no hej nie wiem czy masz notę tego scalaka ..ale profilaktycznie - proszę bardzo zawsze lepszy rydz jak nic :wink:
INTEGRATED CIRCUITS
DATA SHEET
TDA7088T
FM receiver circuit for battery
supply
Product specification
Supersedes data of January 1991
File under Integrated Circuits, IC01
1996 May 14
Philips Semiconductors
Product specification
FM receiver circuit for battery supply
TDA7088T
FEATURES
GENERAL DESCRIPTION
• Equipped with all stages of a mono receiver from
antenna to audio output
The TDA7088T is a bipolar integrated circuit for use in
mono portable and pocket radios. It is used when a
minimum of peripheral components (of small dimensions
and low costs) is important. The circuit contains a
frequency-locked-loop (FLL) system with an Intermediate
Frequency (IF) of about 70 kHz. Selectivity is achieved by
active RC-filters. De-tuning related to the IF and too weak
input signals is suppressed by the mute circuit.
• Mute circuit
• Search tuning with a single varicap diode
• Mechanical tuning with integrating AFC
• AM application supported
• Power supply polarity protection
• Power supply voltage down to 1.8 V.
APPLICATIONS
• Mechanical tuning; this is possible with or without
integrating AFC circuit
• Electrical tuning; this is realized by one directional
(band-up) search tuning facility, including RESET to the
lower-band limit.
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VP
supply voltage
1.8
3
5
V
IP
supply current
4.2
5.2
6.6
mA
fiRF
radio input frequency
0.5
−
110
MHz
Vi(rms)
RF sensitivity input voltage
(RMS value)
VoAF = −3 dB; VoAF = 0 dB
at Vi = 1 mV; mute off
−
3
6
µV
signal handling
∆f = ±75 kHz; THD & lt; 10%
100
200
−
mV
Vo(rms)
audio output signal (RMS
value)
RL = 22 kΩ
60
85
120
mV
Tamb
operating ambient temperature
−10
−
+70
°C
ORDERING INFORMATION
PACKAGE
TYPE
NUMBER
NAME
TDA7088T
SO16
1996 May 14
DESCRIPTION
plastic small outline package; 16 leads; body width 3.9 mm
2
VERSION
SOT109-1
1996 May 14
3
reset
0.1 µF
5.6
kΩ
10 nF
78
nH
0.1 µF
680
pF
L1
220 pF
1
16
14
4
5
12
×
S
R
&
TDA7088T
V2
+1
+
8
V2
3.9 nF
6 kΩ
VP
+
5 kΩ
9
330 pF
V3
10
13
MUTE
ALLPASS
FILTER
5.4 kΩ
470 pF
15
−1
22 nF
6 kΩ
run
22 kΩ
2
V2
VoAF
AF
LOOP FILTER
DEMODULATOR
1.8 nF
AF
IF
LIMITER
0.1 µF
Fig.1 Block diagram and application circuit for search tuning.
SEARCH
TUNING
VCO
MIXER
2.2 kΩ
7
180 pF
MEH089
3
FM receiver circuit for battery supply
V1, V2 and V3 are internal voltages.
3V
VP
BB910
10 kΩ
70
nH
V1
2.2 kΩ
6
3.3 nF
handbook, full pagewidth
68
pF
82
pF
11
VP
Philips Semiconductors
Product specification
TDA7088T
BLOCK DIAGRAM AND APPLICATION CIRCUIT
Philips Semiconductors
Product specification
FM receiver circuit for battery supply
TDA7088T
PINNING
SYMBOL
PIN
DESCRIPTION
MUTE
1
mute output
VoAF
2
audio frequency output signal
LOOP
3
AF loop filter
VP
4
+3 V supply voltage
OSC
5
oscillator resonant circuit
IFFB
6
IF feedback
CLP1
7
low-pass capacitor of 1 dB amplifier
VoIF
8
IF output to external coupling
capacitor (high-pass)
handbook, halfpage
MUTE
1
16 TUNE
VoAF
2
15 CAP
LOOP
3
14 GND
VP
4
TDA7088T
13 CLIM
ViIF
9
IF input to limiter amplifier
OSC
5
12 ViRF
CLP2
10
low-pass capacitor of IF limiter
amplifier
IFFB
6
11 ViRF
ViRF
11
radio frequency input
CLP1
7
10 CLP2
ViRF
12
radio frequency input
VoIF
8
CLIM
13
limiter offset voltage capacitor
GND
14
15
all-pass filter capacitor/input for
search tuning
TUNE
16
ViIF
ground (0 V)
CAP
9
MGE664
electrical tuning/AFC output
Fig.2 Pin configuration.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
VP
supply voltage
0
5
V
Tstg
storage temperature
−55
+150
°C
Tamb
operating ambient temperature
−10
+70
°C
Ves
electrostatic handling; note 1
−
−
−
Note
1. There is no special ESD protection circuit built-in; ESD data on request.
1996 May 14
4
Philips Semiconductors
Product specification
FM receiver circuit for battery supply
TDA7088T
DC CHARACTERISTICS
VP = 3 V; Tamb = 25 °C; unless otherwise specified.
SYMBOL
PARAMETER
MIN.
TYP.
MAX.
UNIT
VP
supply voltage (pin 4)
1.8
3
5
V
IP
supply current (pin 4)
4.2
5.2
6.6
mA
V1
DC voltage on pin 1
2.50
2.55
2.60
V
V3
DC voltage on pin 3
2.64
2.69
2.74
V
V6, 7
DC voltage on pins 6 and 7
2.38
2.44
2.50
V
V8
DC voltage on pin 8
1.60
1.67
1.74
V
V9, 10, 13
DC voltage on pins 9, 10 and 13
2.42
2.47
2.52
V
V11, 12
DC voltage on pins 11 and 12
0.91
0.94
0.98
V
V15
DC voltage on pin 15
2.06
2.12
2.18
V
I2
AF output current on pin 2
45
60
80
µA
I5
oscillator current on pin 5
275
375
500
µA
AC CHARACTERISTICS
VP = 3 V; Tamb = 25 °C; fiRF = 96 MHz modulated with fmod = 1 kHz and ±22.5 kHz deviation; Vi = 400 µV (measured as
EMF; RS = 75 Ω) and measurements taken in Fig.4; unless otherwise specified.
SYMBOL
Vi(rms)
PARAMETER
RF sensitivity input voltage
(RMS value)
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VoAF = −3 dB; VoAF = 0 dB
at Vi = 1 mV; see Fig.3
mute off
−
3
6
µV
mute on
3
6
12
µV
S+N
------------- = 26 dB
N
−
5
10
µV
signal handling
∆f = ±75 kHz; THD & lt; 10%
100
200
−
mV
S+N
------------N
signal plus noise-to-noise ratio
see Fig.3
52
56
−
dB
THD
total harmonic distortion
∆f = ±22.5 kHz
−
1
1.4
%
∆f = ±75 kHz
−
2.4
3.3
%
47
52
−
dB
10
−
dB
60
85
120
mV
αAM
AM suppression
FM: 1 kHz; ±75 kHz;
AM: 1 kHz; m = 0.8
RR1000
ripple rejection
100 mV RMS ripple on VP; 7
f = 1 kHz
Vo(rms)
audio output signal (RMS value) RL = 22 kΩ
Search tuning (with BB910 and C16 = 0.1 µF) see Fig.1
V16
minimum output voltage on
pin 16
limiting point
−
VP − 1.85 −
V
∆V/∆t
tuning steepness
voltage at pin 16
95
210
420
mV/s
∆fosc/∆t
oscillator steepness
1.25
2.83
5.6
MHz/s
∆IAFC/∆V3
AFC steepness
4.75
9.5
19
µS
1996 May 14
voltage at pin 3
5
Philips Semiconductors
Product specification
FM receiver circuit for battery supply
TDA7088T
MEH092
25
handbook, full pagewidth
VoAF
(dB)
S+N
0
(2)
(2)
−20
(1)
(1)
−40
noise
−60
−80
10−6
10−5
10−4
(1) Mute on.
(2) Mute off.
Fig.3 Input sensitivity.
1996 May 14
6
10−3
EMF (V)
10−2
Philips Semiconductors
Product specification
FM receiver circuit for battery supply
TDA7088T
TEST AND APPLICATION INFORMATION
handbook, full pagewidth
3.9 nF
8
9
3.3 nF
180 pF
330 pF
10
RS
75 Ω
10 kΩ
220
pF
EMF (fRF)
11
6
12
ViRF
7
5
82 pF
68
pF
70
nH
27 pF
78
nH
TDA7088T
0.1 µF
13
1.2
kΩ
18
pF
C1
4
10 nF
22 nF
14
3
470 pF
VoAF
1.8 nF
15
2
VP
22 kΩ
VP =
+3 V
16
1
0.1 µF
mute disable
MEH090
C1 = Toko 2A-15BT-R01.
Fig.4 Test circuit and application for mechanical tuning.
1996 May 14
7
Philips Semiconductors
Product specification
FM receiver circuit for battery supply
TDA7088T
handbook, full pagewidth
3.9 nF
8
9
3.3 nF
180 pF
330 pF
10
11
220
pF
10 kΩ
6
12
ViRF
7
5
82 pF
68
pF
70
nH
27 pF
TDA7088T
0.1 µF
13
D1
78
nH
18
pF
1.2
kΩ
C1
C2
4
0.1 µF
10 nF
22 nF
14
3
470 pF
15
2
22 kΩ
VP =
+3 V
VoAF
1.8 nF
16
1
VP
0.1 µF
AFC
MEH091
C1 = Toko 2A-15BT-R01.
Fig.5 Application circuit with AFC for mechanical tuning.
1996 May 14
8
BA483
1996 May 14
AM
FM
AM
FM
9
AM-IF
100 kΩ
10 nF
(1)
0.1
µF
2.7 kΩ
3.9
nF
330
pF
1 µF
9
8
+3 V
AF
5
4
12
0.1
µF
13
14
3
22
kΩ
16
1
4.7 nF
off
27 kΩ
12 Ω
volume
MEH157
5.1 Ω
10
nF
earphone
AF
transformer
22 µF
battery
switch on
+3 V
AF amplifier
47 nF
1 µF
470 pF
AF
15
2
22 nF
(FM antenna)
TDA7088T
33 pF
RF
11
6
AM antenna
10 kΩ
10
7
180
pF
VP
Fig.6 AM application circuit.
4.7 nF
handbook, full pagewidth
CC7642
BAW62
4.7 nF
12 pF
33 pF
H
L
FM receiver circuit for battery supply
(1) CC7642: AM-IF amplifier/demodulator type number WU-xi 742 Fty.
+3 V
oscillator
resonant
circuit
Philips Semiconductors
Product specification
TDA7088T
Philips Semiconductors
Product specification
FM receiver circuit for battery supply
TDA7088T
PACKAGE OUTLINE
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A
X
c
y
HE
v M A
Z
16
9
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
8
e
0
detail X
w M
bp
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.01
0.019 0.0098 0.39
0.014 0.0075 0.38
0.050
0.24
0.23
0.041
0.039
0.016
0.028
0.020
inches
0.0098 0.057
0.069
0.0039 0.049
0.16
0.15
0.01
0.01
0.028
0.004
0.012
θ
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT109-1
076E07S
MS-012AC
1996 May 14
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
91-08-13
95-01-23
10
o
8
0o
Philips Semiconductors
Product specification
FM receiver circuit for battery supply
TDA7088T
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Repairing soldered joints
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
Reflow soldering
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
Wave soldering
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
1996 May 14
11
Philips Semiconductors
Product specification
FM receiver circuit for battery supply
TDA7088T
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1996 May 14
12
Philips Semiconductors
Product specification
FM receiver circuit for battery supply
TDA7088T
NOTES
1996 May 14
13
Philips Semiconductors
Product specification
FM receiver circuit for battery supply
TDA7088T
NOTES
1996 May 14
14
Philips Semiconductors
Product specification
FM receiver circuit for battery supply
TDA7088T
NOTES
1996 May 14
15
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SCDS48
© Philips Electronics N.V. 1996
All rights are reserved. Reproduction in whole or in part is prohibited without the
prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation
or contract, is believed to be accurate and reliable and may be changed without
notice. No liability will be accepted by the publisher for any consequence of its
use. Publication thereof does not convey nor imply any license under patent- or
other industrial or intellectual property rights.
Printed in The Netherlands
517021/1200/02/pp16
Document order number:
Date of release: 1996 May 14
9397 750 00843