Wg Sm element V2405.
Process Flow, Electrical
Process Flow, Electrical
Applicable for G502
Contents
1
2
Process Flow ..................................................................................................... 2
1.1
Process Flow, Description..................................................................... 3
Revision History ................................................................................................ 4
1213-7917 1
Company Internal © Sony Ericsson Mobile Communications AB
Process Flow, Electrical
1 Process Flow
Unit in
No Trouble
Found or
Software
Fault
Determine
Fault
Liquid Intrusion Control
Hardware
Fault Found
Reject for
Customer Abuse
Fault not repairable on this level
or cause of failure not found
Trouble Shoot
Fault not repairable on this level
Repair
Upgrade Software
to Latest Revision
if Needed
Update Label if
Needed
Test
Fail
Next Repair Level
Pass
Unit Out
1213-7917 1
Company Internal © Sony Ericsson Mobile Communications AB
2(4)
Process Flow, Electrical
1.1
Process Flow, Description
Box
Unit in
Determine Fault
Reference
Process the phone according to local requirements.
Test Instruction, Mechanical and Electrical
Determine if the phone is faulty or not, and try to confirm the customer’s
complaint. Only perform those tests necessary to confirm the failure.
If a hardware fault is found, or a hardware and software fault is found,
then continue with Trouble Shoot.
If only a software fault is found, then continue with Upgrade Software to
Latest Revision, Test, and Unit Out.
Report as SW upgrade.
If no hardware or software fault is found, then continue with Upgrade
Software to Latest Revision, Test, and Unit Out.
Report as No Trouble Found, NTF.
Reject for Customer
Abuse
Trouble Shoot
Repair
If liquid intrusion or other abuse is found, then continue with Reject for
Customer Abuse.
Test Instruction, Mechanical
If liquid intrusion or abuse is found, then reject the product according to
local requirements.
Trouble Shooting Guide, Mechanical and Electrical
Determine the cause of the failure. Trouble-shoot the phone according to
the guide for the most common faults.
Working Instruction, Mechanical and Electrical
Repair the faulty phone according to the instruction. Replace parts as
required. (Product Change Survey, Mechanical)
Flashing the latest software into the phone at this point may “repair” some
problems.
Upgrade Software to
Latest Revision if Needed
Update Label if Needed
Test
Unit Out
Next Repair Level
If a repair that requires calibration has been done, then calibrate the unit
in SERP. (Test Instruction, Electrical)
Calibration can only be done by authorized repair locations.
Product Change Survey, Mechanical
Upgrade the software to the latest revision if needed.
Working Instruction Mechanical
Print and apply a new label if needed.
Test Instruction, Mechanical and Electrical
Perform all tests as described in the instruction.
Process and package the phone according to local requirements.
If the cause of the failure cannot be found or is not reparable at this level,
then the product can be Scrapped, Swapped, or returned to the customer
at the customer’s request.
Scrap:
According to local directives
Swap: Swap the phone according to the instruction in Working
Instructions, Swap and Customize and according to local directives.
1213-7917 1
Company Internal © Sony Ericsson Mobile Communications AB
3(4)
Process Flow, Electrical
2 Revision History
Rev.
1
Date
Changes / Comments
2008-05-26
1st release
1213-7917 1
Company Internal © Sony Ericsson Mobile Communications AB
4(4)
Part List, Electrical
Part List, Electrical
Applicable for G502
Contents
1
Part list Main Board........................................................................................... 2
2
Revision History ................................................................................................ 4
1213-7925 1
Company Internal © Sony Ericsson Mobile Communications AB
Part List, Electrical
1 Part list Main Board
Contains only components that are possible to replace on the main board.
Pos. number refers to the components position number on the board.
Some components are noted as MSL X. These components are moisture-sensitive
and are rated at various levels (MSL):
Level 1:
Unlimited floor life; does not require dry pack or re-baking.
Level 2:
1 year floor life; & lt; /=30 C; 60%rh; shipped in dry pack; must be re-baked
after being opened if floor life is exceeded.
Level 2A:
4 week floor life; & lt; /=30 C; 60%rh; shipped in dry pack; must be rebaked after being opened if floor life is exceeded.
Level 3:
168 hours floor life; & lt; /=30 C; 60%rh; shipped in dry pack; must be rebaked after being opened if floor life is exceeded.
Level 4:
72 hours floor life; & lt; /=30 C; 60%rh; shipped in dry pack; must be rebaked after being opened if floor life is exceeded.
Level 5:
48 hours floor life; & lt; /=30 C; 60%rh; shipped in dry pack; must be rebaked
after being opened if floor life is exceeded.
Level 5A:
24 hours floor life; & lt; /=30 C; 60%rh; shipped in dry pack; must be rebaked
after being opened if floor life is exceeded.
Level 6:
6 hours floor life; & lt; /=30 C; 60%rh; shipped in dry pack; must be rebaked
after being opened if floor life is exceeded.
Component placing will be found in document 1213-7892.
NOTE!
RF Calibration by using SERP can only be done by authorized repair
centers.
Fence modification according to Working Instruction Electrical.
P=Primary side, S=Secondary side.
Side Pos.
P
P
P
P
S
P
P
P
P
N/A
X1200
X1201, X1202
X1203
X2200
X2402
X4200
X4310
S2402, S2403
B3100
X2403
Description
Part Number
BT shielding can
Antena switch conn
1200-7601
RPT79947
Antenna connector
battery Connector
keypad Connector
SND 901 58
SND10620
RNV799036
B to B connector, female,
22 pin
Camera connector
Input Switch Side Push
Microphone
SIM Card Conn Micro
SD Hight, 2.2 mm
Comments
RNV799046
RNV799011
RMD10116/9
RLC509429/5
1204-8474
1213-7925 1
Company Internal © Sony Ericsson Mobile Communications AB
2(4)
Part List, Electrical
Side Pos.
Description
Part Number
P
P
MS-Micro Pico holder
LED Diode
Capacitor Ceramic
470,0 nF +/-10% 6,3 V
IC Single bus buffer
gate
RNK87147/2
RKZ433664/3
Filter 0.0 Hz 0402
IC Vreg
1-Bit Level Translator
ASIC Tjatte3 CSP20
Trans P-ch FET
Trans MOSFET
Complementary N P 20
V (D S)
Zener Diode voltage
regulator 15V 5%
MICROCIRCUIT/USB
transceiver and UART
MU
MIKROKRETS/Class
AB Audio Amplifier
REG70618/20
RYT113997/4
RYT109914/1
ROP1013074/1
RYN122910/1
P & S
S
P
P
S
P
P
X2490
V2201
C3113, C3120,
C3145, C3146
D2105
L2400,
L2401, L2402,
L2403, L2404
N2203
N2400
N3101
V2202
S
V2405
P
P
S
V2420, V2421
D2404
N3100
RJC5163026/47
Comments
MSL1
1200-0425
MSL1
MSL1
RYN901918/2
RKZ223905/2
MSL1
RYT109913/1
RYT1017841/2
MSL3
P
N1400
S
B2100
P
Special Soldering Process Required
N1210
Module Bluetooth + FM
1200-6182
STLC2592
Crystal 32,768 kHz
RTM501911/1
- Authorized Repair Centers Only
SL4
Require calibration (SERP)
Require calibration (SERP)
UMTS Only
MSL R5A
Special Soldering Process Required
RF-Module Squid Pre bumped
1204-1674
P
N1200
-
RF-Module Thor Prebumped
Special Soldering Process Required
1203-6579
1213-7925 1
Company Internal © Sony Ericsson Mobile Communications AB
Authorized Repair Centers
Only
Require calibration (SERP)
MSL R5A
- Authorized Repair Centers Only
3(4)
Part List, Electrical
2 Revision History
Rev.
1
Date
Changes / Comments
2008-05-26
1st version
1213-7925 1
Company Internal © Sony Ericsson Mobile Communications AB
4(4)
Go/No Go Test Script Specification, Electrical
Go/No Go Test Script Specification,
Electrical
Applicable for: G502c and G502i
Contents
1 ... General................................................................................................................................3
1.1
About This Document .....................................................................................3
1.2
Script Requirements .......................................................................................3
1.3
Traffic Channel (TCH) Allocation Table.......................................................4
1.4
Power Level Allocation Table........................................................................4
1.5
Test Limits ........................................................................................................4
1.6
Attenuation Factors.........................................................................................4
2 ... Test Sequence - Radiated ..............................................................................................5
2.1
Initializing and Call Setup...............................................................................5
2.2
Audio Loopback...............................................................................................7
2.3
GSM 1800 Low TCH Measurements ...........................................................7
2.4
GSM 1800 Mid TCH Measurements ............................................................7
2.5
GSM 1800 High TCH Measurements ..........................................................8
2.6
GSM 900 Low TCH Measurements .............................................................8
2.7
GSM 900 Mid TCH Measurements ..............................................................9
2.8
GSM 900 High TCH Measurements ............................................................9
2.9
GSM 1900 Low TCH Measurements .........................................................10
2.10
GSM 1900 Mid TCH Measurements ..........................................................10
2.11
GSM 1900 High TCH Measurements ........................................................11
2.12
UMTS 2100 Low TCH Measurements (G502i only) ................................11
2.13
UMTS 2100 Mid TCH Measurements (G502i only) .................................12
2.14
UMTS 2100 High TCH Measurements (G502i only) ...............................12
3 ... Test Sequence - Conducted ........................................................................................13
3.1
Initializing and Call Setup.............................................................................13
3.2
Audio Loopback.............................................................................................14
3.3
GSM 1800 Low TCH Measurements .........................................................14
3.4
GSM 1800 Mid TCH Measurements ..........................................................14
3.5
GSM 1800 High TCH Measurements ........................................................15
3.6
GSM 900 Low TCH Measurements ...........................................................15
3.7
GSM 900 Mid TCH Measurements ............................................................16
3.8
GSM 900 High TCH Measurements ..........................................................16
3.9
GSM 1900 Low TCH Measurements .........................................................17
3.10
GSM 1900 Mid TCH Measurements ..........................................................17
3.11
GSM 1900 High TCH Measurements ........................................................18
3.12
UMTS 2100 Low TCH Measurements (G502i only) ................................18
3.13
UMTS 2100 Mid TCH Measurements (G502i only) .................................19
3.14
UMTS 2100 High TCH Measurements (G502i only) ...............................19
4 ... Attenuation Factors.......................................................................................................20
1213-7931 1
Company Internal
Sony Ericsson Mobile Communications AB
Go/No Go Test Script Specification, Electrical
4.1
Radiated Loss Values ..................................................................................20
4.2
Conducted Loss Values ...............................................................................21
5 ... Revision history .............................................................................................................21
1213-7931 1
Company Internal
2(21)
Sony Ericsson Mobile Communications AB
Go/No Go Test Script Specification, Electrical
1 General
1.1
About This Document
This document contains the test requirements for a 3G GSM (900/1800/1900) and
UMTS (2100) pocket transceiver using an antenna coupler (Radiated) or RF cable
(Conducted) connection. These test sequences should be used as an arrival and
verification test of radio functionality.
Tests are done in signaling mode, i.e. a call has been established to the test instrument.
The test instrument controls the transceiver unit. RF performance is measured with an
antenna coupler or the direct line connection, whichever method is selected.
1.2
Script Requirements
The test should be designed so those users with little or no system expertise can
perform accurate testing.
The measurements should run automatically, though a certain amount of manual
work is included (and mandatory), such as MS call setup (i.e. dialling number).
It should be possible to print or store the measurement results.
It should be possible to change the channels used in testing due to possible local
radio interference. The ranges for these settings are specified under the Channel
Allocation Table.
All functions and settings should be protected in such a manner that the end-user
cannot directly change them. (For example, a password or encrypted settings file.)
The attenuation factors that should be used are stated in section 4. The test
instrument must be capable of using different attenuation factors for RX and TX. It
must also be possible to use various attenuation factors for different channels in
each band.
NOTE!
1213-7931 1
Company Internal
Any setups other than the one stated in this document must be
discussed and exempted by Sony Ericsson to be approved.
3(21)
Sony Ericsson Mobile Communications AB
Go/No Go Test Script Specification, Electrical
1.3
Traffic Channel (TCH) Allocation Table
Band
GSM 900
GSM 900
GSM 900
Ch definition Any ARFCN of:
Low
975-979
Mid
36-40
High
120-124
GSM 1800
GSM 1800
GSM 1800
512-516
697-701
881-885
GSM 1900
GSM 1900
GSM 1900
Low
Mid
High
512-516
658-662
806-810
WCDMA 2100
WCDMA 2100
WCDMA 2100
1.4
Low
Mid
High
Low
Mid
High
9612
9750
9888
Power Level Allocation Table
Band
GSM 1800/1900
GSM 1800/1900
GSM 1800/1900
1.5
Power level (PL)
GSM 900
GSM 900
GSM 900
PL
definition
Lowest
Mid
Highest
Lowest
Mid
Highest
15
8
0
19
12
5
Test Limits
The test limits for each measurement are specified in the Sequence Tables.
1. Since a coupler introduces higher measurement inaccuracy, some
measurements in the radiated test sequences may have wider limits than
stated in the 3GPP specifications.
2. The conducted limits conform to the phase 3GPP specification.
1.6
Attenuation Factors
The different scripts must be configured with the correct attenuation factors and named
after the product that they are designed to test. The attenuation factors to be used are
stated in section 4.
1213-7931 1
Company Internal
4(21)
Sony Ericsson Mobile Communications AB
Go/No Go Test Script Specification, Electrical
2 Test Sequence - Radiated
2.1
Initializing and Call Setup
Parameter
BCCH
TCH
TX power level
RF output power
System
1213-7931 1
Company Internal
Value
Mid
Mid
High
-40
GSM 1800
Unit
Ch
Ch
PL
dBm
5(21)
Sony Ericsson Mobile Communications AB
Go/No Go Test Script Specification, Electrical
2.1.1
Sequence
1. Initialize instrument
2. Insert a test-USIM and attach a fully charged standard battery to the
mobile. It’s very important that a fully charged battery is used otherwise
there is a high risk for incorrect test results.
3. Position the mobile in the coupler according to the picture.
Rohde & Schwarz Shield Box and Coupler (D7)
4. Turn on the mobile and wait for registration.
5. Set up a call to the instrument or let the instrument call the MS.
6. Close the lid on the shielding box.
1213-7931 1
Company Internal
6(21)
Sony Ericsson Mobile Communications AB
Go/No Go Test Script Specification, Electrical
2.2
Audio Loopback
1. Set power level to high.
2. Activate audio loopback in the instrument.
3. Operator must acknowledge passed or failed before the test is continued.
2.3
GSM 1800 Low TCH Measurements
Parameter
TCH
TX power level
RF output power
System
2.3.1
Unit
Ch
PL
dBm
GSM 1800 Low TCH Test Limits
Measurement
TX power
RMS Phase Error
Rx Level
RX Quality
2.4
Value
Low
High
-68
GSM 1800
Test Limits
30 +/-4
0 +/-5
34-50
0-3
Unit
dB
deg
dB
Units
GSM 1800 Mid TCH Measurements
Parameter
TCH
TX power level
RF output power
System
2.4.1
Unit
Ch
PL
dBm
GSM 1800 Mid TCH Test Limits
Measurement
TX power
RMS Phase error
Peak Phase error
Freq. error
Rx Level
Rx Quality
1213-7931 1
Company Internal
Value
Mid
Mid
-102
GSM 1800
Test Limits
14 +/-5
0 +/-5
0 +/-20
+/-0.1 ppm
2-14
0-3
Unit
dB
deg
deg
Hz
dB
Units
7(21)
Sony Ericsson Mobile Communications AB
Go/No Go Test Script Specification, Electrical
2.5
GSM 1800 High TCH Measurements
Parameter
TCH
TX power level
RF output power
System
2.5.1
Unit
Ch
PL
dBm
GSM 1800 High TCH Test Limits
Measurement
TX power
RMS Phase error
2.6
Value
High
Low
-68
GSM 1800
Test Limits
0 +/-7
0 +/-5
Unit
dB
deg
GSM 900 Low TCH Measurements
Parameter
TCH
TX power level
RF output power
System
2.6.1
Unit
Ch
PL
dBm
GSM 900 Low TCH Test Limits
Measurement
TX power
RMS Phase error
Rx Level
Rx Quality
1213-7931 1
Company Internal
Value
Low
High
-68
GSM 900
Test Limits
33 +/-4
0 +/-5
34-50
0-3
Unit
dB
deg
dB
Units
8(21)
Sony Ericsson Mobile Communications AB
Go/No Go Test Script Specification, Electrical
2.7
GSM 900 Mid TCH Measurements
Parameter
TCH
TX power level
RF output power
System
2.7.1
Unit
Ch
PL
dBm
GSM 900 Mid TCH Test Limits
Measurement
TX power
RMS Phase error
Peak Phase error
Freq error
Rx Level
Rx Quality
2.8
Value
Mid
Mid
-102
GSM 900
Test Limits
19 +/-5
0 +/-5
0 +/-20
+/-0.1 ppm
2-14
0-3
Unit
dB
deg
deg
Hz
dB
Units
GSM 900 High TCH Measurements
Parameter
TCH
TX power level
RF output power
System
2.8.1
Unit
Ch
PL
dBm
GSM 900 High TCH Test Limits
Measurement
TX power
RMS Phase error
1213-7931 1
Company Internal
Value
High
Low
-68
GSM 900
Test Limits
5 +/-7
0 +/-5
Unit
dB
deg
9(21)
Sony Ericsson Mobile Communications AB
Go/No Go Test Script Specification, Electrical
2.9
GSM 1900 Low TCH Measurements
Parameter
TCH
TX power level
RF output power
System
2.9.1
Value
Low
Low
-68
GSM 1900
Unit
Ch
PL
dBm
GSM 1900 Low TCH Test Limits
Measurement
TX power
RMS Phase Error
Rx Level
RX Quality
Test Limits
0 +/-7
0 +/-5
34-50
0-3
Unit
dB
deg
dB
Units
2.10 GSM 1900 Mid TCH Measurements
Parameter
TCH
TX power level
RF output power
System
Value
Mid
Mid
-102
GSM 1900
Unit
Ch
PL
dBm
2.10.1 GSM 1900 Mid TCH Test Limits
Measurement
TX power
RMS Phase error
Peak Phase error
Freq. error
Rx Level
Rx Quality
1213-7931 1
Company Internal
Test Limits
14 +/-5
0 +/-5
0 +/-20
+/-0.1 ppm
2-14
0-3
Unit
dB
deg
deg
Hz
dB
Units
10(21)
Sony Ericsson Mobile Communications AB
Go/No Go Test Script Specification, Electrical
2.11 GSM 1900 High TCH Measurements
Parameter
TCH
TX power level
RF output power
System
Value
High
High
-68
GSM 1900
Unit
Ch
PL
dBm
2.11.1 GSM 1900 High TCH Test Limits
Measurement
TX power
RMS Phase error
Test Limits
30 +/-4
0 +/-5
Unit
dB
deg
2.12 UMTS 2100 Low TCH Measurements (G502i only)
Parameter
TCH
Power Level
RF out
Value
Low
Maximum
-93
Unit
Channel
dBm
dBm
2.12.1 UMTS 2100 Low TCH Test Limits (G502i only)
Measurement
Tx Maximum Output Power
EVM
Frequency Error
Tx Adjacent Channel Level Ratio +/- 5MHz
Tx Adjacent Channel Level Ratio +/- 10MHz
1213-7931 1
Company Internal
Test Limits
19 to 27
17.5 max
-0.1 to 0.1
-36
-46
Unit
dBm
%
ppm
dBc
dBc
11(21)
Sony Ericsson Mobile Communications AB
Go/No Go Test Script Specification, Electrical
2.13 UMTS 2100 Mid TCH Measurements (G502i only)
Parameter
TCH
Power Level
RF out
Value
Mid
Maximum
-93 (* -104)
Unit
Channel
dBm
dBm
2.13.1 UMTS 2100 Mid TCH Test Limits (G502i only)
Measurement
Tx Maximum Output Power
EVM
Frequency Error
Tx Adjacent Channel Level Ratio +/- 5MHz
Tx Adjacent Channel Level Ratio +/- 10MHz
Rx Reference Sensitivity Level* (RF out: -104)
Test Limits
19 to 27
17.5 max
-0.1 to 0.1
-36
-46
-0.1 to 0.1
Unit
dBm
%
ppm
dBc
dBc
%
2.14 UMTS 2100 High TCH Measurements (G502i only)
Parameter
TCH
Power Level
RF out
Value
High
Maximum
-93
Unit
Channel
dBm
dBm
2.14.1 UMTS 2100 High TCH Test Limits (G502i only)
Measurement
Tx Maximum Output Power
EVM
Frequency Error
Tx Adjacent Channel Level Ratio +/- 5MHz
Tx Adjacent Channel Level Ratio +/- 10MHz
Test Limits
19 to 27
17.5 max
-0.1 to 0.1
-36
-46
Unit
dBm
%
degree
dBc
dBc
2.14.2 Call Disconnect Sequence
1. Disconnect call.
2. End test.
1213-7931 1
Company Internal
12(21)
Sony Ericsson Mobile Communications AB
Go/No Go Test Script Specification, Electrical
3 Test Sequence - Conducted
3.1
Initializing and Call Setup
Parameter
BCCH
TCH
TX power level
RF output power
System
3.1.1
Value
Mid
Mid
High
-40
GSM 1800
Unit
Ch
Ch
PL
dBm
Sequence
1. Initialize instrument
2. Insert a test-USIM and attach a fully charged standard battery to the
mobile. It’s very important that a fully charged battery is used otherwise
there is a high risk for incorrect test results. A dummy battery can also be
used.
3. Remove the antenna cover and connect the mobile to the RF fixture
according to the picture.
4. Turn on the mobile and wait for registration.
5. Set up a call to the instrument or let the instrument call the MS.
1213-7931 1
Company Internal
13(21)
Sony Ericsson Mobile Communications AB
Go/No Go Test Script Specification, Electrical
3.2
Audio Loopback
1.
2.
Activate audio loopback in the instrument.
3.
3.3
Set power level to high.
Operator must acknowledge passed or failed before the test is continued.
GSM 1800 Low TCH Measurements
Parameter
TCH
TX power level
RF output power
System
3.3.1
Unit
Ch
PL
dBm
GSM 1800 Low TCH Test Limits
Measurement
TX power
RMS Phase Error
Rx Level
RX Quality
3.4
Value
Low
High
-68
GSM 1800
Test Limits
30 +/-2
0 +/-5
36-48
0-3
Unit
dB
deg
dB
Units
GSM 1800 Mid TCH Measurements
Parameter
TCH
TX power level
RF output power
System
3.4.1
Unit
Ch
PL
dBm
GSM 1800 Mid TCH Test Limits
Measurement
TX power
RMS Phase error
Peak Phase error
Freq. error
Rx Level
Rx Quality
1213-7931 1
Company Internal
Value
Mid
Mid
-102
GSM 1800
Test Limits
14 +/-3
0 +/-5
0 +/-20
+/-0.1 ppm
4-12
0-3
Unit
dB
deg
deg
Hz
dB
Units
14(21)
Sony Ericsson Mobile Communications AB
Go/No Go Test Script Specification, Electrical
3.5
GSM 1800 High TCH Measurements
Parameter
TCH
TX power level
RF output power
System
3.5.1
Unit
Ch
PL
dBm
GSM 1800 High TCH Test Limits
Measurement
TX power
RMS Phase error
3.6
Value
High
Low
-68
GSM 1800
Test Limits
0 +/-5
0 +/-5
Unit
dB
deg
GSM 900 Low TCH Measurements
Parameter
TCH
TX power level
RF output power
System
3.6.1
Unit
Ch
PL
dBm
GSM 900 Low TCH Test Limits
Measurement
TX power
RMS Phase error
Rx Level
Rx Quality
1213-7931 1
Company Internal
Value
Low
High
-68
GSM 900
Test Limits
33 +/-2
0 +/-5
36-48
0-3
Unit
dB
deg
dB
Units
15(21)
Sony Ericsson Mobile Communications AB
Go/No Go Test Script Specification, Electrical
3.7
GSM 900 Mid TCH Measurements
Parameter
TCH
TX power level
RF output power
System
3.7.1
Unit
Ch
PL
dBm
GSM 900 Mid TCH Test Limits
Measurement
TX power
RMS Phase error
Peak Phase error
Freq error
Rx Level
Rx Quality
3.8
Value
Mid
Mid
-102
GSM 900
Test Limits
19 +/-3
0 +/-5
0 +/-20
+/-0.1 ppm
4-12
0-3
Unit
dB
deg
deg
Hz
dB
Units
GSM 900 High TCH Measurements
Parameter
TCH
TX power level
RF output power
System
3.8.1
Unit
Ch
PL
dBm
GSM 900 High TCH Test Limits
Measurement
TX power
RMS Phase error
1213-7931 1
Company Internal
Value
High
Low
-68
GSM 900
Test Limits
5 +/-5
0 +/-5
Unit
dB
deg
16(21)
Sony Ericsson Mobile Communications AB
Go/No Go Test Script Specification, Electrical
3.9
GSM 1900 Low TCH Measurements
Parameter
TCH
TX power level
RF output power
System
3.9.1
Value
Low
Low
-68
GSM 1900
Unit
Ch
PL
dBm
GSM 1900 Low TCH Test Limits
Measurement
TX power
RMS Phase error
Rx Level
RX Quality
Test Limits
0 +/-5
0 +/-5
36-48
0-3
Unit
dB
deg
dB
Units
3.10 GSM 1900 Mid TCH Measurements
Parameter
TCH
TX power level
RF output power
System
Value
Mid
Mid
-102
GSM 1900
Unit
Ch
PL
dBm
3.10.1 GSM 1900 Mid TCH Test Limits
Measurement
TX power
RMS Phase error
Peak Phase error
Freq. error
Rx Level
Rx Quality
1213-7931 1
Company Internal
Test Limits
14 +/-3
0 +/-5
0 +/-20
+/-0.1 ppm
4-12
0-3
Unit
dB
deg
deg
Hz
dB
Units
17(21)
Sony Ericsson Mobile Communications AB
Go/No Go Test Script Specification, Electrical
3.11 GSM 1900 High TCH Measurements
Parameter
TCH
TX power level
RF output power
System
Value
High
High
-68
GSM 1900
Unit
Ch
PL
dBm
3.11.1 GSM 1900 High TCH Test Limits
Measurement
TX power
RMS Phase error
Test Limits
30 +/-2
0 +/-5
Unit
dB
deg
3.12 UMTS 2100 Low TCH Measurements (G502i only)
Parameter
TCH
Power Level
RF out
Value
Low
Maximum
-93
Unit
Channel
dBm
dBm
3.12.1 UMTS 2100 Low TCH Test Limits (G502i only)
Measurement
Tx Maximum Output Power
EVM
Frequency Error
Tx Adjacent Channel Level Ratio +/- 5MHz
Tx Adjacent Channel Level Ratio +/- 10MHz
1213-7931 1
Company Internal
Test Limits
21 to 25
17.5 max
-0.1 to 0.1
-36
-46
Unit
dBm
%
ppm
dBc
dBc
18(21)
Sony Ericsson Mobile Communications AB
Go/No Go Test Script Specification, Electrical
3.13 UMTS 2100 Mid TCH Measurements (G502i only)
Parameter
TCH
Power Level
RF out
Value
Mid
Maximum
-93 (* -104)
Unit
Channel
dBm
dBm
3.13.1 UMTS 2100 Mid TCH Test Limits (G502i only)
Measurement
Tx Maximum Output Power
EVM
Frequency Error
Tx Adjacent Channel Level Ratio +/- 5MHz
Tx Adjacent Channel Level Ratio +/- 10MHz
Rx Reference Sensitivity Level* (RF out: -104)
Test Limits
21 to 25
17.5 max
-0.1 to 0.1
-36
-46
-0.1 to 0.1
Unit
dBm
%
ppm
dBc
dBc
%
3.14 UMTS 2100 High TCH Measurements (G502i only)
Parameter
TCH
Power Level
RF out
Value
High
Maximum
-93
Unit
Channel
dBm
dBm
3.14.1 UMTS 2100 High TCH Test Limits (G502i only)
Measurement
Tx Maximum Output Power
EVM
Frequency Error
Tx Adjacent Channel Level Ratio +/- 5MHz
Tx Adjacent Channel Level Ratio +/- 10MHz
Test Limits
21 to 25
17.5 max
-0.1 to 0.1
-36
-46
Unit
dBm
%
degree
dBc
dBc
3.14.2 Call Disconnect Sequence
1. Disconnect call.
2. End test.
1213-7931 1
Company Internal
19(21)
Sony Ericsson Mobile Communications AB
Go/No Go Test Script Specification, Electrical
4 Attenuation Factors
4.1
Radiated Loss Values
The following values shall be used when testing the Sony Ericsson G502i in the Rohde
& Schwarz RF shield box (R & S part # 1150.1008.02) using the Rohde & Schwarz
coupler (R & S part # 1150.0801.02) and SEMC RF-cable (SEMC part # RPM 119 855).
A precision type N Male to SMA Female adapter is required to connect the cable to the
RF shield box.
NOTE!
These values are only valid if you are using the Grid Positioning Plate (R & S
part number 1158.9789.00)
Attenuation
Band
Channel
GSM 900
8.23
14.80
7.36
16.95
11.59
Low
6.75
9.05
6.90
8.37
High
7.45
7.52
Low
8.30
6.83
Mid
9.30
7.40
High
10.50
6.92
Low
12.00
7.48
Mid
11.80
8.64
High
1213-7931 1
Company Internal
13.15
Mid
WCDMA 2100
Low
High
GSM 1900
TX
Mid
GSM 1800
RX
10.80
10.20
20(21)
Sony Ericsson Mobile Communications AB
Go/No Go Test Script Specification, Electrical
4.2
Conducted Loss Values
1. The following values shall be used when testing the Sony Ericsson G502i with a
Direct Line connection. The Direct Line connection shall consist of a SEMC RF-cable
(SEMC part # RPM 119 855), RF Probe (SEMC part # SXA 109 6356).
Attenuation
Band
Channel*
RX
TX
GSM 900
ALL
0.8
0.8
GSM 1800
ALL
1.3
1.3
GSM 1900
ALL
1.3
1.3
WCDMA
2100
ALL
1.5
1.5
5 Revision history
Rev.
1
1213-7931 1
Company Internal
Date
Changes / Comments
2008-06-18
Initial Release
21(21)
Sony Ericsson Mobile Communications AB
This document was created with Win2PDF available at http://www.win2pdf.com.
The unregistered version of Win2PDF is for evaluation or non-commercial use only.
This page will not be added after purchasing Win2PDF.
Equipment List, Electrical
Equipment List, Electrical
Applicable for G502
Contents
1
General ...............................................................................................................2
2
Column Definitions............................................................................................2
3
Repair Equipment..............................................................................................3
3.1
Sony Ericsson Provided Repair Equipment...........................................3
3.2
Picture of equipments orderable from Sony Ericsson............................5
3.3
Equipment Provided by Other Supplier .................................................7
3.4
Lead-free Solder Equipment................................................................21
Revision History ..............................................................................................23
4
1213-7929 1
Company Internal © Sony Ericsson Mobile Communications AB
Equipment List, Electrical
1
General
This document describes the minimum required equipments for the Electrical Repair Process of the G502 mobile phone.
Equipment listed without a part number is not orderable from Sony Ericsson and must be bought locally.
2
Column Definitions
The matrix in the end of the equipment tables describe where the actual equipment is needed (marked with an X) or may be
needed/optional (marked with a Z).
Flash upgrade:
Equipment for downloading software to the unit, both signalling and test-program.
Manual test:
Equipment necessary to perform a manual test.
Repair:
Equipment necessary for replacing components.
Go/No Go test:
Equipment necessary for Go/No Go test.
Calibration with SERP:
Equipment necessary to perform a calibration with SERP. Calibration can only be done by authorized
repair centers.
The column that assist a specifying and/or clarifying the equipment needed are considered description type columns.
•
Description
The name of the equipment
•
Part Number
The Sony Ericsson part number to use when ordering from Sony Ericsson.
•
Description
Additional information that helps to specify the equipment.
1213-7929 1
Company Internal © Sony Ericsson Mobile Communications AB
2(23)
Equipment List, Electrical
3
Repair Equipment
Some of the required equipment will be provided by Sony Ericsson and some equipment has to be sourced locally. This chapter will
separate these equipments.
3.1
Sony Ericsson Provided Repair Equipment
Part Number
Comments
SonyEricsson programming
interface - SEPI
USB cable DCU-65
LTN 214 1484
USB/Interface Box+CD
X
X
RPM 13112R1
X
X
SonyEricsson programming
interface cable
Torque Screwdriver *
Front opening tool
Bits/Torx/T6
Flex film assembly tool
Shield Fence Plier
KRY 101 1119
Used for SonyEricsson programming interface
cable - SEPI
SEPI cable
Lead-free labels (sheet of 24)
SVF 930 1379
Battery Eliminator
Rework fixture
RF Test Cable Flexible 1M
NTZ 112 533
LTD 260 273
RPM 119 855
Repair
Calibration in
SERP
Manual Test
Go/No Go
Test
Flash Upgrade
Description
NTZ 112 459
NTZ 112 302/2
NTZ 112 288
NTZ 112 521
NTZ 112 537
1213-7929 1
Company Internal © Sony Ericsson Mobile Communications AB
Torque set to 18 Ncm +/- 1 Ncm
Opening tool
Spare part to screwdriver
Tweezers
For use when repair under shield fence is
necessary
These lead-free labels must be applied to all
materials and tools that contact the solder.
Dummy Battery (BST-33 Hans)
For PBA (Printed Board Assembly)
This is the only approved RF cable!
X
X
X
X
X
X
X
Z
X
X
Z
X
3(23)
Equipment List, Electrical
SXA 109 6356
NTZ 112 1067
NTZ 112 1071
KDR 109
171/256
NTZ 112 590
SMK RF Probe
Camera removal tool
Repair
Comments
SMK RF Probe
MEGA Pixel Camera Tool
USB Activation Dongle
256MB Memory Stick
Micro(M2)
Plectrum Tool
Calibration in
SERP
Part Number
Manual Test
Go/No Go
Test
Flash Upgrade
Description
1213-7929 1
Company Internal © Sony Ericsson Mobile Communications AB
Z
X
X
X
This item is needed to test the applicable product’s memory
slot.
X
Guitar Pick
X
4(23)
Equipment List, Electrical
3.2
Picture of equipments orderable from Sony Ericsson
Pictures of tools that is orderable from Sony Ericsson.
LTN 214 1484
KRY 101 1119
NTZ 112 1071
KDR 109 171/256
SVF 930 1379
NTZ 112 302/2
SXA 109 6356
NTZ 112 459
NTZ 112 288
NTZ 112 1067
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Company Internal © Sony Ericsson Mobile Communications AB
5(23)
Equipment List, Electrical
NTZ 112 590
NTZ 112 521
KRY 101 1413
NTZ 112 537
1213-7929 1
Company Internal © Sony Ericsson Mobile Communications AB
NTZ 112 533
LTD 260 273
RPM 119 855
6(23)
Equipment List, Electrical
3.3
Equipment Provided by Other Supplier
This is the list of equipments provided by other suppliers than Sony Ericsson
Description
Comments
27
Battery Charger
(Standard SEMC charger applicable for
G502)
The battery charger needs to be
connected to the Sony Ericsson
Programming Interface Cable during
calibration.
Type A to Type B USB cable.
43
USB Computer Cable
Picture
Repair
Test
Pos
X
This is part of the hardware needed for
performing calibration.
X
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Equipment List, Electrical
Description
Agilent 8960
Required Components:
• E5515C (8960 Series 10
Mainframe)
• Option E5515C-002 (2nd RF
source)
• Option E5515C-003 WCDMA HW
Option
Required Software
• E1985B or E1987A TA Fast
Switching
•
•
•
Comments
Picture
Repair
Test
Pos
Some older versions of the 8960 Series
10 mainframes may need to have a
hardware upgrade in order to have
WCDMA capabilities. See your local
Agilent representative for details.
Note: It is strongly recommended that
the instrument vendor be contacted
before ordering this setup to ensure that
the options stated are still valid or that
no part numbers have changed.
X X
E1963A WCDMA Test Application
E1968A-101 GSM Test Application
E1968A-410
Application
required for GSM Calibration
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8(23)
Equipment List, Electrical
Description
Comments
Willtek 4403/4405
Note: It is strongly recommended that
the instrument vendor be contacted
before ordering this setup to ensure that
the options stated are still valid or that
no part numbers have changed.
Required Components:
• 440x (4403 or 4405)
• Option 4460 GSM/GPRS/EDGE HW
• Option 4457 GSM Call Mode
• Option 4458 GSM Non-Call Mode
• Option 4468 EDGE Call Mode
• Option 4449 EDGE Non-Call Mode
• Option 4475 ACPM for 440x
• Option 4479 Baseband processing HW
• Option 4466 WCDMA/UMTS Non-Call
Mode
• Option 4467 WCDMA/UMTS Call Mode
• WMain 52 MHZ clock for 4400/3100
• Firmware Version 14.00 or higher
1213-7929 1
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Picture
Repair
Test
Pos
X X
9(23)
Equipment List, Electrical
77
Description
Comments
Rohde & Schwarz CMU200
Required Components
• CMU200 mainframe (Base
Unit)
• Options CMU-B11, CMU-B21,
CMU-B52, CMU-B54, CMUB56, CMU-B68, CMU-B95 and
CMU-U65
• Required SW package: CMUPK100
Power Supply
(w/digital readout)
Note: It is strongly recommended that
the instrument vendor be contacted
before ordering this setup to ensure that
the options stated are still valid or that
no part numbers have changed.
NOTE!
If using the Power Supply in conjunction
with the Battery Eliminator (Dummy
Battery) to power the phone during the
GNG test or Calibration routine a high
quality DC source that meets the following
requirements must be used.
1213-7929 1
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Picture
Repair
Test
Pos
X X
Device Requirements:
• Output Voltage: 0-5 volt minimum.
• Output Current: 0-2 amps minimum.
• Transient response time: & lt; 100 µs
Some examples of Power Supplies that
meet these requirements are as follows:
• Agilent 66xx series
• Agilent 663x series
Z
Z
10(23)
Equipment List, Electrical
Description
Comments
78
Small Convection (Hot Air) Device
Device Requirements:
• The device should allow variable
adjustment over a temperature
range.
• The device should be capable of
reaching an upper temperature of
426.7oC (800oF) or more.
The range of airflow the device is
capable of generating should fall under
20 litre/minute.
Certain components on the parts list
can only be replaced using this
device. These parts are specified in
the parts list.
79
Large Convection (Hot Air) Device
•
•
1213-7929 1
Company Internal © Sony Ericsson Mobile Communications AB
The device should allow variable
temperature adjustment and be
capable of reaching an upper
temperature of 426.7oC (800oF) or
more.
The range of airflow the device is
capable of generating should be
above 20 litre/minute.
Picture
Repair
Test
Pos
X
X
11(23)
Equipment List, Electrical
Description
Comments
80
Nozzles for Large Convection (Hot Air)
Device
Digital Multi-meter
Microscope
GPIB Card
NOTE: Only necessary if you have a
large convection device.
Used for troubleshooting failures
Minimum magnification required is 10x
National Instruments or Keithley
81
82
83
84
GPIB Cable
1213-7929 1
Company Internal © Sony Ericsson Mobile Communications AB
NOTES:
• Drivers are required and should
be supplied with a card.
• A GPIB card is not required if
testing is being performed using
the Willtek 420x instrument.
This cable is only required if a GPIB
card is used.
Picture
Repair
Test
Pos
X
Z
X
Z X
Z X
12(23)
Equipment List, Electrical
Description
Comments
88
Power cable – Red
Cable Requirements:
• Minimum cross sectional area of
conductor = 1.2mm2
• Maximum length = 1.5 m
• One end of cable must have a male
banana-type connector to be able to
interface with the battery eliminator.
• The other end of the cable needs
whatever connection is necessary to
connect to the power supply that
you have.
Cable Requirements:
• Minimum cross sectional area of
conductor = 1.2mm2
• Maximum length = 1.5 m
• One end of cable must have a male
banana-type connector to be able to
interface with the battery eliminator.
• The other end of the cable needs
whatever connection is necessary to
connect to the power supply that
you have.
NOTE: Only necessary if using the Battery
Eliminator (Dummy Battery).
89
Power cable – Black
NOTE: Only necessary if using the Battery
Eliminator (Dummy Battery).
1213-7929 1
Company Internal © Sony Ericsson Mobile Communications AB
Picture
Repair
Test
Pos
Z
Z
Z
Z
13(23)
Equipment List, Electrical
Description
Comments
90
Component baking oven
Picture
Repair
Test
Pos
Temperature requirements: 125°C
+5°C/-0°C
Required for drying moisture sensitive
components.
Below are links to several companies
that sell convection ovens.
http://www.cascadetek.com/forcedlist.p
hp
http://www.wisoven.com/lab1.htm
X
http://www.shellab.com/products.html
http://www.terrauniversal.com/products/
ovens/imperiaivmechcon.php
http://www.labsynergy.com/products_la
boratoryovens.asp?keyword=*laborator
yovens
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14(23)
Equipment List, Electrical
Description
Comments
91
RF Shield Package
Using an RF shield package is one of
the options for testing the applicable
product(s). Testing of the applicable
product(s) can also be performed by
using the combination of an RF Probe
and an RF cable.
Rohde & Schwarz RF Shield Package
•
•
CMU-Z10 – Antenna Coupler
(Partnr: 1150.0801.10)
CMU-Z11 – RF Shield Cover
(Partnr. 1150.1008.02)
Spare parts for mobile phone fixation
for R & S CMU-Z10 are available for
purchase from Rohde & Schwarz:
• Grid Positioning Plate –
1158.9789.00
• L-shaped bracket –
1158.9808.00
• Stabilizing pieces –
1158.9820.00
Picture
Repair
Test
Pos
Z
NOTE: The Rohde & Schwarz
package will require the use of a
precision N-type male to SMA female
RF adapter to mate with the SEMC
RF cable.
1213-7929 1
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NOTE: If you are using a different RF
Shield Package than Rohde &
Schwartz, special attenuation factors
for Go/No-Go test are required.
15(23)
Equipment List, Electrical
Description
Comments
92
Flux
Lead-free solder does not require a
special flux. The “No Clean” flux used
with leaded products is acceptable.
Although some manufacturers are
developing fluxes specially made for
use with lead-free solder (higher
evaporation temperatures, less smoke,
etc.), these are not required.
This tape is required to protect adjacent
components from hot air.
One of the following operating systems
must be used:
• Windows 2000 with service pack 2
or higher
• Windows XP
93
Low Static Heat Protection Tape
96
Computer
Minimum Requirements:
• One unused PCI slot for GPIB card
• 3 USB Ports
• The processor and RAM of the
computer should at least meet the
the minimum requirements specified
by the operating system’s
manufacturer.
1213-7929 1
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Picture
Repair
Test
Pos
X
X
Z X
16(23)
Equipment List, Electrical
Description
Comments
99
109
110
Test U-SIM
Printer
RF adapter for RF shield box
According to your Instrument supplier
Optional, but recommended
This adapter is used to connect the RF
shield box to the RF cable and is only
required if a shield package is going to
be used for testing.
X
Z Z
Recommended source:
• Pasternack Enterprises – (949)
261-1920 or
www.pasternack.com
• Part number: PE9430
Z
•
111
112
113
114
The adapter for a Rohde & Schwarz
Shield box must be a precision Ntype male to SMA female adapter.
Cutting Pliers
ESD Gloves
ESD Wristband
Nylon Pointer
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Company Internal © Sony Ericsson Mobile Communications AB
Picture
Repair
Test
Pos
Z
Z
Z
Z
17(23)
Equipment List, Electrical
Description
Comments
115
Zebra Printer
Current Model Options:
• 110XiIIIPlus or Z4Mplus
These models use a DB9 Male-DB9 Female
Null Modem
Discontinued Model Options:
NOTE – The following models may
also be used, but
Zebra has discontinued selling them.
• 90xi Series
• Z4M
• Z4000 deluxe
These models use a DB25 Male-DB9 Female
Null Modem
1213-7929 1
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Picture
Repair
Test
Pos
Z
18(23)
Equipment List, Electrical
Description
Comments
116
Null Modem Cable
This cable connects the Zebra printer to the
computer. Two
companies that carry this type of cable are
CDW
(www.cdw.com) and QVS (www.qvs.com).
Part numbers for the DB9 Male-DB9
Female version:
CDW – 361875 (6 Feet Long)
117
Willtek 4921 Shield Enclosure
With modified rear panel and N terminator
• 248718 (Wiltek Part number)
118
Modified rear panel and N terminator
Willtek
•
300872 (Wiltek Part number)
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Part numbers for the DB25 Male-DB9
Female version:
CDW – 375939 (6 Feet Long)
QVS – CC314-06 (6 Feet Long)
QVS – CC314-10 (10 Feet Long)
Used for WCDMA or GSM Calibration
Used for WCDMA or GSM Calibration.
A Service Tool Test Interface (12069888) is also required.
Used with existing Willtek Shield boxes
Replace rear panel with modified rear
panel and place N terminator on RF
connection.
Remove RF coupler. A Service Tool
Test Interface (1206-9888) is also
required.
Picture
Repair
Test
Pos
Z
Z
Z
19(23)
Equipment List, Electrical
Description
Comments
119
Metal Cutters
Use these to trim shield can fences when
they obstruct access to parts.
Cutters should be small enough to cut
fences without damaging parts on the
board.
Cutters should be sharp enough to cut
fences without twisting or pulling the fence.
Recommended cutters available at
www.MSCDirect.com:
Knipex (left) - Mfr Part #: KN7803-5, MSC
#: 32997462
Xuron (right) - Mfr Part #: 2175AS, MSC
#: 88356431
Picture
Repair
Test
Pos
Z
The matrix describes where the actual equipment is needed, marked with an X, or may be needed/option, marked with a Z.
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20(23)
Equipment List, Electrical
3.4
Lead-free Solder Equipment
The items in this table, and any other soldering tools or material that make physical contact with the solder, must remain lead-free.
They must be adequately labelled to make their lead-free status clearly and easily recognized.
Repair
Test
Pos
Description
Comments
Lead-free Solder
Manufacturers of LF Solder:
- Tamura (www.tamura-kaken.co.jp)
Part # TLF-206-93F
- Multicore (www.multicore.com)
Part # 96SC
- Senju (www.senjum.co.jp)
Part # M705
Note: The solder must be composed of
Tin, Silver, and Copper, and nothing else.
The exact composition ratio may vary, but
it must be Tin, Silver, and Copper only.
This composition may also be known as
SnAgCu or SAC.
Lead-free labels
(sheet of 24)
SEMC Part # SVF9301379
(These labels are available from the Sony Ericsson
Picture
X
Required for labeling all soldering tools and
materials that contact the solder.
X
Parts and Tools Warehouse.)
Soldering Tips
X
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Equipment List, Electrical
Repair
Test
Pos
Description
Comments
Soldering Iron
If one work bench is divided to
accommodate both leaded and lead-free
solder, then each side of the bench should
have its own iron.
•
The device should allow variable
temperature adjustment and be
capable of reaching an upper
temperature of 426.7oC (800oF) or
more.
Picture
X
Wicking Tape
X
Tip Tinner
X
Tip Cleaner (steel wool)
X
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Equipment List, Electrical
4
Revision History
Rev.
1
Date
Changes / Comments
2008-05-26
1st version
1213-7929 1
Company Internal © Sony Ericsson Mobile Communications AB
23(23)
Working Instruction, Electrical
Working Instruction, Electrical
Applicable for G502
CONTENTS
1
Read this first! ........................................................................................ 2
2
Lead-free soldering ................................................................................ 3
3
Hot air gun temperature requirements ................................................. 5
4
Soldering tip temperature requirements .............................................. 5
5
BGA equipment reflow profiles............................................................. 5
5.1
5.2
5.3
5.4
5.5
General.................................................................................................. 5
Temperature measurement................................................................... 5
Reflow profiles....................................................................................... 6
REWORK BGA...................................................................................... 7
Process Flow BGA ................................................................................ 9
6
Shield fence instruction......................................................................... 9
7
Replacement of components .............................................................. 10
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10
7.11
7.12
7.13
7.14
7.15
7.16
7.17
7.18
7.19
7.20
7.21
7.22
7.23
7.24
7.25
8
X1200: Antenna switch connector....................................................... 11
X2200: Battery Connector ................................................................... 12
X2402: Keypad Connector .................................................................. 12
X4200: B to B connector, female, 22 pin............................................. 13
X4310: Camera connector .................................................................. 13
S2402, S2403: Input Switch Side Push............................................... 14
B3100: Microphone ............................................................................. 14
X2403: SIM Card Conn Micro SD Hight, 2.2 mm ................................ 15
X2490: MS-Micro Pico holder.............................................................. 15
V2201: LED Diode............................................................................... 16
C3113, C3120, C3145, C3146: Capacitor Ceramic ............................ 16
D2105: IC Single bus buffer gate ........................................................ 17
L2400, L2401, L2402, L2403, L2404: Filter 0.0 Hz 0402 .................... 17
N2203: IC Vreg.................................................................................... 18
N2400: 1-Bit Level Translator.............................................................. 18
N3101: ASIC Tjatte3 CSP20 ............................................................... 19
V2202: Trans P-ch FET....................................................................... 19
V2405: Trans MOSFET Complementary N P 20 V (D S).................... 20
V2420, V2421: Zener Diode voltage regulator 15V 5% ...................... 20
D2404: MICROCIRCUIT/USB transceiver and UART MU .................. 21
N3100: MIKROKRETS/Class AB Audio Amplifier ............................... 21
N1400: Module Bluetooth + FM STLC2592 ........................................ 22
B2100: Crystal 32,768 kHz.................................................................. 22
N1210: RF-Module Squid Pre -bumped .............................................. 23
N1200: RF-Module Thor Pre-bumped................................................. 23
Revision history ................................................................................... 24
1213-7908_1
Company Internal © Sony Ericsson Mobile Communications AB
Working Instruction, Electrical
1 Read this first!
CAUTION
•
Keep all contact surfaces clean, no dirt or hand grease!
•
•
Attention! All repair action with Hot air station or BGA repair station around and on the
opposite side of these components shall be performed with care, if the soldering joints
temperature on these components will reach 220 degree than soldering of these components will
be damaged.
•
•
Remove the Main Camera and VGA Camera before you perform any repair action by using
heating tools: Soldering Iron, Hot Air Station or BGA station!
•
Protect the phone from ESD damages whenever it has been opened by using:
•
ESD-wristband
•
ESD-gloves
•
1213-7908_1
Company Internal © Sony Ericsson Mobile Communications AB
2(24)
Working Instruction, Electrical
2 Lead-free soldering
KEEP ALL CONTACT SURFACES CLEAN OF DIRT AND HAND
GREASE!
THIS PRODUCT IS MANUFACTURED WITH LEAD-FREE SOLDER
AND LEAD-FREE COMPONENTS!
During electrical repair, it is critical to make sure that no
lead is introduced.
This symbol indicates that the product is lead- free.
All lead-free PBA’s will be marked with this symbol.
A lead-free work area must be set up completely separated
from work areas that are used to make lead repairs.
The lead-free work area must also be clearly labeled with
the lead free symbol as shown in the adjacent picture.
The items on this desk must remain lead-free.
They must be adequately labeled to make their lead-free
status clearly and easily recognized.
1213-7908_1
Company Internal © Sony Ericsson Mobile Communications AB
3(24)
Working Instruction, Electrical
Lead-free soldering continued
LFS (lead-free solder paste) characteristics:
• High melting point (typically 220°C)
• Low wettability
• High surface tension
• Difficult to spread
• Recommended tip temperature = 370°C
WHEN SERVICING PBA’S THAT HAVE BEEN MANUFACTURED
WITH LFS (LEAD-FREE SOLDER PASTE), LFS MUST BE USED.
IF NOT, THERE IS A HIGH RISK FOR UNRELIABLE SOLDERING
JOINTS.
Lead-free solder joints are more difficult to inspect because
they do not have shiny surfaces like leaded solder joints.
Also, lead-free solder does not flow as well as leaded
solder, so some of the solder pad areas may remain
exposed.
1213-7908_1
Company Internal © Sony Ericsson Mobile Communications AB
4(24)
Working Instruction, Electrical
3 Hot air gun temperature requirements
The air temperature shall not exceed 360°C. The temperature shall be measured 5 mm from the nozzle outlet.
If it’s not possible to remove and/ or solder with 360°C a BGA Rework Station or another repair process shall
be considered to ensure high process control.
Too high temperature can cause damage and cracks due to thermal stress on sensitive components, e.g.
ceramic components like capacitors.
4 Soldering tip temperature requirements
The soldering tip temperature shall be minimum 310°C and maximum 370°C.
Too high temperature can cause damage and cracks due to thermal stress on sensitive components, e.g.
ceramic components like capacitors.
5
BGA equipment reflow profiles
5.1
General
This document contains reflow profile recommendations for mobile phones and similar
products.
They are just general recommendations and considerations have to be taken for every single
product.
The solder paste is secondary but could also affect the parameters.
In this document one alloy is specified:
SnAgCu (Lead free) melting point 217°C
5.2
Temperature measurement
At least four probes should be used.
They should be placed on components with the highest and lowest thermal mass.
The probes shall be located in the beginning, in the middle and at the end of the board/panel.
It is recommended that the probes are soldered on the board, but glue and caption tape could
also be used, if necessary.
At least one probe shall be placed in the air or on top of a component.
These values are strongly depending on the BGA replacement equipment.
Nozzle type will be chosen after the outer size of the actual component.
Make sure the nozzle does not affect any nearby placed components.
These values are recommendations and may have to be changed depending on the type of
equipment.
The maximum temperature for any component must not exceed 260°C.
1213-7908_1
Company Internal © Sony Ericsson Mobile Communications AB
5(24)
Working Instruction, Electrical
5.3
Reflow profiles
Sn/Ag/Cu (lead-free)
Reflow zone
290
260°C
245°C
235°C
Temperature [ºC]
250
200
150°C
150
125°C
100
50
0
40
80
120
160
200
240
280
Time [Seconds]
Ramp rate
Ramp rate cooling
Pre heating time
Time above liquid
Minimum temperature
Maximum temperature
Maximum component temperature
Time between 230 and 245
Board temperature bottom side
Total time
& lt; 3°C/sec
& lt; 4°C/sec
60-150 sec
40-70 sec
230°C
245°C°
260 °C
30 sec
160°C-185°C
Approx. 3-5min
* The higher temperature in case the board has extremely high ΔT.
1213-7908_1
Company Internal © Sony Ericsson Mobile Communications AB
6(24)
Working Instruction, Electrical
5.4
REWORK BGA
Process for changing the modules is highly advanced rework and it shall only be carried out by well
trained repair technicians/operators.
Every module shall have dedicated heat profiles that should be tested in every BGA reworking
station individually with dedicated heat profiling board (complete SMT assembled PWB) with
thermocouples.
Heat profile shall be done according solder paste manufacturers specification and it shall be
according components maximum temperature.
Target group
Target group for this document are repair process engineers which have understanding of following
standards: IPC-A-610 D, IPC J-STD-001 D (preferably they are certified specialists).
Heat Profile
Heat profile in this document always refers to the heat curve which is measured on the board with
thermocouples and do not refer BGA rework stations setting which can vary depending on the
machine type and individual machine.
Heat profile specifications are defined in the table 2-1 This profile differs from the SEMC mass
production heat profile. Reason for this is that mass production oven heating and zone separation
capability is considerably better than in BGA rework stations. In mass production oven there can be
10 separate zones that can be adjusted individually and heat capacity allows introducing soak zone
and more controlled peak temperature than BGA rework machine. Soak zone in mass production
oven is needed in order to have minimum delta T before reaching peak zone. This is needed to have
as small delta T as possible when solder is above liquidus point. Soak zone is not possible to be
introduced in BGA rework station. Soak zone is not needed either because purpose is only reflow
one component and delta T is not issue in this process.
Thermocouples
Type K thermocouples are most commonly used in the electronics industry. Type K thermocouples
should be used when profiling the modules.
The method of attaching the thermocouple to the assembly to be profiled can be specific to the
assembly and situation as well as preference of the user
Adhesives shall be used to secure the thermocouple to the assembly. This usually results in a
positive physical connection of the thermocouple junction to the assembly. Drawbacks are the
possibility of the adhesive failing during the heating process, removal at the conclusion of the profile.
Caution should be taken to use the minimum amount of adhesive since adding thermal mass can
affect the results of the profile. HMP (high melting point solder) solder that is preferred when
attaching thermocouples in ordinary SMT components can be used to solder thermocouple tip to the
pad but it dissolves to the lead free bump and do not have high melting point features when profiling
is executed.
1213-7908_1
Company Internal © Sony Ericsson Mobile Communications AB
7(24)
Working Instruction, Electrical
Thermocouple attachment.
Primary thermocouple should be attached from back side of the board on the drilled hole (precision
drill, drill bit 0,4mm) as figure 2-2 illustrates. If pad on the board is small the hole should be drilled of
center of the pad so it is possible to solder thermocouple tip on the pad. Thermocouples has are
usually hard to solder due the poor wetting characteristics and additional flux and underside heating
should be used during this operation.
Figure 2-2
Process flow for module replacement
Heat module by using BGA rework machine and applicable heating profile and applicable nozzle for
the module.
When profile reaches end of the peak zone (just before cooling) remove module by using dental
hook.
Remove solder PWB pads by using soldering iron, gel flux, soldering wick. Underside heating unit is
required when performing cleaning. This minimizes the possibility to lift pads of from the PWB.
Clean PWB after solder removal by using isopropyl alcohol
Apply gel flux to the PWB module area
Place the module to the board by using BGA rework station.
Reflow the module with BGA rework station by using applicable heat profile and nozzle.
1213-7908_1
Company Internal © Sony Ericsson Mobile Communications AB
8(24)
Working Instruction, Electrical
Inspection instructions for replacement of the module
Inspection of the replaced module should be carried out according to IPC-610D BGA inspection
guidelines. X-ray can be used as and indicator. For more detailed investigations in problem situations
dye and prie method and micro sectioning can be carried out.
5.5
Component
removal
6
Process Flow BGA
Site cleaning
and
preparation
Application
of
solder paste
Component
placement
Component
reflow
Shield fence instruction
This instruction shows how to cut and bend the shield can
fence to be able to replace components under the fence.
Use a sharp-edged pliers to cut the fence.
MAKE SURE THAT CUTTING PLIERS IS SHARP-EDGED TO
PREVENT DAMAGING THE SHIELD CAN FENCE.
Remove the shield can lid, use a dentist hook.
Remove the pick up area according to the white lines with
a cutting plier. (1)
This pick up area is only used when machine mounting
and there is no need to put it back again.
Cut the shield can fence according to the white lines with
a cutting plier. (2)
1213-7908_1
Company Internal © Sony Ericsson Mobile Communications AB
2
2
1
1
9(24)
Working Instruction, Electrical
7 Replacement of components
EQUIPMENT
•
•
•
•
•
•
•
•
•
•
•
•
Dentist hook
ESD-gloves (cotton gloves)
ESD-wristband
Soldering tool
Hot air soldering station
BGA replacement equipment
Pair of tweezers
Solder cleaning wiper (tin wick)
Solder paste lead-free (SN 96% Ag 3.5% Cu 0.5%)
Use the soldering tip only for lead-free solder paste!
Flux, RMA no-clean flux
Cutting pliers
Shield fence pliers NTZ 112 537
CAUTION
Remove the Main Camera and VGA Camera before you perform any repair action by using
heating tools: Soldering Iron, Hot Air Station or BGA station!
Keep all contact surfaces clean, no dirt or hand grease!
Protect the phone from ESD damages whenever it has been opened by using:
•
ESD-wristband
•
ESD-gloves
MECHANICAL INSTRUCTIONS
For all the following part replacements, disassemble and assemble the phone as described in
Working Instruction 1213-7894.
1213-7908_1
Company Internal © Sony Ericsson Mobile Communications AB
10(24)
Working Instruction, Electrical
7.1
X1200: Antenna switch connector
PROTECT THE MAIN CAMERA SOCKET WITH CAPTION TAPE
Replace the Antenna switch connector with BGA
equipment.
1213-7908_1
Company Internal © Sony Ericsson Mobile Communications AB
11(24)
Working Instruction, Electrical
7.2
X2200: Battery Connector
PROTECT THE MAIN CAMERA SOCKET WITH CAPTION TAPE
Replace the Battery connector with BGA repair equipment.
7.3
X2402: Keypad Connector
Replace the Keypad Connector with BGA equipment.
1213-7908_1
Company Internal © Sony Ericsson Mobile Communications AB
12(24)
Working Instruction, Electrical
7.4
X4200: B to B connector, female, 22 pin
Replace the LCD Connector with BGA equipment.
7.5
X4310: Camera connector
PROTECT THE BATTERY CONNECTOR WITH CAPTION TAPE!
Replace the Camera Connector with BGA equipment.
1213-7908_1
Company Internal © Sony Ericsson Mobile Communications AB
13(24)
Working Instruction, Electrical
7.6
S2402, S2403: Input Switch Side Push
Remove the Switch Connector with Hot wind equipment.
Replace a new Switch with Soldering Iron.
7.7
B3100: Microphone
REMOVE THE BLACK SIM TAPE
PROTECT THE SIM HOLDER WITH CAPTION TAPE
Replace the Microphone with BGA equipment.
PUT BACK A NEW BLACK SIM TAPE
1213-7908_1
Company Internal © Sony Ericsson Mobile Communications AB
14(24)
Working Instruction, Electrical
7.8
X2403: SIM Card Conn Micro SD Hight, 2.2 mm
REMOVE THE BLACK SIM TAPE AND WATER INDICATOR
PROTECT THE MICROPHONE WITH CAPTION TAPE
Replace the SIM Card connector with BGA equipment.
PUT BACK THE NEW BLACK SIM TAPE AND WATER INDICATOR
7.9
X2490: MS-Micro Pico holder
Replace the MS-Micro Pico holder with BGA equipment.
1213-7908_1
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15(24)
Working Instruction, Electrical
7.10
V2201: LED Diode
PROTECT THE MAIN CAMERA SOCKET WITH CAPTION TAPE
Remove the LED Diode with Hot wind equipment.
Replace a new LED Diode with Soldering Iron.
7.11
C3113, C3120, C3145, C3146: Capacitor Ceramic
REMOVE THE BLACK SIM TAPE
Remove the Capacitor with Hot wind equipment.
Replace a new Switch with Soldering Iron.
PUT BACK A NEW BLACK SIM TAPE
Remove the shield can lid.
Use a dentist hook.
Cut the fence according to the white lines.
Remove the Capacitor with Hot wind equipment.
Replace a new Switch with Soldering Iron.
Put back a new shield can lid.
Press on all sides of the lid until you hear a “click” sound.
1213-7908_1
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16(24)
Working Instruction, Electrical
7.12
D2105: IC Single bus buffer gate
Remove the shield can lid.
Use a dentist hook.
Replace the IC Single bus buffer gate with BGA equipment.
Put back a new shield can lid.
Press on all sides of the lid until you hear a “click” sound.
7.13
L2400, L2401, L2402, L2403, L2404: Filter 0.0 Hz 0402
Remove the Filters with Hot wind equipment.
Replace the new Filters with Soldering Iron.
1213-7908_1
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17(24)
Working Instruction, Electrical
7.14
N2203: IC Vreg
PROTECT THE MAIN CAMERA SOCKET AND BATTERY
CONNECTOR WITH CAPTION TAPE
Replace the IC Vreg with BGA equipment.
7.15
N2400: 1-Bit Level Translator
Remove the shield can lid. Use a dentist hook.
Cut the fence according to the white lines.
Replace the Translator with BGA equipment.
Put back a new shield can lid.
Press on all sides of the lid until you hear a “click” sound.
1213-7908_1
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18(24)
Working Instruction, Electrical
7.16
N3101: ASIC Tjatte3 CSP20
REMOVE THE BLACK SIM TAPE
Replace the ASIC Tjatte3 with BGA equipment.
PUT BACK A NEW BLACK SIM TAPE
7.17
V2202: Trans P-ch FET
REMOVE THE BLACK SIM TAPE
PROTECT THE SIM HOLDER AND MICROPHONE WITH CAPTION
TAPE
Remove the Translator with Hot wind equipment.
Replace a new Switch with Soldering Iron.
PUT BACK A NEW BLACK SIM TAPE
1213-7908_1
Company Internal © Sony Ericsson Mobile Communications AB
19(24)
Working Instruction, Electrical
7.18
V2405: Trans MOSFET Complementary N P 20 V (D S)
Remove the shield can lid. Use a dentist hook.
Cut the fence according to the white lines.
Remove the Translator with Hot wind equipment.
Replace a new Switch with Soldering Iron.
Put back a new shield can lid.
Press on all sides of the lid until you hear a “click” sound.
7.19
V2420, V2421: Zener Diode voltage regulator 15V 5%
REMOVE THE BLACK SIM TAPE
PROTECT THE SIM HOLDER WITH CAPTION TAPE
Remove the Zener Diode with Hot wind equipment.
Replace a new Switch with Soldering Iron.
PUT BACK A NEW BLACK SIM TAPE
1213-7908_1
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20(24)
Working Instruction, Electrical
7.20
D2404: MICROCIRCUIT/USB transceiver and UART MU
REMOVE THE BLACK SIM TAPE
PROTECT THE SIM HOLDER WITH CAPTION TAPE
Replace the MICROCIRCUIT/USB transceiver and UART
MU with BGA equipment.
PUT BACK A NEW BLACK SIM TAPE
7.21
N3100: MIKROKRETS/Class AB Audio Amplifier
Remove the shield can lid. Use a dentist hook.
Replace the MIKROKRETS/Class AB Audio Amplifier with
BGA equipment.
Put back a new shield can lid.
Press on all sides of the lid until you hear a “click” sound.
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21(24)
Working Instruction, Electrical
7.22
N1400: Module Bluetooth + FM STLC2592
REMOVE THE BLACK SIM TAPE
PROTECT THE SIM HOLDER WITH CAPTION TAPE
Remove the Shield can with BGA equipment.
Replace the Module Bluetooth + FM STLC2592 with BGA
equipment.
Put back a new shield can with BGA equipment.
PUT BACK A NEW BLACK SIM TAPE
7.23
B2100: Crystal 32,768 kHz
Remove the shield can lid. Use a dentist hook.
Cut the fence according to the white lines.
Replace the Crystal 32,768 kHz with BGA equipment.
Put back a new shield can lid.
Press on all sides of the lid until you hear a “click” sound.
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22(24)
Working Instruction, Electrical
7.24
N1210: RF-Module Squid Pre -bumped
PROTECT THE BATTERY CONNECTOR WITH CAPTION TAPE!
Replace the RF-Module Squid Pre -bumped with BGA
equipment.
7.25
N1200: RF-Module Thor Pre-bumped
PROTECT THE BATTERY CONNECTOR WITH CAPTION TAPE!
Replace the RF-Module Thor Pre-bumped with BGA
equipment.
1213-7908_1
Company Internal © Sony Ericsson Mobile Communications AB
23(24)
Working Instruction, Electrical
8 Revision history
Rev.
1
Date
2008-05-26
Changes / Comments
1st version
1213-7908_1
Company Internal © Sony Ericsson Mobile Communications AB
24(24)
Component Placing, Electrical
Component Placing, Electrical
Applicable for G502
Contents
1
Mounting drawing table ....................................................................................2
2
Mounting drawing..............................................................................................3
3
Revision history.................................................................................................6
1213-7892 1
Company Internal © Sony Ericsson Mobile Communications AB
1(6)
Component Placing, Electrical
1 Mounting drawing table
Board Number
Drawing
Comments
By using the “Search” function and enter the component name you can find the position of the component
(Use Adobe Reader 7.0 or a later version). Example: You can see the component name highlighted on the circuit board (use zoom to
enlarge).
1213-7892 1
Company Internal © Sony Ericsson Mobile Communications AB
2(6)
Component Placing, Electrical
2 Mounting drawing 1202-9432 rev.3
1213-7892 1
Company Internal © Sony Ericsson Mobile Communications AB
C2208
R2203
C4229
V2406
R2434
R2132
C2105
C2106
C2430
C2239
C2346
C2329
D2000
C4226
C4302
C2324
SP2107
SP2117
SP2101
R4224
C4224
R4225
C4225
R2120
R4213
C4227
R2118
R2100
C2327
C2304
C2328
ST2106
R2101
R4222
C4228
C4204
R2119
D2105
R1205
C2318
SP2127
SP2122
SP2121
C2311
SP2124
SP2128
C2345
C2336
C2330
C2344
C2313
C2338
C2315
C2340
C2316
R2121
C2121
R2220
C2301
C2343
C2347
R1204
C2334
R5101
SP2125
C2302
R1203
ST2456
ST2457
R4221
C4222
C4221
C4220
C4219
C4218
C4217
C4216
C4215
R4219
R4218
R4220
R4214
SP2129
SP2126
25
C2303
26
SP2123
C2342
C4213
C4214
C2326
C5103
R2102
C4301
X4200
ST4309
C5104
1
R4226
R2104
C2305
ST4201
ST4200
C4223
2
R4223
R4215
R2443
C4203
X3101
SP2112
R4217
ST4304
C2341
S4300
C2333
R4216
R4307
R4308
SP2114
ST4303
SP2103
C2339
SP2108
C2308
C2243
C2244
ST2218
SP2106
SP2115
R2402
R2105
C2319
R2404
C2238
N2202
R2401
C2307
R2103
C3141
V3101
V3102
C3142
SP2104
ST2229
C2317
C2202
R2438
R2435
R2403
ST2300
R2222
ST2216
B2100
C2218
C2214
ST2205
R2406
C2207
C2216
ST2204
C2229
SP2130
C2322
R3134
C3138
ST2225
ST2202
C2337
C2213
C2205
ST2206
ST2207 C2215
C2200
C2314
C3163
C3155
C2335
ST2203
C2209
C3145
C3146
R3131
C2230
R2437
C2101
R2131
L3104
SP3201
R2436
R2422
N2400
ST2105
C3136
SP3206
R2421
C3130
R3130
C4202
C4201
R4210
R2441
X3100
L4200
C2400
C2225
C3129
SP3203
R4204
V2405
R3135
C3167
R3132
C3168
C3165
R3133
C3166
V4206
R4209
R2400
C2425
C3133
C3164
C2227
ST4202
ST4204
R2439
C3126
C3127
C3132
C3134
R2440
C3152
ST3114
C2204
C3139
C4212
R4207
N2000
C3135
C2104
C3128
C3140
C3151
R4211
C4200
V4205
R2416
C3112
R4212
C4205
V4200
R4203
C3102
C2405
C3137
R4202
C2240
L4201
C2429
C3123
V4201
V2206
C4230
C2241
C2210
SP3202
C2242
R2419
SP3207
C2219
SP3205
C2406
ST2401
ST2400
SP3204
ST4203
C2226
SP3200
R3102
V2400
L2200
L2201
B1
R3110
C4208
C2432
ST2201
B11
ST3115
C2220
ST3116
R3106
C2221
C3103
C2222
A1
N3100
C3106
C3149
R3103
C3105
A11
C3150
C3104
R3137
1202-9432 rev.3
L3103
1202-9432 rev.3
TP2207
X2402
TP2004
R2445
R2444
R2447
R2448
R2449
R2446
C2457
C2470
C2456
C2458
C2468
C2469
X2490
TP2201
V2441
C2467
V2440
R1401
R2200
V2423
R2409
N3101
C3303
R3129
R2451
R2452
R2455
R2453
R2450
R2454
R2442
R1211
R1212
R1214
R1213
R1215
R3128
L2403
L2404
C3119
C3169
R3304
C3125
C3124
V2420
C3113
R2433
D2405
C4207
C3120
TP4200
V4203
L2405
R3112
C4206
ST2224
L3300
L2401
L2402
X2400
ST3302
L2409
ST2223
V2200
ST3303
SP3300
C2415
C2284
L3301
L2408
L2410
C2283
C2420
C2416
N2204
C3305
C1412
C1210
C2442
R4302
C1211
C2445
C4315
R1200
C1212
C2441
ST4326
C4314
R1201
C2440
ST4327
R1216
C2443
C2206
C2212
R1210
C2444
C2211
R1209
C2431
C2282
C3304
X2200
C2287
C2286
C1409
ST1406
C2421
C2250
C2288
C2223
R2204
R1400
ST1402
ST2219
N2203
L2400
N1400
ST1405
ST2210
ST2217
Z1400
ST3301
C1408
R2405
ST1403
E1003
R2280
C2422
C2235
C3302
ST2215
R1403
SP2105
C2237
C2224
C1401
C1416
C1415
ST1401
C1418
C1407
C1417
C2236
N1210
C1413
L2207
L2407
N2205
C2465
C3108
C3107
ST2227
R2299
V2402
TP2005
C1000
V3106
C2404
C2233
C2234
L3109
R2210
C2448
ST2220
C2231
L3108
C2427
C2426
C2459
C2460
C2461
C2462
C2245
C2232
V3105
TP2003
TP2203
L3111
C3109
C2463
L3110
TP3105
C2464
X3103
X3102
TP3104
TP2206
V2401
TP2205
R2432
R2431
C4312
Same net only
Same net only
Same net only
X1202
C4308
ST4331
C4310
2
20
L1
2
20
12
01
C1
C
C1200
C1204
IN
X1200
V3107
S2402
OUT
V2201
V2203
V3108
V3109
V3110
S2403
C2249
R2426
SP2409
L3101
C3162
C3160
C3161
ST2228
TP2202
V2408
C1
20
V2202
R2201
ST4333
6
3
20
ST4312
C2408
C2409
C4322
R1
C4313
TP4300
X1003
C2201
SP2406
V3104
ST4335
SP2404
SP2412
V3103
Same net only
TP2200
R2425
C4305
C2410
Same net only
Same net only
Same net only
C4321
Same net only
ST4328
R2423
C2428
C4309
Same net only
SP2403
Same net only
Same net only
Same net only
D2404
R2424
R3138
ST4332
V2404
ST4334
V2407
C4311
Same net only
B4200
ST4329
ST4311
Same net only
V2403
Same net only
C4306
X1201
X4310
C2424
C2414
C4320
X1203
C2413
R2428
C2412
C4318
N1200
Same net only
C4319
Same net only
L2411
C2423
C2418
C2411
TP4201
X2403
C4307
ST4306
Same net only
ST4205
C4323
ST4206
Same net only
Same net only
Same net only
Same net only
ST4330
Same net only
C2407
Same net only
V2421
L3100
R1208
TP3101
B3100
Component Placing, Electrical
3 Revision history
Rev.
1
Date
Changes / Comments
2008-05-26
1st release
1213-7892 1
Company Internal © Sony Ericsson Mobile Communications AB
6(6)
Trouble Shooting Guide Repair Instruction Electrical/,
Electrical
Trouble Shooting Guide Repair
Instruction Electrical/, Electrical
Applicable for G502
Contents
1
General ............................................................................................................... 2
2
3
Repair Actions for Manual Test Failures......................................................... 3
2.1
Power On/Off ........................................................................................... 3
2.2
Software Flash ......................................................................................... 3
2.3
Charging................................................................................................... 3
2.4
Hands-Free connection............................................................................ 3
2.5
SIM........................................................................................................... 3
2.6
Main Display............................................................................................. 3
2.7
Main LCD LED: ........................................................................................ 3
2.8
Keypad LEDs ........................................................................................... 3
2.9
Keypad Keys ............................................................................................ 3
2.10 Volume Up/Down Key .............................................................................. 3
2.11 Real Time clock........................................................................................ 3
2.12 Polyphonic Speaker (Loudspeaker, Bas Speaker) .................................. 3
2.13 Hands-Free (PHF) Aux Earphone............................................................ 3
2.14 Microphone .............................................................................................. 4
2.15 Hands-Free (PHF) Aux Microphone......................................................... 4
2.16 Camera .................................................................................................... 4
2.17 Memory Card ........................................................................................... 4
2.18 Bluetooth .................................................................................................. 4
2.19 Fm Radio.................................................................................................. 4
2.20 USB.......................................................................................................... 4
2.21 Camera Video LED .................................................................................. 4
Repair Actions for Go/NoGo Test Failures ..................................................... 5
4
Repair Actions for Calibration Routine Failures ............................................ 5
5
Revision History ................................................................................................ 5
State: Released 2
Company Internal © Sony Ericsson Mobile Communications AB
1213-7905
Trouble Shooting Guide Repair Instruction Electrical/, Electrical
1 General
The purpose of this document is to indicate the electrical level repair actions associated with
the different failure symptoms.
For symptoms that have multiple repair actions, the repair actions are listed in order of their
probability of creating a successful repair. The first action has the highest probability, and
subsequent actions have lower probabilities. The intention is for the repair technician to
implement the first repair action and then retest the phone. If the phone continues to fail the
same test, then the technician should continue to the second repair action. If the phone
continues to fail the same test after all of the repair actions are exhausted, then the phone will
be considered not reparable at this level.
This document should be used only after the actions from the Mechanical Trouble Shooting
Guide have been exhausted for the specific symptom.
Voltage, current, and resistance information is provided for some symptoms to enable faster
repairs. Perform current measurements using a dummy battery and power supply with digital
current display. The phone should be fully assembled. Perform voltage and resistance
measurements with a multimeter. Purchasing this equipment and performing these
measurements is optional but recommended.
Perform current measurements using a
dummy battery and power supply with digital
current display.
The phone should be fully assembled.
Perform voltage measurements with a
multimeter.
Perform resistance measurements with a
multimeter.
State: Released 2
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Trouble Shooting Guide Repair Instruction Electrical/, Electrical
2 Repair Actions for Manual Test Failures
Failure
Failure Symptom
Repair Action
2.1 Power
On/Off
Current draw greater than
300 mAmps
Current draw when powered off
•
•
•
•
N1200
N1210
N1200
N1210
Using no current when On/Off button
is pressed and will not start
• X2402
Will not power off
• X2402
Other symptoms
• X2200 if damaged
2.2 Software
Flash
2.3 Charging
2.4 Hands-Free
connection
• V2405
Charging from power outlet
• X2400 if Damaged (Mech Part
List)
• V2421 if short circuit
• V2202
Charging from computer via USB
Phone stuck in PHF mode when
PHF is not attached
• D2404
• V2420 if short circuit
• N2400
2.5 SIM
• X2403 if damaged
2.6 Main Display
• X4200 if damaged
2.7 Main LCD LED:
2.8 Keypad LEDs
• X4200 if damaged
• X2402 if damaged
2.9 Keypad Keys
• X2402 if damaged
2.10 Volume Up/Down Key
• S2402, S2403 f damaged.
2.11 Real Time
clock
The clock has to be set after the
battery has been detached
2.12 Polyphonic Speaker (Loudspeaker, Bas Speaker)
2.13 Hands-Free (PHF) Aux Earphone
State: Released 2
Company Internal© Sony Ericsson Mobile Communications AB
• B2100
• L2400
• N3100
• N3101
• L2403 if more than 1 Ohm
• L2404 if more than 1 Ohm
3(5)
Trouble Shooting Guide Repair Instruction Electrical/, Electrical
Failure
Failure Symptom
2.14 Microphone
Repair Action
• B3100
• C3113, C3120
2.15 Hands-Free (PHF) Aux Microphone
2.16 Camera
•
•
•
•
N3101
L2401 if more than 1 Ohm
L2402 if more than 1 Ohm
X4310 if damaged
2.17 Memory Card
• X2490 if damaged
2.18 Bluetooth
• X2400 if Damaged (Mech Part)
• N1400
• D2105
2.19 Fm Radio
2.20 USB
2.21 Camera Video LED
State: Released 2
Company Internal© Sony Ericsson Mobile Communications AB
• N1400
• N2203
• C3145, C3146
• V2405
• V2201
4(5)
Trouble Shooting Guide Repair Instruction Electrical/, Electrical
3 Repair Actions for Go/NoGo Test Failures
Failure
Repair Action
Fails any part of Go/No Go testing
Fails Go/No Go test, but passes calibration
• Run the calibration routine
Fails Go/No Go test after passing calibration
• Check X1200 for damage and
replace it necessary
• Replace Antenna
• Replace X1201, X1202, X1203 if
damaged
• Return the phone through Go/No Go
testing
• Change X1200 and retest
• Check LCM gasket is missing or not.
4 Repair Actions for Calibration Routine Failures
Failure
Repair Action
Fails any part of the calibration routine
• Replace X1200 if damaged
• Replace X1201, X1202, X1203 if
damaged
• N1210 UMTS – Approved Centers Only
• N1200 GSM – Approved Centers Only
5 Revision History
Rev.
Date
Changes / Comments
1
2008-05-26
1st version
2
2008-06-17
V2405 added
State: Released 2
Company Internal© Sony Ericsson Mobile Communications AB
5(5)
Test Instruction, Electrical
Test Instruction - Electrical
Applicable for G502
1
Abstract ............................................................................................................2
2
Test Procedure.................................................................................................2
3
Test flow ...........................................................................................................2
3.1
Software Update ..................................................................................2
3.1.1
Verify Software Version........................................................................2
3.1.2
Update Software Version......................................................................3
3.2
Go/No-Go Test.....................................................................................3
3.2.1
RF Test Fixture (Conducted Test Method) ...........................................3
3.2.2
RF Coupler (Radiated Test Method).....................................................4
3.2.3
SERP GNG ..........................................................................................4
Calibration ........................................................................................................5
4.1
Flashing the Test Program (ITP) into the Mobile ..................................5
4.2
Calibration Instructions.........................................................................5
4.3
Updating the Commercial Software into the Mobile after Calibration ....6
Service Tests....................................................................................................6
5.1.1
Main Display Test.................................................................................6
5.1.2
LED/Illumination Test ...........................................................................6
5.1.3 Keyboard Test.........................................................................................7
5.1.4 Speaker Test...........................................................................................7
5.1.5 Earphone Test ........................................................................................7
5.1.6 Microphone Test .....................................................................................7
5.1.7 Vibrator Test ...........................................................................................8
5.1.8 Camera Test ...........................................................................................8
5.1.9 Memory card test ....................................................................................8
5.1.10 FM Radio Test.......................................................................................8
5.1.11 Real Time Clock Test ............................................................................9
5.1.12 Total call Time.......................................................................................9
5.1.13 Security Test .........................................................................................9
5.2
Manual Tests........................................................................................9
5.2.1
On The Air Call To Mobile ....................................................................9
5.2.2
Bluetooth Test ....................................................................................10
5.2.3
System Connector Test ......................................................................10
5.2.4
Camera video LED Test .....................................................................10
Revision History.............................................................................................11
4
5
6
1213-7907 2
Company Internal © Sony Ericsson Mobile Communications AB
Test Instruction, Electrical
1 Abstract
This document describes the test procedure for the Electrical repair package.
2 Test Procedure
To verify all components within the Electrical repair package, all tests must be
performed.
3 Test flow
If the phone passes these tests without any failures, it is OK to return it to the
customer.
If there are any failures, the phone must be repaired according to the troubleshooting
guide or sent to a higher repair level.
3.1
Software Update
Update to latest signalling software and run the service activities software from
EMMA.
3.1.1
Verify Software Version
NOTE!
Remove the SIM-card before testing.
To verify if the phone needs new software, you have to check the Software Version in
the phone. Current Software Versions are checked through the following steps:
1. Start up the phone.
2. Enter the Service Tests Menu by pressing the sequence
navigate buttons and the on the keypad.
with the
3. Select Service info.
4. Select SW Information.
5. Check the file revisions on the display.
6. Press “central navi” key to return to the Service info menu.
1213-7907 2
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Test Instruction, Electrical
3.1.2
Update Software Version
Update the software in the phone by doing the following steps:
1. Make sure that the phone’s battery is fully charged or use a battery eliminator.
Connect correct flash cable and interface according to the Installation instruction.
2. Logon to the EMMA server, and follow the instructions
3.2
Go/No-Go Test
This test verifies that the radio parameters of a mobile fulfil the GSM / WCDMA
specifications. A mobile is considered good if all measurements pass. All results will
be presented on the screen and can be printed out if a printer is available.
3.2.1
RF Test Fixture (Conducted Test Method)
1. Remove the Antenna cover according to Working Instructions, Mechanical.
2. Insert a test USIM that is compatible with your Test Instrument and install a fully
charged standard battery to the mobile.
NOTE!
A Battery Eliminator (Dummy Battery) may be used in place of a
standard fully charged battery if you use a power supply that meets the
requirements that are documented in the Electrical Equipment List.
3. Attach the RF Probe to the mobile according to the pictures.
4. Install the RF Cable to the RF Probe.
Attach the RF Probe to the mobile according to the picture.
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Test Instruction, Electrical
3.2.2
RF Coupler (Radiated Test Method)
1. Insert a test USIM that is compatible with your Test Instrument and a fully
charged standard battery. It is very important that a standard fully charged battery
is used; otherwise, there is a risk for wrong test results.
2. Position the mobile in the coupler according to the picture.
3.2.3
SERP GNG
NOTE!
For complete and detailed user instructions, see the SERP Users
Manual located in the SERPINFO.htm that gets placed on the Desktop
after SERP is installed.
1. On a PC with SERP installed, start the SERP program by double clicking on the
“RepairManager.exe” icon on the desktop.
2. Click on “Settings” in the SERP Window and verify that the test instrument and
the GPIB address correspond.
3. Click on the “Station Setup” tab and verify that the “cable” (or the coupler)
settings are selected under the “RF Connection-GoNogo” Drop down window.
Click on “Apply” and then the “OK” button.
4. Enter (or scan) the IMEI number of the mobile to be tested into the “Enter IMEI”
box in the SERP Window and click on the “Load” button. The appropriate phone
model will be displayed.
1213-7907 2
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Test Instruction, Electrical
5. In the SERP window, check the “Final GoNogo Test” box only. Click on the
“Start Test” button and follow the instructions. (Power on the phone when the
“Call Connection” dialog box appears.)
4 Calibration
NOTE!
4.1
A Test Program must be loaded in the handset before performing the
calibration routine. After calibration the handsets must be re-customized
with signalling SW.
Flashing the Test Program (ITP) into the Mobile
NOTE!
Flashing instructions may vary depending on the interface used.
Flash the Test Program software into the mobile by doing the following:
1. Attach a fully charged battery to the mobile.
2. Open the EMMA application and log in.
3. Ensure the mobile is powered off.
4. While holding the “2+5” button, connect the mobile to the USB Flash cable. (Once
the USB symbol appears in the lower left corner of the EMMA window you may
release the “2+5” button.)
5. Select the “G502 ITP protocol and follow the on screen instructions.
NOTE!
4.2
Under most circumstances the display on the mobile will be blank when
the Test Program is installed.
Calibration Instructions
NOTE!
For complete and detailed user instructions, see the SERP Users
Manual that gets placed on the Desktop after SERP is installed.
1. On a PC with SERP installed, start the SERP program by double clicking on the
“RepairManager.exe” icon on the desktop.
2. Click on the “Settings” button in the SERP Window to verify the test instrument,
GPIB address and the COM Port matches the SERP settings. Click on “Apply”
and then the “OK” button.
3. Enter (or scan) the IMEI number of the mobile to be calibrated into the “Enter
IMEI” box of the SERP Window and click on the “Load” button.
4. In the SERP window, check the “Calibration” box only.
5. Connect the mobile to the test instrument using the RF fixture (refer to section
6.1.1).
6. Connect the Sony Ericsson Programming Interface Cable to the mobile’s system
connector.
7. Click on the “Start Test” button in the SERP window to start the Calibration
routine (mobile will automatically turn on).
1213-7907 2
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Test Instruction, Electrical
8. Monitor the progress of the calibration routine by viewing the information
presented in the “Test Manager” window.
9. If a calibration routine fails, troubleshoot according to the1213-7905 Electrical
Troubleshooting Guide.
10. After successful calibration, reinstall the antenna cover plug. Refer to the Working
Instruction, Mechanical.
4.3
Updating the Commercial Software into the Mobile
after Calibration
To be able to use the handset after calibration requires going through the
Customization process which reloads the appropriate signalling code for the desired
operator. Refer to the 1213-7919 Build Swap Customization Instruction document for
further details on the Customization process.
5 Service Tests
Power up the phone.
NOTE!
Remove the SIM-card before testing.
Enter the Service Tests menu by pressing the sequence
navigate buttons and the on the keypad.
Select “Service Tests”.
5.1.1
with the
Main Display Test
To verify the display:
1. Select “Main Display” from the “Service Tests” menu.
2. The display toggles between four different test patterns.
Make sure that there are no dots missing and that the colours and contrast is OK.
3. Press the “central navi” key to go back to the service tests menu.
5.1.2
LED/Illumination Test
To verify that the backlight and the LEDS are OK:
1. Select “LED/illumination” from the “Service Tests” menu.
2. Check that the backlight in the display and the keyboard is toggle between on
and off.
3. Press the “central navi” OK key to go back to the service tests menu.
1213-7907 2
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Test Instruction, Electrical
5.1.3 Keyboard Test
To verify that all the keys are working:
1. Select “Keyboard” from the “Service Tests”.
2. Press all keys on the keypads and the ”Side Up” and “Side Down” keys on the
right side and close Flip . If they are ok a text feedback is displayed showing the
information which key was pressed. All keys should be tested.
3. If you stop pressing keys the phone will return to the service test menu.
5.1.4 Speaker Test
Warning! Do NOT hold the phone to your ear while performing this test.
To verify the Speaker function:
1. Select “Speaker” from the “Service Tests” menu.
2. Adjust the volume and make sure that the Speaker is working properly.
3. Press the “central navi” OK key to go back to the service tests menu.
5.1.5 Earphone Test
To verify the Earphone function:
1. Select “Earphone” from the “Service Tests” menu.
2. Adjust the volume and make sure that the Earphone is working properly.
3. Press the “central navi” OK key to go back to the service tests menu.
5.1.6 Microphone Test
This test is intended to test the microphone. Therefore, the earphone should be
tested before this test is entered.
1. Select “Microphone” from the “Service Tests” menu.
2. The phone will start to record and after that the sound is played in the speaker.
Make sure that the record sounds have a load and clear sound.
3. The phone will automatically return to the service tests menu when
“Microphone Playing” is completed.
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Test Instruction, Electrical
5.1.7 Vibrator Test
To verify the vibrator function:
1. Select “Vibrator” from the “Service Tests” menu.
2. Press any key and the vibrator will vibrate 3 times.
3. Press the “central navi” OK key to go back to the service tests menu.
5.1.8 Camera Test
To verify the camera functionality:
1. Select Camera from the “Service Tests” menu.
2. The camera function will now start and are visible in the display. Make sure that
the contrast is OK.
3. Press the “right soft-Back” key to go back to the service tests menu.
5.1.9 Memory card test
This test is to verify if the communication to the memory card is working.
1.
Insert a memory card into the memory card holder located on the
lower left side of the phone.
2.
Select “Memory Card” from the “Service tests” menu.
3.
Make sure that the phone will detect the memory card.
4.
Remove the memory card from the holder.
5.
Press the “central navi” OK key to go back to the service tests menu.
5.1.10 FM Radio Test
To verify the function of the FM radio:
1.
Install a Portable Hands-Free (PHF) to the system connector.
2.
Select “FM radio” from the “Service Tests” menu and press the “Select” key.
3.
Using the keypad set the frequency to a known good FM station.
4.
While listening to the FM station with the PHF ensure that the sound quality
compares to a known good handset.
5.
Remove the PHF and press the “central navi” Ok key to end the test.
1213-7907 2
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Test Instruction, Electrical
5.1.11 Real Time Clock Test
This test will check if the built in real time clock works.
1. Select “Real time clock” from the “Service Tests” menu.
After approximately 5 seconds you will get information whether the clock is ok or
not.
2. Press the “central navi” OK key to go back to the service tests menu.
5.1.12 Total call Time
This test will show you the Total Call Time of the phone.
1. Select “Total Call Time” from the “Service Tests” menu
and you will get information regarding the “Total Call Time” of this phone.
2. Press the “central navi” OK key to go back to the service tests menu.
5.1.13 Security Test
To verify that the Device Key test is working:
1. Select “Security “from the “Service Tests” menu.
2. Select “Device Key test “from the menu, and you will get information regarding
Device Key test, make sure the status is “Key ok”.
3. Press the “central navi” OK key and then press “right soft-back” key to go back to
the service tests menu.
5.2
Manual Tests
5.2.1
On The Air Call To Mobile
To verify the function of the speaker, microphone, polyphonic ring signal and
volumes button.
1. Insert an operator SIM card and start the phone.
2. Set up a call from another phone to the mobile phone.
3. Answer the phone call.
4. Check that the polyphonic ring signal is working and that the backlight switches
on OK.
5. Also check that the quality of the sound both in the mobile phone and the other
phone are OK.
1213-7907 2
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Test Instruction, Electrical
6. Press the volume key up and down and check that the volume in the phone is
altered.
7. End the call.
8. Check that the ending procedure is OK and that the speech time is displayed.
5.2.2
Bluetooth Test
To verify that the Bluetooth communication is working:
1. Insert a SIM card, connect a battery and start the unit.
2. Activate the Bluetooth function by entering Connectivity/Bluetooth and turn it on.
3. Set up a link between the phone and another Bluetooth compatible device. If a
connection can be established the Bluetooth module is considered working.
5.2.3
System Connector Test
Hands free equipment and a charger are used in this test, to check the functionality
of the System Connector.
1. Insert a SIM card, connect a battery and start the unit.
2. Connect the Hands free equipment to the system connector and set up a call and
listen if you can speak/hear in the hands free set.
3. Connect the charger to the system connector and see if the phone starts to
charge and if the charging is indicated in the display
5.2.4
Camera video LED Test
To verify that the camera video LED is working:
1. Insert a SIM card, connect a battery and start the unit.
2. Activate the Video function and take a Video.
3. If the camera video LED in the camera side turned red then considered it is
working.
1213-7907 2
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Test Instruction, Electrical
6 Revision History
Rev.
1
2
Date
Changes / Comments
2008-05-26
2008-6-20
First release
Update Test Flow & Calibration
1213-7907 2
Company Internal © Sony Ericsson Mobile Communications AB
11(11)
Installation Instruction, Electrical
Installation Instruction - Electrical
Applicable for G502
Contents
1
General ............................................................................................................... 2
2
Go/No Go Testing.............................................................................................. 2
2.1
Test Set-up Go/No Go test.................................................................... 2
2.2
Test Set ................................................................................................. 3
2.3
RF Connections Antenna Coupler......................................................... 3
2.4
RF Connections Antenna adapter (optional) ......................................... 3
Calibration.......................................................................................................... 4
3.1
Test set up – SERP (only authorized centers) ...................................... 4
3.2
Test Set ................................................................................................. 4
3.3
Power Supply ........................................................................................ 5
3.4
Battery eliminator .................................................................................. 5
3.5
GPIB card and cable ............................................................................. 5
3.6
RF Connection ...................................................................................... 5
3.7
SonyEricsson programming interface – SEPI ....................................... 5
3.8
Sony Ericsson programming interface cable......................................... 5
3.9
USB PC cable ....................................................................................... 5
General Equipment ........................................................................................... 6
4.1
Test Set up ............................................................................................ 6
4.2
Computer............................................................................................... 6
4.3
Service Card Reader and Service Card ................................................ 6
4.4
SonyEricsson programming interface – DCU-65 .................................. 7
4.5
Label Printer (optional) .......................................................................... 7
4.6
Bluetooth Device ................................................................................... 7
Software ............................................................................................................. 7
5.1
EMMA.................................................................................................... 7
5.2
Labelmake II software (optional) ........................................................... 7
5.2.1
Willtek 420x Go/No-Go Test Script ....................................................... 8
5.2.2
SERP Go/No Go Test Script ................................................................. 8
5.3
SERP (only authorized centers) ............................................................ 8
Revision History ................................................................................................ 9
3
4
5
6
1213-7915 1
Company Internal © Sony Ericsson Mobile Communications AB
Installation Instruction, Electrical
1 General
The Electrical Installation Instructions describes the procedures for installing all of the
hardware and software needed to perform testing, calibration, software loading and
repair activities at an Electrical level for the Sony Ericsson products specified.
2 Go/No Go Testing
There are two options for performing a Go No/Go test. One is to use an RF Fixture
and the other is to use an antenna coupler together with a shielding box.
2.1
Test Set-up Go/No Go test
All test hardware necessary for this test set up is documented in the Electrical
Equipment List.
COMPUT
ER
PRINT
ER
GPIB
CABLE
T TS
ES ET
OPT
IONAL
OPT
IONAL
RF CABLE
Used for
Radiated S
ignal
to the Unit
RF PROBE
HOLDER
*
Used for
Conducted S
ignal
to the Unit
RF PROBE
RF S
HIELD
BOX
*
BAT ERY AND
T
BAT ERY COVER
T
*
T RF Probe Holder and the Battery Cover may not be used for every product.
he
S the Installation Instructions and T Instructions for details.
ee
est
1213-7915 1
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Installation Instruction, Electrical
2.2
Test Set
An E-GSM 900/GSM 1800/GSM 1900 Test Set approved according to the Instrument
List must be used.
It should be installed according to the Instrument Manufacturer Instructions.
2.3
RF Connections Antenna Coupler
Connect the RF Cable between the RF-port of the Test set and the RF Shield box.
The Antenna Coupler should be installed into the RF Shield Box according to
manufacturer instructions.
2.4
RF Connections Antenna adapter (optional)
Connect the RF-cable between the RF-port of the Test set and the Antenna adapter.
Assemble the RF adapter to the RF-holder according to the information in the Test
Instruction Electrical.
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3 Calibration
3.1
Test set up – SERP (only authorized centers)
All test hardware necessary for this test set up is documented in the Electrical
Equipment and Instrument List.
COMPUT
ER
GPIB
CABLE
T TS
ES ET
RF PROBE
HOLDER
*
RF CABLE
CHARGER
RF
PROBE
S
EPI
CABLE
S
EPI
US
B
CABLE
POWER S
UPPL
Y
DUMMY BAT ERY
T
AND MODIFIED
BAT ERY COVER
T
*
*
FULL CHARGED BAT ERY
Y
T
AND
BAT ERY COVER
T
*
T RF Probe Holder, Battery Cover, and Modified Battery Cover may not be used for every product.
he
S the Installation Instructions and T Instructions for details.
ee
est
3.2
Test Set
A Test Set approved according to the Instrument List must be used.
It should be installed according to the Instrument Manufacturer Instructions.
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Installation Instruction, Electrical
3.3
Power Supply
Power Supply according to Instrument List must be used.
3.4
Battery eliminator
Battery eliminator is to be used together with a power supply to power the phone
during the calibration. Connect the cables from the battery eliminator to the power
supply, red cable to positive output terminal and black cable to negative output
terminal.
3.5
GPIB card and cable
GPIB card and cable according to the Equipment List. Use the GPIB cable to connect
the GPIB card to the test instrument.
3.6
RF Connection
RF-holder and RF adapter according to Equipment List. Connect the RF adapter to
the RF cable. The RF adapter is held on the phone with the RF fixture.
3.7
Sony Ericsson programming interface – SEPI
The USB programming interface is delivered with the necessary software and
instruction for installation. The USB programming interface (SEPI) should be
connected to an USB-port on the computer. A standard Sony Ericsson Mobile
Communication charger, CST-60 must be connected to the SEPI.
3.8
Sony Ericsson programming interface cable
The cable is the interface between the USB programming interface (SEPI) and the
phone.
3.9
USB PC cable
The A-B Plug-Plug cable is the interface between the computer and the USB
programming interface (SEPI). Connect the cable between the USB programming
interface and the computer.
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Installation Instruction, Electrical
4 General Equipment
4.1
Test Set up
General Test set up to perform SW loading and manual test according to Test
Instruction. All necessary hardware for this test set up is documented in the Electrical
Equipment list.
US
B
ACT ION
IVAT
DONGLE
DCU-65
CABLE
4.2
Computer
IBM compatible computer is required. The computer should include at least two USBports. Refer to Equipment List for minimum requirements.
4.3
Service Card Reader and Service Card
The Service Card Reader is delivered with the necessary software and instructions
for installation. The Service Card Reader should be connected to an USB-port on the
computer.
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Installation Instruction, Electrical
4.4
Sony Ericsson programming interface – DCU-65
The cable is the interface between the computer and the phone. DCU-65 cable
should be connected to an USB-port on the computer.
4.5
Label Printer (optional)
A Zebra printer model 90xi, 90xiII or 4000 deluxe shall be used. Connect the printer
with a standard RS 232 serial printer cable [refer to the Zebra printer manual] to the
serial port on the computer. Read the Zebra installation manual for more information
about the installation.
4.6
Bluetooth Device
Any Bluetooth device as headset, other Bluetooth phone or other Bluetooth device
can be used to verify the Bluetooth function in the phone. Set up the connection
according to the chosen equipments manufacturer.
5 Software
5.1
EMMA
EMMA contains all software required to service the product. Installation and user
manuals are available in the EMMA start page.
http://ma3.extranet.sonyericsson.com/ma3/
5.2
Labelmake II software (optional)
LabelMake II is an application installed through Java Web Start.
Access the Labelmake software from CSPN Web page.
You will find LabelMake II in the dropdown menu on the CSPN web page.
http://cspn.extranet.sonyericsson.com
Press “START LabelMake II “button and you will be directed to the LABELMAKE II
client page.
Product labels are downloaded on-line from a remote server database.
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Installation Instruction, Electrical
5.2.1
Willtek 420x Go/No-Go Test Script
An approved Sony Ericsson Test Script must be installed in the Test Instrument. The
Willtek 420x script can be downloaded from CSPN. The Test Script is located on
CSPN under Repair Instructions / Standard.
The FEA number for the 420x test script is 1213-7931 x when using the R & S Coupler
or the RF Fixture.
NOTE!
The “x” in the FEA number refers to the revision of the Test Script.
Ensure the latest revision script posted to CSPN is installed.
Install the Test Script according to the Instrument Manufacturer’s Instructions.
5.2.2
SERP Go/No Go Test Script
SERP stands for “Sony Ericsson Repair Platform”. It is an application used for testing,
calibrating and repairing Sony Ericsson mobile phones.
1. Download the latest revision of the SERP application from CSPN (Repair
Instructions/Standard/SERP Install Package) or through the use of the SERP
Online Update Tool (OUT).
2. Unzip the file and open the file “SERP_Installation.doc” for installation instructions.
3. After SERP is installed a file titled “SERPINFO.htm” will be placed on the
Windows Desktop. This file contains numerous documents including:
•
•
SERP Troubleshooting Guide – This document contains a few
troubleshooting steps that should be reviewed before reporting issues to Sony
Ericsson.
•
SERP Trouble Report Form – This form should be filled out when reporting
SERP issues to the regional support team.
•
5.3
SERP Users Manual – This document contains system requirements, release
notes, fault reporting instructions, supported test instruments, installation
procedures and detailed operating instructions.
SERP OUT Quick Guide – This document contains system requirements,
registration information and general user guidelines for the OUT application.
SERP (only authorized centers)
Download the latest revision of SERP application from CSPN. This application is
located under Repair Instructions/Standard/SERP Install package
http://cspn.extranet.sonyericsson.com
Unzip the file and open the Installation instructions.
Follow the Install instructions to install SERP.
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6 Revision History
Rev.
1
Date
Changes / Comments
2008-05-26
1st release
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