltage
VCC
-0.5 to +7.0
VIN
-0.5 to + VCC
IO
10
– 55 to +125
2
7
NC
3
6
MC
4
5
GND
mA
TSTG
VCC
V
Output Voltage
IN
V
Input Voltage
8
OUT
Symbol
1
SW
ABSOLUTE MAXIMUM RATINGS (see NOTE)
_C
Storage Temperature
Note:
Permanent device damage may occur if the above Absolute Maximum Ratings are
exceeded. Functional operation should be restricted to the conditions as detailed in
the operational sections of this data sheet. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
Copyright E 1995 by FUJITSU LIMITED and FUJITSU MICROELECTRONICS
This device contains circuitry to protect the inputs against damage
due to high static voltages or electric fields. However, it is advised
that normal precautions be taken to avoid application of any
voltage higher than maximum rated voltages to this high
impedance circuit.
MB501SL
D
Input Buffer
D
Q
D
Q
C
C
C
Q
IN
IN
SW
D
Q
D
Q
D
Q
D
Q
D
Q
SW
C
Q
C
Q
C
Q
C
Q
C
Q
MC
SW
Divide Ratio
H
1/64
H
L
1/65
L
H
1/128
L
MB501SL
MC
H
L
1/129
Note:
SW: H = VCC, L = OPEN
MC: H = 2.0V to VCC,
L = GND to 0.8V
Figure 1. MB501SL Block Diagram
PIN DESCRIPTION
Pin Number
Symbol
1
IN
2
VCC
Power Supply, +5V
3
SW
Divide Ratio Control Input (See Divide Ratio Table)
4
OUT
Output
5
GND
Ground
6
MC
Modulus Control Input (See Divide Ratio Table)
7
NC
Non Connection
8
IN
Complementary Input
2
Description
Input
Output
Buffer
OUT
MB501SL
RECOMMENDED OPERATING CONDITIONS
Values
Parameter
Symbol
Unit
Min.
Typ.
Max.
Power Supply Voltage
VCC
4.5
5.0
5.5
V
Operating Temperature
TA
–40
—
+85
°C
Load Capacitance
CL
—
—
8
pF
ELECTRICAL CHARACTERISTICS
(Recommended Operating Conditions unless otherwise noted)
Values
Parameter
Symbol
Condition
Unit
Min.
Typ.
Max.
Power Supply Current
ICC
—
—
5.0
7.0
mA
Output Amplitude
VO
Built-in a termination resistor.
Load capacitance = 8pF
1.0
1.6
—
VP–P
Input Frequency
fin
With input coupling capacitor
1000pF
10
—
1100
MNz
Input Signal Amplitude
PIN
—
–14
—
0
dBm
High Level Input Voltage for MC
VIHM
—
2.0
—
—
V
Low Level Input Voltage for MC
VILM
—
—
—
0.8
V
High Level Input Voltage for SW
VIHS*
—
VCC –0.1
VCC
VCC +0.1
V
Low Level Input Voltage for SW
VILS
—
High Level Input Current for MC
IIHM
VIH = 2.0V
—
—
0.4
mA
Low Level Input Current for MC
IILM
VIL = 0.8V
–0.2
—
—
mA
Modulus Set-up Time MC to Output
tSET
—
—
16
26
ns
OPEN
V
Note: * Design Guarantee
3
MB501SL
VCC = +5.0V + 10%
C3
Sampling scope input point
for input waveform
VCC
C1
OUT
IN
P.G.
Sampling scope prober point
for output waveform
SW
IN
50Ω
CL
C2
MC
GND
MC Input
C1: 1000pF
C2: 1000pF
C3: 0.1µF
CL: 8pF (including scope and jig capacitance)
Figure 2. Test Circuit
TWO MODULUS OPERATING TIMING CHART
Example: Divide Ratio of 64/65
64
65
IN
32
OUT
32
32 32 32
32
32
33
32 32 33 32 33 32 32
MC
tSET
tSET
Notes:
When divide ratio of 129 is selected, positive pulse is added by one to 65.
The typical set up time (tSET) is 16ns from MC signal input to the timing of change of prescaler divide ratio.
4
MB501SL
MINIMUM INPUT SIGNAL AMPLITUDE VIN (dBm)
TYPICAL CHARACTERISTICS CURVES
TA = 25°C
10
VCC = 4.5V
VCC = 5.0V
VCC = 5.5V
0
DATASHEET SPEC
-10
-20
-30
0.8
1.0
1.2
1.4
INPUT FREQUENCY fIN (GHZ)
MINIMUM INPUT SIGNAL AMPLITUDE VIN (dBm)
Figure 3. Input Signal Amplitude vs. Input Frequency
VCC = 5.0V
10
TA = –40°C
TA = 25°C
TA = 85°C
0
DATASHEET SPEC
-10
-20
-30
0.8
1.0
1.2
1.4
INPUT FREQUENCY fIN (GHZ)
Figure 4. Input Signal Amplitude vs. Input Frequency
5
POWER SUPPLY CURRENT ICC (mA)
MB501SL
6.0
5.0
4.0
4.5
5.0
POWER SUPPLY VOLTAGE VCC (V)
5.5
POWER SUPPLY CURRENT ICC (mA)
Figure 5. Power Supply Current vs. Power Supply Voltage
6.0
5.0
4.0
-40
-20
0
20
40
60
TEMPERATURE TA (°C)
Figure 6. Power Supply Current vs. Temperature
6
80
MINIMUM INPUT SIGNAL AMPLITUDE VIN (dBm)
MB501SL
10
VCC = 5.0V
TA = 25°C
0
DATASHEET SPEC
-10
-20
-30
10
100
1000
INPUT FREQUENCY (MHz)
Figure 7. Input Signal vs. Input Frequency
7
MB501SL
C1
VSX (Max. 8V)
VCC
VCC
VCC
10kΩ
C2 XI
12kΩ
16 15 14 13 12 11 10 9
VCO
MB87001A
0.047µF
1 2
3
4
12kΩ
5 6
7 8
100kΩ
Clock
Data
LE
10kΩ
33kΩ
1000pF
1000pF
5 6
47kΩ 47kΩ 47kΩ
7
8
MB501SL
VCC
1 2
3
4
1000pF
1000pF
XI
VCC
VSX
C1, C2
:12.8MHz x’tal
: 5V + 10%
: 8V Max.
: depends on crystal oscillator
Lock
Det.
10kΩ
Figure 8. Typical Application Example
8
OUTPUT
MB501SL
PACKAGE DIMENSIONS
8-LEAD PLASTIC DUAL IN-LINE PACKAGE
(CASE No.: DIP-08P-M01
ǒ
) .016
.370 –.012
Ǔ
) 0.40
9.40 –0.30
INDEX
ǒ
15°C MAX.
.244 .010
(6.20 0.25)
) .012
.039 –.000
) 0.30
0.99 –0.00
Ǔ
ǒ
.300 (7.62)
TYP.
) .012
.060 –.000
.010 .002
(0.25 0.05)
Ǔ
) 0.30
1.52 –0.00
) .014
.035 –.012
) 0.35
0.89 –0.30
ǒ
Ǔ
.172 (4.36) MAX.
.020 (0.51)
MIN.
.100 (2.54)
TYP.
.118 (3.00) MIN.
.018 .003
(0.46 0.08)
Dimensions in inches (millimeters).
E1988 FUJITSU LIMITED D08006S-2C
9
MB501SL
PACKAGE DIMENSIONS (Continued)
8-LEAD PLASTIC FLAT PACKAGE
(CASE No.: FPT-08P-M01
) .010
.250 – .008
) 0.25
6.35 – 0.20
ǒ
.089(2.25) MAX.
(SEATED HEIGHT)
Ǔ
.002(0.05) MIN.
(STAND OFF)
.307+.016
(7.80+0.40)
INDEX
.209+.012
(5.30+0.30)
) .016
.268 – .008
ǒ
Ǔ
) 0.40
6.80 – 0.20
.020+.008
(0.50+0.20)
.050(1.27)
TYP.
.018+.004
(0.45+0.10)
∅.005(0.13) M
) .002
.006 – .001
ǒ
Ǔ
) 0.05
0.15 – 0.02
.150(3.81)
REF.
Details of “A” part
“A”
.004(0.10)
.008(0.20)
.020(0.50)
.007(0.18)
MAX.
.027(0.68)
MAX.
Dimensions in inches (millimeters).
E1988 FUJITSU LIMITED F08002S-3C
10
MB501SL
PACKAGE DIMENSIONS (Continued)
8-LEAD PLASTIC FLAT PACKAGE
(CASE No.: FPT-08P-M02
ǒ
.061+.008
) .010
.199 – .008
(1.55+0.20)
.006+.004
Ǔ
) 0.25
5.05 – 0.20
(SEATED HEIGHT)
(0.15+0.10)
.236+.016
(6.00+0.40)
45°
.154+.012
(3.90+0.30)
(STAND OFF)
.197+.012
(5.00+0.30)
.020+.008
(0.50+0.20)
.016(0.40)
.008+.002
.050(1.27)
.017+.004
(0.42+0.10)
TYP.
∅.005(0.13) M
(0.20+0.05)
“A”
Details of “A” part
.016(0.40)
.008(0.20)
.004(0.10)
.150(3.81)
REF.
.007(0.18)
MAX.
.026(0.65)
MAX.
Dimensions in inches (millimeters).
E1988 FUJITSU LIMITED F08004S-2C
All Rights Reserved.
Circuit diagrams utilizing Fujitsu products are included as a means of illustrating typical
semiconductor applications. Complete information sufficient for construction purposes is
not necessarily given.
The information contained in this document has been carefully checked and is believed to
be reliable. However, Fujitsu assumes no responsibility for inaccuracies.
The information contained in this document does not convey any license under the copyrights, patent rights or trademarks claimed and owned by Fujitsu.
Fujitsu reserves the right to change products or specifications without notice.
No part of this publication may be copied or reproduced in any form or by any means, or
transferred to any third party without prior written consent of Fujitsu.
11
MB501SL
FUJITSU LIMITED
For further information please contact:
Japan
FUJITSU LIMITED
International Marketing Div.
Furukawa Sogo Bldg., 6-1, Marunouchi 2-chome
Chiyoda-ku, Tokyo 100, Japan
Tel: (03) 3216-3211
Telex: 781-2224361
FAX: (03) 3215-0662
North and South America
FUJITSU MICROELECTRONICS, INC.
Integrated Circuits Division
3545 North First Street
San Jose, CA 95134-1804, USA
Tel: 408-922-9000
FAX: 408-432-9044
Europe
FUJITSU MIKROELEKTRONIK GmbH
Am Siebenstein 6-10,
6072 Dreieich-Buchschlag,
Germany
Tel: (06103) 690-0
Telex: 411963
FAX: (06103) 690-122
Asia
FUJITSU MICROELECTRONICS ASIA PTE LIMITED
51 Bras Basah Road,
Plaza By The Park,
#06-04 to #06-07
Singapore 0719
Tel: 336-1600
Telex: 55573
FAX: 336-1609
©FUJITSU LIMITED 1990
12
Printed in Japan PV0055–905A3
U813BS/U813BSE
1.1-GHz Prescaler for PLLs in TV, CATV and SAT TV Tuners
Technology: Bipolar
Features
D
D
D
D
U813BS ECL output stage
U813BSE emitter-follower output stage
3 scaling factors 64/128/256, programmable at Pin 5
High input sensitivity
D
D
D
D
Low output impedance
Low power consumption
Pin-compatible to the U6xxB-series except Pin 5
Electrostatic protection according to MIL-STD. 883
Case
8-pin dual-inline plastic
8-pin SO plastic
6-pin SIP plastic
(U813BS, U813BSE)
(U813BS-FP, U813BSE-FP)
(U813BS-SP, U813BSE-SP)
Block Diagram
Figure 1. Block diagram
TELEFUNKEN Semiconductors
Rev. A1, 05-Sep-96
1 (7)
U813BS/U813BSE
Absolute Maximum Ratings
Reference point pin 4 (1)
Parameters
Supply voltage
Input-voltage range
Junction temperature
Storage-temperature range
Ambient-temperature range
Symbol
VS
Vi
Ti
Tstg
Tamb
Unit
V
V
°C
°C
°C
Symbol
Pin 8 (4)
Pin 2, 3, 5 (2, 5, 6)
Value
6
0 to VS
125
–40 to +125
–25 to +70
Value
100
100
175
Unit
Thermal Resistance
Parameters
Junction ambient
DIP8
SIP6
SO8
RthJA
K/W
Note:
The device is self-oscillating without input signal
Pin Description (Dip8, SO8)
Pin
1
2, 3
4
5
6, 7
8
Function
Not connected
Input
Ground
Switch 64/128/256
Output
VS
Pin Description (SIP6)
Pin
1
2
3
4
5,6
Function
Ground
Switch 64/128/256
Output
VS
Input
Notes:
Pin numbers without brackets apply to DIP8 and SO8 package,
Pin numbers with brackets to SIP6
RMS voltage calculated from the available power measured
2 (7)
TELEFUNKEN Semiconductors
Rev. A1, 05-Sep-96
U813BS/U813BSE
Electrical Characteristics
VS = 4.5 to 5.5 V, Tamb = 0 to +70_C, referred to test circuit, unless otherwise specified
Parameters
Supply current
Input sensitivity
Large-signal compatibility
Test Conditions / Pin
VS = 5 V
U813BS
Pin 8 (4)
U813BSE
Pin 8 (4)
RG = 50 W
fi = 70 to 1000 MHz
Pin 2, 3 (5, 6)
fi = 1000 to 1100 MHz
Pin 2, 3 (5, 6)
RG = 50 W
Pin 2, 3 (5, 6)
Frequency range
q
y
g
Output stage
a. Balanced ECL output
Voltage swing each
output
Output impedance
b. Emitter follower
Voltage swing each
output
Output impedance
Switching voltage for
g
g
Symbol
Min.
Typ.
Max.
Unit
35
38
45
50
mA
mA
Vi
10
mV
Vi
15
mV
IS
IS
Vi
fimin
fimax
300
mV
70
1100
RL = 10 k//13 pF
Pin 6, 7 (3)
Pin 6, 7 (3)
VO
ZO
0.8
RL = 10 k//13 pF
Pin 6, 7 (3)
Pin 6, 7 (3)
./. 64
Pin 5 (2)
./. 128
Pin 5 (2)
./. 256
Pin 5 (2)
VO
ZO
VSF
VSF
VSF
1
TELEFUNKEN Semiconductors
Rev. A1, 05-Sep-96
MHz
Vpp
W
500
Vpp
W
200
open
VS –0.5
0
0.5
V
V
3 (7)
U813BS/U813BSE
Test Circuits
Figure 2.
L1 = L2 = 150 nH (6 turns CuL 0.45 mm
Ĭ on 4 mm Ĭ)
Figure 3.
4 (7)
TELEFUNKEN Semiconductors
Rev. A1, 05-Sep-96
U813BS/U813BSE
Output Circuits
Figure 4.
Figure 5.
TELEFUNKEN Semiconductors
Rev. A1, 05-Sep-96
5 (7)
U813BS/U813BSE
Dimensions in mm
6 (7)
TELEFUNKEN Semiconductors
Rev. A1, 05-Sep-96
U813BS/U813BSE
Ozone Depleting Substances Policy Statement
It is the policy of TEMIC TELEFUNKEN microelectronic GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems
with respect to their impact on the health and safety of our employees and the public, as well as their impact on
the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as
ozone depleting substances ( ODSs).
The Montreal Protocol ( 1987) and its London Amendments ( 1990) intend to severely restrict the use of ODSs and
forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban
on these substances.
TEMIC TELEFUNKEN microelectronic GmbH semiconductor division has been able to use its policy of
continuous improvements to eliminate the use of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively
2 . Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency ( EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C ( transitional substances ) respectively.
TEMIC can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain
such substances.
We reserve the right to make changes to improve technical design and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each customer
application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized
application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of,
directly or indirectly, any claim of personal damage, injury or death associated with such unintended or
unauthorized use.
TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Telephone: 49 ( 0 ) 7131 67 2831, Fax number: 49 ( 0 ) 7131 67 2423
TELEFUNKEN Semiconductors
Rev. A1, 05-Sep-96
7 (7)
This datasheet has been download from:
www.datasheetcatalog.com
Datasheets for electronics components.
HMC363S8G
v01.0701
MICROWAVE CORPORATION
SMT GaAs HBT MMIC
DIVIDE-BY-8, DC - 12.0 GHz
Typical Applications
Features
Prescaler for DC to X Band PLL Applications:
Ultra Low SSB Phase Noise: -153 dBc/Hz
• Satellite Communication Systems
• Fiber Optic
Output Power: -6 dBm
• Pt-Pt and Pt-MPt Radios
3
Wide Bandwidth
Single DC Supply: +5V
• VSAT
S8G SMT Package
General Description
FREQUENCY GENERATION - SMT
Functional Diagram
The HMC363S8G is a low noise Divide-by-8
Static Divider with InGaP GaAs HBT technology
in an 8 lead surface mount plastic package. This
device operates from DC (with a square wave
input) to 12 GHz input frequency with a single
+5.0V DC supply. The low additive SSB phase
noise of -153 dBc/Hz at 100 kHz offset helps the
user maintain good system noise performance.
Electrical Specifications, TA = +25° C, 50 Ohm System, Vcc= 5V
Parameter
Conditions
Minimum Input Frequency
Input Power Range
Typ.
12
Maximum Input Frequency
Min.
13
Sine Wave Input. [1]
Max.
GHz
0.2
0.5
GHz
Output Transition Time
& gt; -20
+10
dBm
-10
& gt; -15
+2
dBm
-5
& gt; -8
0
dBm
Fin= 12 GHz
SSB Phase Noise (100 kHz offset)
-15
Fin= 11 to 12 GHz
Reverse Leakage
Fin= 1 to 7 GHz
Fin= 7 to 11 GHz
Output Power
-9
-6
dBm
Both RF Outputs Terminated
65
dB
Pin= 0 dBm, Fin= 6 GHz
-153
dBc/Hz
Pin= 0 dBm, Fout= 882 MHz
100
ps
70
mA
Supply Current (Icc)
1. Divider will operate down to DC for square-wave input signal.
3 - 48
Units
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Visit us at www.hittite.com, or Email at sales@hittite.com
HMC363S8G
v01.0701
MICROWAVE CORPORATION
SMT GaAs HBT MMIC
DIVIDE-BY-8, DC - 12.0 GHz
GaAs MMIC SUB-HARMONICALLY Input Sensitivity Window17 Temperature
PUMPED MIXER vs. - 25 GHz
Input Sensitivity Window, T= 25 °C
10
0
INPUT POWER (dBm)
20
10
Recommended
Operating Window
-10
-20
0
Min Pin +25 C
Max Pin +25 C
Min Pin +85 C
Max Pin +85 C
Min Pin -40 C
Max Pin -40 C
-10
-20
-30
-30
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15
0
1
2
3
4
INPUT FREQUENCY (GHz)
6
7
8
9
10 11 12 13 14 15
SSB Phase Noise
Performance, Pin= 0 dBm, T= 25 °C
0
0
+25 C
+85 C
-2
-40 C
-3
-4
-5
-6
-7
-8
-20
SSB PHASE NOISE (dBc/Hz)
-1
OUTPUT POWER (dBm)
5
INPUT FREQUENCY (GHz)
Output Power vs. Temperature
-9
-10
0
1
2
3
4
5
6
7
8
9
-40
-60
-80
-100
-120
-140
-160
2
10
10 11 12 13 14 15
10
INPUT FREQUENCY (GHz)
0
10
4
10
5
10
6
10
7
Reverse Leakage, Pin= 0 dBm, T= 25 °C
0
Pfeedthru
2nd Harmonic
3rd Harmonic
-10
POWER LEVEL (dBm)
-10
3
OFFSET FREQUENCY (Hz)
Output Harmonic
Content, Pin= 0 dBm, T= 25 °C
OUTPUT LEVEL (dBm)
3
-20
-30
-40
-50
Both Output Ports Terminated
One Output Port Terminated
FREQUENCY GENERATION - SMT
INPUT POWER (dBm)
20
-20
-30
-40
-50
-60
-70
-60
-80
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15
INPUT FREQUENCY (GHz)
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15
INPUT FREQUENCY (GHz)
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Visit us at www.hittite.com, or Email at sales@hittite.com
3 - 49
HMC363S8G
v01.0701
MICROWAVE CORPORATION
SMT GaAs HBT MMIC
DIVIDE-BY-8, DC - 12.0 GHz
Output Voltage Waveform,
Pin= 0 dBm, Fout= 882 MHz, T= 25 °C
Absolute Maximum Ratings
3
RF Input (Vcc = +5V)
+13 dBm
200
AMPLITUDE (mV)
300
Vcc
+5.5V
100
VLogic
Vcc -1.6V to Vcc -1.2V
Storage Temperature
-65 to +150 deg C
Operating Temperature
-40 to +85 deg C
0
-100
Typical Supply Current vs. Vcc
FREQUENCY GENERATION - SMT
-200
Icc (mA)
4.75
64
70
5.25
TIME (nS)
Vcc (V)
5.0
-300
22.7 22.9 23.1 23.3 23.5 23.7 23.9 24.1 24.3 24.5 24.7
75
Note: Divider will operate over full voltage range shown above
Pin Locations & Outline Drawing
1. MATERIAL:
A. PACKAGE BODY - LOW STRESS INJECTION-MOLDED PLASTIC,
SILICA & SILICONE INPREGNATED.
B. LEADFRAME MATERIAL: COPPER ALLOY
2. PLATING: LEAD-TIN SOLDER PLATE
3. DIMENSIONS ARE IN INCHES (MILLIMETERS)
4. CHARACTERS TO BE HELVETICA MEDIUM, .030 HIGH USING WHITE
INK, LOCATED APPROX AS SHOWN.
5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.
6. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.
3 - 50
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Visit us at www.hittite.com, or Email at sales@hittite.com
HMC363S8G
v01.0701
MICROWAVE CORPORATION
SMT GaAs HBT MMIC
DIVIDE-BY-8, DC - 12.0 GHz
Pin Description
Function
Description
1
OUT
Divided output 180° out of phase with pin 3.
2
N/C
No connection.
3
OUT
4
VCC
5
IN
RF Input must be DC blocked.
6
VCC
Supply voltage 5V ± 0.25V can be applied to pin 4 or 6.
7
IN
RF Input 180° out of phase with pin 5 for differential operation. AC
ground for single ended operation.
8
GND
Interface Schematic
Ground: Backside of package has exposed metal ground slug which
must be connected to ground.
Divided Output.
Supply voltage 5V ± 0.25V can be applied to pin 4 or 6.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Visit us at www.hittite.com, or Email at sales@hittite.com
3
FREQUENCY GENERATION - SMT
Pin Number
3 - 51
HMC363S8G
v01.0701
MICROWAVE CORPORATION
SMT GaAs HBT MMIC
DIVIDE-BY-8, DC - 12.0 GHz
HMC363S8G Evaluation PCB
FREQUENCY GENERATION - SMT
3
The circuit board used in the final application should use RF circuit design techniques. Signal lines should
have 50 ohm impedance while the package ground leads and backside ground slug should be connected
directly to the ground plane similar to that shown. A sufficient number of via holes should be used to connect the top and bottom ground planes. The evaluation circuit board shown is available from Hittite upon
request. This evaluation board is designed for single ended input testing. J2 and J3 provide differential
output signals.
Evaluation Circuit Board Layout Design Details
Item
Description
J1 - J3
PC Mount SMA RF Connector
C1 - C4
100 pF Capacitor, 0402 Pkg.
C5
1000 pF Capacitor, 0603 Pkg.
C6
10 µF Tantalum Capacitor
U1
HMC363S8G Divide-by-8
PCB*
104627 Eval Board
* Circuit Board Material: Rogers 4350
3 - 52
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Visit us at www.hittite.com, or Email at sales@hittite.com
v01.0701
HMC363S8G
MICROWAVE CORPORATION
SMT GaAs HBT MMIC
DIVIDE-BY-8, DC - 12.0 GHz
HMC363S8G Application Schematic
FREQUENCY GENERATION - SMT
3
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Visit us at www.hittite.com, or Email at sales@hittite.com
3 - 53
Part Description Package Pins product
11C90DCQR 650 MHz prescalers J16A 16 National Sem.
11C91DCQR 650 MHz prescalers J16A 16 National Sem.
ADF4110 Single, Integer-N, 550 MHz PLL With Programmable Prescaler And Charge Pump - Analog Devices
ADF4111 Single, Integer-N, 1.2 GHz PLL With Programmable Prescaler And Charge Pump - Analog Devices
ADF4112 Single, Integer-N 3.0 GHz PPL With Programmable Prescaler And Charge Pump - Analog Devices
ADF4113 Single, Integer-N 4.0 GHz PLL With Programmable Prescaler And Charge Pump - Analog Devices
CA3179 1.25 GHz x64/x256 prescaler RCA
CND2047 10GHz frequency divider by 4 fixed modulus prescaler. Chip, SOIC8, FTP8 8 Toshiba
CND2050-DAF/20 0.5-11.5 GHz divide by 4 static prescaler. SOIC8 8 Toshiba
COP87L88RD 8-Bit CMOS OTP Microcontrollers with 16k or 32k Memory and 8-Channel A/D with Prescaler MDIP, PLCC 40, 44 National Sem.
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DN8506S Prescaler IC for TV and VCR tuners - Panasonic
DN8522S-A Prescaler IC for CATV - Panasonic
DS8673N Low Power VHF/UHF Prescalers - National Sem.
HD10551 Prescaler for digital tuning system SP-8 8 Hitachi Sem.
HMC251MS8 SMT prescaler 3.0 -6.5 GHz MSOP 8 Hitachi Sem.
IFD50010 Avantek 5 GHz prescaler /4 Hitachi Sem.
IFD53010 Silicon bipolar MMIC 3.5 GHz divide-by-4 static prescalers -- 4 Hitachi Sem.
IFD53110 Silicon bipolar MMIC 5.5 GHz divide-by-4 static prescalers -- 4 Hitachi Sem.
KGF2701 2.0 GHz two-modulus prescaler PSOP 8 National Sem.
KGL2115 UNF-band digital device. 2-modulus prescaler. SOP 8 National Sem.
KGL2132 2.0 GHz two-modulus prescaler PSOP 8 National Sem.
KGL2135 1.7 GHz two-modulus prescaler PSOP 8 National Sem.
LB3500 1/8 prescaler for PLL electronic tuning SEP9 9 SANYO
LMX5080M PLLatinum 2.7 GHz Low Power Dual Modulus Prescaler for RF Personal Communications - National Sem.
MB15E03SLP Single serial input PLL freguency synthesizer on-chip 1.2 GHz prescaler SSOP, BCC 16 Fujitsu
MB15E05SLPV Single serial input PLL frequency synthesizer On-chip 2.0 Ghz prescaler BCC 16 Fujitsu
MB15E07LP Single serial input PLL frequency synthesizer On-chip 2.5 Ghz prescaler BCC 16 Fujitsu
MB501L Two modulus prescaler DIP 8 Fujitsu
MB501LP =NE701=MC12022 divider/64/65/128/129 1.2 GHz DIP8 8 Fujitsu
MB501LPF =NE701D same in SMD SO-8 8 Fujitsu
MB504L Two modulus prescaler DIP 8 Fujitsu
MB506P Prescaler /64/128/256 max. 2.5 GHz DIP8 8 Fujitsu
MB506PF Prescaler /64/128/256 max. 3 GHz see UPB1505 SO8 8 Fujitsu
MB510 Prescaler /128/144/256/272 max. 2,7 GHz SO8 8 Fujitsu
MB511 Prescaler /1/2/8 max.1.2GHz sensitive: -26 dBm DIP8 8 Fujitsu
MC12009P Dual modulus prescaler PDIP 16 Motorola
MC12011 8/9 divider max. 600 MHz. Motorola
MC12011P Dual modulus prescaler PDIP 16 Motorola
MC12015P Dual modulus prescaler PDIP 8 Motorola
MC12016 40/41 divider max. 250 MHz =135C05 8 Motorola
MC12016P Dual modulus prescaler PDIP 8 Motorola
MC12017 divider Motorola
MC12018 divider 128/129 550MHz low power DIP8 8 Motorola
MC12019 Dual modulus prescaler SO-8, PDIP 8 Motorola
MC12022D See also MB501LPF, 64/65/128/129 divider 1.2 GHz SO-8, PDIP 8 Motorola
MC12022SL V(cc): -0.5 to +7.0V; 1.1GHz low power dual modulus prescaler PDIP, SO8 8 Motorola
MC12023P 225 MHz prescaler PDIP 8 Motorola
MC12025P 520 MHz dual modulus prescaler PDIP 8 Motorola
MC12026A 1.1 GHz dual modulus prescaler 8/9/16/17 divider SO8, PDIP 8 Motorola
MC12028A 1.1 GHz dual modulus prescaler SO-8, PDIP 8 Motorola
MC12032AD 64/65/128/129 divider 2 GHz SO8 8 Motorola
MC12033AD 2.0 GHz low voltage dual modulus prescaler SO-8, PDIP 8 Motorola
MC12034AD 2.0 GHz dual modulus prescaler SO-8, PDIP 8 Motorola
MC12036 1.1 GHz dual modulus prescaler with stand-by mode SO-8, PDIP 8 Motorola
MC12052ASD 1.1 GHz super low power dual modulus prescaler SSOP 8 Motorola
MC12053A 1.1 GHz super low power dual modulus prescaler with stand-by mode SO-8, SSOP 8 Motorola
MC12054A 2.0 GHz super low power dual modulus prescaler SO-8, SSOP 8 Motorola
MC12058 1.1 GHz super low power dual modulus prescaler SO-8, SSOP 8 Motorola
MC12066D 1.3 GHz prescaler SO-8 8 Motorola
MC12074 1.1 GHz prescaler SO-8, PDIP 8 Motorola
MC12075 1.3 GHz prescaler SOIC, PDIP 8 Motorola
MC12076 1.3 Hz prescaler SOIC, PDIP 8 Motorola
MC12078 1.3 GHz prescaler SOIC, PDIP 8 Motorola
MC12078 1.3 GHz prescaler PDIP 8 Motorola
MC12089 2.9 GHz prescaler SO-8, PDIP 8 Motorola
MC12090 UHF prescaler DIP, PDIP 16 Motorola
MC12093 2,4,8.1 GHz low power prescaler with stand-by mode SO-8, SSOP 8 Motorola
MC12095 Prescaler max. 2.7 GHz, /2 of /4 low power prescaler with stand-by mode SO-8, SSOP 8 Motorola
MC12098D 2.5 GHz prescaler SO-8 8 Motorola
MC3393 divider 15/16 150 MHz lowpower DIP8 8 Motorola
MN6152U PLL LSI with Built-In Prescaler - Panasonic
MN6155 PLL LSI with Built-In Prescaler - Panasonic
MSL2318 Divider /10 (40 MHz) /100 (250 MHz) switchable DIL DIL8 8
NTE851 Integrated circuit. VHF/UHF prescaler DIP 14 National Sem.
PE3501 3.5 GHz low power CMOS divide-by-2 prescaler TSSOP 8 Panasonic
PE3502 3.5 GHz low power CMOS divide-by-4 prescaler SOP 8 Panasonic
PE3503 3.5 GHz low power CMOS divide-by-8 prescaler SOP 8 Panasonic
PE9301 3.5 GHz low power CMOS divide-by-2 prescaler for RAD-hard applications SOIC 8 Panasonic
PE9302 3.5 GHz low power CMOS divide-by-4 prescaler for RAD-hard applications Flat pack 8 Panasonic
PE9303 3.5 GHz low power CMOS divide-by-8 prescaler for RAD-hard applications Flat pack 8 Panasonic
PMB2313T Prescaler Circuit 1.1 GHz - Infineon
PMB2314T Prescaler Circuit 2.1 GHz - Infineon
RDD104 Selectable 4 Decade CMOS* Divider US Digital
RED3600 Complementary MOS* (CMOS*) Divider US Digital
SA701 Divide by 128/129 - 64/65 ECL* prescaler dual modulus low power ECL prescaler DIL8, DLF, SOT96, SO, DIP 8 Philips
SA702 Divide by 64/65/72 triple modulus low power ECL* prescaler DIL8, SOT96, NE, DIP 8 Philips
SA703 Divide by 128/129/144 ECL* prescaler DIL8 8 Philips
SAA1058 32/33 Divider to 125 MHz DIL8 8
SAB6456 Sensitive 1 GHz prescaler=SDA4212 divider ECL* o/p select 64/256 see U891BS(pincomp.) DIP, SO, SOT96 8 Philips
SAB6457A Divide-by-64/256 prescaler DIL8 8 Philips
SP4653 256 divider Plessey 1 GHz DIP8 8 Plessey
SP4740 1-3Ghz /256 prescaler with low current and low radiation TTL-out DIP8, MDIP 8 Plessey
SP4902 Prescaler /2 max. 2.5 GHz alt. zie U862 DIP8 8 Plessey
SP8629 100 divider 150 MHz DIP8 8
SP8668 10 divider 1.6 GHz !!! (normally nearly NLG 200)
SP8690 =95H90 10/11 prescaler 225 MHz
SP8704 divider /128/129/64/65 1GHz lowpower only 10 mA DIP8 8
SP8718 64/65 divider 550 MHz smd SO8 8
SP8719M =SP8792 but 550 MHz; 80/81 divider PLCC 8
SP8782 Prescaler /16/17/32/33 max. & gt; 1 GHz DIP8 DIP8 8
SP8789 Prescaler /20/22 500 MHz lowpower DIP8 DIP8 8
SP8793 Prescaler /40/41 225 MHz see also MC12016
SP8830 6.5V; 1.5GHz+10 prescaler DIP 8 Mitel
SP8908 Prescaler /8 5,5 GHz SO8 8
TC9127P High speed PLL with built-in prescaler DIP28-P 22 Toshiba
TC9128P High speed PLL with built-in prescaler DIP28-P 22 Toshiba
TC9172AP High speed PLL with built-in prescaler DIP, DIP28-P 16 Toshiba
TC9227P High speed PLL with built-in prescaler DIP 22 Toshiba
TC9228P High speed PLL with built-in prescaler DIP 22 Toshiba
TC9307AF Single chip DTS controller with built-in prescaler-PLL-LCD driver (DTS-12) QFP44-P 44 Toshiba
TD6116P 1.2GHz prescaler SIP7-P 7 Toshiba
TD6118P 1.2GHz prescaler SIP7-P 7 Toshiba
TD6120P 1.2GHz prescaler SIP7-P 7 Toshiba
TD6122P 1.2GHz prescaler SIP7-P 7 Toshiba
TD6124P 1.2GHz prescaler SIP7-P 7 Toshiba
TD6126P 1.2GHz prescaler SIP7-P 7 Toshiba
TD7101F ELC prescaler for digital synthsized tuner - Toshiba
TD7103F ECL prescaler for digital synthesized tuner - Toshiba
TD7104F ECL prescaler for digital synthesized tuner - Toshiba
TD7104P ECL prescaler for digital synthesized tuner - Toshiba
U666B 256-divider 1.2 GHz DIP8 not self oscillating Toshiba
U813BSE 1.1-GHz prescaler for PLLs in TV, CATV and SAT TV tuners, emitter-follower output stage DIP 8 SANYO
U813BS-FP 1.1-GHz prescaler for PLLs in TV, CATV and SAT TV tuners, ECL output stage SO 8 SANYO
U824 4-divider 2.3 GHz in TO50 (X-case) very scarce SANYO
U833BSE divider /64/128/256 max. 1.3 GHz (typ.1.6GHz) emitt.foll. o/p SANYO
U847BST (pincomp.SP4740) Dlr./256 max. 1.3GHz (typ.1.6GHz) TTL output SANYO
U862BS divider /2 2.5GHz TO50 SANYO
U865BS divider /960/1024 1.2 GHz DIP8 8 SANYO
U891BS divider /64/128/256 on chip filt.(clean output) 1.2Gz balanced output DIP8 8 SANYO
U893BSE divider /64/128/256 on chip filt.(clean output) 1.2GHz balanced output DIP 8 SANYO
U893BSE-FP 1.3 GHz prescaler for PLL's in TV, CATV and SAT TV tuners SO 8 SANYO
U893BSE-SP 1.3 GHz prescaler for PLL's in TV, CATV and SAT TV tuners SIP 6 SANYO
UPB1502GR 2 GHz prescaler divided by 64/65, 128/129 8-P-SOP - NEC
UPB1505GR 64/128/256 divider 4 GHz (pincomp. MB506PF but faster) NEC
UPB1506GV 3GHz,64/128/256 dividing prescaler 8-P-SSOP - NEC
UPB1507GV 3GHz 64/128/256 dividing prescaler 8-P-SSOP - NEC
UPB1508GV 3GHz,2 dividing prescaler 8-P-SSOP - NEC
UPB1509GV 1GHz,low voltage 2/4/8 dividing prescaler 8-P-SSOP - NEC
UPB1510GV 3GHz, 4 dividing prescaler 8-P-SSOP - NEC
UPB1510GV 3.0 GHz Divide by 4 prescaler NEC
UPB1511TB 800MHz, low current 2/4 dividing prescaler 6-P - NEC
UPB571C 500MHz dual-modulus prescaler DIP 8 NEC
UPB582 /4 divider 3 GHz DIP8 8 NEC
UPB584G 2.5 GHz divide by 2 prescaler NEC
UPD1719G Integral prescaler, PLL synthesizer LCD driver microcontroller - 64 NEC
ZL40800/DC 6 GHz fixed modulus prescaler of 8 or 16. SOIC 8 Toshiba
ZL40802/DC 6 GHz fixed modulus prescaler of 8 or 16. SOIC 8 Toshiba
Sept. 1995
Edition 3.0a
DATA SHEET
MB506
ULTRA HIGH FREQUENCY PRESCALER
ULTRA HIGH FREQUENCY PRESCALER
The Fujitsu MB506 is a high frequency, up to 2.4GHz, prescaler used with a
frequency synthesizer to form a Phase Locked Loop (PLL). It will divide the input
frequency by the modulus of 128 or 256 and the output level is 1.6V peak to peak
on ECL level.Operation in the 1.6GHz range meets the specification for
applications in Direct Broadcasting Satellite Systems (DBS), CATV systems, and
UHF Transceivers.
PLASTIC PACKAGE
DIP-08P-M01
FEATURES
S High Frequency Operation
2.4GHz max.
S Power Dissipation
90mW typ.
S Wide Operation Temperature
-40°C to +85°C
S Stable Output Amplitude
VOUT = 1.6Vp–p
PLASTIC PACKAGE
FPT-08P-M01
S Complete PLL synthesizer circuit with the Fujitsu MB87006A, PLL
synthesizer IC
PIN ASSIGNMENT
S Plastic 8-pin Standard Dual-In-Line Package or Flat Package
IN
1
VCC
ABSOLUTE MAXIMUM RATINGS (See Note)
8
2
IN
7
NC
TOP VIEW
Rating
Symbol
Value
Unit
Supply Voltage
VCC
–0.5 to +7.0
V
Input Voltage
VIN
–0.5 to VCC
IO
10
–55 to +125
6
SW2
OUT
4
5
GND
mA
TSTG
3
V
Output Current
SW
°C
Storage Temperature
Note:
Permanent device damage may occur if the above Absolute Maximum Ratings are
exceeded. Functional operation should be restricted to the conditions as detailed in
Copyright E 1995 by FUJITSU LIMITED and FUJITSU MICROELECTRONICS
This device contains circuitry to protect the inputs against
damage due to high static voltages or electric fields. However,
it is advised that normal precautions be taken to avoid
application of any voltage higher than maximum rated voltages
to this high impedance circuit.
MB506
the operational sections of this data sheet. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
D Q
D Q
C Q
Input
Buffer
D Q
C Q
C Q
IN
IN
SW
SW
D Q
D Q
D Q
C Q
C Q
C Q
D Q
SW
C Q
D Q
SW
C Q
Output
Buffer
OUT
SW1
SW2
H
H
1/64
L
H
1/128
H
L
1/128
L
L
1/256
Note:
Divide Ratio
H = VCC, L = open
Figure 1. MB506 Block Diagram
PIN DESCRIPTION
Pin Number
1
IN
2
VCC
Power Supply Voltage
3
SW1
Divide Ratio Control Input Selecting Divide Ratio (See Divide Ratio Table)
4
OUT
Output
5
GND
Ground
6
SW2
Divide Ratio Control Input Selecting Divide Ratio (See Divide Ratio Table)
7
NC
No Connection
8
2
Symbol
Function
IN
Complementary Input
Input
MB506
RECOMMENDED OPERATING CONDITIONS
Value
Parameter
Symbol
Unit
Min.
Supply Voltage
Output Current
TA
Load Capacitance
5.0
5.5
IO
Ambient Temperature
Max.
4.5
VCC
Typ.
CL
1.2
V
mA
+85
°C
12
–40
pF
ELECTRICAL CHARACTERISTICS
(Recommended operating conditions unless otherwise noted.)
Value
Parameter
Symbol
Conditions
Unit
Min.
Supply Curent
ICC
Output Amplitude
VO
Typ.
Input Frequency
fIN
Input Signal Amplitude
PIN
High Level Input Voltage for SW
VIHS*
Low Level Input Voltage for SW
18
mA
1.6
1.0
Vp–p
TA = –40°C
to 85°C
100
2200
TA = –40°C
to 60°C
100
2400
fIN = 100MHz to 1.3GHz
–16
5.5
fIN = 1.3MHz to 2.4GHz
–4
5.5
with input
coupling
capacitor
1000pF
MHz
dBm
VILS
VCC –0.1
VCC
Open
VCC +0.1
V
V
*Design Guarantee
MINIMUM INPUT SIGNAL AMPLITUDE (MVp–p)
Note:
Max.
1000
VCC = 5.0V
TA = 25°C
800
600
400
200
0
100
200
500 1000 2000
INPUT FREQUENCY (MHz)
5000
Figure 2. Input Signal Amplitude vs. Input Frequency
3
MB506
PACKAGE DIMENSIONS
8-LEAD PLASTIC DUAL-IN-LINE PACKAGE
(CASE No.: DIP-08P-M01)
8-LEAD PLASTIC FLAT PACKAGE
(CASE No.: FPT-08P-M01)
15° MAX
ǒ
INDEX
) .010
.250 – .008
) 0.25
6.35 – 0.20
.244+.010
(6.20+0.25)
Ǔ
.002(0.05)
MIN
(STAND OFF)
.300(7.62)TYP
View “A”
.008(0.2)
) .014
.035 – .012
) 0.35
0.89 – 0.30
ǒ
ǒ
INDEX
.010+.02
(0.25+0.5)
) .016
.370 – .012
) 0.40
9.40 – 0.30
) .016
.268 – .008
ǒ
) 0.40
6.80 – 0.20
.209+.012
(5.30+0.25)
Ǔ
Ǔ
.307+.016
(7.8+0.4)
Ǔ
.020+.008
(0.5+0.2)
.100(2.54)TYP
.018+.004
(0.45+0.10)
.050(1.27)
TYP
ǒ
.172(4.36)MAX
.020(0.5)
.007(0.18)
MAX
.027(0.68)
MAX
) .002
.006 – .001
) 0.05
0.15 – 0.2
Ǔ
.085(2.15)MAX
) .012
.039 – 0
) 0.3
0.99 – 0
ǒ
Ǔ
.020*0.51)
MIN
.018+.003
(0.46+0.08)
) .012
.060 – 0
ǒ
.118(3.0)MIN
) 0.3
1.52 – 0
A
Ǔ
.0315+.008
(0.8+0.2)
Dimensions in
inches (millimeters)
E1987 FUJITSU LIMITED D08006S-2C
All Rights Reserved. Circuit diagrams utilizing Fujitsu products are
included as a means of illustrating typical semiconductor applications.
Complete information sufficient for construction purposes is not
necessarily given. The information contained in this document has been
carefully checked and is believed to be reliable. However, Fujitsu
assumes no responsibility for inaccuracies.
Dimensions in
inches (millimeters)
E1987 FUJITSU LIMITED F08002S-2C
The information contained in this document does not convey any license
under the copyrights, patent rights or trademarks claimed and owned by
Fujitsu. Fujitsu reserves the right to change products or specifications
without notice. No part of this publication may be copied or reproduced in
any form or by any means, or transferred to any third party without prior
written consent of Fujitsu.
FUJITSU LIMITED
For further information please contact:
Europe
Japan
FUJITSU MIKROELEKTRONIK GmbH
Am Siebenstein 6-10,
6072 Dreieich-Buchschlag,
Germany
Tel: (06103) 690-0
Telex: 411963
FAX: (06103) 690-122
FUJITSU LIMITED
International Marketing Div.
Furukawa Sogo Bldg., 6-1, Marunouchi 2-chome
Chiyoda-ku, Tokyo 100, Japan
Tel: (03) 3216-3211
Telex: 781-2224361
FAX: (03) 3215-0662
North and South America
FUJITSU MICROELECTRONICS, INC.
Integrated Circuits Division
3545 North First Street
San Jose, CA 95134-1804, USA
Tel: 408-922-9000
FAX: 408-432-9044
©FUJITSU LIMITED 1990
4
Asia
FUJITSU MICROELECTRONICS ASIA PTE LIMITED
51 Bras Basah Road,
Plaza By The Park,
#06-04 to #06-07
Singapore 0719
Tel: 336-1600
Telex: 55573
FAX: 336-1609
Printed in Japan PV0050–902A3