RX-2B_TX-2B.pdf

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Silan
Semiconductors

TX-2B/RX-2B

REMOTE CONTROLLER WITH FIVE
FUNCTIONS
DESCRIPTION
DIP-14

The TX-2B/RX-2B is a pair of CMOS LSIs designed for remote

TX-2B

controlled car applications. The TX-2B/RX-2B has five control keys
for controlling the motions (i.e. forward, backward, rightward, leftward
and the turbo function ) of the remote controlled car.

FEATURES
* Wide operating voltage range (VCC=1.5~5.0V)

RX-2B

* Low stand-by current

DIP-16

* Auto-power-off function for TX-2B
* Few external components are needed

ORDERING INFORMATION
Part No.

Package

TX-2B

DIP-14-300-2.54

RX-2B

DIP-16-300-2.54

BLOCK DIAGRAM
FOSC

11

RIGHT

1

LEFT

14

TURBO

6

FORWARD

5

BACKWARD

Timing
Generator

12

OSCO

2

Oscillator

OSCI

TEST B

13

4

9 VDD

10 PC
Latch
Circuit

Encoding
Circuit

Logic

8 SO
7 SC

3
GND

TRANSMITTER TX-2B Block Diagram

HANGZHOU SILAN MICROELECTRONICS JOINT-STOCK CO.,LTD
Rev: 1.0

1

2002.03.29

Silan
Semiconductors

TX-2B/RX-2B

BLOCK DIAGRAM
OSCI

4

Timing
Generator

Oscillator
OSCO

SI

3

VO1

15

VI1

13 VDD

5

14

Decoding
Circuit

AMP

Computer

PLA

LDB

9

6 RIGHT

Control
Logic
RDB

7 LEFT

8

VI2

16

VO2

12 TURBO

Latch
Circuit

1

10 BACKWARD
11 FORWARD

2
GND

RECEIVER RX-2B Block Diagram

PIN CONFIGURATION
14

LEFT

VO2

1

16

VI2

TEST

2

13

FOSC

GND

2

15

VO1

GND

3

12

OSCI

SI

3

14

VI1

ACKWARD

4

11

OSCO

OSCI

4

13

VDD

FORWARD

5

10

PC

OSCO

5

12

TURBO

TURBO

6

9

VDD

RIGHT

6

11

FORWARD

SC

7

8

SO

LEFT

7

10

BACKWARD

ROB

8

9

LDB

RX-2B

1

TX-2B

RIGHT

HANGZHOU SILAN MICROELECTRONICS JOINT-STOCK CO.,LTD
Rev: 1.0

2

2002.03.29

Silan
Semiconductors

TX-2B/RX-2B

ABSOLUTE MAXIMUM RATINGS
Characteristic

Symbol

Value

Unit

VDD

0.3~5.0

V

VIN, VOUT

GND-0.3~VDD+0.3

V

TOPR

-10~65

°C

Tstg

-25~125

°C

Supply Voltage
Input / Output Voltage
Operating Temperature
Storage Temperature

ELECTRICAL CHARACTERISTICS
1. TX-2B (VDD=4.0V, Fosc=128KHz, Tamb =25°C, unless otherwise specified.)

Characteristic

Symbol

Min

Typ

Max

Unit

VDD

1.5

4.0

5.0

V

Operating Current

IDD

--

--

2.0

mA

Stand-By Current

ISTB

--

--

10

uA

DC O/P Driving Current

Idrive

5

--

--

mA

AC O/P Driving Current

Idrive

5

--

--

mA

AC O/P Frequency

Faudio

0.5

--

1.0

kHz

Unit

Operating Voltage

2. RX-2B (VDD=4.0V,Fosc=128KHz, Tamb=25°C, unless otherwise specified.)
Symbol

Min

Typ

Max

Operating Voltage

characteristic

VDD

1.5

4.0

5.0

V

Operating Current

IDD

--

--

3.0

mA

O/P Driving Current

Idrive

1

--

--

mA

O/P Sinking Current

Isink

1

--

--

mA

Ftolerance

-20

--

20

%

Effect Decoding Frequency Variation

PIN DESCRIPTION
1. TX-2B
Pin No.

Symbol

1

RIGHT

The rightward function will be selected, if this pin is connected to GND

Description

2

TEST

This pin is used for testing mode

3

GND

Negative power supply

4

BACKWARD

5

FORWARD

The backward function will be selected, if this pin is connected to GND
The forward function will be selected, if this pin is connected to GND
(To be continued)

HANGZHOU SILAN MICROELECTRONICS JOINT-STOCK CO.,LTD
Rev: 1.0

3

2002.03.29

Silan
Semiconductors

TX-2B/RX-2B

(Continued)

Pin No.

Symbol

6

TURBO

Description
The turbo function will be selected if this pin is connected to GND

7

SC

8

SO

Output pin of the encoding signal with carrier frequency
Output pin of the encoding signal without carrier frequency

9

VDD

Positive power supply

10

PC

Power control output pin

11

OSCO

Oscillator output pin

12

OSCI

Oscillator input pin

13

FOSC

This pin is used for testing mode

14

LEFT

The leftward function will be selected, if this pin is connected to GND

2. RX-2B
Pin No.

Symbol

Description

1

VO2

Inverter 2 output pin for power amplify

2

GND

Negative power supply

3

SI

4

OSCI

Input pin of the encoding signal
Oscillator input pin

5

OSCO

Oscillator output pin

6

RIGHT

Rightward output pin

7

LEFT

Leftward output pin

8

ROB

Rightward function disable, if this pin is connected to GND
Leftward function disable, if this pin is connected to GND

9

LDB

10

BACKWARD

11

FORWARD

Forward output pin

12

TURBO

TURBO output pin

13

VDD

Backward output pin

Positive power supply

14

VI1

Inverter 1 input pin for power amplify

15

VO1

Inverter 1 output pin for power amplify

16

VI2

Inverter 2 input pin for power amplify

HANGZHOU SILAN MICROELECTRONICS JOINT-STOCK CO.,LTD
Rev: 1.0

4

2002.03.29

Silan
Semiconductors

TX-2B/RX-2B

CODE FORMAT
1. ENCODE RULE
(A).Bit Format (W1 is used for function codes,W2 for start codes)
1KHz
W1

1KHz 50% Duty cycle

W2
500Hz 75% Duty cycle

(B).Date Format
W2

W2

W2

W2

(n) X W1

W2

W2

W2

W2

W2

W2

W2

1

2

3

4

1

2

3

4

W1

W1

W1

W2

W1

(n) X W1

W2

W2

W2

W2

W2

W2

W2

W2

W1
n-th

W1

start code
n x W1

function code
1 word

Number Of Function Code (N) W1

Function Key

4

Decode Result
End Code

10

Forward

Forward

16

Forward & Turbo

Forward

22

Turbo

Turbo

28

Turbo & Forward & Left

Forward & Left

34

Turbo & Forward & Right

Forward & Right

40

Backward

Backward

46

Backward & Right

Backward & Right

52

Backward & Left

Backward & Left

58

Left

Left

64

Right

Right

HANGZHOU SILAN MICROELECTRONICS JOINT-STOCK CO.,LTD
Rev: 1.0

5

2002.03.29

Silan
Semiconductors

TX-2B/RX-2B

2. ENCODE/DECODE TIMING

Any function key
Encode output

1st word

2nd word

3rd word

1

2

3

4

5

6

7

8

end code

Decode output

9ms

9ms

SI
(n) W1

8ms

1ms

8ms

Decode output
T

T=17ms+(nW1)x1ms

TESTING CIRCUIT
(The oscillator frequency of TX-2B, RX-2B is 128KHz, the oscillator resistor is 160KOhm and 250KOhm respectively)

12

11

turbo
10

9

8

16

15

14

13

12

11

10

9

6

7

8

F

13

5

6

7

1

2

3

4

5

fosc=128kHz

left

4

turbo

3

forward

right

left

2

backward

100

1

RX-2B

right

TX-2B

­

VCC=3V

14

backward

forward
fosc=128kHz

HANGZHOU SILAN MICROELECTRONICS JOINT-STOCK CO.,LTD
Rev: 1.0

6

2002.03.29

Silan
Semiconductors

TX-2B/RX-2B

TYPICAL APPLICATION CIRCUIT
TRANSMITTER

VCC
Rosc=500k

?

14

13

12

11

10

9

5

6

R.F.
SI CIRCUIT

8

7

TX-2B
4
forward

turbo

3
backward

2

right

left

1

RECEIVER

power
switch
16
100

­

VCC

15

14

13

12

11

10

9

6

7

8

F

RX-2B

4.3V
1

2

3

4

5

R.F.
CIRCUIT
500k

?

GND

HANGZHOU SILAN MICROELECTRONICS JOINT-STOCK CO.,LTD
Rev: 1.0

7

2002.03.29

Silan
Semiconductors

TX-2B/RX-2B

INFRARED APPLICATION CIRCUIT

F

DC:3V

TRANSMITTER

100

­
fosc=114kHz

1~4.7

?

13

12

11

10

9

8

5

6

7

Photo Diode

14

TX-2B
4

Turbo

Frontwar
d

15

3

Right

16

2

Backw
ard

Left

1

C8050

RECEIVER

14

13

12

11

10

9

100K

F

RX-2B

­

100

?

DC:5V

VDD

OUT
1

2

3

4

5

6

7

8

IR
Receiver

1815

fosc=114KHz
GND

HANGZHOU SILAN MICROELECTRONICS JOINT-STOCK CO.,LTD
Rev: 1.0

8

2002.03.29

Silan
Semiconductors

TX-2B/RX-2B

RECOMMENDED APPLICATION CIRCUIT
R

VDD=9V

L

1

14

2

13

3

12

LED

220k

??

390

203P

Rosc=160K

L2
2.2 H

L4
6.8 H

­

­

11

L1
2.2 H
47P

XTAL
27MHz

­

151P

L3

F

7T 0.3mm ( )
x 5mm(Core)

?

68P

10

151P

203P

­

47

33K

100

3.0V

F

8

203P

7

Q2
C945

?

9

?

6

100

TURBO

68P

Q1
C945

?

5

103P

TX-2B

4

?

B

1.5k

C2 47P

?

L2
104P 3.3k

R2

F
4.7

7

10

3.9M

501P

Rosc=250K

11

473P

C945
Q6

1kO

R1,R2,R3,R4=80~150 ,are
changeable with the VDD1 and
VDD2.

?

left

6

8

right

12

Q5

?

5

104P

C3 18P
C4 203P

L1
1.1 F

?

3.3k

?

RX-2B

R2

M

C945

13

222P

Q4

Q2

turbo

9

forward

backward

R3
Q7
1k

Q8

?

Q9

473P

R4
1k

M

C945

C945

?

?

14

4

?

­

15

1k

?

?

820

­

­

390

R1
C945

1k
330

16

3

100 F
/16V

Q3

VDD1

VDD2
103P

2

1N4148

470 F
/16V

220 F
/16V

203P

1

3.0V

­

?

3.9MO

VDD1=12V,R=330
VDD1=9V,R=220

3.3k

?

C1 102P

7T 0.3mm ( )
x 5mm(Core)

?

180k

?
?

Q1

­

4P

Q1: C9018,C1815,C380,C382
Q2,Q3,Q4: 5610,C8550,B772
Q5,Q6: C8050,5609,D882
Q7,Q8: B564,C8550,B772
Q9,Q10: D471,C8050,D882

Q10

HANGZHOU SILAN MICROELECTRONICS JOINT-STOCK CO.,LTD
Rev: 1.0

9

2002.03.29

Silan
Semiconductors

TX-2B/RX-2B

PACKAGE OUTLINE

DIP-14-300-2.54

UNIT: mm

0.25

7.62

B

6.35

B

0.25

0.05

2.54

1.52
15 degree

19.55

0.3

0.46

0.08

3.00MIN

0.5MIN

4.36MAX

B

2.40MAX

B

DIP-16-300-2.54

UNIT: mm

1.52

0.25

7.62

6.35

B
19.55 0.3

B

0.25

0.05

2.54

B

3.00MIN

0.5MIN

4.36MAX

15 degree

0.3

0.46

1.27MAX

0.08

B

0.99

B

HANGZHOU SILAN MICROELECTRONICS JOINT-STOCK CO.,LTD
Rev: 1.0

10

2002.03.29


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